JPH087615Y2 - Chip type electronic parts - Google Patents

Description

[Detailed description of the device]

[0001]

[Industrial application] This device has a capacitor,
The present invention relates to a chip type electronic component in which an element is directly soldered to the surface of a circuit board.

[0002]

2. Description of the Related Art Conventionally, a chip-type electronic component in which a capacitor is formed has a resistor formed on the surface of a substrate as disclosed in, for example, Japanese Utility Model Publication No. 48-105837.
Electrodes were provided at both ends of the electrode, and a capacitor was formed between the electrodes. This electrode was formed by applying solder plating or the like to the end surface of the substrate. As for the electrode structure of the resistor, as disclosed in JP-B-58-46161, a conductive coating material containing silver or the like is applied to the electrode portion, and the surface thereof is plated with a metal such as Ni. There are some that have been applied.

[0003]

In the case of the above-mentioned conventional technique, in a chip type electronic component provided with a capacitor, stray capacitance is generated between an electrode and another conductor portion, and particularly in a small chip component, the capacitor is used. It was not possible to secure a sufficient distance between the portion and the electrode, etc., and stray capacitance was easily generated, and the influence was large.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object thereof is to provide a high-quality chip-type electronic component which hardly causes stray capacitance and is easy to manufacture.

[0005]

According to the present invention, a capacitor is formed by providing a capacitance forming electrode on the surface of a dielectric substrate, and a resin film or glass film having a low dielectric constant is formed on the end face of the substrate. An end face electrode electrically connected to the capacitance forming electrode of the capacitor is printed and formed on the outside of the film with a conductive resin paint or a conductive metal glaze.

[0006]

In the chip-type electronic component of the present invention, since the end face electrodes are formed on the end face of the dielectric substrate through the resin film having a low dielectric constant, the stray capacitance by the end face electrodes is extremely small and easy to manufacture. Is.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. This embodiment is a surface mount device in which a capacitor 12 and a resistor 14 are formed on a substrate 10 made of a dielectric material such as ceramics. The resistor 14 is a glass coat 1
It is formed on the surface of the substrate 10 via 6. Board 10
The glass coat 18 is formed on the back side of the glass coat 16, the electrode 20 is formed at one end of the glass coat 16, 18, and the capacitance forming electrode 22 for the capacitor 12 is also formed by the glass coat 16, 1.
It is formed on the front and back surfaces of the substrate 10 in the portion where 8 is not provided. Further, the resistor 14 is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and is covered with the glass coat 24. The front and back surfaces of the chip-type electronic component of this embodiment are almost entirely covered and protected by the glass coat 26.

Resin films 28 and 30 having a low dielectric constant, such as epoxy resin, are printed on a pair of opposed end faces of the substrate 10 so as to extend between the glass coats 16 and 18.
On the outside of the resin film 28, an end face electrode 32 made of a conductive resin paint such as silver paint is formed by printing.
Are directly connected to the capacitor 12. Further, on the outside of the resin coating 30, the end face electrode 3 connected to the resistor 14 is provided.
4 is formed by printing with a conductive paint. A plating layer 36 of Ni, Cu or the like is formed on the surface of each of the end face electrodes 32, 34. The capacitor 12 and the resistor 14 of this embodiment form a series circuit as shown by the solid line in FIG.

Further, the resin coatings 28, 30 may be replaced with a glass coating formed by applying a glass paste. By using the glass coating, the end face electrodes 32,
34 may be formed by applying a conductive metal glaze paste containing silver or the like in addition to the conductive resin paint.

Next, a method of manufacturing the chip type electronic component of this embodiment will be described with reference to FIG. The chip-type electronic component of this embodiment is one in which a large number of elements are formed vertically and horizontally on a large ceramic plate and divided to form individual chip-type electronic components. As shown in FIG. The glass paste forming the glass coats 16 and 18 is sequentially printed on the front and back surfaces of the substrate 10 except for the capacitor forming portion and dried. Then, the glass coats 16 and 18 are baked at a temperature of about 850 ° C. Next, as shown in (B), an electrode 20 and a capacitance forming electrode 22 forming the capacitor 12 are formed.
And are printed on the front and back with a conductive metal glaze paste or the like, and dried. Then, the electrode 20 and the capacitance forming electrode 22 are fired at a temperature of about 850 ° C. Next, as shown in (C), a metal glaze-based resistor 14 is formed by printing, dried, and baked at a temperature of about 850 ° C. Further, a glass paste for the glass coat 24 covering the resistor 14 is printed, dried, and baked at about 600 ° C. After that, laser trimming is performed to adjust the resistance value to form the trimming groove 15. And as shown in (D),
A glass paste for the glass coat 26 is printed on the front and back surfaces and baked at about 600 ° C. And the large substrate 10
Is divided into strips so that the end faces of the electrode formation portion are exposed. Next, as shown in (E), resin films 28 and 30 having a low dielectric constant such as an epoxy resin are formed on the end faces by a printing means such as a roller and baked at a temperature of about 200 ° C. Then, the end face electrodes 32 and 34 are formed by printing with a conductive resin paint,
Dry and bake at about 200 ° C. After that, the strip-shaped substrate 10 is divided into each chip, and the plating layer 36 is formed on the surfaces of the end face electrodes 32 and 34 to complete the process.

When a glass coating is applied instead of the resin coatings 28 and 30, a glass paste is applied, dried and baked at about 600.degree. And, in the end face electrode,
In addition to the conductive resin paint, a conductive metal glaze paste having a high firing temperature can also be used. When the conductive resin paint is printed and formed, it is formed in the same manner as above, and when the conductive metal glaze paste is printed, about 600
Bake at ° C.

The chip-type electronic component of this embodiment has a substrate 1
Since the end face electrodes 32, 34 are formed on the end face of 0 through the low dielectric constant resin coatings 28, 30 or the glass coating, the end face electrodes 32, 34 and the electrode 20 or the capacitance forming electrode 22 are connected to each other as shown in FIG. The stray capacitance 38 as indicated by the broken line is hardly generated. In particular, the resin coating has a smaller dielectric constant than the glass coating, and has a great effect of not causing stray capacitance.

According to the chip-type electronic component of this embodiment,
Even small chip-type electronic parts have almost no stray capacitance,
A high quality element can be formed. Further, it is easy to form the resin film 28, 30 having a low dielectric constant or the glass film. In particular, the resin coating may have a low firing temperature, and does not adversely affect the resistor 14 and the electrode 12 due to heat during manufacturing.

Next, a second embodiment of this invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment will be described with the same reference numerals. The chip-type electronic component of this embodiment is the same as that of the above-mentioned embodiment except that one of the end face electrodes is omitted and the electrode 40 is provided on the back surface of the capacitor 12.
It is formed integrally with the capacitance forming electrode 22 on the back surface side of. The other structure is the same as that of the above-described embodiment, and the substrate 1
The capacitor 12 and the resistor 14 are formed on the
4 is formed on the surface of the substrate 10 through the glass coat 16. The glass coat 18 is also formed on the back surface side of the substrate 10, the electrode 20 is formed at one end of the glass coats 16 and 18, and the capacitance forming electrode 22 for the capacitor 12 is also the portion where the glass coats 16 and 18 are not provided. Board 1
It is formed on the front and back surfaces of 0. Furthermore, the resistor 14 is
It is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and is covered with a glass coat 24. The entire front and back surfaces of the chip-type electronic component of this embodiment are also covered and protected by the glass coat 26. The one end surface electrode 34 electrically connected to the capacitor 12 and the resistor 14 is formed by printing with a conductive resin paint or a conductive metal glaze paste through the glass coating or the resin coating 30 as in the above embodiment. Has been done. Further, the surface of the electrode 40 may be plated with solder. The manufacturing method is the same as the above except that the step of forming one of the end face electrodes is deleted from the steps of the above embodiment.

According to this embodiment, since no stray capacitance is generated in the inner portion of the end face electrode, a resin coating film is not required, and the electrode 40 can be formed at the same time as the capacitance forming electrode 22, and the number of manufacturing steps is greatly reduced. can do. This chip component can be easily soldered by reflow soldering, and even in flow soldering,
By properly setting the distance between the circuit board and the electrode 40, the soldering can be surely performed.

Next, a third embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment will be described with the same reference numerals. In the chip-type electronic component of this embodiment, one end portion of the glass coat 16 is omitted from the second embodiment described above, and the electrode 42 is provided on the back surface.
Is integrally formed with the capacitance forming electrode 44 on the back surface side of the capacitor 12. The capacitance forming electrode 44 for the capacitor 12 has a capacitance that can be changed by appropriately changing the printing range. Other configurations are similar to those of the first embodiment described above, and the capacitor 12 and the resistor 14 are formed on the substrate 10, and the resistor 14 is formed on the surface of the substrate 10 via the glass coat 16. The glass coat 18 is also formed on the back surface side of the substrate 10, and the glass coat 1
An electrode 20 is formed at one end of each of the capacitors 6 and 18, and the capacitor 1
The capacitance forming electrode 22 for 2 is also formed on the surface of the substrate 10 where the glass coat 16 is not provided. Furthermore, the resistor 14 is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and the glass coat 2
Covered with 4. The entire front and back surfaces of the chip-type electronic component of this embodiment are also covered and protected by the glass coat 26. The one end surface electrode 34 electrically connected to the capacitor 12 and the resistor 14 is formed by printing with a conductive resin paint or a conductive metal glaze paste through the glass coating or the resin coating 30 as in the above embodiment. Has been done. Further, the surface of the electrode 42 may be plated with solder. In addition, the manufacturing method is one in which the step of forming one of the end face electrodes is deleted from the step of the above-mentioned embodiment,
Others are the same as above.

Also in this embodiment, the same effect as that of the above-described embodiment can be obtained, the number of manufacturing steps can be largely omitted, and the capacity can be easily adjusted.

The chip type electronic component of the present invention may be a combination of a capacitor and another element, or may be a chip type electronic component provided with a plurality of capacitors and resistors. Further, an appropriate material can be selected for the resin film or glass film having a low dielectric constant, and the shape and material of the end face electrode can be appropriately set.

[0019]

According to the chip type electronic component of the present invention, a capacitor is formed on the surface of a dielectric substrate to form a capacitor, and a resin film or a glass film having a low dielectric constant is formed on the end face of the substrate. Since the end face electrode connected to the capacitor is formed on the outer side of the capacitor, even a small chip type electronic component has a relatively small stray capacitance and a high quality element can be formed. In addition, the low dielectric constant resin coating and the conductive resin paint have a low firing temperature, do not adversely affect other parts on the element due to heat at the time of formation, and are easily manufactured,
A large amount of highly reliable chip-type electronic components can be provided at low cost.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a chip-type electronic component according to a first embodiment of the present invention.

FIG. 2 is a circuit diagram of the chip-type electronic component of this embodiment.

FIG. 3 is a diagram showing a manufacturing process of the chip-type electronic component of this embodiment.

FIG. 4 is a vertical sectional view of a chip-type electronic component according to a second embodiment of the present invention.

FIG. 5 is a vertical sectional view of a chip-type electronic component according to a third embodiment of the present invention.

[Explanation of symbols]

 10 Substrate 12 Capacitor 14 Resistor 22,44 Capacitance Forming Electrode 28,30 Resin Coating 32,34 End Face Electrode

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location H01G 4/40 7924-5E H01G 4/40 301 A

Claims (2)

[Scope of utility model registration request] 1. A capacitance forming electrode is provided on a surface of a dielectric substrate.
In a chip-type electronic component in which electrodes are formed on the end face of this substrate, a resin film with a low dielectric constant is formed on the end face of the substrate, and the capacitance of the capacitor is placed outside this resin film. A chip-type electronic component, characterized in that an end face electrode electrically connected to the forming electrode is formed of a conductive resin paint. 2. A capacitance forming electrode is provided on the surface of a dielectric substrate.
In the chip-type electronic component in which electrodes are formed on the end face of this substrate, a glass film with a low dielectric constant is formed on the end face of the substrate, and the capacitance of the capacitor is placed outside the glass film. A chip-type electronic component characterized in that an end face electrode electrically connected to a forming electrode is formed by a conductive resin paint or a conductive metal glaze.