JPH0822931A - Application of electrode paste on chip component - Google Patents

Abstract

PURPOSE:To form uniformly electrodes in a method of applying An electrode paste on chip components which are used for various kinds of electronic equipment. CONSTITUTION:Chip components 11 are inserted in through holes 12a provided in a holding plate 12, terminal parts of the components 11 are pushed out to the side of the back of the plate 12 by a push-out tool 13 and thereafter, the surfaces of the terminals of all the chip components 11 are brought into contact with a bed board 14, the components 11 are pushed back within the plate 12 by the bed board 14, an electrode paste is applied on the chip components and is dried and electrodes 16 are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of applying an electrode paste to a chip part when forming an external electrode on a terminal part of the chip part.

[0002]

2. Description of the Related Art With the downsizing of electronic equipment, electronic parts are also becoming smaller and have high performance. For example, a monolithic ceramic capacitor is a chip component having a dimension of about 1 to 3 mm obtained by alternately laminating a dielectric ceramic and an internal electrode material by transfer or lamination, cutting the dielectric ceramic into a predetermined dimension, and then firing the cut. To apply the electrode paste to both ends of such a chip component, for example, the following method is used. First, an insertion plate 5 having holes 7 corresponding to the through holes 4 provided in the holding plate 2 as shown in FIG. 2A on the holding plate 2 made of an elastic body having the through holes 4 as shown in FIG. Are stacked, and the chip component 1 is put into the through hole 4 of the insertion plate 5 as shown in FIG. Subsequently, the chip component 1 is inserted into the holding plate 2 by using the pushing tool 3 having the convex portion 8 as shown in FIG. After that, the push-out tool 3 is pulled out from the through-hole 4, the insertion plate 5 is removed, the push-out tool 3 is put into the through-hole 4 again, and the chip component 1 is moved to the back side of the holding plate 2 as shown in FIG. It is extruded, and the extruding tool 3 is held as it is, or the extruding tool 3 is removed as shown in FIG. Then, the terminal surface of the chip component 1 is immersed in an electrode paste bath and dried to form the electrode 6.

[0003]

As described above, in the conventional coating method, the chip component 1 is positioned not on the electrode paste coating surface but on the opposite terminal surface. Therefore, there is a problem that the position of the electrode paste application surface is not uniform, the dimensional variation of the chip component 1 and the thickness variation of the electrode 6 occur, and the yield decreases.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide an electrode paste application method for a chip component, in which the dimensional variation of the chip component and the thickness variation of the electrode do not occur and the yield is improved.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention uses a first step of inserting a chip component into a through hole of a holding plate made of an elastic body, and an extrusion tool having a convex portion to insert The second step of extruding a part of the chip component pushed out to the back side of the holding plate and removing the pushing tool, bringing the base plate into contact with the protruding part of the chip component, and pushing back a part of the chip component into the holding plate. This is a method having three steps and a fourth step of applying an electrode paste to the protruding parts of the chip component to form electrodes.

[0006]

After the chip parts are extruded to the back side of the holding plate by the extruding tool, the protruding parts of all the chip parts, that is, the terminal surfaces are brought into contact with the base plate. The base plate pushes the chip component back into the holding plate, and the positions of the application surfaces are made uniform. As a result, the electrode paste can be evenly applied to both terminal surfaces of the chip component.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for applying an electrode paste to a chip component according to an embodiment of the present invention will be described below with reference to the drawings.

(1) As shown in FIG. 1A, after the chip component 11 is inserted into the through hole 12a of the holding plate 12, the chip component 1 is pushed by the pushing tool 13 having the convex portion 18.
A part of 1 is extruded to the back side of the holding plate 12.

(2) As shown in FIG. 1B, the push-out tool 13 is removed, and the terminal surfaces of all the chip components 11 are brought into contact with the base plate 14.
Push part of 1 back into holding plate 12.

(3) As shown in FIG. 1C, an electrode paste is applied and dried to form an electrode 16, and then the holding plate 12 is inverted.

(4) As shown in FIG. 1D, the holding plate 12 is provided on the opposite side of the chip component 11 by the pushing tool 13.
Extrude to the back side of.

(5) As shown in FIG. 1 (e), the push-out tool 13 is removed, and the terminal surfaces of all the chip components 11 are brought into contact with the base plate 14.
Push part of 1 back into holding plate 12.

(6) As shown in FIG. 1F, the electrode paste is applied and dried to form the electrode 17.

The operation of the above electrode paste coating method will be described below. Chip component 1 by push-out tool 13
After pushing 1 to the back side of the holding plate 12, the terminal surfaces of all the chip components 11 are brought into contact with the base plate 14. The base plate 14 allows the chip component 11 to hold the holding plate 12
It is pushed back in and the positions of the application surfaces are made uniform, so that the electrode paste can be applied uniformly to both terminal surfaces of the chip component 11.

As a result, the variation in electrode thickness, which was about 80 μm in the conventional electrode paste coating method, is about 50 μm.
It was within.

[0016]

As described above, according to the present invention, the chip component is pushed back into the holding plate by the base plate, and the positions of the coating surfaces are made uniform, so that both terminal surfaces of the chip component are made uniform. It is possible to provide an electrode paste application method for a chip component that can apply an electrode paste, does not cause dimensional variations and electrode thickness variations, and can improve the yield.

[Brief description of drawings]

1A to 1F are process diagrams of an electrode paste coating method according to the present invention.

2A to 2D are process diagrams of a conventional electrode paste coating method.

FIG. 3 is a perspective view of a conventional chip component holding plate.

[Explanation of symbols]

 11 Chip Component 12 Holding Plate 12a Through Hole 13 Extrusion Tool 14 Base Plate 15 Insertion Plate 16 Electrode 17 Electrode 18 Convex Part

Claims (1)

[Claims] 1. A first step of inserting a chip component into a through hole of a holding plate made of an elastic body, and a push-out tool having a convex portion to push a part of the inserted chip component to the back side of the holding plate to project it. The second step of removing, the extruding tool is removed, the base plate is brought into contact with the protruding part of the chip component, the third part is pushed back into the holding plate, and the electrode paste is applied to the protruding part of the chip component. And a fourth step of forming an electrode by applying an electrode paste to a chip component.