JPH1022183A - Manufacturing method of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form electrodes with high dimensional accuracy until the sizes of the extended parts of the electrodes formed on the adjacent surfaces of both end faces of the main body of electronic parts become sufficiently large at the time of forming the electrodes, so that the electrodes can be extended to parts of the adjacent surfaces from parts of the end faces. SOLUTION: While a coating plate 22 made of rubber, etc., which can be compression-deformed in the thickness direction is supported by a supporting member 23 made of a metal, etc., a main body 2 of electronic parts is closely adhered to the plate 22 by compression-deforming the plate 22 in the thickness direction by press-contacting an end face 3 of the main body 2 with the plate 22. While the main body 2 is closely adhered to the plate 22, conductive paste 28 is supplied to a main surface 24 of the plate 22 through a connecting pass 27 of the supporting member 23 and a slit 26 of the plate 22 until the paste 28 rises from the surface 24 and applied to part of the end face 3 of the main body 2 and parts of the adjacent surfaces 5 and 6 of the end face 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more particularly, to an electrode extending on a part of an end face of a component body provided in the electronic component and extending from the end face to a part of an adjacent face. To improve the method for forming

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing an external appearance of an electronic component 1 which is of interest to the present invention. For example, some composite electronic components constituting an array of capacitors and inductors, a filter including them, and the like have an appearance as shown in FIG.

The electronic component 1 includes a component body 2 having a hexahedral shape, for example, and a plurality of electrodes 4 serving as terminals for electrical connection to external circuit elements are provided on a part of an end surface 3 of the component body 2. Is formed. Each electrode 4 has not only a portion extending on the end face 3 but also an adjacent face extension 7 extending to a part of the adjacent faces 5 and 6 adjacent to each of the end faces 3. In the electronic component 1, the electrodes 4 are formed not only on the end face 3 of the component body 2 but also on an end face 8 facing the end face 3 in a similar manner.

In order to form the above-mentioned electrode 4, a coating device 9 as shown in FIG. 6 is used. This coating device 9
Comprises a coating plate 10 made of metal, and the coating plate 10
A plurality of slits 11 having a width corresponding to the width of each electrode 4
Is provided. The end face 3 of the component body 2 is arranged so as to be in contact with the application plate 10, and in that state, the conductive paste 1
2 is supplied under pressure until it rises on the upper surface of the application plate 10 through the slit 11. As a result, the conductive paste 12 is applied on a part of the end face 3 of the component body 2 and a part of the adjacent faces 5 and 6.

The same operation is performed on the other end face 8 of the component body 2.
Is also implemented for

Then, the conductive paste 12 applied on the component body 2 is baked, and the conductive paste 12
Thus, the electrode 4 having the adjacent surface extension 7 as shown in FIG. 5 is formed.

However, according to the method using the coating apparatus 9 shown in FIG. 6, the coating plate 10 is made of metal and thus hard, and the component body 2 is made of a hard material such as ceramic. As described above, when the end surface 3 of the component main body 2 is brought into contact with the application plate 10, a gap may be generated between the application plate 10 and the component main body 2 depending on the surface state of the component main body 2. When such a gap occurs, the electrode 4 may not be formed with a predetermined width as shown in FIG. That is, the electrode 4 is on the end face 3
As shown by an imaginary line in FIG. 7, it must be formed with a width 13, but due to the above-mentioned gap, it may be formed with a width 13 a larger than a predetermined width 13 as shown by a solid line.

As a result, in the obtained electronic component 1,
An inconvenience of forming the electrode 4 having a variation in the width direction size is encountered.

On the other hand, when the coating apparatus 14 shown in FIG. 8 is used, the above-mentioned disadvantages are avoided.

The coating device 14 has a coating plate 15 made of an elastically deformable material such as rubber. The coating plate 15 has a plurality of grooves 1 having a width corresponding to the width of the electrode 4.
6 are provided, and each groove 16 is filled with a conductive paste 17.

Next, as shown in FIG. 9, the end surface 3 of the component main body 2 is brought into contact with the coating plate 15 and the component main body 2 is pressed toward the coating plate 15 to compress the coating plate 15 in the thickness direction. Deform. As a result, the conductive paste 17 in the groove 16 is applied on the end face 3 of the component main body 2, and a part of the conductive paste 17 swells on the upper surface of the application plate 15 and is applied on the adjacent surfaces 5 and 6. Is done.

The same operation is performed on the other end face 8 of the component body 2.
Is also implemented for

Thereafter, as in the case of using the coating device 9 shown in FIG. 6, a conductive paste 17 is baked, and the conductive paste 17 is used to form an electrode 4 having an adjacent surface extension 7 as shown in FIG. Is formed.

As described above, according to the method using the coating apparatus 14 shown in FIGS. 8 and 9, a high adhesion state is achieved between the coating plate 15 and the component main body 2, and therefore, as shown in FIG. As described above, in the obtained electronic component 1, the inconvenience of forming the electrode 4 having a variation in the width direction is not encountered, but the conductive paste 17 is applied to the coating plate 15 in accordance with the compression deformation of the coating plate 15. However, as shown in FIG. 10, a problem is encountered in that there is a limit in increasing the extension 18 of the adjacent surface extension 7 of the electrode 4 as shown in FIG.

[0015]

SUMMARY OF THE INVENTION It is therefore an object of the present invention to avoid the disadvantages encountered by the two prior arts described above, to provide high dimensional accuracy and to provide sufficient extension of the adjacent surface extension. It is an object of the present invention to provide a method of manufacturing an electronic component, which includes a step of forming an electrode.

[0016]

SUMMARY OF THE INVENTION The present invention relates to a component body and an electrode formed on a part of an end face of the component body and extending from a part of the end face to a part of an adjacent face. The present invention is directed to a method of manufacturing an electronic component, and has the following configuration in order to solve the above-described technical problem.

That is, the electrode has a first main surface in contact with the end surface of the component body and a second main surface opposed thereto, and is made of a material which can be elastically deformed in the thickness direction by pressing the component body. A slit having a width corresponding to the width of the coating plate is provided, and an application plate is prepared, and a through-path in contact with the second main surface of the application plate and communicating with the slit is provided,
A support member made of a relatively rigid material is provided so as to substantially maintain the initial state of the second main surface regardless of the elastic compression deformation of the application plate.

Then, the end face of the component main body is brought into contact with the first main surface of the coating plate, and the component main body is pressed toward the coating plate, so that the coating plate is compressed and deformed in the thickness direction. The conductive paste is supplied under pressure until it rises on the first main surface through the through passage of the member and the slit of the coating plate, whereby the conductive paste is applied on a part of the end face of the component body and a part of the adjacent face. A conductive paste is applied.

In the present invention, the step of applying the above-mentioned conductive paste is preferably performed as follows. That is, first, the conductive paste is supplied under pressure until it swells on the first main surface through the through path and the slit. Next, the raised portion of the conductive paste is removed by operating the blade along the first main surface. Next, the end face of the component main body is brought into contact with the first main surface, and the component main body is pressed toward the application plate, whereby the application plate is compressed and deformed in the thickness direction. In this state, the conductive paste is pressurized again to cause the conductive paste to be applied to the adjacent surface of the component body to swell on the first main surface.

[0020]

FIG. 1 shows a method of manufacturing an electronic component, particularly a method of forming an electrode, according to an embodiment of the present invention. FIG. 1 is a sectional view showing a component main body 2 for the electronic component 1 shown in FIG. 5 and a coating apparatus 21 used for forming electrodes on the component main body 2. The coating device 21 includes a coating plate 22 and a support member 23, and the coating plate 22 and the support member 23 are shown in a perspective view in a state separated from each other in FIG.

The application plate 22 has a first main surface 24 in contact with the end surface 3 of the component main body 2 and a second main surface 25 opposed thereto.
Having. As shown in FIG. 1, the application plate 22 is made of a material, such as rubber, which can be elastically compressed and deformed in the thickness direction by pressing the component main body 2. The coating plate 22 is provided with a plurality of slits 26 having a width corresponding to the width of the electrode 4 shown in FIG.

On the other hand, the support member 23 has a plate shape in this embodiment, and is disposed so as to be in contact with the second main surface 25 of the application plate 22. When the application plate 22 is made of, for example, rubber, the application plate 22 may be formed on the support member 23. Alternatively, the separately prepared coating plate 22 and the support member 23 may be bonded with an adhesive. The support member 23 is provided with a through-path 27 communicating with the slit 26 of the application plate 22. The support member 23 is
Irrespective of the elastic compressive deformation of the coating plate 22, the second main surface 25 of the coating plate 22 is made of a material having relatively high rigidity, for example, metal so as to substantially maintain the initial state.

The coating plate 22 and the support member 23 which are superimposed as described above are arranged so as to close the upper opening of the paste tank 29 containing the conductive paste 28. A pressure cylinder 30 is provided in communication with the paste tank 29. A piston 31 is movably provided in the pressurizing cylinder 30, and the conductive paste 28 in the paste tank 29 is pressurized by the operation of the piston 31. As described above, when the conductive paste 28 is pressurized, the conductive paste 28 is supplied so as to reach the first main surface 24 of the application plate 22 through the through path 27 and the slit 26.

The pressurizing cylinder 30 and the piston 3
The pressurizing means 1 may be replaced by another pressurizing means such as a pressurizing means having a mechanism for causing compressed air to directly act on the conductive paste 28.

Further, a blade 32 operating along the first main surface 24 of the coating plate 22 is provided. This blade 3
2 is for scraping the conductive paste 28 on the application plate 22.

By using such a coating device 21, the conductive paste 28 to be the electrode 4 is coated on the component body 2. The preferred procedure of this coating method is shown in FIG.
Is shown in FIG. 3 is an enlarged cross-sectional view of a part of the application plate 22 and the support member 23.

First, the conductive paste 28 in the paste tank 29 is pressurized by the operation of the piston 31, and as a result, as shown in FIG.
Is applied through the passage 27 and the slit 26
2 until it rises on the first main surface 24.

Next, as shown in FIG. 3 (2), by operating the blade 32 in the direction of arrow 33 along the first main surface 24 of the coating plate 22, the raised portion of the conductive paste 28 is removed. Is done. As a result, the conductive paste 28 in the slit 26 is flush with the upper surface opening of the slit 26, and the amount of the conductive paste 28 existing in the slit 26 is made constant.

Next, as shown in FIG. 3 (3), the end face 3 of the component body 2 is brought into contact with the first main surface 24 of the coating plate 22, and the component body 2 is
, The application plate 22 is compressed and deformed in the thickness direction. Thereby, a high adhesion state is obtained between the first main surface 24 of the application plate 22 and the end surface 3 of the component body 2.

In this step, the conductive paste 2 in the slit 26 is formed according to the amount of compression deformation of the coating plate 22.
Although a part of 8 protrudes from the main surface 24 of the coating plate 22, this protruding alone is not enough to form the adjacent surface extension 7 of the electrode 4 shown in FIG.

While the state shown in FIG. 3 (3) is maintained, the conductive paste 28 is pressed again by the operation of the piston 31 as shown in FIG. The conductive paste 28 to be applied to the adjacent surfaces 5 and 6 of the application plate 22 rises on the first main surface 24 of the application plate 22.

Next, as shown in FIG. 3 (5), the component main body 2 is separated from the application plate 22.

In this manner, the conductive paste 28 serving as the electrode 4 is applied to the end face 3 of the component body 22, and the conductive paste 28 serving as the adjacent face extension 7 of the electrode 4 is applied to the adjacent faces 5 and 6. The conductive paste 28 is applied.

The same operation is performed on the other end face 8 of the component body 2.
Is also implemented for

In FIG. 2, as shown by imaginary lines in which a plurality of component bodies 2 are arranged in parallel on the coating plate 22, the above-described steps are performed on the plurality of component bodies 2. However, it is preferable to carry out the processes simultaneously at the same time in terms of the efficiency of the process.

Thereafter, the conductive paste 28 applied on the component body 2 is baked, and the conductive paste 28
Thus, the electronic component 1 having the electrode 4 having the adjacent surface extension 7 as shown in FIG. 5 is obtained.

Although the present invention has been described with reference to the specific embodiments illustrated in the drawings, the present invention is not limited to these embodiments, and various other embodiments are possible within the scope of the present invention. It is.

For example, the shape of the component body on which the electrode is to be formed, the region on the component body on which the electrode is to be formed, the number thereof, and the like are arbitrary.

In the above-described embodiment, the through path 27 provided in the support member 23 is provided by a plurality of elongated holes corresponding to one slit 26, as shown in FIG. May be replaced with another form of through-path. For example, the penetration path is the slit 26
It may be a slit shape similar to that described above. Also, as shown in FIG. 4, the through passage 27a may be provided by a number of relatively small circular holes corresponding to one slit 26 (shown by an imaginary line).

In the above-described embodiment, the support member 23 is formed in a plate shape. However, the present invention is not limited to this, and any other shape may be used as long as the support member 23 has only a surface in contact with the second main surface 25 of the application plate 22. It may be.

In the above-described embodiment, as shown in FIG. 1, for example, in the step of applying the conductive paste 28, the conductive paste 28 is applied from the bottom to the top with the end face 3 to be coated facing downward. However, the direction of the end face 3 to be coated can be arbitrarily changed in consideration of the viscosity of the conductive paste 28, such as upward, side, or oblique. .

[0042]

As described above, according to the present invention, the coating plate having the first and second main surfaces and made of an elastically deformable material is attached to the second main surface of the coating plate. By contacting the end face of the component main body with the first main surface of the application plate and pressing the component main body while substantially maintaining the initial state by the supporting member made of a relatively high-rigidity material that contacts the application plate, In a state of being compressed and deformed in the thickness direction, the conductive paste is supplied under pressure until it rises on the first main surface through the through-path of the support member and the slit of the application plate, whereby a part of the end surface of the component body is provided. Applying a conductive paste on the upper and part of the adjacent surface is performed.

Therefore, a high contact state is achieved between the component body and the coating plate, so that the width of the electrode in the obtained electronic component does not vary, and the electrode is formed with high dimensional accuracy. Can be. Moreover, for the extension of the adjacent surface of the electrode, the conductive paste is positively supplied under pressure, and the conductive paste is applied to the adjacent surface by being raised on the first main surface of the coating plate. Therefore, the dimension of the extension of the adjacent surface can be made sufficiently large, and the accuracy of the dimension can be increased.

In the present invention, in performing the step of applying the conductive paste, it is preferable to first supply the conductive paste until it rises on the first main surface through the through path and the slit. By operating the blade along the main surface, the raised portion of the conductive paste is removed, and then the end surface of the component main body is brought into contact with the first main surface, and the component main body is pressed, whereby the coating plate is pressed. Are compressed and deformed in the thickness direction, and in this state, the conductive paste is pressed again to cause the conductive paste to be applied to the adjacent surface of the component body to rise on the first main surface. However, if such an embodiment is adopted, at the stage before the component body is brought into contact with the first main surface of the application plate, the conductive material remaining in the slit Paste can be removed. Therefore, since the fresh conductive paste can be always applied on the end face and the adjacent face of the component body, the change in the viscosity of the conductive paste can be reduced between the repeated steps of applying the conductive paste. it can. As a result, it is possible to reduce variations in the dimensions of the formed electrodes between the steps of applying the conductive paste. Also, the first of the coating plates
At the stage before contacting the component body with the main surface of the blade, when the raised portion of the conductive paste is removed by the operation of the blade, the amount of the conductive paste in the slit can be always constant, so that It becomes easy to make the amount of swelling of the conductive paste formed in the step of applying the conductive paste a desired value. In this regard,
In the process of applying the conductive paste, it is possible to reduce the variation in the dimensions of the formed electrodes and, when a plurality of electrodes are formed in one component body, to reduce the variation in the dimensions between these electrodes. Can be.

[Brief description of the drawings]

FIG. 1 is a front view showing a cross section of a coating apparatus 21 used in an electrode forming step included in a method for manufacturing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a coating plate 22 and a support member 23 shown in FIG. 1 separately from each other.

FIG. 3 shows a typical process included in a method of applying a conductive paste 28 performed by using the application device 21 shown in FIG. 1, in which an application plate 22 and a part of a support member 23 are enlarged. Is shown.

FIG. 4 is a view for explaining another embodiment of the present invention, in which a supporting member 2 provided with a through-path 27a of another form is provided.
FIG.

FIG. 5 is a perspective view showing an appearance of an electronic component 1 which is of interest to the present invention.

6 is a front view showing a part of a conventional coating apparatus 9 used for forming the electrodes 4 of the electronic component 1 shown in FIG.

7 is an enlarged perspective view showing a part of the component main body 2 for explaining a problem that may be encountered in forming an electrode by the coating device 9 shown in FIG. 6;

8 is a front view showing a cross section of another conventional coating apparatus 14 used to form the electrodes 4 of the electronic component 1 shown in FIG.

9 is a diagram illustrating a part main body 2 using the coating apparatus 14 illustrated in FIG.
FIG. 4 is a front view showing a step of applying a conductive paste 17 to the substrate in a cross section.

FIG. 10 is an enlarged perspective view showing a part of the component main body 2 to explain a problem that may be encountered in forming an electrode by the coating apparatus 14 shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component main body 3, 8 End surface 4 Electrode 5, 6 Adjacent surface 7 Adjacent surface extension 21 Coating device 22 Coating plate 23 Support member 24 1st main surface 25 2nd main surface 26 Slit 27, 27a Penetration path 28 conductive paste 29 paste tank 31 piston 32 blade

Claims (2)

[Claims] 1. A method for manufacturing an electronic component, comprising: a component body; and an electrode formed on a part of an end surface of the component body and extending from a part of the end surface to a part of an adjacent surface. Having a first main surface in contact with an end surface of the component main body and a second main surface facing the first main surface, the first main surface being made of a material elastically compressively deformable in a thickness direction by pressing the component main body; An application plate provided with a slit having a width corresponding to the width of the electrode; and a through-path that is in contact with the second main surface and communicates with the slit, and is provided regardless of elastic compression deformation of the application plate. And a supporting member made of a material having a relatively high rigidity so as to substantially maintain an initial state of the second main surface. An end surface of the component body is brought into contact with the first main surface, and Pressing the component body toward the application plate Thereby, in a state where the application plate is compressed and deformed in the thickness direction, the conductive paste is supplied under pressure until it swells on the first main surface through the through path and the slit,
Accordingly, a method of manufacturing an electronic component, comprising: applying the conductive paste on a part of an end surface of the component main body and a part of an adjacent surface. 2. The step of applying the conductive paste comprises: supplying the conductive paste under pressure until the conductive paste swells on the first main surface through the through path and the slit; By operating the blade along the surface, the raised portion of the conductive paste is removed, and then the end surface of the component body is brought into contact with the first main surface, and the component body is attached to the coating plate. By compressing the conductive paste in the thickness direction, the conductive paste to be applied to the adjacent surface of the component body is pressed again by pressing the conductive paste again in that state. The method of manufacturing an electronic component according to claim 1, further comprising each step of swelling on the first main surface.