CN102548259A - Method for producing asymmetrically laminated printed circuit board - Google Patents
Method for producing asymmetrically laminated printed circuit board Download PDFInfo
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- CN102548259A CN102548259A CN2012100047954A CN201210004795A CN102548259A CN 102548259 A CN102548259 A CN 102548259A CN 2012100047954 A CN2012100047954 A CN 2012100047954A CN 201210004795 A CN201210004795 A CN 201210004795A CN 102548259 A CN102548259 A CN 102548259A
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Abstract
The invention belongs to the field of printed circuit boards, and provides a method for producing an asymmetrically laminated printed circuit board. Hot pressing treatment is performed on boards in six stages by modifying lamination parameters, pressure, temperature and time are rationally controlled according to production requirements, and the boards are gradually and uniformly heated and pressurized in stages, so that a manufacturing process for the printed circuit board is optimized. A layer of core board is sandwiched between the boards, so that the hardness of the boards is improved, the boards are difficult to bend and deform, the problem that the board is warped towards a thin surface in the production of a subsequent procedure after the lamination is effectively solved, the production difficulty of the subsequent procedure is reduced, a leveling step after forming is avoided, production cost is decreased, and production efficiency is improved.
Description
Technical field
The invention belongs to the printed circuit board field, relate in particular to a kind of method that is used to produce asymmetric pressing printed circuit board.
Background technology
Printed circuit board is that a kind of work flow of complicacy that utilizes is mended line on copper coin; And the product that is made through series of process means such as etching; And support plate being provided for the follow-up product that mounts, major product is used fields such as all consumer appliances, industry control, communication, wireless telecommunications.
The technology of the processing printed circuit board that prior art provides causes two sides level thickness or copper thickness different, asymmetric easily; The plate face can be to a thin prying when operation was produced behind the lamination; Can only after moulding, flatten, can cause the unforeseen thing of possibility occurring, bring serious quality to draw trouble to product in following process; When making, rise simultaneously, become the difficult problem of this product of puzzlement industry processing because of the learies increase causes cost.
Summary of the invention
The invention provides a kind of method that is used to produce asymmetric pressing printed circuit board; Be intended to solve the technology of the processing printed circuit board that prior art provides; Cause two sides level thickness or copper thickness different, asymmetric easily, the plate face can be to a thin prying when operation was produced behind the lamination; Can only after moulding, flatten; Can cause the unforeseen thing of possibility occurring, bring serious quality to draw trouble to product, the problem that when making, causes cost to rise simultaneously because of the learies increase in following process.
The object of the present invention is to provide a kind of method that is used to produce asymmetric pressing printed circuit board, this method may further comprise the steps:
Sheet material to producing printed circuit board carries out preliminary treatment;
Sheet material to through preliminary treatment carries out hot-pressing processing;
Sheet material to through hot-pressing processing carries out cold pressing treatment;
Sheet material is carried out subsequent operation, processing.
The method that is used to produce asymmetric pressing printed circuit board provided by the invention is utilized change pressing parameter, sheet material has been carried out the hot-pressing processing in six stages; And according to the reasonable controlled pressure of production requirement, temperature, time, segmentation is progressively heated, pressurizeing is heated sheet material, and is stressed even; Optimized the manufacture craft of printed circuit board, one deck central layer that increases in the middle of the sheet material has strengthened the hardness of sheet material; Sheet material is difficult for flexural deformation, has solved effectively that the plate face can reduce the production difficulty of knowing clearly in the back operation to the problem of a thin prying when operation was produced behind the lamination; Reduce the step that flattens after the moulding, reduced production cost, improved production efficiency.
Description of drawings
Fig. 1 shows that the embodiment of the invention provides is used to produce the realization flow figure of the method for asymmetric pressing printed circuit board.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further specified below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in the qualification invention.
Fig. 1 shows that the embodiment of the invention provides is used to produce the realization flow of the method for asymmetric pressing printed circuit board.
This method may further comprise the steps:
In step S101, the sheet material of producing printed circuit board is carried out preliminary treatment;
In step S102, the sheet material through preliminary treatment is carried out hot-pressing processing;
In step S103, the sheet material through hot-pressing processing is carried out cold pressing treatment;
In step S104, sheet material is carried out subsequent operation, processing.
The implementation method of in embodiments of the present invention, the sheet material of producing printed circuit board being carried out preliminary treatment is:
Sheet material is carried out the processing of receiving inspection, melanism, baking;
Sheet material is carried out the processing of riveted, sanction Copper Foil, sanction polypropylene plastics flitch, composing.
In embodiments of the present invention, to the implementation method of carrying out hot-pressing processing through the sheet material of preliminary treatment be:
Divide six stages that sheet material is carried out hot-pressing processing, 140 ℃ of first section temperature, time 5min, pressure 12kg/cm2;
150 ℃ of second section temperature, time 5min, pressure 15kg/cm2;
180 ℃ of the 3rd section temperature, time 15min, pressure 19kg/cm2;
190 ℃ of the 4th section temperature, time 15min, pressure 23kg/cm2;
200 ℃ of the 5th section temperature, time 60min, pressure 26kg/cm2;
140 ℃ of the 6th section temperature, time 20min, pressure 12kg/cm2.
In embodiments of the present invention, to the implementation method of carrying out cold pressing treatment through the sheet material of hot-pressing processing be:
To the sheet material time of carrying out be 30min, pressure is the cold pressing treatment of 20mpa.
In embodiments of the present invention, the vacuum degree of cold pressing treatment is 23-30kpa.
In embodiments of the present invention, this method further comprises:
If the variable thickness appearance of Copper Foil on the sheet material, then thin copper foil add the two layers of polypropylene plastic plate, and meanwhile thick Copper Foil add one deck polypropylene plastics flitch.
In embodiments of the present invention, sheet material is carried out subsequent operation, handles and further to comprise:
Sheet material is carried out punch operation, and change down processing procedure over to.
In embodiments of the present invention, this method has added the central layer of one deck increase sheet material hardness in the middle of sheet material.
Below in conjunction with accompanying drawing and specific embodiment application principle of the present invention is further described.
In embodiments of the present invention, the pressing parameter: hot pressing divides six sections, 140 ℃ of first section temperature, time 5min, pressure 12kg/cm2; 150 ℃ of second section temperature, time 5min, pressure 15kg/cm2; 180 ℃ of the 3rd section temperature, time 15min, pressure 19kg/cm2; 190 ℃ of the 4th section temperature, time 15min, pressure 23kg/cm2; 200 ℃ of the 5th section temperature, time 60min, pressure 26kg/cm2; 140 ℃ of the 6th section temperature, time 20min, pressure 12kg/cm2.Segmentation is progressively heated, pressurizeing is heated plank, and is stressed even.
The parameter of colding pressing: pressure: 20mpa, time 30min, vacuum degree 23-30kpa, adding colds pressing can not be out of shape after not allowing cooling.
If copper thickness is different, thin copper foil add the two layers of polypropylene plastic plate, and meanwhile thick Copper Foil add one deck polypropylene plastics flitch; Utilize change pressing parameter, and the change Copper Foil, be optimized manufacture craft above the polypropylene plastics flitch, added one deck central layer in the middle of the plate; Plate hardness is strengthened, and plank is difficult for flexural deformation, effectively reaches production of products; Make surface layer time thickness or copper thickness different, asymmetric, the plate face can be to the problem of a thin prying when operation was produced behind the lamination; Obtained solving effectively, and in pcb board production, cost has effectively been reduced.
The method that is used to produce asymmetric pressing printed circuit board that the embodiment of the invention provides is utilized change pressing parameter, sheet material has been carried out the hot-pressing processing in six stages; And according to the reasonable controlled pressure of production requirement, temperature, time, segmentation is progressively heated, pressurizeing is heated sheet material, and is stressed even; Optimized the manufacture craft of printed circuit board, one deck central layer that increases in the middle of the sheet material has strengthened the hardness of sheet material; Sheet material is difficult for flexural deformation, has solved effectively that the plate face can reduce the production difficulty of knowing clearly in the back operation to the problem of a thin prying when operation was produced behind the lamination; Reduce the step that flattens after the moulding, reduced production cost, improved production efficiency.
More than be merely preferred embodiment of the present invention,, all any modifications of within spirit of the present invention and principle, being done, be equal to and replace and improvement etc., all should be included within protection scope of the present invention not in order to restriction the present invention.
Claims (8)
1. a method that is used to produce asymmetric pressing printed circuit board is characterized in that, this method may further comprise the steps:
Sheet material to producing printed circuit board carries out preliminary treatment;
Sheet material to through preliminary treatment carries out hot-pressing processing;
Sheet material to through hot-pressing processing carries out cold pressing treatment;
Sheet material is carried out subsequent operation, processing.
2. the method for claim 1 is characterized in that, the implementation method that said sheet material to the production printed circuit board carries out preliminary treatment is:
Sheet material is carried out the processing of receiving inspection, melanism, baking;
Sheet material is carried out the processing of riveted, sanction Copper Foil, sanction polypropylene plastics flitch, composing.
3. the method for claim 1 is characterized in that, the implementation method that said sheet material to the process preliminary treatment carries out hot-pressing processing is:
Divide six stages that sheet material is carried out hot-pressing processing, 140 ℃ of first section temperature, time 5min, pressure 12kg/cm2;
150 ℃ of second section temperature, time 5min, pressure 15kg/cm2;
180 ℃ of the 3rd section temperature, time 15min, pressure 19kg/cm2;
190 ℃ of the 4th section temperature, time 15min, pressure 23kg/cm2;
200 ℃ of the 5th section temperature, time 60min, pressure 26kg/cm2;
140 ℃ of the 6th section temperature, time 20min, pressure 12kg/cm2.
4. the method for claim 1 is characterized in that, the implementation method that said sheet material to the process hot-pressing processing carries out cold pressing treatment is:
To the sheet material time of carrying out be 30min, pressure is the cold pressing treatment of 20mpa.
5. like claim 1 or 4 described methods, it is characterized in that the vacuum degree of said cold pressing treatment is 23-30kpa.
6. the method for claim 1 is characterized in that, said method further comprises:
If the variable thickness appearance of Copper Foil on the sheet material, then thin copper foil add the two layers of polypropylene plastic plate, and meanwhile thick Copper Foil add one deck polypropylene plastics flitch.
7. the method for claim 1 is characterized in that, said sheet material is carried out subsequent operation, handles and further to comprise:
Sheet material is carried out punch operation, and change down processing procedure over to.
8. the method for claim 1 is characterized in that, said method has added the central layer of one deck increase sheet material hardness in the middle of sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100047954A CN102548259A (en) | 2012-01-09 | 2012-01-09 | Method for producing asymmetrically laminated printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100047954A CN102548259A (en) | 2012-01-09 | 2012-01-09 | Method for producing asymmetrically laminated printed circuit board |
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| CN102548259A true CN102548259A (en) | 2012-07-04 |
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| CN2012100047954A Pending CN102548259A (en) | 2012-01-09 | 2012-01-09 | Method for producing asymmetrically laminated printed circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484879B (en) * | 2013-11-07 | 2015-05-11 | Nan Ya Printed Circuit Board | Method and apparatus for adjusting curvature of substrate |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN109432881A (en) * | 2018-12-14 | 2019-03-08 | 核工业理化工程研究院 | The preparation method of radioactive liquid waste adsorption filtration device and absorption filter element |
| CN109769356A (en) * | 2019-02-26 | 2019-05-17 | 景旺电子科技(龙川)有限公司 | A kind of production method of soft or hard combination PCB |
| CN115988779A (en) * | 2022-12-02 | 2023-04-18 | 广州添利电子科技有限公司 | Process method for improving bending of mixed material PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563361A (en) * | 1991-08-30 | 1993-03-12 | Sumitomo Bakelite Co Ltd | Manufacture of multilayer printed circuit board |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN101600298A (en) * | 2009-07-09 | 2009-12-09 | 皆利士多层线路版(中山)有限公司 | A kind of manufacture method of circuit board |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
-
2012
- 2012-01-09 CN CN2012100047954A patent/CN102548259A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563361A (en) * | 1991-08-30 | 1993-03-12 | Sumitomo Bakelite Co Ltd | Manufacture of multilayer printed circuit board |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN101600298A (en) * | 2009-07-09 | 2009-12-09 | 皆利士多层线路版(中山)有限公司 | A kind of manufacture method of circuit board |
| CN102244982A (en) * | 2011-04-06 | 2011-11-16 | 深南电路有限公司 | Method for controlling warp of local high-frequency mixed-laminated circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484879B (en) * | 2013-11-07 | 2015-05-11 | Nan Ya Printed Circuit Board | Method and apparatus for adjusting curvature of substrate |
| CN106851970A (en) * | 2017-02-27 | 2017-06-13 | 深圳市仁创艺电子有限公司 | The preparation method that a kind of thermoelectricity separates metal substrate |
| CN109432881A (en) * | 2018-12-14 | 2019-03-08 | 核工业理化工程研究院 | The preparation method of radioactive liquid waste adsorption filtration device and absorption filter element |
| CN109432881B (en) * | 2018-12-14 | 2024-01-05 | 核工业理化工程研究院 | Adsorption and filtration device for radioactive waste liquid and preparation method of adsorption filter element |
| CN109769356A (en) * | 2019-02-26 | 2019-05-17 | 景旺电子科技(龙川)有限公司 | A kind of production method of soft or hard combination PCB |
| CN115988779A (en) * | 2022-12-02 | 2023-04-18 | 广州添利电子科技有限公司 | Process method for improving bending of mixed material PCB |
| CN115988779B (en) * | 2022-12-02 | 2024-05-03 | 广州添利电子科技有限公司 | Technological method for improving bending of mixed material PCB |
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Application publication date: 20120704 |