JP2005108781A - Socket connector for ic chip, evulsion jig used for the same, and inserting/evulsion method for ic chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector 10 for IC having structures in which an IC 14 is not permitted to be replaced without permission by a person other than one in charge, and is replaceable according to need and to provide a jig used for replacement. <P>SOLUTION: The IC connector 10 is equipped with a base 20 which holds contacts 40 to contact with contacts 16 of the IC, and a cover 30 which has an engaging mouth 32 for the IC 14 and is installed on the base 20. The cover 30 is provided with a groove 34, and the base 20 is provided with an engaging means to engage with the groove 34, wherein the engaging means engages with the groove 34 by sliding the cover 30. The jig 50 is provided with a recess 54 of a size that accommodates the connector 10 for an IC to fix the IC 14 and the cover 30, in which recess 54 a protrusion 52 is arranged at a position corresponding to the groove 34 of the cover 30, wherein the IC is to be pulled out by using the jig 50 by inserting the protrusion 52 into the groove 34 of the cover 30 and sliding the cover 30 while pressing it. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC chip socket connector (hereinafter referred to as an “IC connector”) used in computers, gaming machines, and the like, and in particular, an IC chip that cannot be removed without a removal jig. The present invention relates to an insertion / extraction structure.

There are no patent documents listed as prior art.
The conventional IC connector 60 is for connecting the IC chip 14 and the substrate by mounting the IC chip 14. As shown in FIG. 7, the plurality of contacts 40, the base 62, and the cover 64 are mainly used. It has. When the IC chip 14 is attached to the IC connector 60, the contact 16 of the IC chip 14 contacts the contact 40 of the IC connector 6, so that the IC chip 14 is connected to the substrate. Become. Since the IC chip 14 is not directly attached to the substrate, a new IC chip 14 can be easily connected simply by exchanging the IC chip 14, and the function can be expanded or changed.
The contact 40 includes a contact portion 42 that contacts the contact 16 of the IC chip 14, a fixing portion 44 that is held and arranged on the base 62, and a connection portion 46 that is connected to the substrate. It is fixed by pulling in.
As shown in FIG. 7, the base 62 has a substantially U shape, and a plurality of the contacts 40 are held and arranged on both sides in the width direction on the main body portion 22 of the plate-like piece, and the thickness direction is between the contacts 40. The locking portion 24 is provided in a zigzag manner, and a protruding portion 26 that protrudes outward is provided at the tip of the locking portion 24 that is disposed on the outside. The locking portion arranged on the inner side serves as a positioning and guide in the width direction. Further, guide portions 28 protruding in the thickness direction are provided outside the contacts 40 on both sides in the longitudinal direction.
As shown in FIG. 7, the cover 64 has a substantially square shape, and has a fitting port 32 into which the IC chip 14 is inserted, and corresponds to the locking portion 24 of the base 62 on both sides in the width direction. An engagement groove 36 formed by a substantially L-shaped projection 38 is provided at the position.
The IC chip 14 can be fixed by the protrusion 26 of the locking portion 24 arranged outside the base 62 engaging with the engaging groove 36 of the cover 64, and the engagement arranged inside. The stop portion can contact the end face of the protrusion 38 of the cover 64 to play a role of positioning in the width direction and a guide. In addition, as a method of fixing the IC chip 14, a cover having a hinge structure on one side is rotated in the vertical direction to press and connect / fix the IC chip 14 disposed on the base portion, or the IC chip 14. For example, a method of fixing the tail part by directly inserting (pinching) the tail part into a contact disposed on the base may be used.

  In recent years, there has been an increasing demand for replacement with an IC chip 14 having a new function. In such a situation, in the structure of the IC connector 60 described above, anyone can easily remove the IC chip 14, so that a person other than the manager in charge can replace the IC chip 14 for commercial purposes without permission. , There was a problem that information was easily stolen.

  The present invention has been made in view of such a conventional problem, and it is impossible for a person other than the manager to easily replace the IC chip 14 without permission. An IC connector 60 having a structure capable of exchanging the chip 14 and a jig 50 used for the exchange are provided.

  The object is to provide a plurality of contacts 40 that come into contact with the contacts 16 of the IC chip 14, a base 20 that holds and arranges the contacts 40, and a fitting port 32 of the IC chip 14 that is attached to the base 20. In the IC connector 10 including the cover 30 having the cover 30, the cover 30 is provided with a required number of grooves 34, the base 20 is provided with engaging means for entering the grooves 34, and the cover 30 is slid to slide the engagement. This can be achieved by engaging the coupling means with the groove 34 and fixing the IC chip 14.

  A spring pin 12 is disposed on the base 20 as the engaging means, and the cover 30 is slid while being pressed, and the IC chip 14 is fixed by engaging the spring 12 with the groove 34. That is, as the engaging means, a required number of spring pins 12 are arranged at predetermined positions of the base 20, and a groove portion 34 that engages with the spring pins 12 is provided in the cover 30. Since the IC pin 14 is fixed by engaging the spring pin 12 with the groove 34, the IC chip 14 cannot be replaced without a dedicated jig 50.

Since a dedicated jig 50 is required to replace the IC chip 14, the removal jig 50 having the following structure is provided.
A concave portion 54 having a size for receiving the cover 30 is provided, and a protruding piece 52 is disposed in the concave portion 54 at a position corresponding to the groove portion 34 of the cover 30, and the protruding piece 52 is inserted into the groove portion 34 of the cover 30 and pressed. The cover 30 was slid while removing the IC chip 14.
The extraction jig 50 is provided with a handle portion 56 for sliding the cover 30. Thus, by providing the handle portion 56, the extraction jig 50 can be easily handled.

As a method for inserting / removing the IC chip 14, first, when mounting the IC chip 14, first, the IC chip 14 is mounted on the base 20, and secondly, the IC chip 14 is fitted into the fitting port 32 of the cover 30. The IC chip 14 is mounted by sliding the cover 30 and the IC chip 14 so that the engaging means of the base 20 enters the groove 34 of the cover 30.
Next, when the IC chip 14 is removed, the removal jig 50 is first mounted so that the protruding piece 52 of the removal jig 50 is positioned in the groove 34 of the cover 30, and the second is the removal jig. The IC chip 14 is removed by sliding the cover 30 while pressing at 50.

  As an action of the present invention, by pressing the spring pin 12 with the protruding piece 52 of the removal jig 50, the cover 30 can be easily slid and the IC chip 14 can be removed.

As apparent from the above description, the IC connector 10 of the present invention provides the following excellent effects.
(1) A plurality of contacts 40 that come into contact with the contact 16 of the IC chip 14, a base 20 that holds and arranges the contacts 40, and a fitting port 32 of the IC chip 14 that is attached to the base 20. In the IC connector 10 including the cover 30, the cover 30 is provided with a required number of groove portions 34, the base 20 is provided with engagement means for entering the groove portions 34, and the cover 30 is slid to engage the engagement. Since the IC chip 14 is fixed by engaging the means with the groove 34, a dedicated removal jig 50 is required, and it becomes impossible for a person other than the administrator to replace the IC chip 14 without permission, and information is stolen. I can no longer meet.
(2) A spring pin 12 is arranged on the base 20 as the engaging means, the cover 30 is slid while pressing, and the IC chip 14 is fixed by engaging the spring 12 with the groove 34. As a result, the IC chip 14 cannot be replaced without permission by a person other than the manager, but the IC chip 14 can be easily replaced by using the removal jig 50.

As is clear from the above description, according to the extraction jig 50 of the present invention, the following excellent effects can be obtained.
(1) A recess 54 large enough to accommodate the cover 30 is provided, a protruding piece 52 is disposed in the recess 54 at a position corresponding to the groove 34 of the cover 30, and the protruding piece 52 is inserted into the groove 34 of the cover 30. Since the removal jig 50 in which the cover 30 is slid and the IC chip 14 is removed while being inserted and pressed is used, the IC chip 14 can be easily replaced. For this reason, the IC chip 14 can no longer be replaced without permission from a person other than the administrator.
(2) Since the removal jig 50 is provided with a handle portion 56 for sliding the cover 30, the removal jig 50 can be easily handled and the IC chip 14 can be easily replaced.

As is clear from the above description, according to the insertion / extraction method of the present invention, the following excellent effects can be obtained.
(1) As a method for inserting / removing the IC chip 14, first, when mounting the IC chip 14, first, the IC chip 14 is mounted on the base 20, and secondly, the IC chip 14 is attached to the cover 30. The IC chip 14 is mounted by sliding the cover 30 and the IC chip 14 so that the engagement means of the base 20 enters the groove portion 34 of the cover 30. Since it is mounted, the IC chip 14 can be easily mounted, but once mounted, it cannot be removed without the dedicated jig 50.
(2) As a method for inserting / removing the IC chip 14, next, when the IC chip 14 is removed, firstly the removal jig so that the protruding piece 52 of the removal jig 50 is positioned in the groove 34 of the cover 30. 50, and secondly, the IC chip 14 is removed by sliding the cover 30 while being pressed by the removal jig 50. Therefore, if there is no dedicated removal jig 50, the IC chip 14 is replaced. As a result, it was impossible for anyone other than the administrator to replace the IC chip 14 without permission.

The IC connector 10 of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of the IC connector of the present invention as seen from the fitting port side, and FIG. 2 is a perspective view of the IC connector of the present invention in a state where the cover and the base are separated. FIG. 3 is a perspective view of the IC connector of the present invention in a state where the cover and the base are separated and an IC chip is mounted on the base. FIG. 4 is an explanatory view showing a contact state between the IC chip and the contact. FIG. 5A is an explanatory diagram of the state of the spring pin before sliding, and FIG. 5B is an explanatory diagram of the state where the spring pin enters the groove after sliding. FIG. 6 is a perspective view of an extraction jig used in the IC connector of the present invention.
The IC connector 10 of the present invention mainly includes a base 20, a cover 30 and a contact 40.

  Before describing the IC connector 10 of the present invention, the IC chip 14 will be described. Information such as function control and arithmetic processing is written in the IC chip 14, and each device and the like can be controlled and changed by soldering the IC chip 14 to a substrate. If the IC chip 14 is directly attached to the substrate in this way, when it is desired to add new information, the substrate itself needs to be replaced. Therefore, the IC connector 10 as in the present invention is required. . The IC chip 14 has a plurality of contacts 16 protruding on both sides in the width direction. As shown in FIG. 4, the contact 16 of the IC chip 14 is in contact with the contact 40 held by the base 20.

The components of the IC connector 10 of the present invention will be described with reference to the drawings.
First, the contact 40 will be described. The contact 40 is made of metal, and is formed by a known press working. Examples of the material include brass, beryllium copper, phosphor bronze and the like in consideration of springiness and conductivity.
The contact 40 mainly includes a contact portion 42 that contacts the contact 16 of the IC chip 14, a fixing portion 44 that is fixed to the base 20, and a connection portion 46 that is connected to the substrate. In the present embodiment, the connection portion 46 is a surface mount SMT type, but it may be a dip type. The contact 40 is substantially U-shaped, and the shape of the contact portion 42 is appropriately designed in consideration of the spring durability, contact stability, and the like that are easy to contact the contact 16 of the IC chip 14. The contact 40 is fixed to the base 20 by integral molding, press-fitting or drawing. Further, a guide groove or the like may be provided in the contact portion 42 of the contact 40 so that the contact 16 of the IC chip 14 can be easily contacted.

Next, the cover 30 which is the point part of this invention is demonstrated. The cover 30 is an electrically insulating plastic, and is manufactured by a known technique of injection molding. The material of the cover 30 is appropriately selected in consideration of dimensional stability, workability, cost, etc. Generally, polybutylene is used. Examples thereof include terephthalate (PBT), polyamide (66PA, 46PA), liquid crystal polymer (LCP), polycarbonate (PC), and synthetic materials thereof.
As in the prior art, the cover 30 has a substantially square shape, has a fitting port 32 into which the IC chip 14 is inserted, and a locking portion disposed outside the base 20 on both sides in the width direction. The engagement groove 36 formed by the substantially L-shaped protrusion 38 is provided at a position corresponding to 24, and the locking portion 24 arranged on the inner side contacts the end surface of the substantially L-shaped protrusion 38. Thus, positioning in the width direction is performed. Further, a guide groove 37 is provided at a position corresponding to the guide portion 28 of the base 20, whereby the cover 30 is positioned and inserted into the base 20.

  The cover 30 is provided with a required number of grooves 34. The shape and size of the groove 34 are appropriately designed in consideration of the engaging means (the spring pin 12 in this embodiment) of the base 20 and considering the slidability (slidability), mounting properties and strength. ing. In the present embodiment, the shape of the groove 34 is a registration mark, and the positions are provided at two positions on both sides in the longitudinal direction. The number of the groove portions 34 is sufficient if it can be removed without a dedicated removal jig 50, but the slidability (slidability) and mounting properties, the necessity of a dedicated removal jig, etc. In consideration of at least two, it is ideally two in consideration of workability. Considering sliding with the base 20, the cover 30 is provided with a guide rail-like recess 39 as shown in FIG.

Next, the base 20 which is another point part of the present invention will be described. The base 20 is an electrically insulating plastic and is manufactured by a known technique of injection molding. This material is appropriately selected in consideration of dimensional stability, workability, cost, etc. Generally, polybutylene is used. Examples thereof include terephthalate (PBT), polyamide (66PA, 46PA), liquid crystal polymer (LCP), polycarbonate (PC), and synthetic materials thereof.
As in the prior art, the base 20 is substantially U-shaped, and a plurality of the contacts 40 are held and arranged on both sides in the width direction on the main body portion 22 of the plate-like piece, and project between the contacts 40 in the thickness direction. The engaging portion 24 is provided in a staggered manner, and a protruding portion 26 protruding outward is provided at the tip of the engaging portion 24 arranged outside. The locking portion arranged on the inner side serves as a positioning and guide in the width direction. Further, guide portions 28 protruding in the thickness direction are provided outside the contacts 40 on both sides in the longitudinal direction.

  As shown in FIG. 3, the contacts 40 are held and arranged on the base 20 at positions corresponding to the contacts 16 of the IC chip 14, and at positions corresponding to the grooves 34 of the cover 30. Engaging means for entering the groove 34 is provided. As the engaging means, when the engaging means is engaged with the groove portion 34 of the cover 30, it is necessary to have a dedicated extraction jig 50 and the cover 30 can be easily mounted. In this embodiment, a spring pin 12 is arranged as shown in FIG. 2 as the engaging means. In addition to the spring pin 12, a switch component or a probe pin can be used. As shown in FIG. 3, the spring pin 12 can be easily mounted when the IC chip 14 is placed on the base 20 and the cover 30 is mounted, and can be slid while pressing the cover 30. Those having such an elastic force are appropriately selected. The spring pin 12 is attached to the base 20 by integral molding, press-fitting or drawing. Further, a convex portion 29 is provided on the base 20 so as to correspond to the concave portion 39 of the cover 30, and the convex portion 29 and the concave portion 39 of the cover 30 are fitted to each other. It is used as a guide when sliding in the B direction.

Next, the dedicated extraction jig 50 will be described with reference to FIG.
As the extraction jig 50, as shown in FIG. 6, a recess 54 large enough to receive the cover 30 is provided, and a protruding piece 52 is disposed in the recess 54 at a position corresponding to the groove 34 of the cover 30, The removal jig 50 is provided with a handle portion 56 for sliding the cover 30. The size of the concave portion 54 was set to the same size as the cover 30 because it was mounted on the cover 30 and slid. The shape of the protruding piece 52 is inserted into the groove portion 34 of the cover 30 and slides, so that the shape of the protruding piece 52 is the same as that of the groove portion 34. The length of the protruding piece 52 slides the cover 30 while pressing the spring pin 12. Therefore, the tip is inserted into the groove 34 so that the front end is in contact with the upper surface of the base 20. The handle portion 56 is appropriately designed in consideration of the handleability and ease of holding of the extraction jig 50. Further, it is desirable that the extraction jig 50 is provided with C chamfering or R on the entire circumference in consideration of handling and ease of holding.

Finally, a method for inserting and removing the IC chip 14 will be described.
First, when the IC chip 14 is mounted, it is performed in the following order.
First, the IC chip 14 is mounted (mounted) on the base 20.
Second, the IC chip 14 is mounted so as to enter the fitting port 32 of the cover 30.
Third, the cover 30 and the IC chip 14 are slid in the direction of the arrow A in FIG. 5 so that the engaging means of the base 20 enters the groove 34 of the cover 30.
The IC chip 14 is mounted by performing in the above order.

Next, when the IC chip 14 is removed, it is performed in the following order.
First, the removal jig 50 is mounted so that the protruding piece 52 of the removal jig 50 is positioned in the groove 34 of the cover 30. Second, the cover 30 is slid in the direction opposite to the arrow A in FIG.
By performing in the above order, the IC chip 14 is removed.

  As an application example of the present invention, the present invention relates to an IC chip 14 insertion / extraction structure that is used as an IC connector 10 used in a computer, a game machine, etc., and the IC chip 14 cannot be removed without a removal jig.

It is a perspective view of the connector for IC of this invention seen from the fitting port side. It is a perspective view of the connector for IC of the present invention in the state where a cover and a base were separated. FIG. 3 is a perspective view of the IC connector of the present invention in a state where the cover and the base are separated and an IC chip is placed on the base. It is explanatory drawing which shows the contact state of an IC chip and a contact. (A) It is explanatory drawing of the state of the spring pin before a slide. (B) It is explanatory drawing of the state which the spring pin entered into the groove part after the slide. It is a perspective view of the extraction jig | tool used for the connector for IC of this invention. It is a perspective view of the conventional connector for IC in the state which separated the cover and the base.

Explanation of symbols

10, 60 IC chip socket connector 12 Spring pin 14 IC chip 16 Contact 20, 62 Base 22 Main body portion 23 Insertion hole 24 Locking portion 26 Protruding portion 28 Guide portion 29 Protruding portion 30, 64 Cover 32 Fitting port 34 Groove portion 36 Engagement groove 37 Guide groove 38 Protrusion 39 Dimple part 40 Contact 42 Contact part 44 Fixing part 46 Connection part 50 Removal jig 52 Projection piece 54 Recessed part 56 Handle part

Claims (5)

An IC chip socket connector comprising: a plurality of contacts that come into contact with IC chip contacts; a base on which the contacts are held and arranged; and a cover that is attached to the base and has a fitting port for the IC chip. ,
The cover is provided with a required number of grooves, the base is provided with engaging means for entering the groove, and the cover is slid to engage the engaging means with the groove to fix the IC chip. Characteristic socket connector for IC chip. 2. The IC chip is fixed by disposing a spring pin on the base as the engaging means, sliding the cover while pressing the cover, and engaging the spring with the groove. IC chip socket connector. A concave portion having a size for receiving the cover is provided, and a protruding piece is disposed in the concave portion at a position corresponding to the groove portion of the cover, and the cover is slid while the protruding piece is inserted into the groove portion of the cover and pressed. 3. A removal jig used for an IC chip socket connector according to claim 1, wherein the chip is removed. 4. A removal jig used for an IC chip socket connector according to claim 3, further comprising a handle portion for sliding the cover. When mounting an IC chip, first, the IC chip is mounted on the base, second, the cover is mounted so that the IC chip enters the fitting opening of the cover, and third, the base of the base is mounted. The IC chip is mounted by sliding the cover and the IC chip so that the engaging means enters the groove portion of the cover.
When removing the IC chip, firstly, the removal jig is mounted so that the protruding piece of the removal jig is located in the groove of the cover, and secondly, the cover is slid while being pressed by the removal jig. An IC chip insertion / extraction method, wherein the IC chip is removed by

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