JPH0882U - Chip type electronic parts - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a high-quality chip-type electronic component that produces almost no stray capacitance and is easy to manufacture. [Structure] A capacitance forming electrode 22 is formed on the surface of a dielectric substrate 10.
The capacitor 12 is formed by printing. A resin film 28 having a low dielectric constant is formed on the end surface of the substrate 10, and an end surface electrode 32 electrically connected to the capacitance forming electrode 22 of the capacitor 12 is formed outside the resin film 28.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip-type electronic component having a capacitor and an element directly soldered to the surface of a circuit board.

[0002]

[Prior art]

 Conventionally, a chip-type electronic component in which a capacitor is formed has a resistor formed on a substrate surface and electrodes provided on both ends thereof, as disclosed in, for example, Japanese Utility Model Publication No. 48-105837. A capacitor was formed between the electrodes. This electrode was formed by applying solder plating or the like to the end surface of the substrate. As for the electrode structure of the resistor, as disclosed in JP-B-58-46161, a conductive coating material containing silver or the like is applied to the electrode portion, and the surface thereof is coated with a metal such as Ni. Some are plated.

[0003]

[Problems to be solved by the device]

 In the case of the above conventional technology, in a chip-type electronic component provided with a capacitor, stray capacitance occurs between the electrode and another conductor part, and especially in a small chip component, a stray capacitance is present between the capacitor part and the electrode. It was not possible to secure sufficient spacing, stray capacitance was easy to form, and the effect was large.

The present invention has been made in view of the above-mentioned problems of the conventional technology, and an object thereof is to provide a high-quality chip-type electronic component that hardly generates stray capacitance and is easy to manufacture. And

[0005]

[Means for Solving the Problems]

 In this invention, a capacitor is formed by providing a capacitor forming electrode on the surface of a dielectric substrate, and a resin film or glass film having a low dielectric constant is formed on the end face of this substrate, and the above-mentioned film is formed on the outside of this film. This is a chip-type electronic component in which the end face electrode that is electrically connected to the capacitance forming electrode of the capacitor is formed by printing with conductive resin paint or conductive metal glaze.

[0006]

[Action]

 In the chip-type electronic component of the present invention, since the end face electrode is formed on the end face of the substrate of the dielectric body through the resin film having a low dielectric constant, the stray capacitance due to the end face electrode is extremely small and easy to manufacture. .

[0007]

【Example】

 A first embodiment of the present invention will be described below with reference to the drawings. This embodiment is a surface mount device in which a capacitor 12 and a resistor 14 are formed on a substrate 10 made of a dielectric material such as ceramics, and the resistor 14 is formed on the surface of the substrate 10 via a glass coat 16. . A glass coat 18 is also formed on the back side of the substrate 10, an electrode 20 is formed on one end of the glass coats 16 and 18, and a capacitance forming electrode 22 for the capacitor 12 is also a portion where the glass coats 16 and 18 are not provided. Are formed on the front and back surfaces of the substrate 10. Further, the resistor 14 is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and is covered with the glass coat 24. The front and back surfaces of the chip-type electronic component of this embodiment are almost entirely covered and protected by the glass coat 26.

On the pair of opposed end faces of the substrate 10, resin films 28 and 30 having a low dielectric constant such as epoxy resin are printed so as to extend between the glass coats 16 and 18. An end face electrode 32 made of a conductive resin paint such as silver paint is formed by printing on the outside of the resin film 28, and the end face electrode 32 is directly connected to the capacitor 12. Further, on the outer side of the resin coating film 30, an end face electrode 34 connected to the resistor 14 is formed by printing with a conductive paint. A plating layer 36 of Ni, Cu or the like is formed on the surface of each of the end face electrodes 32, 34. The capacitor 12 and the resistor 14 of this embodiment form a series circuit as shown by the solid line in FIG.

Further, the resin coatings 28, 30 may be replaced with a glass coating formed by applying a glass paste. By using the glass coating, the end face electrodes 32, 34 are It may be formed by applying a conductive metal glaze paste containing silver or the like.

Next, a method for manufacturing the chip-type electronic component of this embodiment will be described with reference to FIG. The chip-type electronic component of this embodiment is one in which a large number of elements are formed vertically and horizontally on a large ceramic plate and divided to form individual chip-type electronic components. As shown in FIG. A glass paste for forming the glass coats 16 and 18 is sequentially printed on the front and back surfaces of the substrate 10 except for the capacitor forming portion and dried. Then, the glass coats 16 and 18 are baked at a temperature of about 850 ° C. Next, as shown in (B), the electrodes 20 and the capacitance forming electrodes 22 forming the capacitors 12 are printed on the front and back sides of a conductive metal glaze paste or the like, and dried. Then, the electrode 20 and the capacitance forming electrode 22 are fired at a temperature of about 850 ° C. Next, as shown in (C), a metal glaze-type resistor 14 is formed by printing, dried, and baked at a temperature of about 850 ° C. Further, a glass paste for the glass coat 24 covering the resistor 14 is printed, dried, and baked at about 600 ° C. After that, laser trimming is performed to adjust the resistance value to form the trimming groove 15. Then, as shown in (D), a glass paste for the glass coat 26 is printed on the front and back surfaces and baked at about 600 ° C. Then, the large substrate 10 is divided into strips so that the end faces of the electrode formation portions are exposed. Next, as shown in (E), a resin film 28, 30 having a low dielectric constant such as an epoxy resin is formed on the end surface by a printing means such as a roller and is baked at a temperature of about 200 ° C. Then, the end face electrodes 32 and 34 are formed by printing with a conductive resin paint, dried and baked at about 200.degree. After that, the strip-shaped substrate 10 is divided into chips, and the plating layer 36 is formed on the surfaces of the end face electrodes 32 and 34 to complete the process.

When a glass coating is applied instead of the resin coatings 28 and 30, a glass paste is applied, dried and baked at about 600 ° C. In addition to the conductive resin paint, a conductive metal glaze paste having a high firing temperature can be used for the end face electrode. When the conductive resin paint is formed by printing, it is formed in the same manner as described above, and when the conductive metal glaze paste is printed, it is baked at about 600 ° C.

In the chip-type electronic component of this embodiment, since the end face electrodes 32, 34 are formed on the end face of the substrate 10 via the resin film 28, 30 having a low dielectric constant or the glass film, the end face electrode 32, The stray capacitance 38 as shown by the broken line in FIG. 2 hardly occurs between the electrode 34 and the electrode 20 or the capacitance forming electrode 22. In particular, the resin coating has a smaller dielectric constant than the glass coating, and has a large effect of not causing stray capacitance.

According to the chip-type electronic component of this embodiment, even a small-sized chip-type electronic component has almost no floating capacity, and a high-quality element can be formed. Further, it is easy to form the resin film 28, 30 having a low dielectric constant or the glass film. In particular, the resin coating may have a low baking temperature, so that the resistor 14 and the electrode 12 will not be adversely affected by heat during manufacturing.

Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment will be described with the same reference numerals. The chip-type electronic component of this embodiment is different from that of the above-mentioned embodiment in that one of the end face electrodes is omitted and the electrode 40 is formed on the back surface integrally with the capacitance forming electrode 22 on the back surface side of the capacitor 12. . Other configurations are the same as those of the above-described embodiment, the capacitor 12 and the resistor 14 are formed on the substrate 10, and the resistor 14 is formed on the surface of the substrate 10 via the glass coat 16. A glass coat 18 is also formed on the back side of the substrate 10, an electrode 20 is formed on one end of the glass coats 16 and 18, and a capacitance forming electrode 22 for the capacitor 12 is also a portion where the glass coats 16 and 18 are not provided. Are formed on the front and back surfaces of the substrate 10. Further, the resistor 14 is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and is covered with the glass coat 24. The front and back surfaces of the chip-type electronic component of this embodiment are also covered and protected by the glass coat 26. The one end face electrode 34 electrically connected to the capacitor 12 and the resistor 14 is formed by printing with a conductive resin paint or a conductive metal glaze paste through the glass coating or the resin coating 30 as in the above embodiment. Has been done. Further, the surface of the electrode 40 may be plated with solder. Further, the manufacturing method is the same as the above except that the step of forming one of the end face electrodes is deleted from the step of the above embodiment.

According to this embodiment, since the stray capacitance is not generated in the inner portion of the end face electrode, a resin coating film or the like is not necessary, and the electrode 40 can be formed at the same time as the capacitance forming electrode 22, and the number of manufacturing steps is significantly increased. Can be reduced. This chip component can be easily soldered by reflow soldering, and even in flow soldering, by properly setting the distance between the circuit board and the electrode 40, etc. be able to.

Next, a third embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment will be described with the same reference numerals. In the chip type electronic component of this embodiment, one end portion of the glass coat 16 is further omitted from the second embodiment described above, and the electrode 42 is formed on the back surface integrally with the capacitance forming electrode 44 on the back surface side of the capacitor 12. It was done. The capacity forming electrode 44 for the capacitor 12 has a capacity that can be changed by appropriately changing the printing range. Other configurations are similar to those of the above-described first embodiment, and the capacitor 12 and the resistor 14 are formed on the substrate 10, and the resistor 14 is formed on the surface of the substrate 10 via the glass coat 16. A glass coat 18 is also formed on the back surface side of the substrate 10, an electrode 20 is formed on one end of each of the glass coats 16 and 18, and a capacitance forming electrode 22 for the capacitor 12 is also provided on the substrate where the glass coat 16 is not provided. It is formed on the surface of 10. Further, the resistor 14 is formed between the electrode 20 and one of the capacitance forming electrodes 22 of the capacitor 12, and is covered with the glass coat 24. The entire front and back surfaces of the chip-type electronic component of this embodiment are also covered and protected by the glass coat 26. The one end face electrode 34 electrically connected to the capacitor 12 and the resistor 14 is made of a conductive resin paint or a conductive metal glaze paste through the glass film or the resin film 30 as in the above-described embodiment. Printed. Further, the surface of the electrode 42 may be plated with solder. Further, the manufacturing method is the same as the above except that the step of forming one of the end face electrodes is deleted from the step of the above embodiment.

According to this embodiment, the same effect as that of the above-described embodiment can be obtained, the number of manufacturing steps can be greatly reduced, and the capacity can be easily adjusted.

The chip-type electronic component of the present invention may be a combination of a capacitor and another element, or may be a chip-type electronic component provided with a plurality of capacitors, resistors and the like. Further, an appropriate material can be selected for the low dielectric constant resin coating or glass coating, and the shape and material of the end face electrode can also be set appropriately.

[0019]

[Effect of device]

 In the chip-type electronic component of the present invention, a capacitor is formed on the surface of a dielectric substrate to form a capacitor, and a resin film or glass film having a low dielectric constant is formed on the end face of this substrate, and the outside thereof Since the end face electrode connected to the capacitor is formed, even a small chip-type electronic component has a relatively small stray capacitance and a high quality element can be formed. In addition, the low-dielectric constant resin coating and conductive resin paint have a low baking temperature, do not adversely affect the other parts of the element due to heat during formation, are easy to manufacture, and have high reliability. It is possible to provide a large number of parts at low cost.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a chip-type electronic component according to a first embodiment of the present invention.

FIG. 2 is a circuit diagram of the chip-type electronic component of this embodiment.

FIG. 3 is a diagram showing a manufacturing process of the chip-type electronic component of this embodiment.

FIG. 4 is a vertical sectional view of a chip-type electronic component according to a second embodiment of the present invention.

FIG. 5 is a vertical sectional view of a chip-type electronic component according to a third embodiment of the present invention.

[Explanation of symbols]

 10 Substrate 12 Capacitor 14 Resistor 22,44 Capacitance Forming Electrode 28,30 Resin Coating 32,34 End Face Electrode

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01G 4/12 424 9174-5E H01G 1/14 C

Claims (2)

[Scope of utility model registration request] 1. A chip-type electronic component in which a capacitor is formed on a surface of a dielectric substrate to form a capacitor, and an electrode is formed on an end face portion of the substrate, wherein a resin coating having a low dielectric constant is formed on the substrate. A chip-type electronic component, characterized in that an end face electrode formed on the end face and electrically connected to the capacitance forming electrode of the capacitor is formed on the outside of the resin coating with a conductive resin paint. 2. A chip-type electronic component in which a capacitor is formed on the surface of a dielectric substrate to form a capacitor, and an electrode is formed on the end face of the substrate, in which a glass film having a low dielectric constant is formed on the substrate. A chip-type electronic component, characterized in that an end face electrode formed on the end face and electrically connected to the capacitance forming electrode of the capacitor is formed on the outside of the glass film by a conductive resin paint or a conductive metal glaze.