CN101212867A - Flexible circuit board press bonding method - Google Patents
Flexible circuit board press bonding method Download PDFInfo
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- CN101212867A CN101212867A CNA2006101579977A CN200610157997A CN101212867A CN 101212867 A CN101212867 A CN 101212867A CN A2006101579977 A CNA2006101579977 A CN A2006101579977A CN 200610157997 A CN200610157997 A CN 200610157997A CN 101212867 A CN101212867 A CN 101212867A
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- pressure
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000003825 pressing Methods 0.000 claims abstract description 142
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims description 45
- 230000004888 barrier function Effects 0.000 claims description 44
- 238000009792 diffusion process Methods 0.000 claims description 44
- 239000011248 coating agent Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- 230000006835 compression Effects 0.000 claims description 19
- 238000007906 compression Methods 0.000 claims description 19
- 230000003139 buffering effect Effects 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- -1 polyethylene Polymers 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 8
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000005030 aluminium foil Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229940058401 polytetrafluoroethylene Drugs 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 241001232787 Epiphragma Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000205 computational method Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a method for pressing a flexible circuit board, which adopts a stacking structure to press the raw material of the flexible circuit board. The pressing method includes a pressing step A and a pressing step B. Using the two step pressing method of the invention can obviously reduce the glue-overflowed amount, lower the ratio of harmful bubbles increase the raising peeling strength and improve the performance of the flexible circuit board.
Description
Technical field
The present invention relates to the making of flexible circuit board, particularly a kind of compression method of flexible circuit board.
Background technology
In recent years, the development of information, communication industry has driven the high speed development of microelectronic industry.Along with the miniaturization of electronic product, various electronic devices and components also all develop towards miniaturization, miniaturization direction.The flexible print circuit board that carries various electronic devices and components is no exception certainly, presents the trend of densification development.The raw material of flexible circuit board generally comprise two-layer coverlay and are positioned at the middle Copper Foil of two-layer coverlay.Because the requirement to flexible circuit board (Flexible Printed Circuit, be called for short FPC) is also more and more higher, be used to protect the performance of the corresponding also demanding adhesion strength of coverlay of Copper Foil, heat-resisting, acid and alkali-resistance and filling capacity and various chemical mediators.As the coverlay of flexible circuit board, generally be curable adhesive-coated to polyimide film and form.The quality of the quality of coverlay depends on two aspects: the selection of adhesive material is extremely important on the one hand, generally be to select for use a kind of thermoplastic resin and thermosetting resin to mix, thermoplastic resin plays the effect of quick bonding, and thermosetting resin plays the effect of permanent bond and improves thermal endurance.Be the process for pressing of coverlay on the other hand.The development trend of densification flexible print circuit board must propose strict more requirement to the flowability of coverlay, it is mobile that excessive to be easy to generate the glue that overflows excessive, thereby cover the pad of flexible circuit board, the mobile too small bubble that is easy to generate, peel strength is low, produces defective insulation even short circuit between the flexible circuit board thereby make, moreover paste a little under the inclined to one side situation at coverlay, be easy to generate the road and go out lead, cause short circuit etc., thereby accordingly the coverlay process for pressing is proposed higher requirement.
Existing compression method is to use hot press, according to the mode lamination that is steel plate, biaxially oriented polypropylene film, flexible circuit board raw material, biaxially oriented polypropylene film, polyethylene film, silicane rubber plate, brown paper, steel plate from top to bottom, only carry out a step pressing.In the concrete pressing process, heat cured resin is melt into low viscous liquid earlier, soak into whole adhesive surfaces and fill the circuit space, discharge bubble, along with the carrying out of curing reaction, viscosity improves gradually, enters thoroughly to finish exhaust, calking behind the HTHP and evenly distribute, finishing of final realization adhesive curing cross-linking reaction, thereby the process that realization combines with molecular link interaction force coverlay and Copper Foil.
The main evaluating of compression method is: between coverlay peel strength, overflow glue amount, coverlay soldering resistance and Copper Foil and the coverlay whether bubble arranged, the presentation quality of products such as whether product has weighs wounded, wrinkle, tear the feasibility of pulling and pressing cost etc. open.
The test and the computational methods of the glue amount of overflowing are as follows: the upper strata after pressure is closed, each one of middle level and undermost product, under 100 times metallomicroscope, measure the maximum distance that the epiphragma opening part overflows and locates to glue, five fixing positions during every tensor is surveyed up and down, each five groups of data, the mean value of getting 75 groups of data is the excessive glue amount after the pressing.
Bad detection of circuit bubble and computational methods are as follows: the product that a back lamination constitutes is closed in pressure, in the middle of 30 times microscopicallies are observed circuit, whether flaxen bubble is arranged, complete all products of inspection are the bubble defect ratio with bubble product number divided by the output aggregate number.
The weak point of existing pressing mode is that the area of every layer of existing pressing mode is big, the uniformity of pressure, temperature and the material character of equipment has been proposed quite harsh requirement, thereby existing equipment is difficult to satisfy fully above-mentioned requirements.
Summary of the invention
Technical problem to be solved by this invention is the defective that remedies prior art, and a kind of compression method that can reduce the flexible circuit board of bubble bad phenomenon is provided.
Technical problem of the present invention is solved by the following technical programs:
A kind of compression method of flexible circuit board, comprise and adopt laminate structure that the raw material of flexible circuit board are carried out pressing, described pressing comprises pressing steps A and pressing step B successively, described pressing steps A is meant that the raw material to flexible circuit board carry out pressing under proper temperature and suitable pressure conditions, and described proper temperature condition comprises successively:
A1. when temperature is 40-100 ℃, keep 5min-20min;
A2. be warming up to 155-190 ℃, keep 45min-90min;
A3. when temperature is 155-190 ℃, keep 20min-60min;
A4. be cooled to 35-60 ℃ and keep 20min-50min;
Described suitable pressure conditions comprises successively:
A1. be 0.4 * 10 at pressure
6Pa～0.8 * 10
6During Pa, keep 10min～20min;
A2. be 5.5 * 10 at pressure
5Pa～2.4 * 10
6During Pa, keep 70min～120min;
A3. be 1.8 * 10 at pressure
6Pa～2.4 * 10
6During Pa, keep 20min～80min;
Described pressing step B in turn includes the following steps:
B1. in 8s-20s, be warming up to 170 ℃-190 ℃, boost to 1.03 * 10
7Pa～1.32 * 10
7Pa;
B2. be that 170 ℃-190 ℃, pressure are 1.03 * 10 in temperature
7Pa～1.32 * 10
7Pressing 80s-125s during Pa.
Preferably,
Temperature in described steps A 1, A2, A3, the A4 is kept constant respectively, and the pressure in described step a1, a2, the a3 is kept constant respectively, and temperature and pressure in described step B1, the B2 are kept constant respectively.
Laminate structure in the described pressing process is followed successively by from top to bottom: first pressing plate, first diffusion barrier, flexible circuit board raw material, second diffusion barrier, filling resilient coating, second pressing plate.
Be provided with the filling resilient coating between described first pressing plate and first diffusion barrier.
Described filling resilient coating comprise packed layer, buffering packed layer, resilient coating in one deck at least.
Be provided with filling from the shape layer between the described filling resilient coating and first diffusion barrier and/or second diffusion barrier.
Described first and second pressing plate is a steel plate, first and second diffusion barrier is a biaxially oriented polypropylene film, described first and second packed layer is polyethylene film or burns and pay iron plate or silicon aluminium foil, described resilient coating is brown paper or glass cloth, described buffering packed layer is silicane rubber plate or silica gel pad, and described filling is a poly tetrafluoroethylene from the shape layer.
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate; Described steps A 1 is to keep 10min when temperature is 40 ℃, and described steps A 2 is to keep 45min when temperature is 190 ℃, and described steps A 3 is to keep 30min when temperature is 190 ℃, and described steps A 4 is to keep 50min when temperature is 35 ℃; Described step a1 is to be 0.62 * 10 at pressure
6Keep 10min during Pa, described step a2 is to be 2.4 * 10 at pressure
6Keep 70min during Pa, described step a3 pressure is 2.1 * 10
6Keep 20min during Pa; Described pressing step B adopts the raw material, second diffusion barrier that are followed successively by first pressing plate, second packed layer, first diffusion barrier, FPC from top to bottom, fills the laminate structure from shape layer, buffering packed layer, resilient coating, first packed layer, second pressing plate; Described step B1 is warming up to 180 ℃, boosts to 1.2 * 10 in 8s
7Pa; Described step B2 is to be that 180 ℃, pressure are 1.2 * 10 in temperature
7Pa pressing 120s.
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate; Described steps A 1 is to keep 5min when temperature is 70 ℃, and described steps A 2 is to keep 75min when temperature is 170 ℃, and described steps A 3 is to keep 45min when temperature is 170 ℃, and described steps A 4 is to keep 30min when temperature is 45 ℃; Described step a1 is to be 0.8 * 10 at pressure
6Keep 15min during Pa, described step a2 is to be 1.8 * 10 at pressure
6Keep 90min during Pa, described step a3 pressure is 1.8 * 10
6Keep 50min during Pa; Described pressing step B adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate; Described step B1 is warming up to 170 ℃, boosts to 1.32 * 10 in 15s
7Pa; Described step B2 is to be that 170 ℃, pressure are 1.32 * 10 in temperature
7Pa pressing 80s.
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate; Described steps A 1 is to keep 20min when temperature is 100 ℃, and described steps A 2 is to keep 90min when temperature is 155 ℃, and described steps A 3 is to keep 60min when temperature is 155 ℃, and described steps A 4 is to keep 20min when temperature is 60 ℃; Described step a1 is to be 0.4 * 10 at pressure
6Keep 20min during Pa, described step a2 is to be 0.55 * 10 at pressure
6Keep 120min during Pa, described step a3 pressure is 2.4 * 10
6Keep 80min during Pa; Be followed successively by first pressing plate, second packed layer, first diffusion barrier, FPC raw material, second diffusion barrier, fill laminate structure from shape layer, buffering packed layer, resilient coating, first packed layer, second pressing plate; Described step B1 is warming up to 190 ℃, boosts to 1.03 * 10 in 20s
7Pa; Described step B2 is to be that 190 ℃, pressure are 1.03 * 10 in temperature
7Pa pressing 125s.
Compared with prior art, beneficial effect of the present invention is as follows:
The present invention proposes a kind of compression method of flexible circuit board, comprises two steps, and the first step is the pressing in the time of less pressure, length; Second step was at bigger pressure, the pressing of short time.Like this, realized on the one hand the bad phenomenon of bubble has been eliminated in the accurate control of the excessive glue amount of flexible circuitry panel products on the other hand significantly, increased the evenness of product.Particularly particularly evident for live width, the line-spacing fine-line panel products effect below 0.1mm.
Experimental data shows that also the compression method of flexible circuit board of the present invention can significantly reduce excessive glue amount, reduce the bubble defect ratio, improves peel strength.This can significantly promote the performance of flexible circuit board.
Description of drawings
Contrast accompanying drawing and the present invention is explained below in conjunction with embodiment.
Fig. 1 is a temperature curve schematic diagram in the first step pressing process of the present invention;
Fig. 2 is a pressure curve schematic diagram in the first step pressing process of the present invention;
Fig. 3 is the laminate structure schematic diagram in the pressing process of the present invention;
Fig. 4 is the laminate structure schematic diagram in the second step pressing process of the present invention.
Embodiment
A kind of compression method of flexible circuit board comprises the steps:
First step pressing:
As shown in Figure 1, after stacking according to the raw material 10 that are followed successively by first pressing plate 11, the first diffusion barrier 12a, FPC from top to bottom, the second diffusion barrier 12b, the laminate structure of filling resilient coating, second pressing plate 16, pressing under temperature curve shown in Figure 2 and pressure curve shown in Figure 3.
Above-mentioned filling resilient coating comprises from top to bottom successively: first packed layer 13, buffering packed layer 14, resilient coating 15.
The material of the above-mentioned pressing plate the 1 and second pressing plate 16 all is the high steel matter of hardness, to guarantee evenness, makes raw material 10 pressurizeds of FPC even.The above-mentioned first diffusion barrier 12a and the second diffusion barrier 12b are used for from shape, to guarantee that product does not adhere to other materials, preferably adopt biaxially oriented polypropylene film.Above-mentioned first packed layer, the 13 preferred polyethylene films that adopt, this polyethylene film has filling effect preferably after temperature is to melt about 110 ℃, can block up the excessive glue amount of glue control; The effect that certain buffering pressure is arranged simultaneously.Above-mentioned resilient coating 15 preferred employing brown paper are so that temperature and pressure transmission is more even.The above-mentioned buffering packed layer 14 preferred silicane rubber plates that adopt, this silicane rubber plate is made up of two sides silica gel and middle glass cloth.
As shown in Figure 2, the concrete temperature during pressing moves towards as follows: from the O point, finish to the D point through B point, C point successively.
The O point is identical with the temperature that A is ordered, and corresponding temperature range is: 40 ℃-100 ℃; O point to the time that A is ordered is 5min-20min; Correspond to warm-up phase during this period of time, during this period of time can make the FPC product arrive an even temperature.
The B point is identical with C point temperature, and corresponding temperature range is 155 ℃-190 ℃, and A point to the time that B is ordered is: 45min-90min; Correspond to the temperature rise period during this period of time, binding agent is melted fully.
B point to the time that C is ordered is: 30min-60min; Correspond to holding stage during this period of time, make fusing back binding agent fill circuit.
The temperature range that D is ordered is: 35 ℃-60 ℃, C point to the time that D is ordered is: 20min-50min; Correspond to temperature-fall period during this period of time, the binding agent after the fusing is solidified.
The temperature of above-mentioned preheating, intensification, insulation, temperature-fall period is all constant respectively, promptly remains on a fixing value in the described temperature range, for example: in warm-up phase maintains 40 ℃ of-100 ℃ of scopes always 70 ℃
As shown in Figure 3, pressure trend concrete during pressing comprises following 3 sections, and the pressure change between every section was finished in moment.
The 1st section: pressure range is: 0.4 * 10
6Pa～0.8 * 10
6Pa corresponds to the precompressed stage during this period of time, is maintained during this period of time: 10min～20min;
The 2nd section: pressure range is: 5.5 * 10
5Pa～2.4 * 10
6Pa corresponds to boost phase during this period of time, is maintained during this period of time: 70min-120min;
The 3rd section: pressure range is: 1.8 * 10
6Pa～2.4 * 10
6Pa corresponds to high pressure phase during this period of time, is maintained during this period of time: 20min-80min.
Pressure is all constant respectively in the above-mentioned every period, promptly remains on a fixing value in the described pressure range, for example: maintain 5.5 * 10 in the 2nd section always
5Pa～2.4 * 10
6In the Pa scope 2.1 * 10
6Pa.
The second step pressing:
As shown in Figure 1, after stacking according to the laminate structure identical, carry out the second step pressing with first step pressing.The technological parameter of pressing this moment the following is:
Temperature: 170 ℃-190 ℃;
Pressure: 1.03 * 10
7Pa～1.32 * 10
7Pa;
Squeeze time: 8s-20s
Pressing time: 80s-125s
The squeeze time of precompressed process is to instigate pressure to rise to 1.03 * 10
7Pa～1.32 * 10
7170 ℃-190 ℃ times that Pa, temperature rise to, the precompressed process can make the product preheating, make it to be heated evenly, thus the generation of elimination or minimizing internal stress.The effect of pressing process then mainly is to squeeze out bubble residual in the product by pressure, and it is bad to reduce bubble, strengthens the intensity of bonding.
Temperature and pressure in above-mentioned squeeze time and the pressing time are all constant respectively, promptly remain in the described temperature range and a fixing value in the pressure range, for example maintain 180 ℃ and 5.5 * 10 in 170 ℃ of-190 ℃ of scopes in squeeze time always
5Pa～2.4 * 10
6In the Pa scope 2.1 * 10
6Pa.
As shown in Figure 4, also can be after the laminate structure of shape layer 18, filling resilient coating, first packed layer 13, second pressing plate 16 stack according to the raw material 10 that are followed successively by first pressing plate 11, second packed layer 17, the first diffusion barrier 12a, FPC from top to bottom, the second diffusion barrier 12b, filling, pressing under the technological parameter of the above-mentioned second step pressing.
Above-mentioned filling resilient coating comprises from top to bottom successively: buffering packed layer 14, resilient coating 15 and first packed layer 13.
Above-mentioned first pressing plate 11 and second pressing plate 16 are made up of the high synthetic steel of hardness, and it is stable and fix second packed layer 17 and first packed layer 13 to be used to keep pressing-in temp.Above-mentioned first packed layer, 13 preferred employings are burnt a pair iron plate, and this burning is paid an iron plate and combined by one deck silicon rubber and an iron plate, and filling effect and evenness are preferably arranged, and silicon rubber is positioned at and burns the inboard of paying iron plate, provides evenness high pressing plane.Above-mentioned second packed layer, the 17 preferred silicon aluminium foils that adopt, this silicon aluminium foil is made up of one deck aluminium foil and one deck rubber, and filling effect is preferably arranged.The above-mentioned first diffusion barrier 12a and the second diffusion barrier 12b are used for from shape, to guarantee that product does not adhere to other materials, also can reduce excessive glue, preferably adopt biaxially oriented polypropylene film.Filling is filled from 18 employing of shape layer and is reached from the shape material, the preferably polytetrafluoroethylene film, and the filling effect preferably of filling from shape layer 18 can block up the excessive glue of glue control, fills the good separating effect from shape layer 18, can guarantee that product can not adhere to other materials.The above-mentioned buffering packed layer 14 preferred silica gel pads that adopt, this silica gel pad is combined by both faces rubber and middle glass cloth, and material softness has extraordinary buffering pressure and filling effect.Above-mentioned resilient coating preferably adopts glass cloth, can make the more even of pressure distribution, also has the effect from shape simultaneously.
Embodiment one:
Laminate structure is as shown in Figure 1 adopted in first step pressing, and its process conditions are as follows:
The pressing-in temp process conditions of first step pressing are as follows:
| The process for pressing parameter | O | A | B | C | D |
| Temperature (℃) | 40 | 40 | 190 | 190 | 35 |
| (min) constantly | 0 | 10 | 55 | 85 | 135 |
The pressure process conditions of first step pressing are as follows:
| The process for pressing parameter | Starting point | The 1st section | The 2nd section | The 3rd section |
| Pressure: Pa (* 10 6) | 0.62 | 0.62 | 2.4 | 2.1 |
| Time (min) | 0 | 10 | 70 | 20 |
Laminate structure is as shown in Figure 4 adopted in the second step pressing, and its process conditions are as follows:
Temperature: 180 ℃;
Pressure: 1.2 * 10
7Pa;
Squeeze time: 8S;
Pressing time: 120S.
Embodiment two:
Laminate structure is as shown in Figure 1 adopted in first step pressing, and its process conditions are as follows:
The pressing-in temp process conditions of first step pressing are as follows:
| The process for pressing parameter | O | A | B | C | D |
| Temperature (℃) | 70 | 70 | 170 | 170 | 45 |
| (min) constantly | 0 | 5 | 80 | 125 | 155 |
The pressure process conditions of first step pressing are as follows:
| The process for pressing parameter | Starting point | The 1st section | The 2nd section | The 3rd section |
| Pressure: Pa (* 10 6) | 0.80 | 0.80 | 1.8 | 1.8 |
| Time (min) | 0 | 15 | 90 | 50 |
Laminate structure is as shown in Figure 1 adopted in the second step pressing, and its process conditions are as follows:
Temperature: 170 ℃;
Pressure: 1.32 * 10
7Pa;
Squeeze time: 15S;
Pressing time: 80S.
Embodiment three:
Laminate structure is as shown in Figure 1 adopted in first step pressing, and its process conditions are as follows:
The pressing-in temp process conditions of first step pressing are as follows:
| The process for pressing parameter | O | A | B | C | D |
| Temperature (℃) | 100 | 100 | 155 | 155 | 60 |
| (min) constantly | 0 | 20 | 110 | 170 | 190 |
The pressure process conditions of first step pressing are as follows:
| The process for pressing parameter | Starting point | The 1st section | The 2nd section | The 3rd section |
| Pressure: Pa (* 10 6) | 0.40 | 0.40 | 0.55 | 2.4 |
| Time (min) | 0 | 20 | 120 | 80 |
Laminate structure is as shown in Figure 4 adopted in the second step pressing, and its process conditions are as follows:
Temperature: 190 ℃;
Pressure: 1.03 * 10
7Pa;
Squeeze time: 20S;
Pressing time: 125S.
The raw material of flexible circuit board of the present invention comprise two-layer coverlay and are positioned at the middle Copper Foil of two-layer coverlay.
Below with two comparative examples and comparison of the present invention to further specify beneficial effect of the present invention.Below two comparative examples all according to the mode lamination that is steel plate, biaxially oriented polypropylene film, flexible circuit board raw material (coverlay and Copper Foil), biaxially oriented polypropylene film, polyethylene film, silicane rubber plate, brown paper, steel plate from top to bottom, only carry out one the step pressing.
Comparative example one:
The process for pressing condition is as follows:
The pressing-in temp process conditions of pressing are as follows:
| The process for pressing parameter | O | A | B | C | D |
| Temperature (℃) | 40 | 40 | 155 | 155 | 35 |
| (min) constantly | 0 | 5 | 50 | 80 | 100 |
The pressure process conditions of pressing are as follows:
| The process for pressing parameter | Starting point | The 1st section | The 2nd section | The 3rd section |
| Pressure: Pa (* 10 6) | 0.62 | 0.62 | 1.2 | 2.1 |
| Time (min) | 0 | 10 | 70 | 20 |
Comparative example two:
The process for pressing condition is as follows:
The pressing-in temp process conditions of pressing are as follows:
| The process for pressing parameter | O | A | B | C | D |
| Temperature (℃) | 100 | 100 | 190 | 190 | 60 |
| (min) constantly | 0 | 20 | 110 | 170 | 220 |
The pressure process conditions of pressing are as follows:
| The process for pressing parameter | Starting point | The 1st section | The 2nd section | The 3rd section |
| Pressure: Pa (* 10 6) | 0.4 | 0.4 | 1.6 | 2.4 |
| Time (min) | 0 | 20 | 120 | 80 |
Overflow respectively glue amount, bubble defect ratio, epiphragma peel strength of above-mentioned three embodiments and two comparative examples detected, and testing result is as follows:
1), the test result of excessive glue amount
| Embodiment one | Embodiment two | Embodiment three | Comparative example one | Comparative example two |
| Excessive glue amount | 0.07mm | 0.10mm | 0.08mm | 0.15mm | 0.14mm |
2), the bad check result of bubble
| Embodiment one | Embodiment two | Embodiment three | Comparative example one | Comparative example two | |
| The bubble defect ratio | 2.31％ | 1.85％ | 2.03％ | 13.51％ | 12.89％ |
3), coverlay peel strength test result
| Embodiment one | Embodiment two | Embodiment three | Comparative example | Comparative example two | |
| Peel strength (N/cm) | 6.5 | 7.3 | 5.8 | 3.8 | 4.0 |
Can find from above-mentioned measurement result: the process for pressing of the two-step method that the present invention proposes is compared with existing process for pressing, mainly be to realize the curing of adhesive and realize cementation in first step pressing process, because the less effective control that can realize of pressure relatively to the glue amount of overflowing; In the process in second step, utilize relatively large pressure, squeeze out the bubble that remains in interface and the adhesive, realize the remarkable improvement bad to bubble.Experimental data also further uses method of the present invention can effectively control the glue amount of overflowing, and the reduction bubble is bad, the raising peel strength.Find to use method of the present invention can make product bubble umber of defectives reduce 90% through full inspection, yield promotes 10%.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, just make some simple deduction or replace, all should be considered as belonging to the invention protection range that the present invention is determined by claims of being submitted to.
Claims (10)
1. the compression method of a flexible circuit board comprises and adopts laminate structure that the raw material of flexible circuit board are carried out pressing, it is characterized in that:
Described pressing comprises pressing steps A and pressing step B successively, and described pressing steps A is meant that the raw material to flexible circuit board carry out pressing under proper temperature and suitable pressure conditions, and described proper temperature condition comprises successively:
A1. when temperature is 40-100 ℃, keep 5min-20min;
A2. be warming up to 155-190 ℃, keep 45min-90min;
A3. when temperature is 155-190 ℃, keep 20min-60min;
A4. be cooled to 35-60 ℃ and keep 20min-50min;
Described suitable pressure conditions comprises successively:
A1. be 0.4 * 10 at pressure
6Pa～0.8 * 10
6During Pa, keep 10min～20min;
A2. be 5.5 * 10 at pressure
5Pa～2.4 * 10
6During Pa, keep 70min～120min;
A3. be 1.8 * 10 at pressure
6Pa～2.4 * 10
6During Pa, keep 20min～80min;
Described pressing step B in turn includes the following steps:
B1. in 8s-20s, be warming up to 170 ℃-190 ℃, boost to 1.03 * 10
7Pa～1.32 * 10
7Pa;
B2. be that 170 ℃-190 ℃, pressure are 1.03 * 10 in temperature
7Pa～1.32 * 10
7Pressing 80s-125s during Pa.
2. the compression method of flexible circuit board according to claim 1 is characterized in that:
Temperature in described steps A 1, A2, A3, the A4 is kept constant respectively, and the pressure in described step a1, a2, the a3 is kept constant respectively, and temperature and pressure in described step B1, the B2 are kept constant respectively.
3. the compression method of flexible circuit board according to claim 1 and 2 is characterized in that:
Laminate structure in the described pressing process is followed successively by from top to bottom: first pressing plate, first diffusion barrier, flexible circuit board raw material, second diffusion barrier, filling resilient coating, second pressing plate.
4. the compression method of flexible circuit board according to claim 3 is characterized in that:
Be provided with the filling resilient coating between described first pressing plate and first diffusion barrier.
5. the compression method of flexible circuit board according to claim 3 is characterized in that:
Described filling resilient coating comprise packed layer, buffering packed layer, resilient coating in one deck at least.
6. the compression method of flexible circuit board according to claim 5 is characterized in that:
Be provided with filling from the shape layer between the described filling resilient coating and first diffusion barrier and/or second diffusion barrier.
7. the compression method of flexible circuit board according to claim 6 is characterized in that:
Described first and second pressing plate is a steel plate, first and second diffusion barrier is a biaxially oriented polypropylene film, described first and second packed layer is polyethylene film or burns and pay iron plate or silicon aluminium foil, described resilient coating is brown paper or glass cloth, described buffering packed layer is silicane rubber plate or silica gel pad, and described filling is a poly tetrafluoroethylene from the shape layer.
8. the compression method of flexible circuit board according to claim 7 is characterized in that:
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate;
Described steps A 1 is to keep 10min when temperature is 40 ℃, and described steps A 2 is to keep 45min when temperature is 190 ℃, and described steps A 3 is to keep 30min when temperature is 190 ℃, and described steps A 4 is to keep 50min when temperature is 35 ℃;
Described step a1 is to be 0.62 * 10 at pressure
6Keep 10min during Pa, described step a2 is to be 2.4 * 10 at pressure
6Keep 70min during Pa, described step a3 pressure is 2.1 * 10
6Keep 20min during Pa;
Described pressing step B adopts the raw material, second diffusion barrier that are followed successively by first pressing plate, second packed layer, first diffusion barrier, FPC from top to bottom, fills the laminate structure from shape layer, buffering packed layer, resilient coating, first packed layer, second pressing plate;
Described step B1 is warming up to 180 ℃, boosts to 1.2 * 10 in 8s
7Pa;
Described step B2 is to be that 180 ℃, pressure are 1.2 * 10 in temperature
7Pa pressing 120s.
9. the compression method of flexible circuit board according to claim 7 is characterized in that:
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate;
Described steps A 1 is to keep 5min when temperature is 70 ℃, and described steps A 2 is to keep 75min when temperature is 170 ℃, and described steps A 3 is to keep 45min when temperature is 170 ℃, and described steps A 4 is to keep 30min when temperature is 45 ℃;
Described step a1 is to be 0.8 * 10 at pressure
6Keep 15min during Pa, described step a2 is to be 1.8 * 10 at pressure
6Keep 90min during Pa, described step a3 pressure is 1.8 * 10
6Keep 50min during Pa;
Described pressing step B adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate;
Described step B1 is warming up to 170 ℃, boosts to 1.32 * 10 in 15s
7Pa;
Described step B2 is to be that 170 ℃, pressure are 1.32 * 10 in temperature
7Pa pressing 80s.
10. the compression method of flexible circuit board according to claim 7 is characterized in that:
Described pressing steps A adopts raw material, second diffusion barrier, first packed layer that is followed successively by first pressing plate, first diffusion barrier, FPC from top to bottom, the laminate structure that cushions packed layer, resilient coating, second pressing plate;
Described steps A 1 is to keep 20min when temperature is 100 ℃, and described steps A 2 is to keep 90min when temperature is 155 ℃, and described steps A 3 is to keep 60min when temperature is 155 ℃, and described steps A 4 is to keep 20min when temperature is 60 ℃;
Described step a1 is to be 0.4 * 10 at pressure
6Keep 20min during Pa, described step a2 is to be 0.55 * 10 at pressure
6Keep 120min during Pa, described step a3 pressure is 2.4 * 10
6Keep 80min during Pa;
Be followed successively by first pressing plate, second packed layer, first diffusion barrier, FPC raw material, second diffusion barrier, fill laminate structure from shape layer, buffering packed layer, resilient coating, first packed layer, second pressing plate;
Described step B1 is warming up to 190 ℃, boosts to 1.03 * 10 in 20s
7Pa;
Described step B2 is to be that 190 ℃, pressure are 1.03 * 10 in temperature
7Pa pressing 125s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101579977A CN100569049C (en) | 2006-12-25 | 2006-12-25 | A kind of compression method of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101579977A CN100569049C (en) | 2006-12-25 | 2006-12-25 | A kind of compression method of flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN101212867A true CN101212867A (en) | 2008-07-02 |
| CN100569049C CN100569049C (en) | 2009-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101579977A Withdrawn - After Issue CN100569049C (en) | 2006-12-25 | 2006-12-25 | A kind of compression method of flexible circuit board |
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| CN102059838A (en) * | 2010-12-31 | 2011-05-18 | 陕西生益科技有限公司 | Process method for improving dimensional stability of copper-clad plate |
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| CN105472912A (en) * | 2015-11-23 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Press fit method for high-voltage-resistant PCB with thick copper plate |
| CN105472912B (en) * | 2015-11-23 | 2018-07-31 | 深圳崇达多层线路板有限公司 | A kind of compression method of high pressure resistant thick copper PCB |
| CN105578797A (en) * | 2015-12-18 | 2016-05-11 | 景旺电子科技(龙川)有限公司 | Manufacturing method for improving excessive glue in pressing of COB |
| CN105873367A (en) * | 2016-05-27 | 2016-08-17 | 深圳崇达多层线路板有限公司 | Method for reducing warping degree of multilayer board |
| CN105873367B (en) * | 2016-05-27 | 2019-03-05 | 深圳崇达多层线路板有限公司 | A method of reducing multi-layer board angularity |
| CN106211581A (en) * | 2016-07-11 | 2016-12-07 | 深圳天珑无线科技有限公司 | The device and method of printed circuit board (PCB) levelling warpage |
| CN107072054A (en) * | 2017-05-24 | 2017-08-18 | 厦门华天华电子有限公司 | A kind of process for pressing of flexible circuit |
| CN107241865A (en) * | 2017-07-19 | 2017-10-10 | 东莞市营特电子科技有限公司 | Manufacture the equipment and its technique of FPC |
| CN107241865B (en) * | 2017-07-19 | 2023-09-12 | 广东力兹微电气技术有限公司 | Apparatus for manufacturing flexible circuit board and process thereof |
| CN107914453A (en) * | 2017-11-28 | 2018-04-17 | 信利光电股份有限公司 | A kind of plate construction and its applying method and electronic equipment |
| CN107914453B (en) * | 2017-11-28 | 2020-09-04 | 信利光电股份有限公司 | Plate structure, laminating method thereof and electronic equipment |
| CN111278221A (en) * | 2020-02-21 | 2020-06-12 | 盐城维信电子有限公司 | Quick-pressing partition plate and multilayer quick-pressing method |
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Assignee: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Assignor: BYD Co.,Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Flexible circuit board press bonding method License type: Exclusive license Record date: 20080504 |
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