CN106211581A - The device and method of printed circuit board (PCB) levelling warpage - Google Patents
The device and method of printed circuit board (PCB) levelling warpage Download PDFInfo
- Publication number
- CN106211581A CN106211581A CN201610541334.9A CN201610541334A CN106211581A CN 106211581 A CN106211581 A CN 106211581A CN 201610541334 A CN201610541334 A CN 201610541334A CN 106211581 A CN106211581 A CN 106211581A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- laminating film
- steel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses the device of a kind of printed circuit board (PCB) levelling warpage, it is used for flattening the printed circuit board (PCB) of warpage, described device includes at least one laminating film and at least two steel plates, during work described printed circuit board (PCB), described at least one laminating film be all held on described between at least two steel plates, described at least one laminating film is described in described printed circuit board (PCB) and between steel plate；A kind of method that the invention also discloses printed circuit board (PCB) levelling warpage, by said apparatus and method, the present invention can preferably flatten printed circuit board (PCB).
Description
Technical field
The present invention relates to the manufacturing technology field of printed circuit board (PCB), particularly relate to a kind of printed circuit board (PCB) levelling warpage
Device and method.
Background technology
Printed circuit board (PCB) is being manufactured and in transportation, is being likely to be due to the symmetry of PCB design, production
During produce stress, the series of factors such as mobile causes printed circuit board (PCB) to produce warpage in handling process phenomenon, thus
Affecting the electrical characteristic of circuit board, consumer electronics gradually develop to lightening direction particularly at present, and industry is to printed circuit board (PCB)
The requirement of angularity is more and more stricter.
Accordingly, it is desirable to provide a kind of device and method that can reach the printed circuit board (PCB) levelling warpage that higher leveling requires,
To solve above-mentioned technical problem.
Summary of the invention
The technical problem that present invention mainly solves is to provide the device and method of a kind of printed circuit board (PCB) levelling warpage, it is possible to
Preferably flatten printed circuit board (PCB).
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of printed circuit slab warping
The device of leveling, is used for flattening the printed circuit board (PCB) of warpage, and described device includes at least one laminating film and at least two steel plates, work
Shi Suoshu printed circuit board (PCB), described at least one laminating film be all held on described between at least two steel plates, described at least one laminating film
Described in described printed circuit board (PCB) and between steel plate.
Wherein, described laminating film is covered on described printed circuit board (PCB) or described steel plate.
Wherein, described laminating film is to have high elastic modulus and refractory polyethylene film.
Wherein, be held on described in printed circuit board (PCB) quantity between at least two steel plates be one or more of tiling.
Wherein, described at least two steel plate quantity are more than or equal to three, and are stepped construction, the most adjacent described steel plate
Between only place one layer of described printed circuit board (PCB), and the described printed circuit board (PCB) between different layers is in the position of consistency from top to bottom.
Present invention also offers a kind of method flattening warpage printed circuit board (PCB), including:
Place between at least two steel plates and include at least one laminating film and printed circuit board (PCB), and described at least one laminating film position
In described in described printed circuit board (PCB) and between steel plate；
The described printed circuit board (PCB) being held between described two steel plates is heated, utilizes described two steel plates to described simultaneously
Printed circuit board (PCB) pressurizes；
Lower the temperature to obtain the described printed circuit board (PCB) flattened.
Wherein, described heating includes: is heated to temperature and is more than 200 degree, and maintains more than one hour.
Wherein, before heating or wherein, evacuation and make described steel plate, described laminating film and described printed circuit board (PCB) tight
Contiguity is touched.
Wherein, described at least two steel plate quantity are more than or equal to three, and are stepped construction, the most adjacent described steel plate
Between only place one layer of described printed circuit board (PCB), and the described printed circuit board (PCB) between different layers is in the position of consistency from top to bottom.
Wherein, described laminating film is to have high elastic modulus and refractory polyethylene film.
The invention has the beneficial effects as follows: the apparatus and method of printed circuit board (PCB) levelling warpage of the present invention pass through described laminating film
Allow described steel plate and described printed circuit board (PCB) have a higher laminating degree, thus ensure that printed circuit board (PCB) be leveled after smooth
Degree.
Accompanying drawing explanation
Fig. 1 is a schematic diagram of the device of printed circuit board (PCB) levelling warpage of the present invention.
Fig. 2 is another schematic diagram of the device of the printed circuit board (PCB) levelling warpage of Fig. 1.
Fig. 3 is a top view of the device of the printed circuit board (PCB) levelling warpage of Fig. 1.
Fig. 4 is another top view of the device of the printed circuit board (PCB) levelling warpage of Fig. 1.
Fig. 5 is a flow chart of the method for printed circuit board (PCB) levelling warpage of the present invention.
Detailed description of the invention
The present invention will be described in detail with embodiment below in conjunction with the accompanying drawings.
Referring to the schematic diagram that Fig. 1, Fig. 1 are the devices of printed circuit board (PCB) levelling warpage of the present invention, this device includes print
Printed circuit board press 10, upper steel plate 20, lower steel plate 30 and laminating film 40, this device is used for flattening the printed circuit board (PCB) of a warpage
80, in one embodiment, this laminating film 40 is high temperature resistant and has high elastic modulus, such as, be resistant to the high temperature of 200 DEG C, and it can be poly-
Ethylene (Polyethylene, PE) film or other there is the film of above-mentioned characteristic.
Upper steel plate 20, lower steel plate 30 are the steel plate of surfacing, and printed circuit board (PCB) 80 is positioned over the upside of lower steel plate 30,
Laminating film 40 is covered in the upper surface of printed circuit board (PCB) 80, and in the present embodiment, upper steel plate 20 is pressed on laminating film 40, due to patch
Close film 40 and there is high elastic modulus, thus can ensure that upper steel plate 20 and printed circuit board (PCB) 80 have higher laminating degree；At other
In embodiment, described laminating film 40 also can be covered on described steel plate 20 or 30, and contacts with printed circuit board (PCB) 80.
This printed circuit plate pressing machine 10 includes a pressing plate 11, upper steel plate 20, laminating film 40, printed circuit board (PCB) 80 and lower steel plate
30 are placed on pressing plate 11 times, and pressing plate 11 is pressed in the upside of upper steel plate 20, and pressing plate 11 is by upper steel plate 20, laminating film 40, printed circuit
Plate 80 and lower steel plate 30 compress, thus the both sides of printed circuit board (PCB) 80 are applied certain pressure, and execute stressed big I
It is adjusted with the thickness according to printed circuit board (PCB) 80 and area, thus in the premise ensureing that printed circuit board (PCB) 80 is not subject to crushing
Lower printed circuit board (PCB) 80 is flattened.
And constant high temperature can be heated in printed circuit plate pressing machine 10, thus allow and printed circuit board (PCB) 80 is heated, favorably
Stress is discharged in printed circuit board (PCB) 80.
Refer to Fig. 2, it is possible to using the quantity multilayer steel plates 50 more than or equal to three to press, these steel plates 50 are layer
Stack structure, only places a layer printed circuit board 80, and the printed circuit board (PCB) 80 between different layers between the most adjacent steel plate 50
It is in the position of consistency from top to bottom, thus allows printed circuit plate pressing machine 10 flatten multiple printed circuit board (PCB) 80 simultaneously, but in order to ensure
The leveling effect of printed circuit board (PCB) 80, lamination number can not be too much, and lamination number is preferably less than or equal to 8, thus can improve leveling
Operation efficiency, also can guarantee that circuit board 80 be leveled after effect.
Refer to Fig. 3 and Fig. 4, also can be according to steel plate 50 and the size of printed circuit board (PCB) 80, on a block plate 50
Holding multiple pieces needs the printed circuit board (PCB) 80 of leveling simultaneously, such as, shown in Fig. 3, place 4 bar printings on a block plate 50 simultaneously
Circuit board 80；Such as shown in Fig. 4, a block plate 50 is placed 2 printed circuit board 80 simultaneously.
Also and the design of Fig. 3, Fig. 4 can be combined with the design of Fig. 2, the quantity multilamellar more than or equal to three is not only set
Steel plate 50, and on each layer of steel plate 50, holding multiple pieces needs the printed circuit board (PCB) 80 of leveling, and the print on different layers simultaneously
Printed circuit board 80 is in the position of consistency from top to bottom, thus can flatten multiple printed circuit board (PCB) 80 simultaneously.
Please also refer to Fig. 5 and Fig. 1 or Fig. 2, it is that the device using above-mentioned printed circuit board (PCB) levelling warpage flattens print
The flow chart of printed circuit board.
Step 501, places at least one laminating film 40 and a printed circuit board (PCB) 80, and described patch between at least two steel plates 50
Close film 40 between described printed circuit board (PCB) and a steel plate 50.
In step 501, two block plates 50 can be only set, it is possible to the quantity multilayer steel plates 50 more than or equal to three is set,
And place a layer printed circuit board 80 between the most adjacent steel plate 50, and the printed circuit board (PCB) 80 between different layers is in
The position of lower alignment；And the quantity of the printed circuit board (PCB) 80 placed that tiles between two-layered steel plates 50 is also dependent on steel plate 50 and print
The size of printed circuit board 80 carries out reasonable disposition.
Step 502, steel plate 50, the printed circuit board (PCB) 80 of laminating film 40 be placed in printed circuit plate pressing machine 10, evacuation
And allow steel plate 50, laminating film 40 and printed circuit board (PCB) 80 be in close contact.
Step 503, the high temperature being heated in printed circuit plate pressing machine 10 set (is greater than 200 DEG C or other temperature
Deng), thus printed circuit board (PCB) 80 is heated, and keep a period of time (such as 60 minutes or other duration etc.), print simultaneously
The pressing plate 11 of printed circuit board press 10 is to by laminated steel 50, thus pressurizes printed circuit board (PCB) 80.
Step 504, cooling, then unclamp pressing plate 11, crush board 11 no longer presses laminated steel 50 and pressure release, finally takes out and is put down
Whole printed circuit board (PCB) 80.
In above-mentioned flow process, in step 502, the operation of evacuation can be carried out before step 503, it is possible to same with step 503
Shi Jinhang.
The apparatus and method of above-mentioned printed circuit board (PCB) levelling warpage are heated by printed circuit plate pressing machine 10 and are pressed laminating
Film 40 and printed circuit board (PCB) 80, owing to laminating film 40 has high elastic modulus, thus can ensure upper steel plate 20 and printed circuit board (PCB)
80 have higher laminating degree, and allow printed circuit board (PCB) 80 discharge stress at high operating temperatures and to be driven plain, thus ensure that print
The flatness of printed circuit board 80.
The foregoing is only embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every utilization is originally
Equivalent structure or equivalence flow process that description of the invention and accompanying drawing content are made convert, or are directly or indirectly used in what other were correlated with
Technical field, is the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. a device for printed circuit board (PCB) levelling warpage, is used for flattening the printed circuit board (PCB) of warpage, it is characterised in that: described dress
Putting and include at least one laminating film and at least two steel plates, during work, described printed circuit board (PCB), described at least one laminating film are all held on
Between described at least two steel plates, described at least one laminating film is described in described printed circuit board (PCB) and between steel plate.
2. device as claimed in claim 1, it is characterised in that: described laminating film is covered in described printed circuit board (PCB) or described steel
On plate.
3. device as claimed in claim 1, it is characterised in that: described laminating film is to have elastic modelling quantity and refractory polyethylene
Film.
4. device as claimed in claim 1, it is characterised in that: printed circuit board (PCB) number between at least two steel plates described in being held on
Amount is one or more of tiling.
5. device as claimed in claim 1, it is characterised in that: described at least two steel plate quantity are more than or equal to three, and are
Stepped construction, only places one layer of described printed circuit board (PCB), and the described print between different layers between the most adjacent described steel plate
Printed circuit board is in the position of consistency from top to bottom.
6. the method flattening warpage printed circuit board (PCB), it is characterised in that including:
Place between at least two steel plates and include at least one laminating film and printed circuit board (PCB), and described at least one laminating film is positioned at institute
State described in printed circuit board (PCB) and between steel plate；
The described printed circuit board (PCB) being held between described two steel plates is heated, utilizes described two steel plates to described printing simultaneously
Circuit board pressurizes；
Lower the temperature to obtain the described printed circuit board (PCB) flattened.
7. method as claimed in claim 6, it is characterised in that: described heating includes: is heated to temperature and is more than 200 degree, and dimension
Hold more than one hour.
8. method as claimed in claim 6, it is characterised in that:
Before heating or wherein, evacuation and allow described steel plate, described laminating film and described printed circuit board (PCB) be in close contact.
9. method as claimed in claim 6, it is characterised in that: described at least two steel plate quantity are more than or equal to three, and are
Stepped construction, only places one layer of described printed circuit board (PCB), and the described print between different layers between the most adjacent described steel plate
Printed circuit board is in the position of consistency from top to bottom.
10. method as claimed in claim 6, it is characterised in that: described laminating film is to have high elastic modulus and high temperature resistant poly-
Vinyl film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610541334.9A CN106211581A (en) | 2016-07-11 | 2016-07-11 | The device and method of printed circuit board (PCB) levelling warpage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610541334.9A CN106211581A (en) | 2016-07-11 | 2016-07-11 | The device and method of printed circuit board (PCB) levelling warpage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211581A true CN106211581A (en) | 2016-12-07 |
Family
ID=57473169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610541334.9A Pending CN106211581A (en) | 2016-07-11 | 2016-07-11 | The device and method of printed circuit board (PCB) levelling warpage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211581A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107727667A (en) * | 2017-10-27 | 2018-02-23 | 浙江欧珑电气有限公司 | A kind of large scale printed circuit board defect detector |
| CN110379744A (en) * | 2019-07-31 | 2019-10-25 | 沛顿科技（深圳）有限公司 | Baking suppressor suitable for LGA molding product |
| CN110621118A (en) * | 2019-09-12 | 2019-12-27 | 泰州市博泰电子有限公司 | Circuit board hole plugging method and circuit board |
| CN110716124A (en) * | 2018-07-12 | 2020-01-21 | 东京毅力科创株式会社 | Circuit device, detector, inspection device, and method for adjusting warpage of circuit board |
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| CN1960607A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Method for pressfitting flexible circuit boards and vacuum, quick pressing device |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN101460010A (en) * | 2007-12-11 | 2009-06-17 | 亚洲电材股份有限公司 | Silica gel board used for circuit board compressing and compressing method using the board |
| CN201766771U (en) * | 2010-05-14 | 2011-03-16 | 深圳市博敏电子有限公司 | Rapid vehicle device for levelling warpage of printed circuit board |
| CN201922612U (en) * | 2010-12-31 | 2011-08-10 | 惠州市绿标光电科技有限公司 | Press |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
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2016
- 2016-07-11 CN CN201610541334.9A patent/CN106211581A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960607A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Method for pressfitting flexible circuit boards and vacuum, quick pressing device |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN101460010A (en) * | 2007-12-11 | 2009-06-17 | 亚洲电材股份有限公司 | Silica gel board used for circuit board compressing and compressing method using the board |
| CN201766771U (en) * | 2010-05-14 | 2011-03-16 | 深圳市博敏电子有限公司 | Rapid vehicle device for levelling warpage of printed circuit board |
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| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107727667A (en) * | 2017-10-27 | 2018-02-23 | 浙江欧珑电气有限公司 | A kind of large scale printed circuit board defect detector |
| CN110716124A (en) * | 2018-07-12 | 2020-01-21 | 东京毅力科创株式会社 | Circuit device, detector, inspection device, and method for adjusting warpage of circuit board |
| CN110716124B (en) * | 2018-07-12 | 2022-01-25 | 东京毅力科创株式会社 | Circuit device, detector, inspection device, and method for adjusting warpage of circuit board |
| CN110379744A (en) * | 2019-07-31 | 2019-10-25 | 沛顿科技（深圳）有限公司 | Baking suppressor suitable for LGA molding product |
| CN110621118A (en) * | 2019-09-12 | 2019-12-27 | 泰州市博泰电子有限公司 | Circuit board hole plugging method and circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |