JPS62165957A - Zero insertion type connector - Google Patents

Zero insertion type connector

Info

Publication number
JPS62165957A
JPS62165957A JP646086A JP646086A JPS62165957A JP S62165957 A JPS62165957 A JP S62165957A JP 646086 A JP646086 A JP 646086A JP 646086 A JP646086 A JP 646086A JP S62165957 A JPS62165957 A JP S62165957A
Authority
JP
Japan
Prior art keywords
semiconductor device
connector member
insertion type
zero
lever
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP646086A
Other languages
Japanese (ja)
Inventor
Masao Utahara
歌原　正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP646086A priority Critical patent/JPS62165957A/en
Publication of JPS62165957A publication Critical patent/JPS62165957A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction

Abstract

PURPOSE:To readily attach or detach a semiconductor device to or from a zero insertion type connector without bending a pin at attaching or detaching time by providing cutouts at the connector members of upper and lower portions. CONSTITUTION:A lever 4 is rotated in a direction (b) to increase the superposition of an inserting hole 3A and an engaging hole 2A of upper and lower connector members, to grasp a semiconductor device 5, and to readily and effectively insert a lead pin 5A by utilizing cutouts 3B, 2B. When a lever 4 supported to the members 3D, 3E is rotated in a direction (a), a lever driver 4A supported to a member 2D is press-bonded to a mount 3D to fix a lower connector 2. The hole 3A is moved in a direction (c) to insert a pin 5A into a socket 2G to connect them fixedly. The removal is operated by the reverse order to the above operation. The lead pin 5A is not erroneously bent in case of attaching or detaching the device 5 due to the formation of the cutouts 3B, 2B.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置を実装するコネクタに係り、特に
、ゼロインサーション型コネクタに適用して有効な技術
に関するものである６ 〔従来の技術〕 ゼロインサーション型コネクタは、上部コネクタ部材と
下部コネクタ部材からなり上部コネクタ部材を下部コネ
クタ部材に対して前後方向に移動させて、半導体装置の
リードピンを挿入し、その後、前記上部コネクタ部材を
後方行又は前方行に移動して、半導体装置のリードピン
とコネクタのリードピンのソケットを電気的に接続固定
するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a connector for mounting a semiconductor device, and in particular relates to a technique that is effective when applied to a zero-insertion type connector.6 [Prior Art] ] A zero-insertion type connector consists of an upper connector member and a lower connector member, and the upper connector member is moved in the front-back direction relative to the lower connector member to insert the lead pin of the semiconductor device, and then the upper connector member is moved backward. The lead pins of the semiconductor device and the sockets of the lead pins of the connector are electrically connected and fixed by moving to the row or forward row.

前記ゼロインサーション型コネクタは、日経マグロウヒ
ル社、１．９ｇ４．６．１１発行の、１］経工レクトロ
ニクス別冊マイクロデバイセス、Ｐ２Ｏ６に記載されて
いる。The zero-insertion type connector is described in 1] Keiko Lectronics Special Issue Micro Devices, P2O6, published by Nikkei McGraw-Hill, Inc., 1.9g 4.6.11.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、従来のゼロインサーション型コネクタで
は、ゼロインサーション型コネクタの方が半導体装置よ
りも大きいため、手で半導体装置を着脱するのは回層で
あった。また、そのため。However, in conventional zero-insertion type connectors, since the zero-insertion type connector is larger than the semiconductor device, it is necessary to manually attach and detach the semiconductor device. Also, for that reason.

半導体［ｔのリードピンをゼロインサーション型コネク
タのり−１−ピンのソケットに着脱する際に、リードピ
ンを曲げてしまうという問題があった。There was a problem in that the lead pins of the semiconductor [T were bent when attaching and detaching them to the socket of the glue-1-pin of the zero-insertion type connector.

本発明の目的は、ゼロインサーション型コネクタにおい
て、該ゼロインサーション型コネクタのリートピンのソ
ケットに半導体装置のリードピンを破損することなく確
実に着脱することができる技術を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a technology in which a lead pin of a semiconductor device can be reliably attached to and removed from a socket of a lead pin of a zero-insertion type connector without damaging it in a zero-insertion type connector.

本発明の前記ならびにその他の目的と新規な特徴は１本
明細書の記述及び添付図面によって明らかになるであろ
う。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

〔問題点を解決するための手段〕[Means for solving problems]

本願において開示される発明のうち、代表的なものの概
要を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、前記上部コネクタ部材及び下部コネクタ部材
に、半導体装置の着脱を容易にする切り込みを設けたこ
とにより、半導体装置のリードピンを破損することなく
、半導体装置をゼロインサーション型コネクタに容易に
接続固定するようにしたものである。That is, by providing the upper connector member and the lower connector member with notches that facilitate attachment and detachment of the semiconductor device, the semiconductor device can be easily connected and fixed to the zero-insertion type connector without damaging the lead pins of the semiconductor device. It was designed to do so.

〔作用〕[Effect]

前記した手段によれば、ゼロインサーション型コネクタ
から半導体装置を着脱する際に、前記ゼロインサーショ
ン型コネクタの上部コネクタ部材及び下部コネクタ部材
に切り込みに半導体装置を握んだ手がはるため、半導体
装置をしっかりと握んだ状態で確実に着脱することがで
きる。According to the above-described means, when a semiconductor device is attached or detached from a zero-insertion type connector, the hand holding the semiconductor device is inserted into the notch in the upper connector member and the lower connector member of the zero-insertion type connector. It is possible to reliably attach and detach a semiconductor device while firmly holding it.

以下、本発明の一実・施例を図面を用いて説明する。Hereinafter, one implementation/example of the present invention will be described using the drawings.

なお、全図において、同一の機能を有するものは同一の
符号を付け、その繰り返しの説明は省略する。In all the figures, parts having the same functions are denoted by the same reference numerals, and repeated explanations thereof will be omitted.

〔実施例〕〔Example〕

第１図は、本発明のゼロインサーション型コネクター実
施例の構成を示す全体の斜視図、第２図は、第１図のへ
方向がら見た側面図、第３図は、第１図に示す上部コネ
クタ部材を裏から見た斜視図、 第４図は、第【図に示す下部コネクタ部材の全体を示す
斜視図、 第５図は、第１図に示すレバ一部材の平面図。FIG. 1 is an overall perspective view showing the configuration of a zero-insertion type connector according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 4 is a perspective view showing the entire lower connector member shown in FIG. 5; FIG. 5 is a plan view of the lever member shown in FIG. 1; FIG.

第６図は、第４図の破線で囲んだ部分（イ）の拡大部分
斜視図である。FIG. 6 is an enlarged partial perspective view of the portion (A) surrounded by the broken line in FIG. 4.

第１図及び第２図において、１は、ゼロインサーション
型コネクタであり、下部コネクタ部材２の１−に摺動自
在に上部コネクタ部材３が取り付いている。そして、市
況上部コネクタ部材３を前後方向に、移動させるｉツバ
一部材４が取り付けられている。In FIGS. 1 and 2, 1 is a zero-insertion type connector, and an upper connector member 3 is slidably attached to a lower connector member 2 (1-). An i-flange member 4 for moving the market upper connector member 3 in the front-rear direction is attached.

第１図及び第２図に廿いて、５はゼロインサーション型
コネクタ１に実装された半導体装置である。Referring to FIGS. 1 and 2, reference numeral 5 denotes a semiconductor device mounted on the zero-insertion type connector 1. As shown in FIG.

前記上部コネクタ部材３は、第１図乃至第３図に示すよ
うに、半導体装置５を実装するためり一ドピン挿入用の
挿入穴３Ａが複数個、例えば数十〜数百個、設けられて
いる。そして、半導体装置５の着脱を容易にするための
半円状の切り込み３［３が上部コネクタ部材３の後部に
設けられている。As shown in FIGS. 1 to 3, the upper connector member 3 is provided with a plurality of insertion holes 3A, for example, tens to hundreds of holes, for inserting pins for mounting the semiconductor device 5. There is. A semicircular notch 3 [3 is provided at the rear of the upper connector member 3 to facilitate attachment and detachment of the semiconductor device 5.

また、上部コネクタ部材３の中央部には、上部コネクタ
部材３を前記下部コネクタ部材２にＩＨ動自在に取り付
けるための摺動部材３Ｃが設けられている。また、上部
コネクタ部材３の先端部には、第３図に示すように、前
記レバ一部材４を回転自在に取り付けるレバー支持部月
３Ｄ及び３Ｅが設けられている。そして、前記レバー支
持部材３Ｄは、レバ一部材４のストライカも兼ねている
。Furthermore, a sliding member 3C is provided at the center of the upper connector member 3 for attaching the upper connector member 3 to the lower connector member 2 so as to be movable through IH. Furthermore, as shown in FIG. 3, lever support parts 3D and 3E are provided at the tip of the upper connector member 3 to rotatably attach the lever member 4. The lever support member 3D also serves as a striker for the lever member 4.

前記下部コネクタ部材２は、第１図及び第４図に示すよ
うに、前記上部コネクタ部材３の挿入穴３Ａと同じ位置
に半導体装置５を実装する係合穴２Ａが前記挿入穴３Ａ
と同し数だけ設けられている。また、第６図に示すよう
に、前記係合穴２Ａの内部には、半導体装置５のリード
ピン５Ａを電気的に確実に接続固定するためのり−ドピ
ン２１−（のソケット部２Ｇが取り付いている。そして
、第１図及び第２図及び第４図に示すように、半導体装
置５の着脱を容易にするための半円状の切り込み２Ｂが
前記上部コネクタ部材３の切り込み３Ｂと対応する位置
に設けられている。また、第４図に示すように、下部コ
ネクタ部材２の中央部には。As shown in FIGS. 1 and 4, the lower connector member 2 has an engagement hole 2A for mounting the semiconductor device 5 at the same position as the insertion hole 3A of the upper connector member 3.
There are an equal number of Further, as shown in FIG. 6, a socket portion 2G of a glued pin 21-(for electrically securely connecting and fixing the lead pin 5A of the semiconductor device 5) is attached inside the engagement hole 2A. As shown in FIGS. 1, 2, and 4, a semicircular notch 2B for facilitating attachment and detachment of the semiconductor device 5 is located at a position corresponding to the notch 3B of the upper connector member 3. Also, as shown in FIG. 4, in the center of the lower connector member 2.

前記摺動部材３Ｃを摺動させる摺動面２Ｃが設けられて
いる。また、下部コネクタ部材２の先端部には、第５図
に示すレバ一部材４の上部シネフタ部材２を移動させる
レバー駆動部４Ａを支持するための支持部２１）が一体
に設けられている。また、支持部２Ｄの前部と後部に前
記レバー駆動部４Ａが挿入する溝を形成するレバー駆動
部装着部２Ｅと２Ｆが一体に設けら才している。A sliding surface 2C on which the sliding member 3C slides is provided. Further, a support portion 21) for supporting a lever drive portion 4A for moving the upper cinema lid member 2 of the lever member 4 shown in FIG. 5 is integrally provided at the tip of the lower connector member 2. In addition, lever drive part mounting parts 2E and 2F are integrally provided at the front and rear parts of the support part 2D, forming grooves into which the lever drive part 4A is inserted.

ゼロインサーション型コネクタ１のり−ドピン２Ｈは前
記ソケット部２Ｇと外部装置と電気的に接続するピン部
２丁からなっており、これらは一体に形成されている。The glued pin 2H of the zero insertion type connector 1 consists of the socket part 2G and two pin parts electrically connected to an external device, which are integrally formed.

次に、本実施例のゼロインサーション型コネ、Ｉりの動
作を説明する。Next, the operation of the zero insertion type connector of this embodiment will be explained.

第１図において、レバ一部材４をｂ方向に回動させると
、前記ゼロインサーション型コネクタ１の」二部コネク
タ部材３の挿入穴３Ａと下部コネクタ部材２の係合穴２
Ａは、第７図に示すように、半導体装置５のリードピン
５Δが容易に挿入できろ叔うに重り部分の穴が大きくな
る。その状１服で半導体装置５を手でつかみ、前記切り
込み３１３　）！Ｌび２Ｂを利用して、半導体装！１５
のリードピン５Ａを確実に前記挿入穴３Ａ及び係合穴２
Ａに挿入する（第７図の実線で描かれた状態である）。In FIG. 1, when the lever member 4 is rotated in the direction b, the insertion hole 3A of the two-part connector member 3 of the zero insertion type connector 1 and the engagement hole 2 of the lower connector member 2
In A, as shown in FIG. 7, the hole in the weight portion becomes larger so that the lead pin 5Δ of the semiconductor device 5 can be easily inserted. In that state, grab the semiconductor device 5 with your hand and open the notch 313 )! Semiconductor packaging using L2B! 15
Make sure to insert the lead pin 5A into the insertion hole 3A and the engagement hole 2.
Insert it into A (the state drawn by the solid line in FIG. 7).

この状態から、第１図に示すレバ一部材４をａ方向に回
動することによって、第３図及び第４図に示す前記レバ
ー支持部材３Ｄ及び３Ｅに支持されるレバ一部材４が回
転し、１Ｙｊ記支持部２Ｄに支持されていたレバー駆動
部４Ａがレバー駆動部装着部２Ｅに圧着し、第７図に示
すように、下部コネクタ部材２を固定すると、挿入穴３
ＡがＣ方向に！３動してリートピンＳＡを押し込み９前
記ソケット部２Ｇに半導体装置５のリードピンＳＡが電
気的に接続固定して実装を完了する。From this state, by rotating the lever member 4 shown in FIG. 1 in the direction a, the lever member 4 supported by the lever support members 3D and 3E shown in FIGS. 3 and 4 is rotated. , 1Yj. When the lever drive section 4A supported by the support section 2D is crimped onto the lever drive section mounting section 2E and the lower connector member 2 is fixed as shown in FIG.
A is in the direction of C! The lead pin SA of the semiconductor device 5 is electrically connected and fixed to the socket portion 2G by moving 9 to complete the mounting.

また、半導体装置５を取りはずす時は、第１図しこ示す
レバ一部材４をｂ方向に回動することにより、第３図及
び第４図に示すレバー支持部材３Ｄ及び３Ｅに支持され
ていたレバ一部材４が回転し。Further, when removing the semiconductor device 5, by rotating the lever member 4 shown in FIG. 1 in the direction b, the semiconductor device 5 is supported by the lever support members 3D and 3E shown in FIGS. 3 and 4. The lever member 4 rotates.

１１「記支持部２Ｄに支持されているレバー駆動部４Δ
がレバー駆動部装着部２Ｆに圧着し、第７図に示すよ′
）に、下部コネクタ部材２を固定すると挿入穴３Ａがｄ
方向に移動してリードピン５Ａを押しはずし、Ｉ＊記ソ
ケット部２Ｇから半導体装置５のリートピンＳＡがはず
れる。そして、第１図に示す前記切り込み３Ｂ及び２Ｂ
を利用しで、手で半導体装置５をつかみ、リードピンＳ
Ａを破損することなく確実に取りはずすことができる。11 "Lever drive section 4Δ supported by support section 2D
is crimped onto the lever drive unit attachment part 2F, as shown in Figure 7'.
), when the lower connector member 2 is fixed, the insertion hole 3A is
direction to push and remove the lead pin 5A, and the lead pin SA of the semiconductor device 5 is removed from the I* socket portion 2G. And the cuts 3B and 2B shown in FIG.
, grasp the semiconductor device 5 with your hand, and attach the lead pin S.
A can be reliably removed without damaging it.

以」二の説明かられかるように、前記切り込み３Ｂ及び
２Ｂを設けたことにより、この実施例によれば、半導体
装置５をゼロインサーション型コネクタｌから着脱する
際に５誤って半導体装置５のリートピン５Ａを曲げてし
まうことがなく、容易に着脱できる。As can be seen from the following explanation, by providing the notches 3B and 2B, according to this embodiment, when the semiconductor device 5 is attached or detached from the zero-insertion type connector l, the semiconductor device 5 may be accidentally inserted. It can be easily attached and detached without bending the lead pin 5A.

また、半導体装置５の選別やエージング時での作業効率
を向上することができる。Furthermore, the work efficiency during sorting and aging of the semiconductor devices 5 can be improved.

なお、第８図に示すように、前記ゼロインサーション型
コネクタ１の切り込み３Ｂ″及び２Ｂ’を、上部コネク
タ部材３及び下部コネクタ部材２の中央部に設け、上部
コネクタ部材３の前部と後部に摺動部材３Ｃ’を設けた
構成としてもよい。As shown in FIG. 8, the notches 3B'' and 2B' of the zero-insertion type connector 1 are provided in the center of the upper connector member 3 and the lower connector member 2, and It is also possible to have a configuration in which a sliding member 3C' is provided.

〔効果〕〔effect〕

以上説明したように１本願で開示した新規な技術によれ
ば、前記ゼロインサーション型コネクタに切り込みを設
けたことにより、半導体装ＩｆＬをゼロインサーション
型コネクタから着脱する際に、１１１って半導体装置の
リードピンを曲げてしまうことがなく、容易に着脱でき
ろ。As explained above, according to the novel technology disclosed in the present application, by providing the notch in the zero-insertion type connector, when the semiconductor device IfL is attached or detached from the zero-insertion type connector, the semiconductor device 111 is It should be easy to attach and detach without bending the lead pins of the device.

また、半導体装置の選別やエージング時での作業効率を
向上することができる。Further, it is possible to improve work efficiency during sorting and aging of semiconductor devices.

以−ヒ、本発明を実施例にもとすき具体的に説明したが
、本発明は、　ｉＭｊ記実施例に限定されるものではな
く、その要旨を逸脱しない範囲において種々変形可能で
あることはいうまでもない。Hereinafter, the present invention has been specifically explained using Examples, but the present invention is not limited to the Examples described above, and may be modified in various ways without departing from the gist thereof. Needless to say.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は１本発明のゼロインサーション型コネクター実
施例の構成を示す全体の斜視図、第２図は、第１図のＡ
方向から見た側面図、第３図は、第１図に示す上部コネ
クタ部材を裏から見た斜視図、 第４図は、第１図に示す下部コネクタ部材の全体を示す
斜視図、 第５図は、第１図に示すレバ一部材の平面図、第６図は
、第４図の破線で囲んだ部分（イ）の拡大部分斜視図 第７図は、半導体装置が装着された状態におけろコネク
タの断面図、 第８図は、他の実施例のコネクタの斜視図である。 図中、１・・・ゼロインサーション型コネクタ、２・・
・下部コネクタ部材、２Ａ・・・係合穴、２Ｂ・・・切
り込み、２Ｇ・・・ソケット部、２Ｈ・・・リードピン
、２■・・・ビン部、３・・・上部コネクタ部材、３Ａ
・・・挿入穴、３Ｂ・・・切り込み、４・・・レバ一部
材、５・・半導体装置である。 代理人　弁理士　小川勝馬　　ド 第　　１　　図 第　　２　　図 第　　３　　図 、、））Ａ 第　　４　　図 第　　５　　図 第　　６　　図 第　　７　　図FIG. 1 is an overall perspective view showing the configuration of a zero-insertion type connector according to an embodiment of the present invention, and FIG. 2 is an A of FIG. 1.
3 is a perspective view of the upper connector member shown in FIG. 1 seen from the back; FIG. 4 is a perspective view of the entire lower connector member shown in FIG. 1; The figure is a plan view of the lever member shown in FIG. 1, and FIG. 6 is an enlarged perspective view of the part (A) surrounded by the broken line in FIG. 4. FIG. FIG. 8 is a perspective view of another embodiment of the connector. In the figure, 1... Zero insertion type connector, 2...
・Lower connector member, 2A...Engagement hole, 2B...Notch, 2G...Socket part, 2H...Lead pin, 2■...Bin part, 3...Upper connector member, 3A
. . . insertion hole, 3B . . . notch, 4 . . . lever member, 5 . . . semiconductor device. Agent Patent Attorney Katsuma Ogawa Figure 1 Figure 2 Figure 3, )) A Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

【特許請求の範囲】 １、上部コネクタ部材と下部コネクタ部材からなり、上
部コネクタ部材を下部コネクタ部材に対して前方向又は
後方向に移動させて、下部コネクタ部材に設けられてい
るリードピンのソケットに半導体装置のリードピンを挿
入し、その後、前記上部コネクタ部材を後方向又は前方
向に移動して、半導体装置のリードピンとコネクタのリ
ードピンのソケットを電気的に接続固定するゼロインサ
ーション型コネクタであって、前記上部コネクタ部材及
び下部コネクタ部材に、半導体装置の着脱を容易にする
切り込みを設けたことを特徴とするゼロインサーション
型コネクタ。 ２、前記切り込みを上部コネクタ部材及び下部コネクタ
部材の後部に設けたことを特徴とする特許請求の範囲第
１項記載のゼロインサーション型コネクタ。 ３、前記切り込みを上部コネクタ部材及び下部コネクタ
部材の中央部に設けたことを特徴とする特許請求の範囲
第１項記載のゼロインサーション型コネクタ。 ４、前記上部コネクタ部材の移動は、レバー機構を使用
したことを特徴とする特許請求の範囲第１項記載のゼロ
インサーション型コネクタ。[Claims] 1. It consists of an upper connector member and a lower connector member, and the upper connector member is moved forward or backward relative to the lower connector member to fit into the socket of the lead pin provided in the lower connector member. A zero-insertion type connector in which a lead pin of a semiconductor device is inserted and then the upper connector member is moved backward or forward to electrically connect and fix the lead pin of the semiconductor device and the socket of the lead pin of the connector. . A zero-insertion type connector, characterized in that the upper connector member and the lower connector member are provided with notches to facilitate attachment and detachment of a semiconductor device. 2. The zero-insertion type connector according to claim 1, wherein the notch is provided at the rear of the upper connector member and the lower connector member. 3. The zero-insertion type connector according to claim 1, wherein the notch is provided at the center of the upper connector member and the lower connector member. 4. The zero-insertion type connector according to claim 1, wherein the upper connector member is moved using a lever mechanism.
JP646086A 1986-01-17 1986-01-17 Zero insertion type connector Pending JPS62165957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP646086A JPS62165957A (en) 1986-01-17 1986-01-17 Zero insertion type connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP646086A JPS62165957A (en) 1986-01-17 1986-01-17 Zero insertion type connector

Publications (1)

Publication Number Publication Date
JPS62165957A true JPS62165957A (en) 1987-07-22

Family

ID=11639049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP646086A Pending JPS62165957A (en) 1986-01-17 1986-01-17 Zero insertion type connector

Country Status (1)

Country Link
JP (1) JPS62165957A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218117A (en) * 2007-03-02 2008-09-18 Sensata Technologies Inc Socket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218117A (en) * 2007-03-02 2008-09-18 Sensata Technologies Inc Socket

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