CN108819432A - A kind of ultra-thin glue-line pressurizing attaching method and device - Google Patents
A kind of ultra-thin glue-line pressurizing attaching method and device Download PDFInfo
- Publication number
- CN108819432A CN108819432A CN201810246664.4A CN201810246664A CN108819432A CN 108819432 A CN108819432 A CN 108819432A CN 201810246664 A CN201810246664 A CN 201810246664A CN 108819432 A CN108819432 A CN 108819432A
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- China
- Prior art keywords
- pressure
- pressure chamber
- glue
- line
- substrate
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Abstract
The present invention relates to sheet material attaching process technical field, especially a kind of ultra-thin glue-line pressurizing attaching method and device.Wherein, method include by internal pressure room that the die pressing product to be added for having at least two layers of substrate and between two layers adjacent of substrate coated with glue-line is placed in an enclosed construction, guarantee that inner pressure chamber applies direction in pressure and has certain deformation quantity, inner pressure chamber is placed in the external pressure room of an enclosed construction and keeps the pressure of outer pressure chamber greater than the pressure of inner pressure chamber during applying pressure.The present invention can make pressure suffered by glue-line uniformly can be uniformly coated and diffuse between glue-line, to guarantee the fitting intensity to substrate；Relative to conventional press technique, under the requirement of fitting intensity on an equal basis, the less glue of amount or colloid can be used, and the thickness of glue-line can also be reduced to minimum, to provide condition to mitigate the weight of final products and reducing production cost.
Description
Technical field
The present invention relates to sheet material attaching process technical field, especially a kind of ultra-thin glue-line pressurizing attaching method and it is based on
The method is formed by ultra-thin glue-line pressurizing attaching device.
Background technique
With electronic industry flourish, each electronic product in addition to function it is more and more diversified with complicate other than,
Product also develops towards light, thin direction and theory.By taking touch display screen as an example, mainly by two pieces of different transparent substrates
Composition, the Glasss capacitive touch screen being such as made of face glass and glass inductive circuit board are felt by face glass and Film
It answers the Film capacitive touch screen of wiring board composition, be made of Cover Lens (touching cover board) with Sensor (touch sensor)
Touch screen etc., all this kind, is by smearing liquid glue or solid-state glue isocolloid between two pieces of substrates, then to two
After block substrate pressurizes so that colloid can equably spread and be covered between two pieces of substrates, to realize that the fitting of two pieces of substrates connects
It connects.
Currently, the pressing technology generallyd use in industry is directly to bring pressure to bear on substrate using hydraulic or atmospheric pressure machine
On, according to pressure be object suffered by the ratio between pressure and forced area this physical law, for guarantee the effect that substrate is bonded with
The product in accordance with quality requirement is produced, then the pressure on object is needed to remain unchanged or increasing；However, when product reaches
When certain size (especially large scale or oversize), then needing press machine to apply sufficiently large pressure can ideally press
Close substrate.Meanwhile in order to remove between laminating layer (i.e.：Between substrate and substrate or between substrate and colloid layer) residual gas
Bubble also can carry out pressurization patch to substrate using over-voltage pressurization (also known as vacuum takes out platen press or superpressure pressurization) in industry at present
Close, such method mainly the product of fitting to be pressurised is placed in a pressure chamber, then using the pressure of pressure chamber come
Compacting fitting object needs although such method eliminates the direct relation between press machine pressure applied and substrate sizes
Colloid used by guaranteeing is solid-state or must become solid-state by liquid during pressurization；If colloid remains liquid
State can not then be suitable for this technique, main reason is that：Pressure can not only act on substrate, at the same also can liquid state colloid to
The central area of substrate is squeezed, so that the pressure applied required for causing stress machine acutely declines, and also results in base
There is the region of even different pressure levels between material, seriously affected the fitting quality using liquid glue as the product of glue-line.Separately
Outside, the thickness of glue-line not only will affect the fitting effect of substrate, also be directly related to the weight and material cost of product, and existing
Pressing technology can not but reduce the thickness of glue-line to greatest extent.
Summary of the invention
In view of the deficiency of the prior art, one of them of the invention is designed to provide a kind of ultra-thin glue-line and adds
Press applying method；It is another object of the present invention to provide one kind to be formed by ultra-thin glue-line pressurizing attaching based on preceding method
Device.
To achieve the goals above, first technical solution that the present invention uses for：
A kind of ultra-thin glue-line pressurizing attaching method, it includes the following steps：
S1, the die pressing product to be added at least two layers of substrate and between two layers adjacent of substrate coated with glue-line is placed
In in the internal pressure room of an enclosed construction；
S2, guarantee that inner pressure chamber applies direction in pressure and has certain deformation quantity；
S3, inner pressure chamber is placed in the external pressure room of an enclosed construction；
S4, keep the pressure of outer pressure chamber greater than the pressure of inner pressure chamber during applying pressure.
Preferably, in the step S4, by keeping the pressure of inner pressure chamber constant and increasing outer pressure chamber
The mode of pressure make the pressure of outer pressure chamber during applying pressure be consistently greater than inner pressure chamber pressure.
Preferably, in the step S4, by keeping the pressure of outer pressure chamber constant and reducing inner pressure chamber
The mode of pressure make the pressure of outer pressure chamber during applying pressure be consistently greater than inner pressure chamber pressure.
Preferably, the inner pressure chamber applies the largest deformation amount on direction most not less than die pressing product to be added in pressure
Big thickness.
Second technical solution that the present invention uses for：
A kind of ultra-thin glue-line pressurizing attaching device, it include load contact base plate, be placed in above load contact base plate and with
Load contact base plate compresses cover board, is placed in load contact base plate and compresses between cover board and compressing cover board in parallelly distribute on
Moving direction has the elastic washer of certain deformation quantity and covers at outer cover in load contact base plate, it is described compress cover board,
Load contact base plate and elastic washer are formed with after enclosing jointly has at least two layers of substrate and at adjacent two layers for placing
The inner pressure chamber of die pressing product to be added between substrate coated with glue-line, the load contact base plate and outer cover enclose jointly after
The perimeter of air pressure inside room is formed with external pressure room.
Preferably, the elastic washer is made of rubber material, and the elastic washer is in the moving direction for compressing cover board
On largest deformation amount be not less than die pressing product to be added maximum gauge.
As the above scheme is adopted, the method applied in the present invention can make pressure suffered by glue-line uniformly with can be uniform
Ground is coated and is diffused between glue-line, to guarantee the fitting intensity to substrate；Relative to conventional press technique, it is being bonded on an equal basis
Under the requirement of intensity, the less glue of amount or colloid can be used, and the thickness of glue-line can also be reduced to minimum, thus to mitigate
The weight and reduction production cost of final products provide condition；And device itself then have it is simple and compact for structure, to substrate
Pressurizing attaching significant effect the features such as.
Detailed description of the invention
Fig. 1 is the inner pressure chamber of the embodiment of the present invention in the structural relation under non-pressured state between die pressing product to be added
Schematic diagram；
Fig. 2 is that structural relation of the inner pressure chamber of the embodiment of the present invention in a compressed state between die pressing product to be added is shown
It is intended to；
Fig. 3 is structural relation signal of the inner pressure chamber of the embodiment of the present invention under pressure revocation state between finished product
Figure.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
As shown in Figure 1 to Figure 3, a kind of ultra-thin glue-line pressurizing attaching method provided in this embodiment, it includes the following steps：
S1, there will be at least two layers of substrate 1 (such as touch cover board and cooperate touch sensor with it) and adjacent two
The to be pressurised of glue-line 2 (such as solid colloids such as liquid optical cement liquid glue or solid state optics glue) is coated between layer substrate 1
Product is placed in the inner pressure chamber a of an enclosed construction；
S2, guarantee that inner pressure chamber a applies stressed direction with certain deformation quantity in press machine；
S3, inner pressure chamber a is placed in the outer pressure chamber b of an enclosed construction；
S4, in the case where press machine does not apply pressure, the pressure of inner pressure chamber a is equal to the pressure of outer pressure chamber b,
And then remain that the pressure of outer pressure chamber b is greater than the pressure of inner pressure chamber a during press machine applies pressure, from
And utilize Deformation Features possessed by inner pressure chamber a (i.e.：Applying direction along pressure can produce certain deformation quantity), in guarantee
Under pressure action of the top wall surface of pressure chamber of portion a under the action of press machine or by outer pressure chamber a can with uniformly by
The form of power gradually shifts to the direction where die pressing product to be added and finally offsets with the substrate 1 for being located at top layer and gradually squeeze
Substrate 1 and glue-line 2, since inner pressure chamber a and outer pressure chamber b are relatively isolated from, can effectively enhance glue-line 2 can uniformly be squeezed
Stress is pressed, to realize effect (certainly, inner pressure chamber a and the external pressure that adjacent two layers of substrate 1 is carried out to secure fit
Pressure difference between the b of room needs to remain unchanged within a certain period of time, and this period then depend on the specific size of pressure difference with
And required reach expected 2 thickness of glue-line)；Simultaneously as pressure suffered by glue-line 2 is uniform, it can be not limited to liquid and solid-state, and
And since it can be uniformly coated because of stress and guarantee the fitting intensity to substrate, compared with traditional technique, same
Under requirement Deng fitting intensity, the less glue of amount or colloid can be used, and the thickness of glue-line 2 can also be reduced to minimum, from
And condition is provided to mitigate the weight of final products and reducing production cost.
If S5, glue-line 2 can carry out glue-line 2 after glue-line 2 reaches expected thickness using liquid glue
Curing process；
S6, when glue-line 2 solidification after the completion of, the pressure that can restore outer pressure chamber b is equal with the pressure of inner pressure chamber a
Relationship (i.e.：When the revocation of the pressure of such as press machine, the side wall of inner pressure chamber a is made to set back)；Certainly,
If pressure directly can be made recovery processing, to form final product without solidification.
Discrepancy adjustment in actual process processing, for the pressure of the pressure and inner pressure chamber a of outer pressure chamber b；
Following concrete mode can be used, i.e.,：In step s 4, by keeping the pressure of inner pressure chamber a constant and increasing external pressure
The mode of the pressure of room b make the pressure of outer pressure chamber b during applying pressure be consistently greater than inner pressure chamber a pressure
By force.Or in step s 4, by way of keeping the pressure of outer pressure chamber b constant and reducing the pressure of inner pressure chamber a
The pressure of outer pressure chamber b is set to be consistently greater than the pressure of inner pressure chamber a during applying pressure.
It is strong for fully the fitting squeezed enhance to the maximum extent between the two can be carried out to substrate 1 and glue-line 2
Degree, inner pressure chamber a apply the maximum gauge that the largest deformation amount on direction should be not less than die pressing product to be added in pressure.
Based on above scheme, as shown in Figure 1 to Figure 3, the present embodiment additionally provides a kind of ultra-thin glue-line pressurizing attaching device,
It includes load contact base plate 3, the top for being placed in load contact base plate 3 and the compressing in parallelly distribute on load contact base plate 3
Cover board 4 is placed in load contact base plate 3 and compresses between cover board 4 and in the moving direction for compressing cover board 4 with certain deformation quantity
Elastic washer 5 and cover at outer cover (not shown) in load contact base plate 3, wherein using compressing cover board 4, load
Contact base plate 3 and elastic washer 5 are formed with after enclosing jointly has at least two layers of substrate 1 and in two layers adjacent of base for placing
The inner pressure chamber a of die pressing product to be added between material 1 coated with glue-line 2, after being enclosed jointly using load contact base plate 3 and outer cover
Then external pressure room b is formed in the perimeter of internal air-pressure chamber a.It is directly carried out to compressing cover board 4 using press machine
It is even force or uniformly exerted a force using the pressure in the b of external pressure room to cover board 4 is compressed, using using compress cover board 4 as
The component directly to be exerted a force to die pressing product to be added, by keeping the pressure of inner pressure chamber a to be consistently less than during force
The method of the pressure of outer pressure chamber b enables glue-line 2 to be uniformly coated and diffuses between adjacent two layers of substrate 1,
To complete the fitting to substrate 1, since the pressure of glue-line 2 is uniform, relative to conventional press technique, in fitting intensity on an equal basis
It is required that small, the dosage of glue-line 2 can reach minimum, and then form ultra-thin glue-line, produce to reduce the production cost of product and mitigating
The weight of product provides safeguard.
As a preferred embodiment, the elastic washer 5 of the present embodiment is made of rubber material, and elastic washer 5 is supporting
Largest deformation amount on the moving direction of cover clamp 4 is not less than the maximum gauge of die pressing product to be added.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (6)
1. a kind of ultra-thin glue-line pressurizing attaching method, it is characterised in that：It includes the following steps：
S1, the die pressing product to be added at least two layers of substrate and between two layers adjacent of substrate coated with glue-line is placed in one
In the internal pressure room of enclosed construction；
S2, guarantee that inner pressure chamber applies direction in pressure and has certain deformation quantity；
S3, inner pressure chamber is placed in the external pressure room of an enclosed construction；
S4, keep the pressure of outer pressure chamber greater than the pressure of inner pressure chamber during applying pressure.
2. a kind of ultra-thin glue-line pressurizing attaching method as described in claim 1, it is characterised in that：In the step S4, lead to
It crosses and keeps the pressure of inner pressure chamber constant and increasing the mode of the pressure of outer pressure chamber is applying the pressure of outer pressure chamber
The pressure of inner pressure chamber is consistently greater than during stressed.
3. a kind of ultra-thin glue-line pressurizing attaching method as described in claim 1, it is characterised in that：In the step S4, lead to
It crosses and keeps the pressure of outer pressure chamber constant and reducing the mode of the pressure of inner pressure chamber is applying the pressure of outer pressure chamber
The pressure of inner pressure chamber is consistently greater than during stressed.
4. a kind of ultra-thin glue-line pressurizing attaching method as described in claim 1, it is characterised in that：The inner pressure chamber is being pressed
Power applies the maximum gauge that the largest deformation amount on direction is not less than die pressing product to be added.
5. a kind of ultra-thin glue-line pressurizing attaching device, it is characterised in that：It includes load contact base plate, is placed in load contact base plate
Top and with load contact base plate compressing cover board, be placed in load contact base plate and compress between cover board and supporting in parallelly distribute on
The moving direction of cover clamp has the elastic washer of certain deformation quantity and covers at the outer cover in load contact base plate, described to support
Cover clamp, load contact base plate and elastic washer are formed with after enclosing jointly has at least two layers of substrate and adjacent for placing
Two layers of substrate between be coated with glue-line die pressing product to be added inner pressure chamber, the load contact base plate and outer cover enclose jointly
External pressure room is formed in the perimeter of internal air-pressure chamber after conjunction.
6. a kind of ultra-thin glue-line pressurizing attaching device as claimed in claim 5, it is characterised in that：The elastic washer is by rubber
Material is made, and largest deformation amount of the elastic washer on the moving direction for compressing cover board is most not less than die pressing product to be added
Big thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810246664.4A CN108819432A (en) | 2018-03-23 | 2018-03-23 | A kind of ultra-thin glue-line pressurizing attaching method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810246664.4A CN108819432A (en) | 2018-03-23 | 2018-03-23 | A kind of ultra-thin glue-line pressurizing attaching method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108819432A true CN108819432A (en) | 2018-11-16 |
Family
ID=64154296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810246664.4A Pending CN108819432A (en) | 2018-03-23 | 2018-03-23 | A kind of ultra-thin glue-line pressurizing attaching method and device |
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| CN (1) | CN108819432A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776458A (en) * | 2020-12-30 | 2021-05-11 | 安徽鸿程光电有限公司 | Laminating method and medium injection device |
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|---|---|---|---|---|
| EP0836813A1 (en) * | 1996-10-18 | 1998-04-22 | Salomon S.A. | Method and apparatus for joining, by gluing and pressing, a sole to a shoe upper |
| JP2008262056A (en) * | 2007-04-12 | 2008-10-30 | Shibaura Mechatronics Corp | Device and method for bonding substrate together |
| WO2014091863A1 (en) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Optical film with adhesive on both sides and method for fabrication of image display device employing same |
| CN105954905A (en) * | 2016-07-27 | 2016-09-21 | 深圳市极而峰工业设备有限公司 | Large-size soft-pressurizing full laminating device |
| CN106042587A (en) * | 2016-06-13 | 2016-10-26 | 张家港康得新光电材料有限公司 | Pasting process of 3D film component and product pasted with 3D film component |
| CN107170874A (en) * | 2017-06-08 | 2017-09-15 | 李文联 | A kind of LED display surface protection film method for packing |
| CN206539566U (en) * | 2017-03-01 | 2017-10-03 | 国光电器股份有限公司 | A kind of pressure sensitive adhesive air pressure adhering device |
| CN208376203U (en) * | 2018-03-23 | 2019-01-15 | 深圳市飞帆泰科技有限公司 | A kind of ultra-thin glue-line pressurizing attaching device |
-
2018
- 2018-03-23 CN CN201810246664.4A patent/CN108819432A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0836813A1 (en) * | 1996-10-18 | 1998-04-22 | Salomon S.A. | Method and apparatus for joining, by gluing and pressing, a sole to a shoe upper |
| JP2008262056A (en) * | 2007-04-12 | 2008-10-30 | Shibaura Mechatronics Corp | Device and method for bonding substrate together |
| WO2014091863A1 (en) * | 2012-12-10 | 2014-06-19 | 日東電工株式会社 | Optical film with adhesive on both sides and method for fabrication of image display device employing same |
| CN106042587A (en) * | 2016-06-13 | 2016-10-26 | 张家港康得新光电材料有限公司 | Pasting process of 3D film component and product pasted with 3D film component |
| CN105954905A (en) * | 2016-07-27 | 2016-09-21 | 深圳市极而峰工业设备有限公司 | Large-size soft-pressurizing full laminating device |
| CN206539566U (en) * | 2017-03-01 | 2017-10-03 | 国光电器股份有限公司 | A kind of pressure sensitive adhesive air pressure adhering device |
| CN107170874A (en) * | 2017-06-08 | 2017-09-15 | 李文联 | A kind of LED display surface protection film method for packing |
| CN208376203U (en) * | 2018-03-23 | 2019-01-15 | 深圳市飞帆泰科技有限公司 | A kind of ultra-thin glue-line pressurizing attaching device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776458A (en) * | 2020-12-30 | 2021-05-11 | 安徽鸿程光电有限公司 | Laminating method and medium injection device |
| CN112776458B (en) * | 2020-12-30 | 2023-12-08 | 安徽鸿程光电有限公司 | Attaching method and medium injection device |
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