JP4013619B2 - Electronic component handling apparatus and electronic component handling method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component handling apparatus and an electronic component handling method.
[0002]
[Prior art]
Chip-type electronic components such as chip resistors, chip capacitors, and chip coils are manufactured using, for example, an alignment device (holder) described in Japanese Patent Laid-Open No. 7-66088. As shown in FIG. 9, the alignment device 61 includes two fixed plates 62 and 63 and a movable plate 64 disposed between the fixed plates 62 and 63. The fixing plates 62 and 63 are fixed in a state where a predetermined interval is secured via a spacer (not shown).
[0003]
The fixing plates 62 and 63 are provided with a plurality of holes 65 and 66 for penetrating the plurality of electronic component chips 68, respectively. However, only one hole is shown in FIG. The holes 65 and 66 are aligned with each other. The movable plate 64 is disposed between the fixed plates 62 and 63 so as to be slidable relative to the fixed plates 62 and 63 in the plate surface direction. The movable plate 64 is provided with a hole portion 67. By sliding the movable plate 64 in one direction, the inner diameters of the hole portions 65 and 66 of the fixed plates 62 and 63 are respectively narrowed by one side wall portion 67a of the hole portion 67. be able to.
[0004]
The aligning device 61 having the above configuration is placed on a reference table (holding plate) 70 of the height adjusting device in order to align the holding positions of the plurality of electronic component chips 68. Thereafter, the electronic component chip 68 is inserted into the holes 65 and 66 of the fixed plates 62 and 63, and the movable plate 64 is slid in the direction of the arrow K so as to reduce the inner diameter of the holes 65 and 66 in this state. . As a result, the electronic component chip 68 is sandwiched between the one side wall portions 65 a and 66 a of the hole portions 65 and 66 and the one side wall portion 67 a of the hole portion 67 and is held by the aligning device 61.
[0005]
[Problems to be solved by the invention]
However, as shown in FIG. 9, when the electronic component chip 68 is not in the correct posture and enters the holes 65 and 66 in a tilted posture, the conventional aligning device 61, when the movable plate 64 is slid, There is a risk that the electronic component chip 68 may be damaged by being locally pushed by the movable plate 64 or rubbed by the reference table 70. Therefore, the conventional alignment device 61 needs to put the electronic component chip 68 into the holes 65 and 66 in a correct posture.
[0006]
In addition, the conventional aligning device 61 requires a separate height adjusting device in order to align the holding positions of the plurality of electronic component chips 68.
[0007]
Accordingly, an object of the present invention is to provide an electronic component handling apparatus and an electronic component handling method that can accommodate a chip-like workpiece regardless of the posture and do not require a height adjusting device.
[0008]
[Means and Actions for Solving the Problems]
In order to achieve the above object, an electronic component handling apparatus according to the present invention comprises:
(A) a first plate provided with a plurality of holes,
(B) a second plate provided with a plurality of positioning pins respectively inserted into the plurality of holes,
(C) In a state where the positioning pins are inserted through the hole portions, the first plate and the second plate are combined so as to be relatively slidable in the plate surface direction, and chip-shaped workpieces each having the hole portions as openings are accommodated. Forming a recess for the
It is characterized by.
[0009]
Further, the electronic component handling method according to the present invention uses the electronic component handling apparatus having the above-described features, and slides the first plate and the second plate relative to each other in the plate surface direction so that the chip shape is accommodated in the recess. The workpiece is positioned by the hole wall of the hole and a positioning pin.
[0010]
With the above configuration, the chip-shaped workpiece can be accommodated in the recess regardless of the posture, and the bottom surface of the hole (the top surface of the second plate) is the reference in the height direction. A device becomes unnecessary. Furthermore, even when the chip-shaped workpiece is housed in the recess in a tilted posture, the posture is corrected without damaging the chip-shaped workpiece by supporting and pressing the entire chip-shaped workpiece with the positioning pins or the bottom surface of the recess. be able to. Further, by creating the positioning pin with an elastic body, the dimensional variation of the chip-like workpiece can be absorbed by the positioning pin.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of an electronic component handling apparatus and an electronic component handling method according to the present invention will be described below with reference to the accompanying drawings.
[0012]
[First Embodiment, FIGS. 1 to 5]
As shown in FIGS. 1 and 2, the electronic component handling apparatus 1 generally includes a first plate 2, a second plate 3, and a housing 7 for housing the first plate 2 and the second plate 3. I have.
[0013]
The first plate 2 is provided with a plurality of holes 4 arranged in a lattice pattern. The second plate 3 is provided with a plurality of positioning pins 5 that are respectively inserted into the holes 4 of the first plate 2. The material of the first plate 2 and the second plate 3 is a resin such as bakelite or a metal such as stainless steel. The material of the positioning pin 5 is the same material as that of the elastic body such as rubber or the second plate 3. When the positioning pin 5 and the second plate 3 are made of the same material, integral molding is also possible. The positioning pins 5 are provided so as to be planted on the upper surface of the second plate 3. The positioning pins 5 are cylindrical, but may be prismatic. The height of the positioning pin 5 is not particularly limited as long as the chip-shaped workpiece can slide, but preferably has a height that does not allow the chip-shaped workpiece to ride on the tip of the pin.
[0014]
The first plate 2 and the second plate 3 are combined so as to be relatively slidable in the plate surface direction in a state where each of the positioning pins 5 is inserted into each of the holes 4. That is, the first plate 2 is fixed to the housing 7, and the second plate 3 is slidably attached to the first plate 2. Thereby, the recessed part 6 which makes the hole part 4 each an opening, and makes the upper surface of the 2nd plate 3 a bottom face is formed. A knob 12 is attached to the right end portion of the second plate 3, and the second plate 3 slides in the longitudinal direction (the direction of the arrow X) by turning the knob 12 in the direction of the arrow K1.
[0015]
As shown in FIG. 3, the dimension in the longitudinal direction of the recess 6 is larger than the sum of the longitudinal dimension of the chip-like workpiece (chip-type electronic component) 10 in the horizontal state and the diameter of the positioning pin 5. In the case of the first embodiment, the depth dimension of the recess 6 is set so that the upper surface of the chip-type electronic component 10 placed horizontally in the recess 6 is substantially the same height as the upper surface of the first plate 2. Therefore, the electrical property measurement operation described later is facilitated.
[0016]
Next, a method for measuring the electrical characteristics of the chip-type electronic component 10 using the electronic component handling apparatus 1 will be described.
[0017]
While giving vibration to the electronic component handling apparatus 1, a plurality of chip-type electronic components 10 are spread on the first plate 2 regardless of the posture such as vertical placement or horizontal placement. As shown in FIG. 3, the chip-type electronic component 10 sown on the first plate 2 is swung into the recess 6 and accommodated in a horizontally placed state by vibration. However, the vibration of the electronic component handling apparatus 1 is not necessarily required. When no vibration is applied, the chip-type electronic component 10 is leveled with a brush or the like, and is swung into the recess 6 or is tilted. You may combine vibration and inclination. In this way, the chip-type electronic component 10 can be swung into the recess 6 regardless of the posture, and a conventional height adjusting device becomes unnecessary. Then, by forming the outer peripheral edge 4 b of the hole 4 in a tapered shape (or an R shape), the chip-type electronic component 10 is easily transferred into the recess 6.
[0018]
Thereafter, the knob 12 is turned to slide the second plate 3 in the direction of the plate surface (in the direction of the arrow K2), as shown in FIG. Positioning is performed by being sandwiched between the side wall 4a (hole wall) and the positioning pins 5. At this time, if there is a chip-type electronic component 10 accommodated in the recessed portion 6 in a vertically placed state, when the second plate 3 is slid, the chip-type electronic component 10 is turned over to be in a horizontally placed state. Let Further, if the positioning pin 5 is formed so as to cover the elastic body such as rubber or the surrounding area with the elastic body, the positioning pin 5 absorbs the dimensional variation of the chip-type electronic component 10 when sandwiched. Can do.
[0019]
Next, the measurement probes 51 a and 51 b are brought into contact with the external terminals 11 and 12 of the chip-type electronic component 10 from above the electronic component handling apparatus 1 to measure the electrical characteristics. When the measurement is completed, the knob 12 is turned in the opposite direction, the second plate 3 is slid in the direction opposite to the arrow K2, the chip-type electronic component 10 is released and taken out from the electronic component handling apparatus 1.
[0020]
Moreover, the electronic component handling apparatus 1A as shown in FIG. 5 may be used. This electronic component handling apparatus 1 </ b> A is for forming external electrodes 16, 17, 18 on the side surface of a chip-type electronic component 15. By using the first plate 2 </ b> A having a thin plate thickness, the upper surface of the chip 14 constituting the main body of the chip-type electronic component 15 placed horizontally in the recess 6 protrudes from the upper surface of the first plate 2. In this state, the upper surface of the chip 14 is covered with a mask material 52 having holes 53 formed at predetermined positions, and the external electrodes 16 to 18 are formed by a sputtering method, a vapor deposition method, a printing method, or the like. In addition, the positioning pin 5A shown in FIG. 5 has a tapered head (may be R-shaped) so that the chip 14 can be easily accommodated in the recess 6 in a horizontally placed state.
[0021]
[Second Embodiment, FIGS. 6 to 8]
As shown in FIG. 6, the electronic component handling device 21 generally includes a first plate 22, a second plate 23, a lever 34 for sliding the second plate 23 relative to the first plate 22, and a first plate. A plate 37 and a housing 37 for housing the second plate 23 are provided.
[0022]
The first plate 22 is provided with a plurality of holes 24 arranged in a lattice pattern, and the second plate 23 is provided with a plurality of positioning pins 25 (see FIG. 7).
[0023]
The first plate 22 and the second plate 23 are combined so as to be relatively slidable in the plate surface direction in a state where each of the positioning pins 25 is inserted into each of the holes 24. That is, the first plate 22 is fixed to the housing 37, and the second plate 23 is slidably attached to the first plate 22 via the lever 34. The lever 34 is attached to the first plate 22 and the second plate 23 by rotating shafts 35 and 36, respectively, and rotates in the direction of the arrow K3 with the rotating shaft 35 as a support shaft. And according to rotation of the lever 34, the 2nd plate 23 slides in the direction of arrow K4.
[0024]
As shown in FIG. 7, the recess 26 is formed with the hole 24 as an opening and the upper surface of the second plate 23 as a bottom surface. The size of the concave portion 26 is larger than the sum of the height dimension of the chip-like workpiece 41 (chip constituting the main body of the chip-type electronic component) 41 and the diameter of the positioning pin 25, and the chip 41 is horizontal. The dimensions are such that they are not placed. The depth dimension of the recess 26 is set so that one end of the chip 41 placed vertically in the recess 26 protrudes from the upper surface of the first plate 22.
[0025]
Next, a method for forming external electrodes on the end face of the chip-type electronic component using the electronic component handling apparatus 21 will be described. While giving vibration to the electronic component handling apparatus 21, a plurality of chips 41 constituting the main body of the chip-type electronic component are spread on the first plate 2 regardless of the posture. The chip 41 sown on the first plate 22 is swung into the concave portion 26 and accommodated in a vertically placed state by vibration.
[0026]
Thereafter, the lever 34 is rotated, and the second plate 23 is slid in the plate surface direction (arrow K4 direction). As shown in FIG. Positioning is performed by being sandwiched between the portion 24a and the positioning pin 25. At this time, as shown in FIG. 7, even if there is a tip 41 accommodated in the recessed portion 26 in a tilted state, the tip is positioned on the positioning pin 25 or the bottom surface of the recessed portion 26 (that is, the upper surface of the second plate 23) By supporting and pushing the entire 41, the posture can be corrected without damaging the chip 41.
[0027]
Next, a mask material (not shown) is placed on the upper surface of the chip 41, and the external electrode 42 is formed by a sputtering method or a printing method. When the formation of the external electrode 42 is completed, the lever 34 is rotated in the reverse direction, the second plate 23 is slid in the direction opposite to the arrow K4 direction, the chip 41 is released and taken out from the electronic component handling apparatus 21.
[0028]
[Other Embodiments]
The electronic component handling apparatus and the electronic component handling method according to the present invention are not limited to the above-described embodiment, and can be variously changed within the scope of the gist. For example, in the electronic component handling apparatus 21 of the second embodiment, if a measurement probe is embedded in the bottom surface of the recess 26 (that is, the upper surface of the second plate 23), the electrical characteristics of the chip-type electronic component can be measured. Is also possible. Further, the method for accommodating the chip-like workpieces in the recesses is not limited to vibration transfer, and other methods such as, for example, accommodating the chip-like workpieces one by one in the recesses may be used.
[0029]
【The invention's effect】
As is apparent from the above description, according to the present invention, the chip-like workpiece can be swung into the recess regardless of the posture, and the conventional height adjusting device is not required. Furthermore, even when the chip-shaped workpiece is housed in the recess in a tilted posture, the posture is corrected without damaging the chip-shaped workpiece by supporting and pressing the entire chip-shaped workpiece with the positioning pins or the bottom surface of the recess. be able to. Further, by creating the positioning pin with an elastic body, the dimensional variation of the chip-like workpiece can be absorbed by the positioning pin.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of an electronic component handling apparatus according to the present invention.
FIG. 2 is an external perspective view of the electronic component handling apparatus shown in FIG.
FIG. 3 is a cross-sectional view showing one embodiment of the electronic component handling method according to the present invention.
4 is a cross-sectional view showing a procedure following FIG. 3. FIG.
FIG. 5 is a cross-sectional view showing a modification of the electronic component handling apparatus shown in FIG.
FIG. 6 is a schematic cross-sectional view showing another embodiment of the electronic component handling apparatus according to the present invention.
FIG. 7 is a cross-sectional view showing another embodiment of the electronic component handling method according to the present invention.
8 is a cross-sectional view showing a procedure following FIG.
FIG. 9 is a cross-sectional view showing a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 1A, 21 ... Electronic component handling apparatus 2, 2A, 22 ... 1st plate 3, 23 ... 2nd plate 4, 24 ... Hole part 4a, 24a ... Side wall part 5, 5A, 25 ... Positioning pins 6, 26 ... concave

Claims (3)

A first plate provided with a plurality of holes,
A second plate provided with a plurality of positioning pins respectively inserted through the plurality of holes,
With the positioning pins inserted into the hole portions, the first plate and the second plate are slidably combined in the plate surface direction, and chip-shaped workpieces each having the hole portions as openings are provided. Having formed a recess to accommodate,
Electronic parts handling device characterized by 2. The electronic component handling apparatus according to claim 1, wherein the positioning pin is made of an elastic body capable of sandwiching the chip-shaped workpiece with a hole wall of the hole. Using the electronic component handling apparatus according to claim 1 or 2, the first plate and the second plate are relatively slid in the plate surface direction, and the chip-shaped workpiece accommodated in the concave portion is An electronic component handling method comprising positioning with a hole wall of a hole and the positioning pin.

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