JPS6320816A - Manufacture of electronic parts - Google Patents
Manufacture of electronic partsInfo
- Publication number
- JPS6320816A JPS6320816A JP16511486A JP16511486A JPS6320816A JP S6320816 A JPS6320816 A JP S6320816A JP 16511486 A JP16511486 A JP 16511486A JP 16511486 A JP16511486 A JP 16511486A JP S6320816 A JPS6320816 A JP S6320816A
- Authority
- JP
- Japan
- Prior art keywords
- electrode material
- component
- electrode
- external
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000007772 electrode material Substances 0.000 claims description 20
- 238000009966 trimming Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 10
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
主業上立科旦公！
本発明は、電子部品の製造方法に関し、詳しくは超小型
電子部品本体への外部電極形成方法に関するものである
。[Detailed Description of the Invention] Main job is to get a job! The present invention relates to a method of manufacturing an electronic component, and more particularly to a method of forming external electrodes on a microelectronic component body.
ｌ米■及逝
外部１！極を本体に塗布した超小型電子部品の一具体例
として８￥層セラミックコンデンサを第６図及び第７図
を参照して次に示す、同図に示すように、上記積層セラ
ミックコンデンサ（１）は、複数のセラミックシートを
積層・一体化してなるセラミック積層体を細分割して得
られたコンデンサエレメント（２）を、例えば１０００
℃以上の高温で焼成した後、上記コンデンサエレメント
（２）の内部電極（３）（３）・・・が露出する両端面
（２ａ） （２ａ）に銀ペーストからなる外部電極（
４）（４）を被着形成し〔第７図参照〕、上記内部電極
（３）（３）・・・と外部電極（４）（４）とを電気的
に接続したものである。l rice ■ and passing away 1! As a specific example of a microelectronic component in which electrodes are coated on the main body, an 8-layer ceramic capacitor is shown below with reference to FIGS. 6 and 7. As shown in the same figure, the multilayer ceramic capacitor (1) For example, a capacitor element (2) obtained by finely dividing a ceramic laminate formed by laminating and integrating a plurality of ceramic sheets is divided into 1000 pieces.
After firing at a high temperature of ℃ or higher, external electrodes made of silver paste (
4) (4) is deposited and formed (see FIG. 7), and the internal electrodes (3) (3) . . . and the external electrodes (4) (4) are electrically connected.
上記外部電極（４）（４）をコンデンサニレメト（２）
の両端面に被着形成するに際しては、まず第８図に示す
ように、コンデンサエレメント（２）が嵌合するゴ通孔
（５ａ）を穿設したゴム製プレート（５）にてコンデン
サエし・メント（２）を保持して片方の端面をプレート
（５）より若干、押し出す。そして、ある程度出ている
上記端面をスキージングされたペースト状電極材の槽中
に浸漬した後、乾燥させ、第９図に示すように、一方の
外部電極（４ａ）を塗布する、次に、第１０図に示すよ
うに、上記プレート（５）を裏返してコンデンサエレメ
ント （２）の他方の端面を押し出した後、同様にペー
スト状電極材の槽中に浸漬して乾燥させ、第１１図に示
すように、他方の外部電極（４ｂ）を塗布する。The above external electrodes (4) (4) are connected to capacitors (2)
When coating both end faces of the capacitor, first, as shown in Fig. 8, a rubber plate (5) with a through hole (5a) into which the capacitor element (2) fits is made.・Hold the ment (2) and push one end out slightly beyond the plate (5). Then, after immersing the end surface, which is exposed to some extent, in a bath of squeezed paste-like electrode material, it is dried, and as shown in FIG. 9, one external electrode (4a) is applied.Next, As shown in Fig. 10, after turning the plate (5) over and pushing out the other end face of the capacitor element (2), it was similarly immersed in a bath of paste electrode material and dried, as shown in Fig. 11. Apply the other external electrode (4b) as shown.
（シよ゛と る。占
ところで、上述したように、コンデンサエレメント（２
）の両端面に外部電極（４）（４）を被着形成するに際
しては、プレート（５）にコンデンサエレメント（２）
を保持してペースト状電極の槽中に浸漬している。とこ
ろが、コンデンサエレメントのような超小型電子部品の
場合、プレー１−（５）の保持力が弱く浸漬時に部品本
体がしばしば落下し、しかもプレート（５）への挿入も
回能である。By the way, as mentioned above, the capacitor element (2
) When forming the external electrodes (4) on both end faces of the capacitor element (2) on the plate (5),
The electrode is held in paste form and immersed in a bath. However, in the case of microelectronic components such as capacitor elements, the holding force of the plate 1-(5) is weak and the component body often falls during immersion, and furthermore, it is difficult to insert the component into the plate (5).
ｐ 占 ” るための
本発明は、超小型電子部品本体に外部電極を塗布するに
あたり、ペースト状電極材の槽中に上記部品本体を浸漬
して本体全面に電極材を塗布し乾燥させた後、不所望の
中央部絶縁面をトリミングによって除去し上記外部電極
を塗布・形成したことを特徴とする。In the present invention, when applying an external electrode to the main body of a microelectronic component, the main body of the component is immersed in a bath of paste-like electrode material, the electrode material is applied to the entire surface of the main body, and the electrode material is dried. , the undesired central insulating surface is removed by trimming, and the external electrode is applied and formed.
作朋
超小型電子部品本体をペースト状電極材の槽中に浸漬し
て乾燥させた後、不所望の中央部外周面をトリミングに
よって除去すると、部品本体の両端面を電極材の槽中に
交互に浸漬することなく、外部１！極を形成できる。After the body of the ultra-small electronic component is immersed in a bath of paste-like electrode material and dried, the undesired outer peripheral surface of the central part is removed by trimming, and both end surfaces of the component body are alternately immersed in a bath of electrode material. External 1 without immersion! Can form poles.
１見拠
本発明に係る電子部品の製造方法の一実施例を第１図乃
至第３図を参照し通用順に以下説明するゆ図において、
（６）は超小型電子部品本体〔以下、チップ部品と称す
〕、例えば８￥層セラミックコンデンサのコンデンサエ
レメント、（７）は焼いた時に剥離する性質を持つ樹脂
、（８）は電極材、例えば銀ペースト、（９）は外部電
極で、まず第１図に示すように、チップ部品（６）の中
央部絶縁面に樹脂（７）を塗布する。次に、チップ部品
（６）をそのままペースト状電極材の槽中に浸漬し、第
２図に示すように、部品本体の全面に電極材（８）を塗
布する。そして、電極材（８）を熱風乾燥させた後、チ
ップ部品（６）をより高温〔例えば、８００℃程度〕で
焼付けると、樹脂（７）が部品本体から剥離する。その
後、剥離した脣Ｂ脂（７）をバレルで除去すると、第３
図に示すように、チップ部品（６）の本体両端面に外部
電極（９）（９）が塗布・形成される。1. An embodiment of the electronic component manufacturing method according to the present invention will be described below in the order of application with reference to FIGS. 1 to 3.
(6) is a microelectronic component body (hereinafter referred to as a chip component), such as a capacitor element for an 8-layer ceramic capacitor, (7) is a resin that has the property of peeling off when baked, and (8) is an electrode material, such as Silver paste (9) is an external electrode, and first, as shown in FIG. 1, resin (7) is applied to the central insulating surface of the chip component (6). Next, the chip component (6) is immersed as it is in a bath of paste electrode material, and as shown in FIG. 2, the electrode material (8) is applied to the entire surface of the component body. Then, after drying the electrode material (8) with hot air, when the chip component (6) is baked at a higher temperature (for example, about 800° C.), the resin (7) is peeled off from the component body. After that, when the peeled 辣B fat (7) is removed with a barrel, the third
As shown in the figure, external electrodes (9) (9) are applied and formed on both end surfaces of the main body of the chip component (6).
次に、本考案に係る電子部品の製造方法の他の実施例を
第４図及び第５図を参照し以下説明する０図において、
（１０）はチップ部品、例えば積層セラミックコンデン
サのコンデンサエレメント、（１１）は電極材、例えば
銀ペースト、（１２）は外部電極で、まず第２図に示す
ように、チップ部品（１０）をそのままペースト状電極
材の槽中に浸漬し部品本体の全面に電極材（１１）を塗
布する。そして、電極材（１１）を熱風乾燥させた後、
レーザ等にて機械的に中央部絶縁面の電極材（１１）を
トリミングすると、第５図に示すように、チップ部品（
１ｏ）の本体両端面に外部電極（１２） （１２）が
形成される。Next, another embodiment of the electronic component manufacturing method according to the present invention will be described below with reference to FIGS. 4 and 5, in FIG.
(10) is a chip component, such as a capacitor element of a multilayer ceramic capacitor, (11) is an electrode material, such as silver paste, and (12) is an external electrode.First, as shown in Figure 2, the chip component (10) is The electrode material (11) is applied to the entire surface of the component body by immersing it in a bath of paste electrode material. Then, after drying the electrode material (11) with hot air,
When the electrode material (11) on the central insulating surface is mechanically trimmed using a laser or the like, as shown in FIG.
External electrodes (12) (12) are formed on both end faces of the main body of 1o).
発」Ｆと九果
本発明によれば、超小型電子部品本体に外部電極を塗布
するにあたり、本体全面に電極材を塗布した後、不所望
部分をトリミングによって除去し外部電極を形成するよ
うにしたから、超小型の電子部品でも部品本体に外部電
極を容易に塗布できるようになる。According to the present invention, when applying an external electrode to the main body of a microelectronic component, after applying the electrode material to the entire surface of the main body, undesired parts are removed by trimming to form the external electrode. As a result, external electrodes can be easily applied to the main body of even ultra-small electronic components.
第１図乃至第３図は本発明に係る電子部品の製造方法の
一実施例を示すその適用項の各斜視図、第４図及び第５
図は本発明に係る電子部品の製造方法の他の実施例を示
すその適用順の各斜視図、第６図と第７図は積層セラミ
ックコンデンサの断面図と斜視図、第８図乃至第１１図
は第６図と第７図の積層セラミックコンデンサの外部電
極塗布形成工程の各断面図である。
（６） （１０）−・超小型電子部品本体、（８）
（１１） −電極材、
（９） （１２）−・・外部電極。
ＮＳ ８図
第９図
第１１１４1 to 3 are perspective views showing an embodiment of the electronic component manufacturing method according to the present invention, and FIGS.
6 and 7 are cross-sectional views and perspective views of a multilayer ceramic capacitor, and FIGS. The figures are cross-sectional views of the process of coating and forming external electrodes of the multilayer ceramic capacitors shown in FIGS. 6 and 7. (6) (10) - Ultra-small electronic component body, (8)
(11) - Electrode material, (9) (12) - External electrode. NS 8 Figure 9 Figure 1114
Claims (1)
り、ペースト状電極材の槽中に上記部品本体を浸漬して
本体全面に電極材を塗布し乾燥させた後、部品本体の中
央塗着部をトリミング除去し上記外部電極を所定部分に
形成することを特徴とする電子部品の製造方法。(1) When forming external electrodes on the ultra-small component body, the component body is immersed in a bath of paste-like electrode material, the electrode material is applied to the entire surface of the body, and after drying, the central part of the component body is coated. 1. A method of manufacturing an electronic component, comprising: trimming and removing the attached portion, and forming the external electrode on a predetermined portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16511486A JPS6320816A (en) | 1986-07-14 | 1986-07-14 | Manufacture of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16511486A JPS6320816A (en) | 1986-07-14 | 1986-07-14 | Manufacture of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320816A true JPS6320816A (en) | 1988-01-28 |
Family
ID=15806176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16511486A Pending JPS6320816A (en) | 1986-07-14 | 1986-07-14 | Manufacture of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320816A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017037973A (en) * | 2015-08-11 | 2017-02-16 | 太陽誘電株式会社 | Ceramic electronic component and manufacturing method therefor |
-
1986
- 1986-07-14 JP JP16511486A patent/JPS6320816A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017037973A (en) * | 2015-08-11 | 2017-02-16 | 太陽誘電株式会社 | Ceramic electronic component and manufacturing method therefor |
| US10497513B2 (en) | 2015-08-11 | 2019-12-03 | Taiyo Yuden Co., Ltd. | Ceramic electronic component and method of producing the same |
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