JP3019099B1 - Method of handling chip-shaped component and method of manufacturing chip-shaped electronic component - Google Patents

Abstract

A strip-shaped electrode can be efficiently formed so as to extend continuously on four side surfaces of a quadrangular prism-shaped component body. SOLUTION: After a band-shaped electrode 9 is formed on a first side surface 5 of a component body 2 while being held by a holder,
From this holder, the component body 2 is transferred to a region 22 on the main surface of another holder 13 and adjacent to the opening of the cavity 14. Next, with the working surface 18 of the holding member 19 provided by the elastic material 17 in contact with the component body 2, the holding member 19 is
After the component main body 2 is rolled as indicated by an arrow 24 by parallel translation in the direction, the component main body 2 is inserted into the cavity 14 of the holder 13. In this state, a strip-shaped electrode 9 is formed on the second side surface 6 of the component body 2. By repeating these steps, the electrodes 9 extending continuously on the four side surfaces 5 to 8 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for handling chip-shaped components and a method for manufacturing chip-shaped electronic components.

More specifically, the present invention uses a holder having a cavity for accommodating a chip-shaped component, such as a component body of a chip-shaped electronic component, and sequentially exposes different side surfaces of the component body to openings of the cavity. A method for handling chip-shaped components, which is advantageously applied in a situation where it is necessary to perform the process, and a process for forming electrodes over a plurality of side surfaces of the component body are performed while basically using the handling method. And a method for manufacturing a chip-shaped electronic component.

[0003]

2. Description of the Related Art FIG. 7 is a perspective view showing the appearance of a chip-shaped electronic component 1 which is of interest to the present invention.

[0004] The chip-shaped electronic component 1 has a component body 2. The component body 2 is a square having two opposite end surfaces 3 and 4 and first, second, third and fourth side surfaces 5, 6, 7 and 8 connecting between the end surfaces 3 and 4. It has a column shape. The first, second, third and fourth sides 5, 6, 7 and 8 are arranged in this order.

On the first to fourth side surfaces 5 to 8, for example, two strip-shaped electrodes 9 and 10 are formed so as to extend continuously, respectively. In other words, while the electrodes 9 and 10 are formed so as to cross each of the first to fourth side surfaces 5 to 8, respectively,
It is formed so as to go around the outer surface of the component body 2.
The electrodes 9 and 10 function as, for example, terminal electrodes of the chip-shaped electronic component 1, and as described above, the component body 2
For example, unnecessary inductance components can be reduced by being formed so as to go around the outer surface.

The above-mentioned electrodes 9 and 10 are usually formed by applying a conductive paste and baking it. When applying a conductive paste for forming such electrodes 9 and 10, a holder 11 as shown in FIG. 8 is used.

Referring to FIG. 8, holder 11 has a plate shape, and has a cavity 12 for accommodating component body 2 therein. In order to allow a plurality of component bodies 2 to be handled simultaneously by one holder 11, only one cavity is provided in FIG. 8, but a plurality of cavities 12 are provided. It is housed individually.

Each cavity 12 is formed with a through-hole penetrating through the holder 11, at least the inner peripheral surface of which is made of an elastic material, and has a size capable of elastically holding the component body 2. Therefore, each cavity 12
When the component main body 2 is inserted into the inside, the component main body 2 is pushed into the cavity 12.

As shown in FIG. 8, the component body 2 is held by the holder 11 with one side surface, for example, the first side surface 5 exposed or projected from the opening of the cavity 12. In this state, for example, by applying screen printing, a conductive paste is applied so as to form strip-shaped electrodes 9 and 10 on first side surface 5 of component body 2. FIG. 8 shows only one electrode 9.

Next, after the above-mentioned conductive paste is dried as required, the component body 2 is taken out of the holder 11, and this time, for example, the second side surface 6 is exposed.
The component body 2 is inserted into the cavity 12 of the holder 11. At this time, a plurality of holders 11 are prepared,
A holder different from the initially used holder 11 may be used.

Next, as in the case of the first side surface 5 described above, a conductive paste is applied so as to form strip-shaped electrodes 9 and 10 on the second side surface 6.

Thereafter, the insertion of the component main body 2 into the cavity 12 and the application of the conductive paste for forming the electrodes 9 and 10 as described above are repeated while changing the direction of the component main body 2 to thereby obtain the electrode 9. And 10 are formed around the outer surface of the component body 2.

[0013]

As described above, the strip-shaped electrodes 9 and 10 are provided on the first to fourth side surfaces 5 to 8, respectively.
Are formed so as to extend continuously, it is impossible to complete the application of the conductive paste for forming these electrodes 9 and 10 in one step.
The application of the conductive paste must be performed in a separate step for each of the first to fourth side surfaces 5 to 8.
Moreover, when applying these conductive pastes,
A state in which the component main body 2 is held by the holder 11 in each direction must be realized while sequentially changing the direction of the component main body 2 so as to expose each of the first to fourth side surfaces 5 to 8.

For this reason, as described above, it is possible to efficiently and reliably perform the handling of sequentially changing the holding posture of the small chip-shaped components such as the component main body 2 by the holder 11 for a large number of chip-shaped components. That is where it is desired to be.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of handling a chip-like component and a method of manufacturing a chip-like electronic component using the same, which can satisfy the above-mentioned demands.

[0016]

According to the present invention, there is provided a method for handling a chip-shaped component, comprising: two opposing end faces;
First, second, third and fourth connecting these end faces.
The first and second aspects of the present invention are directed to a method of handling a quadrangular prism-shaped chip-shaped component, in which the first, second, third and fourth sides are arranged in this order. In order to solve the problem, the method includes the following steps.

That is, the method for handling chip-like parts according to the present invention is as follows. (1) A plurality of cavities for accommodating chip-like parts one by one is provided, and the opening of each cavity is formed along its main surface. Providing a holding member that is distributed and has a working surface provided by an elastic material while providing a holder; (2) a first and third side surface extending parallel to the main surface of the holder; Disposing the chip-shaped component on a region adjacent to the opening of each cavity on the main surface of the holder so as to be in a state, and (3) placing the pressing member on the operation surface facing the main surface of the holder. And (4) relatively moving the holding member and the holder in parallel with each other by contacting the working surface of the holding member with the plurality of chip-shaped components while arranging the holding members. The action of the holding member is such that the second and fourth side faces of the tip-shaped component extend in parallel with the main surface of the holder, and each tip-shaped component is brought to a position covering the opening of each adjacent cavity. A rolling step of rolling each chip-shaped component in contact with the surface on the main surface of the holder; and (5) the second and fourth side surfaces of each chip-shaped component extend parallel to the main surface of the holder. Inserting each chip-shaped component into each cavity while maintaining the state.

In the above-described method for handling chip-like parts according to the present invention, preferably, the preparing step includes preparing the above-mentioned holder as a first holder and preparing a plurality of pieces for accommodating chip-like parts one by one. And a step of preparing a second holder, in which the openings of the cavities are distributed along the main surface thereof, wherein the arranging step includes disposing the chip-like component on the first and third side surfaces. An accommodating step of accommodating in each cavity of the second holder in a state of extending in parallel with the main surface of the second holder;
While arranging the main surfaces of the holder in parallel with each other, the chip-shaped component housed in each cavity of the second holder is
A transfer step of transferring the area on the main surface of the first holder and adjacent to the opening of each cavity.

In the preferred embodiment described above, more preferably, the first and second holders each have a plate shape, and the cavities of the first and second holders are respectively formed by the first and second holders. It is formed with a through-hole penetrating the holder, at least the inner peripheral surface of which is made of an elastic material, and has a size capable of elastically holding the chip-shaped component.

When the above-described configuration is adopted, in the insertion step, each chip-shaped component is inserted into each cavity so as to be pushed into the cavity. It is preferable to push the chip-shaped component into each cavity.

Similarly, when the above-described configuration is employed, in the above-described transfer step, a plurality of pushers are inserted from one opening of each cavity toward the other opening, thereby forming the second holder. It is preferable to extrude the chip-shaped component housed in the cavity.

In the method of handling a chip-shaped component according to the present invention, it is preferable that the elastic material that provides the working surface of the pressing member is rubber.

In the method for handling a chip-shaped component according to the present invention, the side surfaces of the chip-shaped component sequentially exposed from the opening of the cavity are changed at least by two side surfaces by sequentially changing the holding posture of the chip-shaped component by the holder. However, after the above-described insertion step, by repeating the above-described arrangement step, contact step, rolling step and insertion step, the four side surfaces of the chip-shaped component are sequentially exposed. The holding posture of the chip-shaped component by the holder can be sequentially changed.

The present invention also provides two opposing end faces and first, second, and second connecting faces.
A quadrangular prism-shaped component main body having third and fourth side faces, the first, second, third and fourth side faces being arranged in this order, and at least the first and second side faces The present invention is also directed to a method of manufacturing a chip-shaped electronic component in which a strip-shaped electrode is formed so as to extend continuously. This method of manufacturing a chip-shaped electronic component is characterized by including the following steps in order to solve the above-described technical problem.

That is, according to the method of manufacturing a chip-shaped electronic component according to the present invention, there are provided (1) a plurality of component bodies, and a plurality of cavities for accommodating the component bodies one by one. Providing a first and second holder having a cavity opening distributed along a main surface thereof and a holding member having a working surface provided by an elastic material; and (2) a component body. To
An accommodating step of accommodating in each cavity of the second holder such that the first side surface is exposed from the opening of each cavity of the second holder; and (3) the first exposed from the opening of each cavity. A first electrode forming step of forming a strip-shaped electrode on the side surface of the second holder, and (4) placing the main surfaces of the first and second holders in parallel with each other in the respective cavities of the second holder. The housed component body is positioned adjacent to the opening of each cavity on the main surface of the first holder such that the first and third side surfaces extend in parallel with the main surface of the first holder. Transferring on the area, the transferring process,
(5) While arranging the holding member so that the operation surface faces the main surface of the first holder,
Contacting the working surface of the holding member,
(6) By relatively moving the holding member and the holder in parallel, the second and fourth side surfaces of each component main body extend in parallel with the main surface of the first holder, and
A rolling step of rolling each component body in contact with the working surface of the holding member on the main surface of the first holder so that each component body is brought to a position covering the opening of the adjacent cavity. (7) While maintaining the state where the second and fourth side surfaces of each component body extend parallel to the main surface of the holder, the second side surface is exposed from the opening of each cavity of the first holder. And (8) a second electrode forming step of forming a strip-shaped electrode on the second side surface exposed from the opening of each cavity. Features.

Such a method of manufacturing a chip-shaped electronic component basically uses the above-described method of handling a chip-shaped component.
The preferred embodiment adopted in the above-described method for handling chip-shaped components can be appropriately adopted.

[0027]

1 to 6 illustrate an embodiment of the present invention. This embodiment is directed to a method for manufacturing the chip-shaped electronic component 1 shown in FIG. 7, and more specifically, a strip-shaped electrode 9 on the first to fourth side surfaces 5 to 8 of the component main body 2. And 10 are each formed to extend continuously.

In this embodiment, a plurality of component bodies 2 are prepared, and in addition to the holder 11 shown in FIG. 8, a holder having the same structure as the holder 11 as shown in FIGS. 13 are prepared. As in the case of the holder 11, the holder 13 is provided with a plurality of cavities 14 for accommodating the component main bodies 2 one by one, and the openings of the cavities 14 are formed along the main surface of the holder 13. And are distributed in rows. Similarly to the holder 11, the holder 13 has a plate shape, and each cavity 14 is formed with a through hole penetrating the holder 13, at least the inner peripheral surface of which is made of an elastic material. It has dimensions that can be clamped by

As shown in FIGS. 1 and 2, an extruding member 16 forming a plurality of pushers 15 corresponding to the positions of the cavities 12 and 14 of the holders 11 and 13 is prepared.

As shown in FIGS. 3 to 6, a holding member 19 having a working surface 18 provided by an elastic material 17 such as rubber is prepared. Working surface 1
8 is the cavity 12 or 1 of the holder 11 or 13
4 has an area that covers the region where it is provided.

After the completion of the preparatory steps, an accommodation step of accommodating a plurality of component bodies 2 in the respective cavities 12 of the holder 11 is performed as shown in FIG. In this housing step, each component body 2 is pushed into each cavity 12, and the first side surface 5 of the component body 2 is exposed or protrudes from the opening of the cavity 12.

Next, a first electrode forming step of forming strip electrodes 9 and 10 on the first side face 5 of the component body 2 exposed from the opening of the cavity 12 as described above is performed. . More specifically, a conductive paste to be electrodes 9 and 10 is applied, for example, by screen printing. The electrodes 9 and 10 may be formed by printing a conductive paste or applying dry plating, for example.

FIG. 1 shows that a plurality of component bodies 2 are held by the holder 11 and
The state in which strip-shaped electrodes 9 and 10 are formed on the first side face 5 of FIG.

Next, as shown in FIG. 1, the holders 11 and 13 are arranged so that the main surface of the holder 11 and the main surface of the other holder 13 are parallel to each other. A pushing member 16 is arranged above the above. Further, a spacer 20 is disposed between the holders 11 and 13. The spacer 20 is provided with a plurality of penetrating positioning holes 21 corresponding to the positions of the cavities 12 and 14 of the holders 11 and 13, respectively. Each positioning hole 21 has a dimension that gives a slight clearance to the component main body 2 so as to allow the component main body 2 to pass therethrough.

The holders 11 and 13 and the spacer 20 are superimposed as shown in FIG. 2. At this time, as shown in FIG. 1, the cavity 12 and the spacer 20 of the holder 11 are superposed. The positioning hole 21 is positioned so as to face a region 22 adjacent to the opening of the cavity 14 of the holder 13.

In the above-described state, by pushing the pushing member 16 toward the holder 13, a plurality of pushers 15 are inserted from one opening of each cavity 12 of the holder 11 to the other opening. As shown in FIG. 2, the component main body 2 housed in each cavity 12 of the holder 11 is pushed out. The extruded component body 2 is positioned on the main surface of the holder 13 and on the region 22 adjacent to the opening of each cavity 14 while being positioned in the positioning hole 21 of the spacer 20.

In this manner, the component main body 2 accommodated in each cavity 12 of the holder 11 is moved so that the first and third side surfaces 5 and 7 extend in parallel with the main surface of the holder 13. The transfer process in which the transfer is performed on the region 22 adjacent to the opening of each cavity 14 on the main surface of the holder 13 is completed.

After the completion of the transfer step, the pushing member 16, the holder 11, and the spacer 20 are removed. FIG. 3 shows the state of the component body 2 after the transfer process is completed.

Next, as shown in FIG.
8 so that the holding member 8 faces the main surface of the holder 13.
9 are arranged. In this state, the pressing member 19 is moved closer to the holder 13 so that the action surface 1 of the pressing member 19 is
8 is brought into contact, and a contact step is performed.

In this contact step, since the working surface 18 is provided by the elastic material 17,
The contact surfaces 18 contact the working surfaces 18 with all of the component bodies 2 even when there is a certain degree of dimensional variation among the multiple component bodies 2 at a portion where they contact. be able to.

Next, as shown by an arrow 23 in FIG. 4, the pressing member 19 is moved in parallel with respect to the holder 13. This translation is performed by the holding member 19.
It is sufficient to relatively translate the and the holder 13 relatively. Therefore, in addition to moving only the holding member 19 as described above, even if only the holder 13 is moved, both the holding member 19 and the holder 13 are moved. You may move it.

As described above, the holding member 19 and the holder 13
Are relatively translated, each component body 2 in contact with the working surface 18 of the pressing member 19 rolls on the main surface of the holder 13 as shown by an arrow 24. As a result of this rolling step, as shown in FIG. 5, the second and fourth side surfaces 6 and 8 of each component main body 2 are in a state of extending parallel to the main surface of the holder 13, and each component main body 2 is adjacent to each other. Is brought to a position covering the opening of each cavity 14.

During the rolling process as described above, the working surface 18 provided by the elastic material 17 is
Elastically deformed along the outer shape of, it is easy to roll all the component bodies 2 reliably and at once, and it is also possible to prevent the component bodies 2 from being damaged. In particular, when rubber is used as the elastic material 17, a high friction coefficient due to rubber can be expected, so that all the component bodies 2 can be more reliably rolled with high reliability.

Next, as a result of the above-described rolling process, the holder 1
Each component main body 2 brought to a position covering the opening of each cavity 14 of FIG. 3 holds the state where the second and fourth side surfaces 6 and 8 extend in parallel with the main surface of the holder 13 in FIG.
As shown in (2), the second side surface 6 is inserted into each cavity 14 so that it is exposed or protrudes from the opening of each cavity 14 of the holder 13.

In the above-described insertion step, the pressing member 19 is used as it is, and the component main body 2 is pressed into each cavity 14 by the pressing member 19. As described above, if the holding member 19 is used also in the insertion step, the transition from the above-described rolling step to the insertion step can be smoothly performed, and the cavity 1 of the holder 13 can be moved.
Undesired displacement or inclination of the component main body 2 to be inserted into the component 4 can be suppressed.

Next, after the pressing member 19 is removed,
A second electrode forming step for forming band-shaped electrodes 9 and 10 on the second side surface 6 of each component body 2 exposed from the opening of each cavity 14 of the holder 13 is performed. This second electrode forming step proceeds in substantially the same manner as the above-described first electrode forming step.

As described above, the component body 2 in which the strip-shaped electrodes 9 and 10 are continuously extended on the first and second side surfaces 5 and 6, respectively, is obtained. A strip-shaped electrode 9 is also provided on the third side 7 and the fourth side 8.
When forming the first and second electrodes 10, after the second electrode forming step, the above-described transfer step, contact step, rolling step, inserting step, and second electrode forming step are repeated as many times as necessary.

In the transfer step in such a repetitive stage, the holder 11 is used again, and the transfer of the component main body 2 from the holder 13 to the holder 11 is performed, or another holder is prepared. Holder 13 to holder
The component main body 2 may be relocated.

As described above, when the electrodes 9 and 10 are formed of a conductive paste, a step of baking the conductive paste is performed at any stage in order to obtain the chip-shaped electronic component 1.

As described above, the present invention has been described in relation to the illustrated embodiment.
Various modifications are possible.

For example, in the illustrated embodiment, as shown in FIG.
Although the holding member 19 used in the rolling step is used as it is for inserting the, another member may be used.

In the illustrated embodiment, the end faces 3 and 4 of the component body 2 are substantially square, so that the first
Although the fourth to fourth side surfaces 5 to 8 have the same shape and dimensions as each other, the end surfaces are rectangular, and the first and third side surfaces and the second and fourth side surfaces have different shapes and sizes. The present invention can also be applied to a case in which the present invention is provided. In this case, the cavity 12 provided in the holder 11 and the cavity 14 provided in the holder 13 are:
It will have different shapes and dimensions from each other.

Further, as the holders 11 and / or 13, a holder having a bottomed cavity instead of a through hole, or a holder having a cavity for accommodating a component main body with an appropriate clearance may be used.

For example, when the first and second holders each having a bottom and provided with a cavity for accommodating the component body 2 with an appropriate clearance are used, the second holder is used.
When the component body 2 is to be transferred from the first holder to the first holder, first, the first holder is overlapped so as to be positioned on the second holder, and then the first and second holders are kept in the overlapped state. If the vertical relationship of the second holder is reversed, the component main body 2 can be transferred onto the first holder by gravity acting on the component main body 2.

Further, the holder may be provided with an operating member that operates so that the inner diameter of the cavity can be expanded and contracted while the cavity is formed with a through hole. In this case, the component main body 2 in the cavity can be held in the cavity or discharged from the cavity by the operation of the operation member.

In the illustrated embodiment, the strip-shaped electrodes 9 and 10 are formed on the side surfaces 5 to 8 of the component body 2.
The formation position, number, width, shape, and the like of such electrodes can be arbitrarily changed as necessary.

In the illustrated embodiment, the strip-shaped electrodes 9 and 10 are formed on the first to fourth side surfaces 5 to 8 of the component main body 2.
Has been described as being carried out on each of the side surfaces 5 to 8, but the opposing side surfaces of the component body 2, that is, the first and third side surfaces 5 and 7 or the second and fourth side surfaces 6 and 8 By using a holder having a thickness that allows both to be exposed, both the first and third side surfaces 5 and 7 or the second and third sides can be used for the component body 2 held in a specific posture by the holder. The electrode forming step can be performed on both of the fourth side surfaces 6 and 8. If such a configuration is adopted, each of the electrodes 9 and 10 can be formed on the four side surfaces 5 to 8 simply by performing one rolling step.

The present invention can be applied to a case other than forming electrodes on the side surfaces of the component body. For example, the present invention can be applied to the case where various operations such as marking on a side surface of a component main body and measurement of electrical characteristics of a chip-shaped electronic component are performed.

In the illustrated embodiment, since the component main body 2 is disposed on the holder 13 for performing the rolling step, the component main body 2 is transferred from another holder 11 for holding the component main body 2. Without using the latter holder 11, for example, using a suitable alignment device that can arrange a plurality of component bodies 2 in a predetermined position in an aligned state, the cavity on the main surface of the holder 13 is used. The component main body 2 may be arranged on the region 22 adjacent to the opening 14.

Although the above-described embodiment relates to a method of manufacturing or handling a chip-shaped electronic component 1, the present invention is also applicable to a method of handling a chip-shaped component other than a chip-shaped electronic component. Can be.

[0061]

As described above, according to the method for handling chip-like parts according to the present invention, a holder provided with a plurality of cavities for accommodating chip-like parts one by one is used. After arranging the chip-shaped parts on the main surface and on the area adjacent to the opening of each cavity, the contacting surface of the holding member, provided by the elastic material, is brought into contact with the plurality of chip-shaped parts, and By relatively translating the holder and the tip, the tip-like component rolls on the main surface of the holder, thereby bringing each tip-like component into a position covering the opening of each adjacent cavity, and Since each chip-shaped component is inserted into each cavity, it is possible to efficiently obtain the state inserted into each cavity while changing the direction of a plurality of chip-shaped electronic components. That.

Further, as described above, since the working surface of the pressing member is provided by an elastic material, even if there is a dimensional variation among a plurality of chip-shaped components, the working surface is all chip-shaped. The contact with the component and the rolling of the chip component can be ensured, and the damage of the chip component can also be prevented.

In the method for handling a chip-shaped component according to the present invention, the first and second holders are used as holders, and the chip-shaped components housed in the cavities provided in the second holder are placed on the first holder. By disposing the chip-shaped component on the main surface of the first holder and adjacent to the opening of each cavity, the chip-shaped component on such a specific region can be obtained. Can be efficiently performed.

When the first and second holders are used as described above, each of the holders has a plate shape, and each cavity is formed with a through hole penetrating the holder, and at least the inner peripheral surface thereof is formed. When the chip-shaped component is made of an elastic material and has a dimension capable of elastically holding the chip-shaped component, the holding state of the chip-shaped component in the cavity can be easily obtained, and the chip-shaped component from the cavity can be obtained. Can be easily discharged. Therefore, the above-described transfer can be realized by a simple operation.

Further, as described above, when the cavity formed with the through hole has a structure capable of elastically holding the chip-shaped component, a pushing step for inserting each chip-shaped component into the cavity is performed. In the above, if each chip-shaped part is pushed into each cavity by using the holding member used in the rolling step, the transition from the rolling step to the insertion step can be smoothly advanced, and each chip Undesired displacement or inclination of the shaped part can be suppressed.

Further, in the above-mentioned transfer step, a plurality of pushers are inserted from one opening of each cavity toward the other opening to push out the chip-like parts housed in each cavity of the second holder. With this configuration, the chip-shaped component can be easily and reliably transferred onto the first holder without changing the posture of the chip-shaped component held by the second holder.

Further, in the method of handling a chip-shaped component according to the present invention, if rubber is used as the elastic material for providing the working surface of the pressing member, the coefficient of friction with the chip-shaped component can be increased. In the rolling step, the chip-shaped component can be reliably rolled without applying much pressure to the chip-shaped component, and therefore, the chip-shaped component can be hardly damaged.

On the other hand, according to the method of manufacturing a chip-shaped electronic component according to the present invention, since the structure provided for the above-described method of handling the chip-shaped component is basically provided, the effects provided by this method of handling are provided. Can be efficiently performed while forming the strip-shaped electrodes so as to extend continuously on at least two side surfaces of the quadrangular prism-shaped component body.

[Brief description of the drawings]

FIG. 1 shows holders 11 and 13 prepared in a method of manufacturing a chip-shaped electronic component according to an embodiment of the present invention;
FIG. 4 is a perspective view showing a state in which each part of an extruding member 16 and a spacer 20 is separated from each other.

2 is a cross-sectional view showing a state where the holders 11 and 13 and a spacer 20 shown in FIG. 1 are superimposed, and the component body 2 is pushed out of a cavity 12 of the holder 11 by a pusher 15 of an pushing member 16;

FIG. 3 is a perspective view showing a positional relationship between the component main body 2 and a cavity 14 of a holder 13 after the process shown in FIG. 2 is completed, and showing a state in which a holding member 19 is separated from the component main body 2.

4 shows a state in which the operating surface 18 of the pressing member 19 shown in FIG. 3 is in contact with the component main body 2, and the component main body 2 is moved in parallel with the holder 13 by moving the pressing member 19 in parallel with the holder 13. FIG. 5 is a cross-sectional view for explaining a rolling step of rolling on the main surface of FIG.

FIG. 5 is a cross-sectional view showing a state after a rolling step is completed from the state shown in FIG. 4;

FIG. 6 shows a state in which the component body 2 is moved from the state shown in FIG.
FIG. 7 is a cross-sectional view for explaining a step of inserting the inside of the cavity 14 of FIG.

FIG. 7 is a chip-shaped electronic component 1 of interest to the present invention.
FIG.

8 is a cross-sectional view showing a state in the middle of the manufacturing method for obtaining the chip-shaped electronic component 1 shown in FIG. 7, and showing a state in which the component main body 2 is held by the holder 11. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip-shaped electronic component 2 Component main body 3, 4 End surface 5 1st side surface 6 2nd side surface 7 3rd side surface 8 4th side surface 9, 10 Band-shaped electrode 11, 13 Holder 12, 14 Cavity 15 Pusher 17 Elasticity Material 18 Working surface 19 Holding member 22 Area adjacent to opening

Continuation of the front page (56) References JP-A-11-45837 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 43/00 H01G 13/00 391 H01L 21/44

Claims (13)

(57) [Claims] A first, a second, a third, and a fourth side face connecting between the end faces; and a first, a second, a third, and a fourth side face connecting the end faces. A side surface of which is arranged in this order, a method for handling a quadrangular columnar chip-shaped component, wherein a plurality of cavities for accommodating the chip-shaped components one by one is provided, and an opening of each of the cavities is formed. Preparing a holder distributed along the main surface thereof, and preparing a holding member having an operation surface provided by an elastic material; and a first and third side surfaces of the holder. Disposing the chip-shaped component on a region adjacent to the opening of each of the cavities on the main surface of the holder so as to extend parallel to the main surface; The working surface is in front A contact step of contacting the working surface of the holding member with a plurality of chip-shaped components while arranging the holding member so as to face the main surface of the holder; The parallel movement causes the second and fourth side surfaces of each of the chip-shaped components to extend in parallel with the main surface of the holder, and the chip-shaped components of adjacent ones of the cavities are adjacent to each other. Rolling each of the chip-shaped components in contact with the working surface of the holding member on the main surface of the holder so as to be brought to a position covering the opening;
A rolling step; inserting each of the chip-shaped components into each of the cavities while maintaining a state in which the second and fourth side surfaces of each of the chip-shaped components extend parallel to the main surface of the holder; And a method for handling chip-shaped components. 2. The method according to claim 1, wherein the preparing step includes preparing the holder as a first holder, providing a plurality of cavities for accommodating the chip-shaped components one by one, and opening the opening of each of the cavities. A step of preparing a second holder distributed along a surface, wherein the arranging step includes the step of disposing the chip-shaped component such that the first and third side surfaces are in contact with the main surface of the second holder. An accommodating step of accommodating in each of the cavities of the second holder in a state of extending in parallel, and the second holder while arranging the main surfaces of the first and second holders in parallel with each other; Transferring the chip-shaped component housed in each of the cavities to a region on the main surface of the first holder and adjacent to the opening of each of the cavities, comprising: Claim 1 Chip-like component handling method according. 3. The first and second holders each have a plate shape, and the cavities of each of the first and second holders are formed with through holes penetrating the first and second holders. 3. The method of handling a chip-shaped component according to claim 2, wherein at least an inner peripheral surface thereof is made of an elastic material and has a dimension capable of elastically holding the chip-shaped component. 4. The method for handling chip parts according to claim 3, wherein said inserting step includes a step of pressing each of said chip parts into each of said cavities by said holding member. 5. The transfer step includes inserting a plurality of pushers from one opening of each of the cavities to the other opening of the second holder so that the tip-like shape is accommodated in each of the cavities of the second holder. The method for handling chip-shaped components according to claim 3 or 4, further comprising a step of extruding the components. 6. The method for handling a chip-shaped component according to claim 1, wherein the elastic material that provides the working surface of the pressing member is rubber. 7. The method for handling a chip-shaped component according to claim 2, wherein after said inserting step, said arranging step, said contacting step, said rolling step and said inserting step are repeated. 8. The first, second, third and fourth side surfaces having two end surfaces facing each other, and first, second, third and fourth side surfaces connecting between the end surfaces. Side parts are arranged in this order, comprising a quadrangular prism-shaped component body,
A method of manufacturing a chip-shaped electronic component, wherein a strip-shaped electrode is formed so as to extend continuously on at least the first and second side surfaces, wherein a plurality of the component main bodies are prepared, First and second holders are provided, provided with a plurality of cavities for accommodating the component bodies one by one, the openings of each of the cavities being distributed along a main surface thereof, and an elastic material. A preparing step of preparing a pressing member having an action surface; and a step of preparing the component main body so that the first side surface is exposed from the opening of each cavity of the second holder. An accommodating step of accommodating in each of the cavities, the first exposing from the opening of each of the cavities;
A first electrode forming step of forming a strip-shaped electrode on the side surface of the first holder and the first holder and the second holder while arranging the main surfaces of the first and second holders in parallel with each other. The component main body accommodated in the first holder on the main surface of the first holder such that the first and third side surfaces extend in parallel with the main surface of the first holder. Transferring to an area adjacent to the opening of each of the cavities; a transferring step; and arranging the pressing member such that the working surface faces the main surface of the first holder, A contacting step of bringing the working surface of the holding member into contact with a component main body; and relatively moving the holding member and the holder in parallel with each other, whereby the second and fourth parts of each of the component main bodies are moved.
So that the side surface of the first holder extends in parallel with the main surface of the first holder, and each component body is brought to a position covering the opening of the adjacent cavity.
A rolling step of rolling each component body in contact with the working surface of the holding member on the main surface of the first holder; and a second and fourth side surface of each component body. While maintaining the state extending in parallel with the main surface of the holder, each of the component main bodies is inserted into each of the cavities such that the second side surface is exposed from the opening of each of the cavities of the first holder. Inserting, inserting, and the second exposed from the opening of each of the cavities.
Forming a strip-shaped electrode on the side surface of the electronic device, and a second electrode forming step. 9. The first and second holders each have a plate shape, and the cavities of each of the first and second holders are formed with through holes penetrating the first and second holders. 9. The method for manufacturing a chip-shaped electronic component according to claim 8, wherein at least an inner peripheral surface thereof is made of an elastic material and has a dimension capable of elastically holding the component main body. 10. The method of manufacturing a chip-shaped electronic component according to claim 9, wherein said inserting step includes a step of pushing each said component body into each of said cavities by said holding member. 11. The component main body received in each of the cavities of the second holder by inserting a plurality of pushers from one opening of each of the cavities toward the other opening of the cavity. The method for manufacturing a chip-shaped electronic component according to claim 9, further comprising a step of extruding. 12. The method for manufacturing a chip-shaped electronic component according to claim 8, wherein the elastic material that provides the working surface of the pressing member is rubber. 13. The method according to claim 8, wherein after the second electrode forming step, the transfer step, the contacting step, the rolling step, the inserting step, and the second electrode forming step are repeated. A method for producing a chip-shaped electronic component according to any one of the above.