JPH0371579A - Socket - Google Patents

Abstract

PURPOSE:To make good conduction between a lead of an electronic part and a socket electrode at all times by extending a contact face of the socket electrode toward moving direction of the lead of the electronic part. CONSTITUTION:When a lead 2a of an electronic part loosely inserted into a lead insertion hole of a socket body is moved by a moving body 4 and press- fitted into a socket electrode 6a, the lead 2a slides with respect to a contact face S of the socket electrode 6a. Thus contact area between the lead 2a and the socket electrode 6a increases and the lead 2a and the contact face S with the socket electrode 6a are mutually polished at the time of press-fitting, so that an insulation coating such as an oxide film formed on the contact face is removed thereby enhancing conductivity between the lead 2a and the socket electrode 6a.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to a socket for removably mounting electronic components on a predetermined wiring board.

[Conventional technology]

As a socket structure for removably mounting electronic components on a predetermined wiring board, the socket electrode provided in the lead insertion hole of the socket is given a biasing force toward the center of the lead insertion hole to insert the lead of the electronic component. There is a structure that holds it in place.

However, in this case, if the biasing force of the socket electrode is too strong or the number of leads of the electronic component is large, there is a problem that the leads may be deformed when they are inserted or removed.

Therefore, from the viewpoint of preventing such lead deformation,
Conventionally, as shown in FIG. 4, after a lead 30 of an electronic component is loosely inserted into a socket electrode 31, a movable body 32 provided in the socket is moved in the direction of the arrow in the figure to insert the socket electrode 31. A part of the inner wall surface of the socket electrode 31 was brought into contact with the lead 30 by applying pressure from the outside, thereby establishing conduction between the lead 30 and the socket electrode 3. Regarding such a socket structure, for example, Sumitomo 3M Co., Ltd., published by Japan Macnics Co., Ltd., rcONDENsED Catalog JP126. There is a description on page 127.

[Problem to be solved by the invention]

However, in the conventional socket described above, in which the socket electrode is brought into contact with the lead of the electronic component to establish continuity between them, the lead and the socket electrode are in point contact or line contact, so the contact state is not sufficient. However, the present inventor has found that there is a problem in that poor contact is likely to occur due to the formation of an insulating film such as an oxide film on the surface of the lead or socket electrode, for example.

The present invention has been made with attention to the above-mentioned problems, and an object thereof is to provide a technique that can always maintain good conduction between the lead of an electronic component and a socket electrode.

The above and other objects and novel features of the present invention will become apparent from the description of the specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the invention according to claim 1 includes a moving body that press-fits the lead of an electronic component loosely inserted into a lead insertion hole of a socket body into a socket electrode provided in the lead insertion hole, and The socket structure is such that the contact surface of the socket electrode extends in the direction of movement of the lead so that the lead slides against the contact surface of the socket electrode when the socket electrode is press-fitted into the socket electrode. .

A second aspect of the invention provides a socket structure in which at least a portion of the contact surface of the socket electrode is knurled.

[Effect]

According to the above-mentioned invention of claim 1, the contact state between the lead of the electronic component and the socket electrode is surface contact, and the contact area between them becomes large, and when the lead of the electronic component is press-fitted into the socket electrode, The contact surfaces between the component leads and socket electrodes are polished together, and insulating films such as oxide films formed on those contact surfaces are removed, ensuring good continuity between the electronic component leads and socket electrodes at all times. It becomes possible to do so.

Further, according to the invention described in claim 2, when the lead of the electronic component is press-fitted into the socket electrode, an insulating film such as an oxide film formed on the contact surface of the lead of the electronic component or the contact surface of the socket electrode is removed. Furthermore, since it can be removed better, it is possible to always maintain good conduction between the lead of the electronic component and the socket electrode.

〔Example〕

Fig. 1 is an enlarged perspective view of the main part schematically showing the socket 7) electrode of a socket according to an embodiment of the present invention, and Fig. 2 shows a state in which the lead of an electronic component is loosely inserted into the lead insertion hole of this socket. The perspective view and FIG. 3 are enlarged perspective views of essential parts schematically showing another socket electrode of this embodiment.

The socket 1 of this embodiment shown in FIG. 2 is used for aging testing of, for example, a dual-in-line package (DIP) type semiconductor integrated circuit device (electronic component) 2.

The socket 1 includes a socket body 3, a moving body 4 that moves the semiconductor integrated circuit device 2 in the direction of arrow A in the figure, a lever 5 that moves the moving body 4, and a lever 5 that extends downward from the bottom surface of the socket body 3. It is composed of a plurality of socket leads 6 provided.

The socket main body 3 is made of, for example, a synthetic resin, and is preferably a heat-resistant resin that can withstand an aging temperature of, for example, about 150° C. to 175° C.

Near the long sides of the upper surface of the socket main body 3, a plurality of rectangular lead insertion holes 7 are formed along the long sides.

The opening width d of the lead insertion hole 7 is wider than the thickness of the lead 2a of the semiconductor integrated circuit device 2, so that the lead 2a can be easily inserted into and removed from the lead insertion hole 7.

Inside the lead insertion hole 7, a socket electrode 6a made of, for example, aluminum or copper is provided.

The socket electrode 6a is integrally formed with the socket lead 6 described above, and its surface is plated with gold or the like. As shown in FIG. 1, the socket electrode 6a consists of two electrode plates 631+632 facing each other.

The interval between the electrode plates 6 aIt 63z is slightly narrower than the thickness of the lead 2 a of the semiconductor integrated circuit device if2, and the electrode plates 6 a, 6 a2 are biased toward each other.

The spacing between the electrode plates 6 aIt 612 on the lead 2a side is as follows:
In order to make it easier to press-fit the lead 2a, it gradually becomes wider toward the lead 2a side. Then, the electrode plate 6 aI
Each contact surface S of t e a2 extends in the direction in which the lead 2 a is moved by the moving body 4 .

Therefore, in the socket 1 of this embodiment, even when the lead 2a of the semiconductor integrated circuit device 2 is inserted into the lead insertion hole 7, the lead 2a is inserted into the socket electrode 6 by the moving body 4.
The structure is such that the lead 2a does not deform even when it is press-fitted into the lead 2a.

In addition, the contact state between the lead 2a and the socket electrode 6a is surface contact, and the contact area is larger than that of the conventional method. The contact surfaces S of the electrodes 6a are polished together to remove an insulating film such as an oxide film formed on the contact surfaces, so that the conduction between the lead 2a and the socket electrode 6a is always good.

The moving body 4 is made of the same synthetic resin as the socket body 3, for example. When the lever 5 is lowered, the movable body 4 moves in the direction of press-fitting the lead 2a into the socket electrode 6a.On the other hand, when the lever 5 is raised, the movable body 4 moves the lead 2a into the socket electrode 6a.
It moves in the direction of pulling out from a.

As described above, according to this embodiment, the lead 2a of the semiconductor integrated circuit 28 W2 loosely inserted into the lead insertion hole 7 of the socket body 3 is moved by the movable body 4 to connect the socket electrode 6a.
By extending the contact surface S of the socket electrode 6 bow in the moving direction of the lead 2a so that the lead 2a slides against the contact surface S of the socket electrode 6a when press-fitting into the socket electrode, the lead 2a and the socket electrode In addition, when the lead 2a is press-fitted into the socket electrode 6a, the contact area S between the lead 2a and the socket electrode 6a is polished together.
Since an insulating film such as an oxide film formed on their contact surfaces is removed, it is possible to always maintain good conduction between the leads 2a of the semiconductor integrated circuit device 2 and the socket electrodes 6a. As a result, it becomes possible to perform aging or testing with high reliability.

By the way, as a modification of the socket 1 of the embodiment, for example, as shown in FIG. 3, the contact surface S of the socket electrode 6a may be knurled into a mesh shape. in this case,
Semiconductor integrated circuit device 2 glued 2a to socket electrode 6a
When press-fitting, the insulating film such as an oxide film formed on the contact surface of the lead 2a or the contact surface S of the socket electrode 6a is
Furthermore, since it can be removed better, it is possible to always maintain good conduction between the lead 2a of the semiconductor integrated circuit device 2 and the socket electrode 6a.

As above, the invention made by the present inventor has been specifically explained based on Examples, but it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, in the above embodiments, the case where the electronic component is a DIP type semiconductor integrated circuit device has been described, but the invention is not limited to this and various modifications can be made. An integrated circuit device may also be used.

Further, in the above embodiment, a case has been described in which the contact surface of the socket electrode is knurled in a mesh pattern, but the contact surface is not limited to this, and for example, a striped pattern may be used.

In the above explanation, the invention made by the present inventor was mainly applied to sockets for aging or testing, which is the background field of application, but the invention is not limited to this, and various other applications are possible. For example, it can be applied to a socket for use in testing such as electronic circuit characteristic evaluation.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

That is, a movable body is provided that press-fits the lead of an electronic component loosely inserted into a lead insertion hole of a socket body into a socket electrode provided in the lead insertion hole, and when the lead of the electronic component is press-fitted into the socket electrode. 2. The socket structure according to claim 1, wherein the contact surface of the socket electrode extends in the direction of movement of the lead so that the lead slides on the contact surface of the socket electrode. The contact state between the lead and the socket electrode becomes surface contact, and the contact area between them increases.In addition, when the lead of the electronic component is press-fitted into the socket electrode, the contact surfaces of the electronic component and the socket electrode are polished together. Since an insulating film such as an oxide film formed on the contact surfaces thereof is removed, it is possible to always maintain good conduction between the lead of the electronic component and the socket electrode.

Further, at least a part of the contact surface of the socket electrode,
According to the socket structure according to claim 2, which is knurled, when the lead of the electronic component is press-fitted into the socket electrode, an oxide film or the like is formed on the contact surface of the lead of the electronic component or the contact surface of the socket electrode. Since the insulating coating can be removed even better, it is possible to always maintain good conduction between the leads of the electronic component and the socket electrode.

[Brief explanation of drawings]

FIG. 1 is an enlarged perspective view of a main part schematically showing a socket electrode of a socket according to an embodiment of the present invention, and FIG. 2 is a perspective view when an electronic component lead is inserted into the lead insertion hole of the socket. FIG. 3 is an enlarged perspective view of the main part schematically showing the contact surface of the socket electrode of a socket according to another embodiment of the present invention, and FIG. 4 is an enlarged perspective view of the socket electrode of a conventional socket. It is a perspective view shown typically. DESCRIPTION OF SYMBOLS 1...Socket, 2...Semiconductor integrated circuit device (electronic component), 2a...Lead, 3...Socket body, 4
... Moving body, 5... Lever 6... Socket lead, 6a... Socket electrode, 6 al+ 532
... Electrode plate, 7... Lead insertion hole, S... Contact surface, d... Opening width, 30... Lead, 31... Socket electrode, 32... Moving body. Figure 1 S: IBMm 2nd Diagram 7: Lead insertion hole diagram

Claims (1)

[Scope of Claims] 1. A moving body that press-fits the lead of an electronic component loosely inserted into a lead insertion hole of a socket body into a socket electrode in the lead insertion hole, and when press-fitting the lead into the socket electrode. . A socket, characterized in that the contact surface of the socket electrode extends in the direction of movement of the lead so that the lead slides on the contact surface of the socket electrode. 2. The socket according to claim 1, wherein at least a portion of the contact surface of the socket electrode is knurled.