JP2001167855A - Socket for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for electronic parts that can be detachably installed on a board and formed more thinly without a cover plate. SOLUTION: The socket 1 for electronic pars is made a plane shape and comprises a housing 2 having a plurality of openings 21 at outer surface, terminals disposed at each of the openings 21, and a means 3 for moving electronic parts 4 along the surface of the housing 2 by pressing side surface of the electronic parts 4 mounted on the housing 2. The electronic parts 4 is mounted on the housing 2 and the protruding pins 41 are inserted in the opening 21. Pins 41 are connected to the terminals by mounting the electronic parts 4 on the housing 2 and moving them along the surface of the housing 2 using the moving means 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electronic component for detachably mounting an electronic component such as a CPU on a substrate.

[0002]

2. Description of the Related Art When electronic components such as a CPU are detachably mounted on a substrate, an LIF (Low Insertion Foam) is used.
A PGA (Pin Grid Array) type socket called an RCE) or a ZIF (Zero Insertion Force) socket is used. This type of socket has a flat plate-shaped housing having a plurality of openings formed on a surface thereof, and a cover plate which covers a surface of the housing and has a plurality of through holes communicating with the openings. In addition, metal terminals are provided in the openings.

When installing an electronic component, for example, the electronic component is placed on a cover plate, and a pin protruding from the electronic component is inserted into the opening through a through hole. In this case, the pins are located on one side of the terminal and they are separated. Next, when the cover plate is moved to the other side along the surface of the housing, the pin in the opening is pushed by the other side by the cover plate to contact the terminal, and the pin is connected to the terminal. When removing the electronic component, the cover plate is moved to one side, the terminal is separated from the pin, and then the pin is pulled out from the opening and the through hole.

[0004]

However, in the case of the above-mentioned conventional electronic component socket, since the cover plate is provided on the housing, the socket becomes thicker by the thickness of the cover plate, and the miniaturization of the socket is limited. There was a problem that was. The present invention has been made in view of the above circumstances, and has as its object to provide a thinner socket for electronic components without a cover plate.

[0005]

SUMMARY OF THE INVENTION A socket for an electronic component according to the present invention has a flat plate shape, a housing having a plurality of openings formed on a surface thereof, terminals installed in each of the openings, and a housing mounted on the housing. Moving means for moving the electronic component along the surface of the housing by pressing a side surface of the mounted electronic component, the electronic component being mounted on the housing, and a pin projecting from the electronic component. Into the opening, and further moving the electronic component along the surface of the housing using the moving means,
The pin is connected to the terminal.

Here, it is desirable that the moving means is a shuttle that holds the side surface of the electronic component from both ends in the moving direction and moves along the surface of the housing.

[0007] More preferably, the shuttle is
For example, it can be moved by hand tools such as pliers.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an example of an embodiment of an electronic component socket according to the present invention. The electronic component socket 1 is a shuttle (moving means) that moves the electronic component 4 along the surface of the housing 2 by pressing the housing 2 and a side surface of an electronic component 4 (described later) mounted on the housing 2. 3).

The housing 2 is a resin member having a rectangular flat plate shape corresponding to the planar shape of the electronic component 4 to be mounted.
A plurality of openings 21 for receiving (described later) are formed in accordance with the protruding positions of the pins 41, and metal terminals (not shown) are provided in the respective openings 21. FIG.
As shown in FIG. 2, of the two sets of sides of the housing 2 which are parallel to each other, one set of sides (sides extending in the left and right direction in FIG.
Abbreviated as long side. ) Are formed along the other set of sides at both ends of the housing 2 so as to protrude toward the front surface side (upward in the figure) of the housing 2. Further, columnar protrusions 23 protruding from the surface of the protrusion 22 are formed at both ends of the protrusion 22.

The shuttle 3 is formed by stamping a metal plate by press working or the like and forming it into a predetermined shape.
A pair of holding portions 31 each of which has a U-shape that projects toward the surface side of the housing 2 in a cross-sectional view and that connects both ends of the holding portions 31 from outside the housing 2. It has a pair of connecting portions 32 parallel to the sides, and is fitted in the housing 2 from the front side as a whole, and has a rectangular frame shape surrounding the housing 2. The shape of the space S surrounded by the shuttle 3 is substantially the same as the planar shape of the electronic component 4.

A gap having a predetermined width is formed between the holding portion 31 and the side surface of the opposed protruding portion 22. As a result, the holding portion 31 is separated from the protruding portion 22 by an amount corresponding to this gap. It is movable along the long side. Also, the holding unit 3
Long holes 31a penetrating the holding portion 31 are formed at positions facing the protrusions 23, respectively, on the surface of the first surface 1. The shuttle 3 is inserted by inserting the corresponding protrusions 23 into these long holes 31a. It is supported by the housing 2. Further, the major axis of each of the long holes 31a is parallel to the long side, and as a result, the holding portion 31
On the other hand, it is possible to move along the long side by an amount corresponding to the difference between the long diameter of the long hole 31a and the diameter of the projection 23.

Here, the amount of movement of the holding portion 31 with respect to the protrusions 22 and the protrusions 23 coincides with the amount of movement of the pin 41 in the opening 21 when the pin 4 is attached to and detached from the terminal in the opening 21. Is predetermined. That is,
The shuttle 3 is supported by the housing 2 so as to be movable along the long side as shown by an arrow M in the figure, and the amount of movement coincides with the amount of movement of the pin 41 in the opening 21.

The tip of the projection 23 inserted into the elongated hole 31a has a diameter larger than the minor diameter of the elongated hole 31. As a result, the projection 23 is prevented from falling out of the elongated hole 31a. On the other hand, code 3
1b is a notch formed on the side of the holding portion 31 facing outward, and 32a is a guide piece that gradually extends outward from the side end surface of the connecting portion 32 toward the front surface side.

The attachment / detachment of the electronic component 4 to / from the electronic component socket 1 having the above configuration will be described below. When installing the electronic component 4, first, use hand tools such as pliers,
The shuttle 3 is moved to one side, that is, the initial position with respect to the housing 2 by, for example, nipping the side surface of the holding portion 31 between the cutout portions 31b. Note that the initial position indicates a position where the pin 41 is inserted into one side of the terminal provided in the opening 21 when the electronic component 4 is supported by the shuttle 3 at this position.

Next, as shown by an arrow C in FIG. 1, the electronic component 4 is removed with the pin 41 facing the housing 2 side.
The holding portion 31 and the guide piece 32a are used as guides to fit into the space S formed in the shuttle 3. As a result, as shown in FIG. 2, the side surface of the electronic component 4 is sandwiched between the opposing side surfaces (reference numeral 31c in the figure) of the holding portion 31, the electronic component 4 is supported by the shuttle 3, and the pin 41 is , Opening 2
1 is inserted into one side of a terminal installed in the device.

When the shuttle 3 is moved from the initial position with respect to the housing 2 to the other side using a hand tool such as pliers, the side surface of the electronic component 4 supported by the shuttle 3 is pushed to the other side by the side surface 31c. The electronic component 4 moves along the surface of the housing 2 to the other. As a result, the pin 41 in the opening 21 contacts the terminal located on the other side, and the pin 41 is connected to the terminal. When removing the electronic component 4, the shuttle 3 is returned to one side again by using a hand tool such as pliers, and the terminal and the pin 41 are separated. When the shuttle 3 returns to the initial position, the electronic component 4 is removed from the shuttle 3.

In the electronic component socket 1 having the above configuration, the electronic component 4 is moved using the shuttle 3 surrounding the housing 2 instead of the conventional cover plate. It can be placed directly on the housing 2 without any intervention. Therefore,
The socket 1 can be made thinner by the thickness of the cover plate, and the socket can be downsized.

Further, the electronic component socket 1 of the present embodiment
Then, the holding portion 31 of the shuttle 3 is
2, but as shown in FIG.
1 and the overall height of the electronic component socket 1 including the protrusion 22 is
If the electronic component 4 installed in the electronic component socket 1 is at the same position as the surface of the electronic component 4 or at a lower position, the holding portion 31 and the projection 2
The existence of 2 does not matter at all. Alternatively, even when the overall height of the electronic component socket 1 is higher than the surface of the electronic component 4 installed in the electronic component socket 1,
If the overall height of the electronic component socket 1 is less than the overall height of an equivalent electronic component socket having a cover plate,
The object of the present invention is achieved. In practice, since the shuttle 3 of the electronic component socket 1 of the present embodiment is made of metal, its strength is maintained even if the shuttle 3 is made thinner. As a result, the overall height of the electronic component socket 1 becomes smaller than the electronic height. It is maintained at a position sufficiently lower than the surface of the electronic component 4 installed in the component socket 1.

In addition, since the shuttle 3 can be moved by hand tools such as pliers, it is not necessary to provide the electronic component socket 1 with a special mechanism for moving the shuttle 3. Therefore, the size of the electronic component socket 1 can be further reduced, and the cost required for designing and installing the mechanism can be reduced.

FIG. 3 shows another embodiment of the electronic component socket 1 according to the present invention. This electronic component socket 1
Then, the protruding portion 22 and the holding portion 31 are on the other end side (right side in the figure).
Is formed only. Further, a pair of flange portions 24 projecting outward from the long side surface is formed on one end side of the housing 2. The flange 24 has a groove 24
a is formed, and in the groove 24a, the tips of a pair of connecting portions 32 extending from the holding portion 31 so as to sandwich the long side along the long side are movably held along its own longitudinal direction. ing. Further, holding projections 33 protrude from the distal end of the connecting portion 32 toward the surface of the housing 2.
On the other hand, in the case of the present embodiment, in place of the notch 31b, a notch 31d for moving the shuttle 3 is formed on the surface of the holding portion 31, and the guide piece 32a of the connecting portion 32 is removed. Other configurations are the same as those of the electronic component socket 1 shown in FIGS.

In the electronic component socket 1 of this embodiment,
The electronic component 4 is sandwiched between the side surface 31c of the holding portion 31 and the side surface (reference numeral 33a in the drawing) of the holding protrusion 33 in a state where the pin 41 faces the housing 2 side. The electronic component 4 is supported by the shuttle 3, and the pin 41 is inserted into one side of the terminal provided in the opening 21. And the tip of hand tools such as pliers,
By inserting the shuttle 3 into the notch 31d and moving the shuttle 3 in the direction indicated by the arrow M in the figure, the pin 41
It is attached to and detached from terminals installed in the device.

In the electronic component socket 1 of the present embodiment,
Since the protruding portion 22 and the holding portion 31 are formed only on the other end side, the configuration of the one end side not having the protruding portion 22 and the holding portion 31 is reduced in size and simplified. Other effects are shown in FIGS. 1 and 2.
This is the same as the electronic component socket 1 shown in FIG.

Incidentally, the electronic component socket 1 according to the present invention.
Is not necessarily limited to the configuration of the above-described embodiment, and can be arbitrarily modified without departing from the gist of the present invention. In addition, the above hand tools include:
In addition to pliers, any known hand tools, such as pliers and tweezers, can be used as long as they can hold the holding portion 31.

[0024]

As described above, in the electronic component socket according to the present invention, the electronic component is moved by using the shuttle surrounding the housing instead of the conventional cover plate. It can be placed directly on the housing without the interposition of a plate. As a result, the socket can be made thinner by the thickness of the cover plate, and the effect of reducing the size of the socket can be obtained.

[Brief description of the drawings]

FIG. 1 is an upper perspective view showing an example of a structure of an electronic component socket according to the present invention.

FIG. 2 is a partial cross-sectional view of the socket shown in FIG. 1, viewed from the side, showing an example of the structure of the electronic component socket according to the present invention.

FIG. 3 is a top perspective view showing an example of the structure of the electronic component socket according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component socket 2 Housing 3 Shuttle (moving means) 4 Electronic component 41 pin

Continued on the front page F term (reference) 5E023 AA04 AA16 AA22 BB17 BB22 CC02 CC22 DD03 DD06 GG02 HH01 HH18 HH30 5E024 CA19

Claims (3)

[Claims] 1. A housing having a flat plate shape and a plurality of openings formed in a surface thereof, terminals provided in each of the openings, and a side surface of an electronic component mounted on the housing is pressed. Moving means for moving the electronic component along the surface of the housing, placing the electronic component on the housing, inserting a pin projecting from the electronic component into the opening, and further mounting the electronic component. A socket connected to the terminal by moving the pin along the surface of the housing using the moving means. 2. The electronic component according to claim 1, wherein the moving unit is a shuttle that sandwiches a side surface of the electronic component from both ends in the moving direction and moves along a surface of the housing. Socket. 3. The electronic component socket according to claim 2, wherein the shuttle is movable by hand tools such as pliers.