JP4551309B2 - Socket for semiconductor device - Google Patents

Socket for semiconductor device Download PDF

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Publication number
JP4551309B2
JP4551309B2 JP2005309952A JP2005309952A JP4551309B2 JP 4551309 B2 JP4551309 B2 JP 4551309B2 JP 2005309952 A JP2005309952 A JP 2005309952A JP 2005309952 A JP2005309952 A JP 2005309952A JP 4551309 B2 JP4551309 B2 JP 4551309B2
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semiconductor device
socket
portion
claw
main body
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JP2005309952A
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JP2007122913A (en
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修二 渡辺
哲也 金子
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山一電機株式会社
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Description

  The present invention relates to a socket for a semiconductor device that can accommodate a semiconductor device mounted on a predetermined wiring board.

  In general, a semiconductor device may be mounted on a wiring board such as a liquid crystal display device via a semiconductor device socket. A semiconductor device socket having a housing portion for housing a semiconductor device mounted on a wiring board is called a so-called mounting socket. For example, as disclosed in Patent Document 1, the mounting socket is provided on a printed wiring board having an input / output unit for supplying a predetermined signal and transmitting a signal from the semiconductor device.

  As disclosed in Patent Document 1, the mounting socket has a housing portion for housing the semiconductor device and is fixed to a predetermined position on the printed wiring board, and is detachable from the socket body portion. The main element includes a cover member that has a pressing portion that presses the tip of each lead terminal of the accommodated semiconductor device against the contact portion of each contact terminal and holds the semiconductor device.

  A plurality of claw portions that are respectively engaged with the claw portions on the side portion of the socket main body portion are formed at predetermined intervals on the outer peripheral portions of both side surfaces of the cover member formed in a rectangular frame shape. The claw part of the cover member is inserted to a position below the claw part through the gap between adjacent claw parts in the socket main body part, and then slid in one direction with respect to the socket main body part. It is engaged with the claw part of the main body part. Therefore, the tip of each lead terminal of the accommodated semiconductor device is pressed against the contact portion of each contact terminal by the pressing portion of the cover member.

  On the other hand, when removing the accommodated semiconductor device from the socket main body, the claw portion of the cover member is slid in the other direction and separated from each other between the adjacent claw portions of the socket main body portion to be in an unengaged state. . As a result, the cover member is easily removed from the socket body, and the semiconductor device is taken out.

JP 2004-319398 A

  As described above, the mounting socket is required to allow the semiconductor device to be accommodated to be easily attached to and detached from the socket body, while the mounting socket prevents damage due to malicious replacement of the semiconductor device. In some cases, it is desirable to have a structure in which a semiconductor device cannot be easily replaced by a third party who does not have a valid title.

  However, in the mounting socket as described above, measures for preventing such damage are not sufficiently taken.

  In view of the above-described problems, the present invention is a socket for a semiconductor device that can accommodate a semiconductor device mounted on a predetermined wiring board. The semiconductor device can be easily mounted and has a legitimate title. It is an object of the present invention to provide a semiconductor device socket having a structure in which a simple semiconductor device cannot be replaced by a third party who does not.

  In order to achieve the above-described object, a socket for a semiconductor device according to the present invention includes a socket main body having a contact terminal group for electrically connecting a semiconductor device, and a housing portion that detachably accommodates the semiconductor device. A holding member that is slidably disposed on the socket body and has a pair of elastically displaceable lock claws, and selectively holds the semiconductor device housed in the housing in the housing; And a locking end portion that locks the pair of locking claws of the holding member with respect to the socket body portion, and the locking claws of the holding member are socketed from the outside through an opening formed in the socket body portion. It is characterized in that the locking end portion is unlocked by a claw portion of a jig inserted inside the main body portion.

  As is apparent from the above description, according to the semiconductor device socket according to the present invention, the holding member is slidably disposed on the socket body, and the semiconductor device accommodated in the accommodating portion is selectively used as the accommodating portion. Therefore, when mounting the semiconductor device, the semiconductor device can be easily mounted by simply sliding the holding member, and the lock claw of the holding member is connected to the socket body portion from the outside through the opening formed in the socket body portion. Since the lock end portion is unlocked by the claw portion of the jig inserted inside the semiconductor device, the semiconductor device cannot be easily replaced by a third party who does not have a legitimate title.

  FIG. 2 shows an overall configuration of an example of a semiconductor device socket according to the present invention.

  In FIG. 2, the socket for a semiconductor device includes a socket body portion 10 having a housing portion 10A for housing a semiconductor device and a semiconductor device while selectively pressing an electrode portion of the semiconductor device against a contact portion of each contact terminal described later. And a pair of slide members 12 and 14 as holding members for holding or releasing the main members.

  The mounted semiconductor device DV is, for example, a semiconductor element formed of a substantially square LGA (land grid array) type package, and has an electrode surface on which a plurality of electrode portions are formed on each side.

  For example, the socket body 10 is formed of resin, and as illustrated in FIG. 4, the socket body 10 is disposed on a housing 10 </ b> A that houses the semiconductor device DV and four walls that form the outer shell of the housing 10 </ b> A. The contact terminal group 16CG is included.

  As shown in FIG. 5, guide grooves 10 </ b> G for guiding side surfaces and lower surfaces of slide members 12 and 14, which will be described later, are formed in opposite wall portions of the socket body 10. Further, a T-shaped portion 10T that is fitted into the substantially T-shaped grooves of the slide members 12 and 14 protrudes from the center of the bottom of each guide groove 10G. Furthermore, a stepped portion into which the stepped portions of the slide members 12 and 14 are fitted is formed at one end of the bottom of each guide groove 10G.

  A narrow groove 10g for guiding the pair of lock claws 12N and 14N of the slide members 12 and 14 is formed on both side surfaces forming the guide groove 10G. The groove 10g is formed along the direction indicated by the arrow shown in FIG. 3, that is, the moving direction of the slide members 12 and 14.

  Holes 10B and 10bh serving as openings into which large claws 20A and small claws 20a of a jig 20 described later are inserted are formed in one of the remaining opposing wall portions of the socket body 10, respectively. Yes. The holes 10 </ b> B and 10 bh having a substantially rectangular cross section are bottomed holes having a predetermined depth along the height direction of the socket body 10. The hole 10B is formed between the two holes 10bh. Further, as shown in FIGS. 6 and 10A to 10C, holes 10d communicating with the holes 10bh formed at a predetermined interval are formed in the wall portion. The hole 10d penetrates the wall portion so as to be substantially orthogonal to the hole 10bh. Furthermore, the hole 10d and the hole 10bh communicate with the above-described groove 10g, respectively. Each hole 10d extends so as to intersect the groove 10g. As a result, the locking end portion 10E is formed adjacent to the end of each hole 10bh and each groove 10g.

  A small hole 10r is formed at a position adjacent to each hole 10d and close to the corner. The hole 10r passes through the wall so as to be substantially parallel to the hole 10d and substantially orthogonal to the groove 10g.

  In addition, holes 10C and 10ch serving as openings into which large claws 20B and small claws 20b of a jig 20, which will be described later, are respectively inserted, are provided on the other of the remaining opposing wall portions of the socket body portion 10, respectively. Are formed to face the holes 10B and 10bh. The holes 10 </ b> C and 10 ch having a substantially rectangular cross section are bottomed holes having a predetermined depth along the height direction of the socket body 10. The hole 10C is formed between the two holes 10ch. Further, as shown in FIGS. 6 and 10A to 10C, holes 10d and 10r are formed in the wall portion in the same manner as the one wall portion described above. At that time, the locking end 10E is formed adjacent to the end of each hole 10ch and each groove 10g.

  As shown in FIG. 7, a plurality of through-holes 10a are formed in the bottom portion forming the accommodating portion 10A.

  As shown in FIG. 3, each contact terminal group 16CG includes a plurality of contact terminals 16ai (i = 1 to n, where n is a positive integer) arranged corresponding to the arrangement of the electrode portions of the semiconductor device DV. Has been. The contact terminal 16ai formed in a thin plate shape has a terminal portion soldered and fixed to an electrode of a printed wiring board (not shown), a contact portion electrically connected to the electrode portion of the semiconductor device DV, and elasticity. And a connecting portion that connects the terminal portion and the contact portion. The connection portion of each contact terminal 16ai is fixed by being press-fitted into each groove portion formed in each wall portion. The terminal portion of the contact terminal 16ai protrudes outward from each wall portion.

  Since the pair of slide members 12 and 14 have the same structure, the slide member 14 will be described and the description of the configuration of the slide member 12 will be omitted.

  The slide member 14 is formed of, for example, a resin, and as shown in FIG. 5, a T-shaped groove that is slidably fitted to the T-shaped portion 10 </ b> T of the socket main body 10 at the bottom of the substantially central portion 14g. Further, a stepped portion that is engaged with the stepped portion of the socket main body 10 is formed at one end of the bottom of the slide member 14. Further, as shown in FIGS. 10A to 10C, the base ends of the elastically displaceable lock claws 14N are integrally formed at both ends of the slide member 14 facing the groove 10g of the socket body 10 respectively. Is formed. Each lock claw 14N is slidably disposed in the groove 10g. At that time, as shown in FIGS. 10 (A) to 10 (C), the tip of the lock claw 14N is placed on the opening end of the above-mentioned wall hole 10r, the opening end of the hole 10d, and the locking end 10E. It can be close to or separated from. Accordingly, the distal end of the lock claw 14N of the slide member 14 is engaged with the peripheral edge of the opening end of the hole 10r in accordance with the attachment / detachment of the semiconductor device DV with respect to the accommodating portion 10A, and the lock The lock position (second position) to be engaged with the end portion 10E is taken.

  Further, a raised operation portion 14 </ b> M is formed on the upper portion of the slide member 14.

  In such a configuration, when the semiconductor device DV is mounted in the accommodating portion 10A of the socket main body portion 10, first, the slide members 12 and 14 are provided on the outer peripheral portion thereof as shown in FIG. 3 and FIG. It slides in the direction which mutually separates until a part protrudes from the outer peripheral part of the socket main-body part 10. FIG. At that time, the tips of the lock claws 12N and 14N are engaged with the peripheral edge of the opening end of the hole 10r to take the release position.

  Next, the semiconductor device DV is placed and positioned on each contact terminal group 16CG through the slide members 12 and 14. Therefore, the semiconductor device DV can be attached and detached without removing the slide members 12 and 14 from the socket body 10.

  Subsequently, in a state in which the semiconductor device DV is placed on each contact terminal group 16CG, the slide members 12 and 14 are in directions close to each other as shown in FIGS. 8, 9, and 10B. Is slid. At this time, the semiconductor device DV is pressed toward the contact terminal groups 16CG by the inner surfaces of the slide members 12 and 14. At that time, the tips of the lock claws 12N and 14N are engaged with the lock end 10E to take the lock position. The tip crosses part of the holes 10bh and 10ch.

  Therefore, the semiconductor device DV is held in a state where it can be electrically connected while being held on each contact terminal group 16CG. At that time, the tips of the pair of lock claws 12N and 14N concealed inside the socket main body 10 can be easily and simultaneously applied from the outside to the lock end 10E without using a jig as will be described later. On the other hand, since it cannot be unlocked, it is possible to avoid a simple semiconductor device replacement by a third party who does not have a legitimate title.

  On the other hand, when removing the semiconductor device DV from the housing portion 10A of the socket main body portion 10, a substantially rectangular parallelepiped jig 20 as shown in FIGS. 11 (A), (B), and (C) is used. Device DV is removed.

  The jig 20 has claw portions 20A and claw portions 20B that are respectively inserted into the holes 10B and 10C of the socket main body portion 10 at the lower end of the short side. The tips of the claw portion 20A and the claw portion 20B protrude from the lower end surface by a predetermined length. The tip is chamfered.

  Further, a pair of claw portions 20a smaller than the claw portions 20A are formed with the claw portions 20A interposed therebetween. The pair of claw portions 20a protrude from the lower end surface by a predetermined length that is slightly shorter than the protruding length of the claw portion 20A. The tip of the claw portion 20a is chamfered. The pair of claw portions 20a are set to dimensions that can be inserted into the holes 10bh of the socket main body portion 10, respectively.

  Furthermore, a pair of nail | claw part 20b smaller than the nail | claw part 20B is formed on both sides of the nail | claw part 20B. The pair of claw portions 20b protrude from the lower end surface by a predetermined length slightly shorter than the protruding length of the claw portion 20B. The tip of the claw portion 20b is chamfered. The pair of claw portions 20b are set to dimensions that can be inserted into the holes 10ch of the socket main body portion 10, respectively.

  As shown in FIG. 12, the jig 20 is arranged so that the positions of the claw portions 20A, the claw portions 20B, and the like are directly above the holes 10B and 10C of the socket body portion 10, As shown in FIG. 1, the claw portions 20A, 20B, 20a, and 20b are inserted into the holes 10B, 10C, 10bh, and 10ch, respectively. As a result, as shown in FIG. 10C, the lock claw 12N of the slider member 12 and the lock claw 14N of the slider member 14 are pressed by the claw portions 20a and 20b, respectively, and are not pressed against the lock end portion 10E. The engaged state is established and the slidable unlocked state is obtained.

  Then, as shown in FIG. 3, the lock claw 12N of the slider member 12 and the lock claw 14N of the slider member 14 are slid in a direction away from each other, thereby returning from the lock position to the release position described above. It becomes. As a result, the semiconductor device DV can be removed from the accommodating portion 10 </ b> A of the socket main body portion 10.

  Therefore, the example of the semiconductor device socket according to the present invention has the following effects.

  a) When the semiconductor device DV is attached or detached, it is not necessary to completely separate the slide members 12 and 14 and the socket body 10 from the conventional IC socket.

  b) When the slide members 12 and 14 are locked with respect to the socket body 10, the slide members 12 and 14 can be easily locked by simply sliding the slide members 12 and 14 so as to be close to each other. can do.

  The above example is applied to a device that accommodates a semiconductor device formed of an LGA type package. However, the present invention is not limited to such an example. For example, by arranging corresponding contact terminal groups, The present invention may be applied to a device that accommodates a semiconductor device formed of a BGA type or QFN type package.

It is a perspective view which shows an example of the socket for semiconductor devices which concerns on this invention with the mounted jig | tool. It is a perspective view which shows an example of the socket for semiconductor devices which concerns on this invention. It is sectional drawing in the example shown by FIG. FIG. 3 is a plan view of the example shown in FIG. 2. It is a side view in the example shown by FIG. It is a front view in the example shown by FIG. FIG. 3 is a bottom view of the example shown in FIG. 2. It is a perspective view with which operation | movement description in the example shown by FIG. 2 is provided. It is sectional drawing in the example shown by FIG. (A) is sectional drawing which is shown along the 10A-10A line in FIG. 3, and is provided for operation | movement description in the example shown by FIG. 2, (B) is along the 10B-10B line in FIG. FIG. 3C is a cross-sectional view for explaining the operation in the example shown in FIG. 2 and (C) is shown along the line 10C-10C in FIG. 1 and used for explaining the operation in the example shown in FIG. FIG. (A) is a front view which shows the jig | tool used for the example shown by FIG. 2, (B) is a bottom view of the figure shown by (A), (C) is (A). FIG. 3 is a side view of the figure shown. It is a perspective view with which it uses for description of the usage of the jig | tool shown by FIG. 11 (A)-(C).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Socket main-body part 10E Locking end parts 12 and 14 Slider member 12N, 14N Lock claw 20 Jig 20a, 20b Claw part

Claims (2)

  1. A socket body having a contact terminal group for electrically connecting the semiconductor device, and having a housing portion for detachably housing the semiconductor device;
    A holding member that is slidably disposed on the socket body and has a pair of elastically displaceable locking claws, and selectively holds the semiconductor device accommodated in the accommodating portion in the accommodating portion;
    A locking end formed inside the socket main body and locking the pair of locking claws of the holding member with respect to the socket main body.
    The locking claw of the holding member is unlocked with respect to the locking end by a claw portion of a jig inserted into the socket main body portion from the outside through an opening formed in the socket main body portion. A socket for a semiconductor device.
  2. 2. The semiconductor device socket according to claim 1, wherein a plurality of the holding members integrally having the pair of lock claws at a predetermined interval are provided opposite to each other.
JP2005309952A 2005-10-25 2005-10-25 Socket for semiconductor device Active JP4551309B2 (en)

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JP2005309952A JP4551309B2 (en) 2005-10-25 2005-10-25 Socket for semiconductor device

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Application Number Priority Date Filing Date Title
JP2005309952A JP4551309B2 (en) 2005-10-25 2005-10-25 Socket for semiconductor device

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JP2007122913A JP2007122913A (en) 2007-05-17
JP4551309B2 true JP4551309B2 (en) 2010-09-29

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4231067B2 (en) 2006-07-28 2009-02-25 山一電機株式会社 Socket for semiconductor device
JP4880504B2 (en) * 2007-03-19 2012-02-22 日本圧着端子製造株式会社 Module holding structure
WO2010095293A1 (en) 2009-02-18 2010-08-26 シャープ株式会社 Touch panel provided with built-in display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS642382U (en) * 1987-06-25 1989-01-09
JPH0613503A (en) * 1992-06-25 1994-01-21 Matsushita Electric Works Ltd Semiconductor socket
JPH07282930A (en) * 1994-04-07 1995-10-27 Enplas Corp Ic socket
JP2003282207A (en) * 2002-03-25 2003-10-03 Sumitomo Wiring Syst Ltd Bulb socket
JP2005108781A (en) * 2003-10-02 2005-04-21 D D K Ltd Socket connector for ic chip, evulsion jig used for the same, and inserting/evulsion method for ic chip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS642382U (en) * 1987-06-25 1989-01-09
JPH0613503A (en) * 1992-06-25 1994-01-21 Matsushita Electric Works Ltd Semiconductor socket
JPH07282930A (en) * 1994-04-07 1995-10-27 Enplas Corp Ic socket
JP2003282207A (en) * 2002-03-25 2003-10-03 Sumitomo Wiring Syst Ltd Bulb socket
JP2005108781A (en) * 2003-10-02 2005-04-21 D D K Ltd Socket connector for ic chip, evulsion jig used for the same, and inserting/evulsion method for ic chip

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JP2007122913A (en) 2007-05-17

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