JP2891052B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing an electronic component characterized by a method for forming electrodes serving as terminals on the outer surface of a chip-shaped electronic component. It is about.

[0002]

2. Description of the Related Art FIG. 4 shows a typical example of a chip-shaped electronic component of interest to the present invention. The electronic component 1 shown here includes a chip 2 constituting its main body,
Electrodes 3 and 4 serving as terminals are formed on both ends of the chip 2. The electrodes 3 and 4 are usually formed by applying a paste containing a metal powder to each end of the chip 2 and then baking the paste.

FIG. 5 shows a process for applying a paste to one end of the chip 2. Multiple chips 2
Are held by the holder 5 with one end protruding. The holder 5 includes a lattice-shaped core material 6 and an elastic body 7 made of rubber, for example, formed so as to cover the core material 6. A holding hole 8 for receiving the chips 2 one by one is formed in the elastic body 7. , Provided so as to penetrate the elastic body 7. Therefore, the chip 2 inserted into the holding hole 8
Are elastically clamped.

On the other hand, a paste 9 for forming the electrodes 3 and 4
Is applied on the surface 11 of the application board 10 with a constant film thickness.
The holder 5 is brought close to such a coating board 10,
Thereby, one end of each chip 2 is immersed in the paste 9. When the chip 2 is pulled up from the application board 10, the paste 9 is applied to one end of each of the chips 2.

When further applying paste 9 to the other end of chip 2, after paste 9 applied to one end is dried, as shown in FIG. Is transferred to the second holder 5a. That is, the holding hole 8 of the holder 5a is aligned with the holding hole 8 of the holder 5, and the tip 2 is pressed toward the holder 5a by the pusher pin 12. Thus, the chip 2 is held by the holder 5a. Thereafter, the paste 9 is also applied to the other end of each of the chips 2 by a process similar to the process shown in FIG.

[0006]

Referring to FIG. 4, when the electronic component 1 is particularly small, the size of each of the electrodes 3 and 4 extending along the side surface from the end face of the chip 2 is relatively large. High accuracy is required. This dimension 13 is
Although it originally depends on the thickness of the paste 9 shown in FIG. 5, if the heights of the chips 2 held by the holder 5 (or 5a) are different from each other, the dimension 13 May be smaller than the desired value.

Also, electrodes 3 and 4 are provided at both ends of chip 2.
In order to form the paste, a transfer step as shown in FIG. 6 is necessary. In this case, however, the paste 9 is surely rubbed by the inner peripheral surface of the holding hole 8. For this reason, in the obtained electronic component 1, a defect may occur in the electrode 3 or 4. Further, the inner peripheral surface of the holding hole 8 may be contaminated with the paste 9, and the paste 9 attached to the inner peripheral surface of the holding hole 8 may adhere to an undesired portion of the chip 2.

Therefore, an object of the present invention is to provide a method for manufacturing an electronic component, which can solve the above-mentioned problems.

[0009]

SUMMARY OF THE INVENTION The present invention is directed to a method of manufacturing an electronic component, comprising a chip constituting a main body of an electronic component, wherein an electrode is formed on at least one end of the chip. In order to solve the above-mentioned technical problem, the method includes the following steps.

In the method for manufacturing an electronic component according to the present invention,
Two fixed plates which are arranged in a fixed positional relationship with each other in a state where a predetermined interval is formed therebetween, and each of which has a plurality of penetrating portions for penetrating a plurality of chips; The movable plate is disposed so as to be able to reciprocate relatively in the plate surface direction with respect to the fixed plate while being sandwiched between the fixed plates, and has a wall portion for narrowing the inner diameter of the through portion by the operation in one direction. A holder comprising a plate is used. Further, a pressing member having an elastic body provided on one surface is prepared.

In order to hold a plurality of chips by the holder described above, first, the movable plate is relatively moved so as to narrow the inner diameter of the penetrating portion with the chips penetrating the penetrating portion of the fixed plate. Is done.

In the above-mentioned state, the holder is brought close to the coating plate on which the paste to be an electrode is applied with a constant thickness on its surface, so that one end of each of the plurality of chips becomes the paste. Immersed in.

In the state described above, the movable plate is relatively operated so as to widen the inner diameter of the penetrating portion, whereby
The holding of the plurality of chips by the holder is released.

Next, a pressing member is brought close to the coating board so that the elastic body presses each other end of the plurality of chips, whereby one end of each chip is brought into contact with the surface of the coating board. Force to let.

Next, the movable plate is relatively operated so as to reduce the inner diameter of the through portion, whereby the chip is again held by the holder. In this state, the holder is separated from the application board, whereby the paste-applied chip is pulled up from the application board.

When electrodes are to be formed at both ends of the chip, as described above, the chip is pulled up from the coating board, the holder is turned over, and then the dipping step, the step of releasing the holding, Is forced to contact the surface of the application board, the step of holding the chip by a holder, and the step of lifting the chip from the application board are repeated.

[0017]

In the present invention, the holder can hold and release the chip by the relative movement of the movable plate. Therefore, when the plurality of chips are pressed by the elastic body in the released state of the holder, all the chips can be brought into contact with the surface of the coating plate even if the plurality of chips have dimensional variations. it can.

Further, as described above, since the holder capable of selectively taking each of the holding and releasing states is used,
When the chip is to be moved in the penetrating portion of the holder, the chip may be set in the released state, so that the paste applied to the chip is not strongly rubbed when moving.

[0019]

As described above, according to the present invention, all the chips can be brought into contact with the surface of the coating board in a state where each end of the plurality of chips is immersed in the paste. It is easy to set the dimensions (corresponding to the dimension 13 in FIG. 4) of the electrodes formed at the ends of the electrodes to a predetermined value with high accuracy, and to reduce the variation in the dimensions among a plurality of electronic components. It can be extremely small.

In the present invention, when electrodes are to be formed at both ends of a chip, a paste for one electrode is applied to one end of the chip, the holder is turned over, and then the other electrode is formed. What is necessary is just to repeat the process substantially the same as the process of applying the paste for one electrode so that the paste may be applied. As described above, there is no chip transfer step conventionally required, and therefore, the step of applying paste for electrodes to both ends of the chip can be efficiently performed. Moreover, since there is no transfer step, the paste applied to the chip is not strongly rubbed, and as a result, it is possible to prevent the occurrence of defective portions in the electrodes of the obtained electronic component.

[0021]

FIG. 1 is a sectional view schematically showing two steps included in a method of manufacturing an electronic component according to an embodiment of the present invention. In this embodiment, an electronic component 1 shown in FIG. 4 is obtained. FIG. 1 shows a holder 14 for holding a plurality of chips 2 for a plurality of electronic components 1. . Details of the structure of the holder 14 are shown in FIGS.
Is shown in

The holder 14 has two fixing plates 15 and 1
6 and a movable plate 17 disposed between the fixed plates 15 and 16. The fixed plates 15 and 16 are each made of, for example, a plate having a thickness of 0.15 mm, and the movable plate 17 is made of, for example, a plate having a thickness of 0.10 mm.

The fixing plates 15 and 16 are fixed to each other via a spacer 18 with a predetermined space therebetween. Therefore, as shown in FIG. 3, mounting holes 19 and 20 are provided in the fixing plates 15 and 16 and the spacer 18, and screws 21 (FIG. 2) inserted into these mounting holes 19 and 20 allow the fixing plates 15 and 16 to be fixed. And 1
6 are fixed to each other via a spacer 18. The fixing of the fixing plates 15 and 16 to each other is not limited to screwing, and any means such as welding can be used.

The fixing plates 15 and 16 are provided with a plurality of penetrating portions 22 and 23 for penetrating the plurality of chips 2 respectively. Each of these penetrations 22 and each of penetrations 23 are aligned with each other. The through portions 22 and 23 are each provided by a through hole in this embodiment, but may be provided by, for example, a notch as long as the chip 2 can be penetrated. The penetrating portions 22 and 23 define a size larger than the cross-sectional size of the chip 2.

On the other hand, the movable plate 17 comprises the fixed plates 15 and 1
6, between the fixed plates 15 and 16 so as to be able to reciprocate in the plate surface direction. The movable plate 17 has a wall portion 24 for reducing the inner diameters of the through portions 22 and 23 by the operation in one direction. In this embodiment, the movable plate 17 has a plurality of through holes 25 corresponding to the through portions 22 and 23, and the above-described wall portion 24
5 provided by one side edge.

It is important that the movable plate 17 has the wall portion 24, and the mode of forming the through-hole 25 is arbitrary. For example, two adjacent through-holes 25 are 1
A cutout may be provided instead of the through-hole 25 even if the through-hole is formed.

The movable plate 17 is provided with an operating portion 26 projecting from between the fixed plates 15 and 16. A driving force for causing the movable plate 17 to reciprocate is provided via the operation unit 26. The movable plate 17 may be reciprocated by a driving source such as a motor, a cylinder, or a solenoid, or may be manually reciprocated. Also,
The operation between the movable plate 17 and the fixed plates 15 and 16 is as follows.
It is only required that the movable plate 17 be relatively movable.
May be fixed and the fixed plates 15 and 16 may be movable, or both the fixed plates 15 and 16 and the movable plate 17 may be movable.

The movable plate 17 is preferably made of an elastic material such as rubber as a whole, or has at least a wall portion 24.
May be made of an elastic body. Further, fixing plates 15 and 16 may be made of an elastic body.

The holder 14 as described above is attached to a pressing member 27 by a chuck member 28 as shown in FIG. The chuck member 28 is preferably
The holder 14 is made detachable. The pressing member 27 is provided with an elastic body 29 made of, for example, rubber having a thickness of about 3 mm. The elastic body 29 is located so as to face the holder 14.

On the other hand, the paste 30 to be the electrodes 3 and 4 shown in FIG. 4 is prepared in a state of being applied on the surface 32 of the application board 31 with a constant film thickness.

A method for obtaining the electronic component 1 shown in FIG. 4 in such a configuration will be described below.

First, a plurality of chips 2 are respectively penetrated into the respective penetrating portions 22 and 23 of the fixing plates 15 and 16 provided in the holder 14, and in this state,
The movable plate 17 is operated so as to reduce the inner diameters of the through portions 2 and 23. As a result, as shown in FIG.
Each chip 2 is sandwiched by one side edge of each of the penetrating portions 22 and 23 and the wall portion 24, and is held by the holder 14.

Next, the holder 14 holding the plurality of chips 2 is attached to the pressing member 27 by the chuck member 28. In this state, the pressing member 27 is lowered, and the holder 14 approaches the application board 31. Thereby, each one end of the plurality of chips 2 is
It is immersed in the paste 30.

Next, as shown in FIG.
The movable plate 17 is operated so as to widen the inner diameters of 2 and 23. Thus, the holder 14 releases the holding of the plurality of chips 2.

Next, the pressing member 27 is further lowered, and the elastic body 29 presses the other ends of the plurality of chips 2. Thereby, the paste 30 of each chip 2
The one end located inside is forced into a state in which it all contacts the surface 32 of the coating board 31.

Next, the movable plate 17 is operated so that the inner diameters of the penetrating portions 22 and 23 are reduced again, whereby the chip 2 is held by the holder 14.
In this state, the pressing member 27 is raised, and
The holder 14 is separated from the application board 31. as a result,
The chips 2 having the paste 30 applied to one end thereof are pulled up from the application board 31. Thereafter, the paste 30 applied to the chip 2 is dried.

Next, paste 3 is applied to the other end of chip 2.
To give 0, the holder 14 is turned upside down,
It is attached to the pressing member 27 via the chuck member 28. Hereinafter, substantially the same as the case of applying the paste 30 to the one end described above, a step of dipping the chip 2 into the paste 30, a step of releasing the holding of the chip 2 by the holder 14, and a step of applying the chip 2 to the application board 31. The step of forcibly bringing the chip 2 into contact with the surface 32, the step of holding the chip 2 again by the holder 14, and the step of pulling up the chip 2 from the coating board 31 are repeated.

In this way, the paste 30 is applied to both ends of the chip 2 and then the paste 30 is baked, so that the electrodes 3 and 4 are formed on both ends of the chip 2 as shown in FIG. Is done.

As described above, the electronic component 1 shown in FIG. 4 can be manufactured without encountering the above-mentioned problems of the prior art.

In the illustrated embodiment, the holder 14
Is attached to the pressing member 27 via the chuck member 28, and the holder 14 and the pressing member 27 are operated integrally. However, the holder 14 is operated independently of the pressing member 27. You may.

[Brief description of the drawings]

FIG. 1 is an illustrative sectional view showing two representative steps included in a method of manufacturing an electronic component according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view showing a part of a holder 14 shown in FIG.

3 is a perspective view showing fixed plates 15 and 16 and a movable plate 17 provided on a holder 14 shown in FIG. 2 separately from each other.

FIG. 4 is a perspective view showing a typical example of an electronic component 1 of interest to the present invention.

FIG. 5 shows a chip 2 included in a conventional method of manufacturing an electronic component.
FIG. 5 is an illustrative sectional view showing a step of applying paste 9 to the paste.

FIG. 6 shows a chip 2 included in a conventional method for manufacturing an electronic component.
FIG. 9 is an illustrative sectional view showing a transfer step.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Chip 3, 4 electrode 14 Holder 15, 16 Fixed plate 17 Movable plate 18 Spacer 22, 23 Penetration part 24 Wall part 27 Pressing member 29 Elastic body 30 Paste 31 Application board 32 surface

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01G 13/00

Claims (2)

(57) [Claims] 1. A method for manufacturing an electronic component, comprising: a chip constituting a main body of an electronic component, wherein an electrode is formed on at least one end of the chip, wherein a predetermined interval is formed between each other. Two fixed plates each having a plurality of penetrating portions that are arranged in a fixed positional relationship to each other in the state and penetrate a plurality of the chips, and the two fixed plates are sandwiched between the two fixed plates. A movable plate having a wall disposed so as to be capable of reciprocating relative to the fixed plate in the plate surface direction and having a wall for narrowing the inner diameter of each of the through portions by the movement in one direction. In addition, a pressing member having an elastic body provided on one surface is prepared, and the movable plate is relatively moved so as to reduce the inner diameter of the penetrating portion in a state where the chips are respectively passed through the penetrating portions of the fixing plate. To Operating, thereby bringing the plurality of chips into a state of being sandwiched by the holder, bringing the holder close to a coating plate on which paste serving as the electrode is applied with a constant thickness on its surface, By soaking each one end of the plurality of chips in the paste, the movable plate is relatively operated so as to widen the inner diameter of the penetrating portion, and thereby, the plurality of chips Release the holding by the holder, and then bring the pressing member closer to the coating plate so that the elastic body presses the other end of each of the chips, whereby the one of the chips is Force the end to abut the surface of the applicator plate, then move the movable plate relatively to narrow the inner diameter of the penetration, thereby moving the chip forward A state in which the chip is held by the holder, and in that state, the holder is separated from the coating board, whereby the chip provided with the paste is pulled up from the coating board. Method. 2. After the chip is pulled up from the coating board, the holder is turned over, the dipping step, the releasing step, and the step of forcing the chip into contact with the surface of the coating board, The method for manufacturing an electronic component according to claim 1, wherein a step of holding the chip by a holder and a step of pulling up the chip from a coating board are repeated.