JP2008218117A - Socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high user-friendly low-cost socket reducing the number of components. <P>SOLUTION: The socket comprises a plurality of contact pins 110, a base 130 holding the plurality of contact pins 110, and a cover 150 capable of horizontally moving over the base 130. The contact pin 110 is equipped with a pair of contacts 112 capable of opening and closing by elastic deformation and an extending part extending approximately perpendicularly from the pair of contacts 112. The extending part 114 is held on the base 130 and the pair of contacts 112 is aligned in a recessed area 134 of the main surface 132. When the cover 150 is in the insertion position, a BGA package 200 is mounted on the main surface 132 of the base through the window 160 of the cover 150. When the cover 150 moves to the clamping position, the cover 150 pushes the BGA package and the solder ball 220 is clamped by the pair of contacts 112. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a socket that enables mounting of a semiconductor device for surface mounting in which a plurality of terminals such as BGA (Ball Grid Array) or CSP (Chip Sized Package) are arranged on one surface.

  The socket serves as an interface for electrically connecting the semiconductor device and the circuit board. A typical socket into which a semiconductor device such as a BGA is mounted includes a base member on which the semiconductor device is placed and a cover member that presses the semiconductor device placed on the base member. A plurality of contacts are arranged in alignment on the base member, and each contact is connected to a terminal such as a bump formed on one surface of the semiconductor device. The cover member has a function of pressing the upper surface of the semiconductor device toward the base member in order to apply a constant contact pressure between the terminal and the contact of the semiconductor device.

  There are generally a probe pin type and a pinch contact type in a socket in which a semiconductor device such as a BGA is mounted. In the former, after placing the semiconductor package on the base member, the cover member is pressed from above the semiconductor package, and the cover member is fixed to the base member, so that the solder balls and the probe pins are brought into contact with each other to obtain electrical connection. . For example, Patent Document 1 discloses a semiconductor package socket using probe pins. As shown in FIG. 1, the socket includes an insulating substrate 1 that faces the solder balls 22 of the BGA 21, a conductive coil spring 4 that can expand and contract in the direction of the solder balls 22 of the BGA 21, and a through-hole of the substrate 1. A probe pin 3 provided in the hole 2 and electrically connected to the coiled spring 4 is provided.

  In the pinch contact type, as shown in FIG. 2A, a pair of contact portions of the contact pin 30 in a closed state is pushed down a cover (not shown) as shown in FIG. A mechanism for horizontally moving and opening the slider 32 is provided. With the contact portion opened, the semiconductor package 34 is placed on the mounting surface 34. Then, as shown in FIG. 2 (c), the cover 32 is opened to return the slider 32 to its original position. Are closed, and the half-d solder ball 36 is sandwiched between the contact portions to obtain an electrical connection. When removing the semiconductor package 34, the cover member is pushed again to open the contact portion of the contact pin 30 to release the solder ball 36 from the contact portion. Patent Document 2 discloses such a pinch contact type socket.

JP 2001-093634 A JP 2002-203653 A

  However, the conventional socket has the following problems. As the semiconductor package becomes smaller and lighter, the strength of the semiconductor package tends to decrease. Also, the number of external input / output terminals tends to increase as the density of integrated circuits in a semiconductor package increases.

  The above-mentioned probe pin type socket requires that the semiconductor package be pressed from above. When the number of terminals of the semiconductor package increases, the load for pressing increases, the load on the semiconductor package increases, and at the same time, the socket The operability of is reduced. In addition, in order to prevent the semiconductor package from being warped by the reaction force due to the probe pin, it is necessary to press a large area of the upper surface of the semiconductor package with the cover member, and thereby the visibility of the marking on the upper surface of the semiconductor package is improved It will decline. Furthermore, the probe pin is expensive, and the cost of the socket is increased.

  On the other hand, the pinch type socket requires a slider for opening and closing the contact portion of the contact pin and a mechanism for moving the contact pin, so that the number of parts increases, which increases the outer size of the socket, Cost becomes high. Furthermore, when the number of contact pins increases, a large operating force proportional to the number of contacts is required, which is not preferable in terms of operability.

The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a low-cost socket having excellent operability and a reduced number of parts.
A further object of the present invention is to provide a socket that does not impair the visibility of the marking on the upper surface of the semiconductor package.

  The socket according to the present invention is capable of mounting a semiconductor device for surface mounting, and includes a plurality of contacts made of a conductive metal and a main surface for mounting the semiconductor device, and holds the plurality of contacts. A base member that is attached to the base member, is movable on the base member in a horizontal direction, and is formed with a window for exposing a certain region of the main surface of the base member. The contact includes a pair of contact portions that can be opened and closed by elastic deformation, and an extending portion that extends substantially perpendicularly from the pair of contact portions, the extending portions being held by a base member, and the pair of contact portions Are aligned substantially parallel to the main surface, and when the moving member is in the first position on the base member, the semiconductor device can be placed on the main surface of the base member through the window of the moving member, Moving member is on base member When it is moved to the second position, the semiconductor device by the moving member is moved on the main surface in the horizontal direction, the terminals of the semiconductor device is sandwiched by a pair of contact portions of the corresponding contact.

  Preferably, a plurality of depressions capable of receiving each terminal of the semiconductor device are formed on the main surface of the base member, and a pair of contact portions of the plurality of contacts are respectively aligned with the plurality of depressions. Preferably, the pair of contact portions includes convex portions on opposing surfaces, and the interval between the convex portions is smaller than the diameter of the terminal of the semiconductor device. Furthermore, the pair of contact portions includes a first inclined surface, a convex portion connected to the first inclined surface, and a second inclined surface connected to the convex portion. In this case, the first inclined surface may be inclined more gently than the second inclined surface.

  Preferably, the depression includes a shape corresponding to the shape of the terminal of the semiconductor device. For example, in the case of a solder ball such as BGA, the recess includes a semicircular recess. The recess preferably includes a first recess for positioning the terminal of the semiconductor device and a second recess connected to the first recess, and the terminal of the semiconductor device is connected to the second recess from the first recess. It moves to the recess and is sandwiched between the pair of contact portions.

  Preferably, the first inclined surfaces of the pair of contact portions are aligned so as to face the first concave portion, and the convex portion of the first contact portion protrudes into the second concave portion. When the moving member is moved to the second position, the terminal of the semiconductor device is brought into contact with the side surfaces of the convex portion and the second concave portion.

  The moving member includes a protrusion, the base member includes an engaging portion that engages with the protrusion, and the first position or the second position of the moving member is the engagement between the protrusion and the engaging portion. It may be determined by The moving member includes a pressing portion that can contact the side portion of the semiconductor device, and when the moving member moves from the first position to the second position, the side portion of the semiconductor device is pressed by the pressing portion. You may do it. Further, the terminal of the semiconductor device is selected from any of a semicircular, conical, spherical and rectangular bump.

  According to the present invention, since the socket for mounting the semiconductor device for surface mounting can be constituted by the base member, the contact and the moving member, the number of parts of the socket can be reduced, and the socket can be reduced in size and weight, and Cost reduction can be achieved. Furthermore, since the terminal of the semiconductor device is held between the contact pins by moving the moving member in the horizontal direction, the configuration is simpler and the operability is improved as compared with the conventional case.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS The best embodiment of the present invention will be described below in detail with reference to the drawings. Here, a socket for mounting a BGA package is illustrated.

  FIG. 3A is a perspective view of the socket according to the present embodiment, showing a state in which the BGA package is not mounted, and FIG. 3B shows a state in which the BGA package is mounted. FIG. 4 is an overall view of the contact pin. The socket 100 according to the present embodiment includes a plurality of contact pins 110 made of a conductive metal, a base 130 that is made of an insulating resin, holds a plurality of contact pins, and is made of an insulating resin. And a cover 150 slidably mounted on the base 130. The base 130 and the cover 150 are formed by injection molding a resin such as polyetherimide (PEI) or polyamide (PA). In addition, polyethersulfone (PES), polyphenylene sulfide resin (PPS), liquid crystal polymer (LCP), and the like can be used.

  As shown in FIG. 4A, the contact pin 110 is formed, for example, by punching a metal plate such as beryllium copper or a copper alloy. The contact pin 110 includes a pair of contact portions 112 that can be opened and closed by elastic deformation, a bifurcated portion 114 that is bent substantially at right angles from the pair of contact portions 112, an extending portion 116 that is connected to the bifurcated portion 114, and an extension And a terminal portion 118 bent substantially at a right angle from the existing portion 116.

  As shown in FIG. 4B, the pair of contact portions 112 has convex portions 112a formed on the opposing surfaces. The convex portion 112a is formed between the inclined surface 112b and the inclined surface 112c. In this case, the inclined surface 112b may be slightly more inclined than the inclined surface 112c. The distance (gap) P between the opposing convex portions 112a can be made somewhat smaller than the diameter of the solder ball of the BGA package to be mounted. This is because, as will be described later, when the solder balls enter the pair of contact portions 112, the pair of contact portions 112 are opened and the solder balls are sandwiched. Further, the gap P of the convex portion 112a may be zero. In this case, the convex portions 112a of the pair of contact portions are in contact with each other from the beginning.

  5A is a plan view of the base, FIG. 5B is an enlarged view of a part of FIG. 5A, and FIG. 5C is a cross-sectional view taken along line AA in FIG. 5B. The figure is shown. As shown in the figure, a plurality of depressions 134 are formed on the main surface 132 of the base 130 so as to correspond to the positions of the solder balls of the BGA package to be mounted. As shown in FIG. 5B, the recess 134 includes a semicircular recess 134a and a rectangular recess 134b chamfered and connected from the semicircular recess 134a. The recessed part 134b is the same depth as the recessed part 134a, as shown in FIG.5 (c). A partition wall 134c is formed between the rectangular recess 134b and the semicircular recess 134a. Further, on both sides of the concave portion 134a and the concave portion 134b, a substantially rectangular through hole 136 penetrating from the main surface 132 of the base 130 to the back surface (not shown) is formed. A contact pin 110 is inserted into the through hole 136. The recess 134a positions the solder ball when the BGA package is placed on the main surface 132, and the recess 134b provides a space for the solder ball to move when the BGA package is moved.

  In addition, a pair of hooks 140 projecting from the side surfaces 138 of the base 130 are formed. The hook 140 extends with a certain length in the horizontal direction, and the hook 140 engages with an opening of a cover 150 described later. Between the pair of hooks 140, a pair of curved portions 142 that are recessed in a circular shape on the inside are further formed. The curved portion 142 is engaged with a protrusion of the cover 150 described later. Further, a pair of overhanging holding portions 144 are formed on the main surface 132 of the base 130. As will be described later, the pressing portion 144 presses the surface of the package when the BGA package is mounted.

  FIG. 6 is a diagram schematically showing the relationship between contact pins and depressions. The bifurcated portion 114 of the contact pin 110 passes through the adjacent through hole 136, and the terminal portion 118 protrudes from the back surface of the base 130 through the extending portion 116, and is connected to a wiring pattern or the like of a circuit board (not shown). The pair of contact portions 112 of the contact pin 110 are located in the recess 134 without protruding from the main surface 132. As shown in FIG. 6A, the pair of contact portions 112 is provided with a partition wall 134c therebetween, and the pair of contact portions 112 is preloaded so as to open in the direction of arrow F by the side surface of the partition wall portion 134c. Yes. The size of the preload can be changed by adjusting the width of the side wall portion 134c. If the width of the side wall portion 134c is substantially equal to or slightly smaller than the distance between the pair of contact portions 112, the preload is reduced to zero. It is also possible to make it. Further, the inclined surfaces 112b of the pair of contact portions 112 are arranged so as to be aligned with the chamfered portions of the recesses 134b, that is, to face the recesses 134a.

  FIG. 7 is a perspective view of the cover. As shown in the figure, the cover 150 includes a pair of opposing side surfaces 152 and an upper surface 154 connected to the pair of side surfaces 152. In the pair of side surfaces 152, a pair of slot-shaped openings 156 extending in the horizontal direction are formed. The horizontal length of the opening 156 is larger than the horizontal length of the hook 140 of the base 130 described above. Further, a projection 158 protruding outward is formed between the pair of openings 156.

  A rectangular window 160 is formed on the upper surface 154 of the cover 150 so as to expose the recess 134 of the main surface 132 of the base 130. A pressing portion 162 that is bent downward from the upper surface 154 and extends is formed on one side of the window 160, and a similar pressing portion 164 is formed on the opposite side.

  When the cover 150 is mounted on the base 130, the hook 140 of the base 130 is inserted into the opening 156 (see FIG. 3). The cover 150 can slide in the horizontal direction on the base 130, and the movement of the cover 150 is restricted by the sliding of the hook 140 and the opening 156. Further, the protrusion 158 of the cover 150 can slightly fit into one of the pair of curved portions 142 of the base 130, and the cover 150 is stopped at that position with a light click feeling.

  FIG. 8 is a diagram showing a BGA package to be attached to the socket. The BGA package 200 is formed with ball-shaped terminals (solder balls) 220 two-dimensionally arranged on the bottom surface of the main body 210. For example, the solder balls 220 are arranged in four rows at a pitch of 0.5 mm on the outer periphery. Projecting about 0.25 millimeters from the bottom of the package, the overall height of the package is about 0.9 millimeters.

  Next, the operation when the BGA package is mounted on the socket of this embodiment will be described. First, as illustrated in FIG. 9A, when the cover 150 is moved in the X1 direction with respect to the base 130, the protrusion 158 of the cover 150 is fitted to one curved portion 142 of the base 130. The position of the cover at this time is called an insertable position. When the cover 150 is in the insertable position, all the depressions 134 of the main surface 132 of the base 130 are exposed by the window 160 of the cover 150.

  Next, as shown in FIG. 9B, the BGA package 200 is placed on the main surface 132 through the window 160 of the cover 150. The solder ball 220 of the BGA package 200 is inserted into a semicircular recess 134a having a diameter slightly larger than this diameter, and the solder ball 220 is positioned. At this time, the pair of contact portions 112 are in a position facing the semicircular recess 134 a, and the solder ball 220 is not interfered by the pair of contact portions 112.

  Next, as shown in FIG. 9C, the cover 150 is slid in the horizontal direction from the insertable position in the X2 direction. When the cover 150 is slid in the X2 direction, the pressing portion 164 of the cover 150 simultaneously presses the side surface of the BGA package 200 in the X2 direction, and moves the BGA package 200 in the X2 direction on the main surface 132. At the same time, the upper surface of the package end may be pressed by the pressing portions 164a formed on both sides of the pressing portion 164.

  By this movement, the solder balls 220 of the BGA package 200 come into contact with the inclined surfaces 112b of the pair of contact portions 112. Since the gap P between the protrusions 112a of the pair of contact portions 112 is somewhat smaller than the diameter of the solder ball 220, when the solder ball 220 enters while following the inclined surface 112b, the pair of contact portions 112 is moved to the arrow Q. Spreading in the direction, the pair of contact portions 112 are elastically deformed.

  When the cover 150 slides further in the X2 direction and the protrusion 158 of the cover 150 is fitted to the other curved portion 142 of the base 130, the movement of the cover 150 is completed. This position is called a clamp position. When the cover 150 is in the clamp position, the upper surface of the BGA package is pressed by the pressing portion 144 of the base 130. Further, the center of the solder ball 220 is on the inclined surface 112c side with respect to the convex portion 112a of the pair of contact portions 112, and the solder ball 220 is sandwiched between the pair of convex portions 112a and the partition wall portion 134c. The solder ball 220 is pressed by a pair of contact portions 112 in a direction opposite to the arrow Q and slightly toward the partition wall portion, so that the solder ball 220 is difficult to return beyond the convex portion 112a. It will stay stable in position. Therefore, even if the operating force for sliding the cover 150 is released, the solder balls 220 are not pushed out of the pair of contact portions 112. Even if the cover 150 is moved from the clamp position to the insertable position, the solder ball 220 continues to be sandwiched between the pair of contact portions 112, and the electrical connection is lost even if the cover 150 moves due to vibration or the like. Absent.

  It should be noted that the socket 100 according to the present embodiment is not deformed by the slider or other member of the pair of contact portions 112 but elastically deformed when the solder ball is directly inserted. It is. For this reason, unlike the prior art, a slider for opening and closing the contact portion and its moving mechanism are not required.

  When removing the BGA package, the cover 150 is slid in the opposite direction, the cover pressing portion 162 is brought into contact with the side surface of the BGA package, and the BGA package is moved. As a result, the solder ball 220 is detached from the contact pin 112, and the BGA package can be taken out from the main surface 132.

  In the above embodiment, the cover protrusion 158 and the base bending portion 142 are fitted to determine the stop position of the cover 150, but such a configuration is not necessarily required. For example, the stop position of the cover 150 may be determined by appropriately selecting the sizes of the hook 140 of the base 130 and the opening 156 of the cover 150. Alternatively, the stop position of the cover may be determined by bringing the BGA package pressed by the cover 150 into contact with the base.

  As described above, according to the socket of this embodiment, the BGA package can be mounted with a small number of parts including the contact pins 110, the base 130, and the cover 150, so that the socket can be reduced in size and space, and the cost can be reduced. Can be achieved. Furthermore, since the BGA package can be fixed to the contact pins and an electrical connection can be obtained simply by moving the cover 150 in the horizontal direction, the operability becomes simpler. Further, since the BGA package does not need to be pressed from above, a large window 138 of the cover 150 can be formed, and visibility such as marking on the upper surface of the BGA package is improved.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments according to the present invention, and various modifications can be made within the scope of the gist of the present invention described in the claims. Deformation / change is possible.

  In the above embodiment, the BGA package in which solder balls are formed is targeted, but other surface-mounting semiconductor packages (semiconductor devices) may be used. The shape of the terminal is not limited to a spherical shape, and may be a semi-circular, conical, rectangular or other bump.

  The socket according to the present invention is used as an interface of a semiconductor device for surface mounting.

It is a figure which shows the conventional probe pin type socket. It is a figure which shows the conventional pinch contact type socket. FIG. 3A is a perspective view of a socket according to an embodiment of the present invention, in which FIG. 3A shows a state in which a BGA package is not attached, and FIG. 3B shows a state in which a BGA package is attached. FIG. 4A is an enlarged view of a contact, and FIG. 4B is a schematic enlarged view of a pair of contact portions. 5A is a plan view of the base, FIG. 5B is an enlarged view of a part of FIG. 5A, and FIG. 5C is a cross-sectional view taken along line AA in FIG. 5B. FIG. It is a figure which shows the typical relationship between a contact and a hollow, FIG. 6 (a) is a top view, FIG.6 (b) is a BB sectional drawing, FIG.6 (c) is an AA sectional view. is there. It is a perspective view of a cover. It is a figure which shows an example of a BGA package. It is a figure explaining the operation | movement which mounts a BGA package in a socket, The typical top view of a socket and the relationship between a contact pin and a solder ball are shown typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100: Socket 110: Contact pin 112: Contact part 112a: Convex part 112b: Inclined surface 112c: Inclined surface 114: Extension part 130: Base 132: Main surface 134: Depression 134a, 134b: Concave part 134c: Partition part 136: Through Hole 138: Side surface 140: Hook 142: Curved portion 144: Pressing portion 150: Cover 152: Side surface 154: Upper surface 156: Opening 158: Protrusion 160: Window 162, 164: Pressing portion 200: BGA package 210: Main body 220: Solder ball

Claims (11)

A socket in which a semiconductor device for surface mounting can be mounted,
A plurality of contacts made of conductive metal;
A base member that includes a main surface for mounting the semiconductor device and holds a plurality of contacts;
A movable member attached to the base member, movable in the horizontal direction on the base member, and formed with a window for exposing a certain region of the main surface of the base member;
The contact includes a pair of contact portions that can be opened and closed by elastic deformation, and an extending portion that extends substantially perpendicularly from the pair of contact portions, and the extending portions are held by a base member, and the pair of contacts The parts are aligned almost parallel to the main surface,
When the moving member is in the first position on the base member, the semiconductor device can be placed on the main surface of the base member through the window of the moving member;
When the moving member is moved to the second position on the base member, the semiconductor device is moved horizontally on the main surface by the moving member, and each terminal of the semiconductor device is sandwiched by a pair of contact portions of the corresponding contact. Socket. 2. The main surface of the base member is formed with a plurality of depressions capable of receiving each terminal of the semiconductor device, and the pair of contact portions of the plurality of contacts are respectively aligned with the plurality of depressions. Socket described in. 2. The socket according to claim 1, wherein the pair of contact portions includes protrusions on opposing surfaces, and a distance between the protrusions is smaller than a diameter of a terminal of the semiconductor device. 4. The socket according to claim 3, wherein the pair of contact portions includes a first inclined surface, the convex portion connected to the first inclined surface, and a second inclined surface connected to the convex portion. . The socket according to claim 2, wherein the recess has a shape corresponding to a shape of a terminal of the semiconductor device. The recess includes a first recess for positioning a terminal of the semiconductor device and a second recess connected to the first recess, and the terminal of the semiconductor device moves from the first recess to the second recess. The socket according to claim 2 or 5, wherein the socket is sandwiched between a pair of contact portions. The socket according to claim 6, wherein the first inclined surfaces of the pair of contact portions are aligned so as to face the first concave portion, and the convex portion of the first contact portion protrudes into the second concave portion. The socket according to claim 3, wherein when the moving member is moved to the second position, a terminal of the semiconductor device is brought into contact with a side surface of the convex portion and the second concave portion. The moving member includes a protrusion, the base member includes an engaging portion that engages with the protrusion, and the first position or the second position of the moving member is an engagement between the protrusion and the engaging portion. The socket according to claim 1, which is determined by a match. The moving member includes a pressing portion that can contact a side portion of the semiconductor device, and when the moving member moves from the first position to the second position, the semiconductor device is moved by the pressing portion. The described socket. 11. The socket according to claim 1, wherein the terminal of the semiconductor device is selected from any one of a semicircular, conical, spherical, and rectangular bump.

Images