JP2518191B2 - Electronic component manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component capable of avoiding connection failure due to solder erosion and reducing the number of manufacturing steps to improve productivity.

[0002]

2. Description of the Related Art Conventionally, as an electronic component, a plurality of terminals are integrally formed with a holding portion made of, for example, a pair of holding pieces, and an electronic component element is inserted between the holding portions. There is one in which a resin is applied to the outer surface of the electronic component element while being connected by soldering.

When manufacturing such an electronic component, conventionally, the electrode film of the electronic component element is first inserted into the sandwiching piece of each terminal so as to abut. Next, the contact portion between the sandwiching piece and the electrode film is soldered and cooled and hardened. Next, the above-mentioned electronic component is dipped in a resin liquid to coat the resin on the outer surface, and then the resin is dried and baked to cure.

[0004]

However, in the above-mentioned conventional manufacturing method, when the electronic component element is soldered,
Depending on the material of the electrode film, the solder erodes the electrode film,
So-called solder erosion is likely to occur, and as a result, the electrode film may peel off from the electronic component element and cause a connection failure.

Further, in the above-mentioned conventional method, there are many man-hours such as heating and cooling and hardening in the soldering process of the electronic component element and the holding portion, and baking and hardening of the resin liquid in the exterior process, so that the productivity is improved. , Reduction of this process is required.

The present invention has been made in view of the above-mentioned conventional circumstances, and it is possible to prevent peeling of the electrode film due to solder erosion to avoid a defective connection and to reduce the number of manufacturing steps at the time of connecting the terminal and the electronic component element. It is an object of the present invention to provide a method for manufacturing an electronic component that can reduce the productivity and improve the productivity.

[0007]

According to the present invention, an electronic component element is inserted into a holding portion formed at an upper end portion of a plurality of terminals so that an electrode film of the electronic component element abuts on the holding portion. One step, a second step of applying a conductive paste to the contact portion between the electrode film and the holding portion, and a third step of coating the holding portion of the terminal and the outer surface portion of the electronic component element with an exterior resin. And a fourth step of simultaneously baking and curing the exterior resin and the conductive paste, and bonding the holding portion and the electronic component element with an adhesive layer formed by curing the conductive paste. It is a method of manufacturing a component.

[0008]

According to the method of manufacturing an electronic component of the present invention, since the conductive paste is used for connecting the holding portion of the terminal and the electrode film of the electronic component element, it is possible to prevent solder leaching due to conventional soldering, As a result, poor connection due to peeling of the electrode film can be avoided, and product yield can be improved.

Further, in the present invention, since the holding portion and the electronic component element are adhered by the adhesive layer formed by curing the conductive paste at the same time as the baking of the exterior resin, the heating and cooling curing during the conventional soldering can be omitted. Therefore, the number of manufacturing steps can be reduced and productivity can be improved.

[0010]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 3 are views for explaining a method of manufacturing an electronic component according to an embodiment of the present invention.

In the figure, 1 is a three-terminal type electronic component manufactured by the method of this embodiment, which has two terminals 2.
The resonator element 3 is connected between a and 2a, the capacitor element 4 is connected between the terminals 2a and the central ground terminal 2b, and the outer surface portions of the elements 3 and 4 are covered with the exterior resin 8. Has been done.

The resonator element 3 has vibrating electrode films (not shown) formed on both main surfaces of a strip-shaped piezoelectric substrate, and the tip portions of both electrode films are opposed to each other with the substrate sandwiched therebetween. , Energy trapping type thickness vibration is generated. In addition, the capacitor element 4
Is formed by forming a first electrode film (not shown) over substantially the entire length of one main surface of the capacitor substrate (not shown) and a pair of second electrode films at both ends of the other main surface to form two capacitors. There is.

Each of the terminals 2a and 2b is formed by punching a metal plate by press working, and is integrally formed on the belt-shaped frame 5. Also, the above left and right terminals 2
A bifurcated holding portion 6 composed of a pair of holding pieces 6a, 6a is integrally formed on the upper end portions of the a and 2a. The resonator element 3 is bridged between the holding portions 6 and 6, and the resonator element 3 is sandwiched by both holding pieces 6a and 6a.

A holding portion 7 is provided at the upper end of the earth terminal 2b.
Is bent, and the holding portion 7 and the left and right terminals 2 are
The capacitor element 4 is sandwiched between the outer surfaces of a and 2a. The holding portion 7 holds the upper surface and the lower surface of the capacitor element 4 between them. As a result, the elements 3 and 4 are prevented from falling and being displaced.

A cavity forming agent (not shown) is applied to the central portion of the resonator element 3, that is, the piezoelectric vibrating portion, so that an effective vibration space is secured. Further, the contact portion between the electrode film of the resonator element 3 and each of the holding portions 6 and 6, and the electrode film of the capacitor element 4 and the left and right terminals 2
An adhesive layer 9 formed by curing a conductive paste is formed on the outer side surfaces of a and 2a and the contact portion with the holding portion 7.
The adhesive layer 9 is formed by baking the conductive paste at the same time as the resin 8 is baked and cured.
As a result, the abutting portions are electrically and mechanically connected.

Next, a method of manufacturing the electronic component 1 of this embodiment will be described. First Step First, the left and right terminals 2a connected to the frame 5
Both ends of the resonator element 3 are inserted into the holding piece 6a of 2a and bridged between the both holding portions 6, and the holding portion 7 of the ground terminal 2b is elastically deformed slightly outward to insert the capacitor element 4.
As a result, the elements 3 and 4 are clamped by the holding portions 6 and 7, and temporarily fixed in a state where they are prevented from falling off and misaligned (see FIG. 2).

Second Step A conductive paste 9 is applied to the contact portion between the electrode film of the resonator element 3 and each of the holding portions 6 and 6, and the electrode film of the capacitor element 4 and the left and right terminals 2a and 2a are also formed. The conductive paste 9 is applied to the outer surface and the contact portion of the earth terminal 2b with the holding portion 7 (see FIG. 1).

Third Step A cavity forming agent is applied so as to be wound around the piezoelectric vibrating portion of the resonator element 3 to secure an effective vibration space. Next, with the frame 5 supported, the resonator element 3 and the capacitor element 4 are immersed in a resin bath to attach the exterior resin 8.

Fourth Step Then, the exterior resin 8 is dried and baked to be cured. At the time of this baking, the conductive paste is simultaneously cured to form the adhesive layer 9, so that the elements 3 and 4 and the holding portions 6 and 7 are electrically and mechanically connected. Then, from the frame 5 to each terminal 2
Cut a and 2b (see the alternate long and short dash line in FIG. 2). As a result, the electronic component 1 of this embodiment is manufactured (see FIG. 3).

As described above, according to the manufacturing method of this embodiment,
Since the conductive paste is used to connect the resonator element 3 and the capacitor element 4 to the respective holding portions 6 and 7, it is possible to solve the conventional problem of electrode film peeling due to solder erosion and reduce the product defect rate. Yield can be improved.

Further, in the method of this embodiment, the baking and hardening of the conductive paste is carried out at the same time as the baking of the exterior resin 8, so that the heating and cooling hardening process by the conventional soldering can be omitted, and the manufacturing process can be made accordingly. Can be reduced. This is particularly effective when there are many connection points of component elements as in this embodiment.

In the above embodiment, the three-terminal type electronic component is taken as an example, but the present invention can be applied to a two-terminal type and a multi-terminal type electronic component, and further, as a component of the electronic component, a resonator element and a capacitor. Although the element has been taken as an example, the present invention can of course be applied to other electronic components.

[0023]

As described above, according to the method of manufacturing an electronic component of the present invention, the electronic component element is inserted into the holding portions of the plurality of terminals, and the conductive paste is applied to the contact portion between the component element and the holding portion. After applying the above, a resin is applied to the outer surface portion of the electronic component element while supporting the terminals, and then the resin is baked and hardened, and at the same time as the baking, the conductive paste is hardened to form an adhesive layer. Since it is formed, there is an effect that a defective connection due to solder erosion can be eliminated and a product yield can be improved, and a manufacturing process can be reduced to improve productivity.

[Brief description of drawings]

FIG. 1 is a process drawing for explaining a method of manufacturing an electronic component according to an embodiment of the present invention.

FIG. 2 is a process drawing of the method of the above embodiment.

FIG. 3 is a front view of an electronic component manufactured by the method of the embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic component 2a, 2b terminal 3 Resonator element (electronic component element) 4 Capacitor element (electronic component element) 6, 7 Holding part 8 Exterior resin 9 Adhesive layer

Claims (1)

(57) [Claims] 1. A first step of inserting an electronic component element into a holding portion formed on the upper ends of a plurality of terminals so that an electrode film of the electronic component element contacts the holding portion; and the electrode film. A second step of applying a conductive paste to the contact portion with the holding portion,
A third step of coating the holding portion of the terminal and the outer surface portion of the electronic component element with an exterior resin, and simultaneously baking and curing the exterior resin and the conductive paste,
A method of manufacturing an electronic component, comprising: a fourth step of bonding the holding portion and the electronic component element with an adhesive layer formed by curing the conductive paste.