JP2003163064A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket in which the structure is simple and a contact is not bent forward, thereby keeping a floating plate unmoved, and therefore the reliability of the IC socket is high. <P>SOLUTION: The IC socket is provided with a socket substrate, a floating plate in which the IC package provided vertically movably in the socket substrate is mounted. A contact point is connected electrically to the IC package. A curved part gives elastic force. A contact has a fixed part and a terminal fixed to the socket substrate. A pressed body contacts elastically the IC package with the contact by holding the IC package between the floating plate and the pressed body and pressing down the IC package and the floating plate. The contact is arranged so that the curved parts in the adjacent contact rows are arranged in the opposite direction. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to an IC socket for a BGA type IC package in which a predetermined spring load can be obtained from a contact having a curved portion.

[0002]

2. Description of the Related Art Conventionally, in a burn-in test of a BGA type IC package, an open top type IC socket has been used as one of the IC sockets for mounting the IC package.

This open top type IC is shown in FIG.
The socket will be described. FIG. 3 shows a state in which a BGA type IC package is mounted with an IC socket.

The IC socket 100 comprises a socket substrate 11
0, the cover 120, the contact 130, the floating plate 140, the latch 160, and the terminal alignment plate 170.

The cover 120 is vertically movable on the socket substrate 110 via a spring (not shown).

The contacts 130 are the socket substrate 1
The fixed portion 133 implanted in the device 10, the curved portion 132 arranged above the fixed portion 133 and imparting the elastic force to the contact 130 in the vertical direction, and arranged at the upper end of the contact 130. A contact part 131 electrically connected to the pad (solder ball) 201 and a terminal part 134 disposed below the fixing part 133 and electrically connected to a test board (not shown) are provided. As shown in FIG. 4, for example, the contact 130 has its curved portion 132 protruding rightward.
The socket substrate 110 is planted and fixed in the same direction.

The floating plate 140 is biased upward by a spring (not shown), and the socket substrate 11
It is formed so as to be vertically movable relative to zero. The IC package 200 is placed on the floating plate 140. The floating plate 140 is provided for positioning the through holes 141 through which the pads 201 of the mounted IC package 200 and the contact portions 131 of the contacts 130 face from above and below, respectively, and the mounted IC package 200. Positioning mechanism 142
(See FIG. 1).

The latch 160 is the socket substrate 110.
In contrast, at least one pair is rotatably provided and is opened / closed by the vertical movement of the cover 120. The latch 16
When 0 is closed, the IC package 200 mounted on the floating plate 140 is pushed down together with the floating plate 140, so that the pad 201 of the IC package 200 and the contact portion 1 of the contact 130.
It comes into pressure contact with 31.

The terminal alignment plate 170 is a socket substrate 110.
The contact 130 is formed so as to be able to move in and out from the bottom of the
Is provided with a hole through which the terminal portion 134 of FIG. The terminal aligning plate 170 protects the terminal portion 134 of the contact 130 when the terminal portion 134 of the contact 130 is electrically connected to a test board (not shown), and the terminal portion 134 is connected to the test board. Acts as a guide for insertion into the through hole.

The IC package 200 is connected to the IC socket 10
To mount on 0, first, the cover 120 of the IC socket 100 in the free state is pushed down against the spring, thereby opening the latch 160. In this state, the IC package 200 is placed on the floating plate 140. At this time, the IC package 200 is positioned at a predetermined position by the positioning mechanism 142 provided on the floating plate 140.

Next, when the pressing force of the cover 120 is released, the cover 120 returns to its original position due to the urging force of the spring interposed between the cover 120 and the socket substrate 110, and the latch 160 accordingly. Also returns to the original state.
At this time, the IC package 200 is first sandwiched between the latch 160 and the floating plate 140. Then, the latch 160, which tries to return to the original position,
The C package 200 is further pushed down integrally with the floating plate 140. This gives I
The pad 201 of the C package 200 elastically contacts the contact portion 131 of the contact 130 to which the elastic force is applied. Therefore, the IC package 200 receives a predetermined spring load from the contact 130 and is electrically connected to the contact 130 under a predetermined contact pressure.

As shown in FIG. 3, the IC package 2
The IC socket 100 is mounted on a test board in a state where 00 is mounted, and is used for a burn-in test of the IC package 200.

[0013]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
Floating plate 1 with C package 200
A process in which 40 is pushed down by the latch 160 will be described in detail with reference to FIGS. 4 and 5.

FIG. 4 is a partially enlarged sectional view showing a state immediately before the IC package is pushed down by the latch together with the floating plate, and FIG. 5 is a sectional view showing the IC package in contact with the contact, and the contact exerts a pressing force by the latch. FIG. 7 is a partially enlarged cross-sectional view showing a state in which the IC package and the contact are elastically in contact with each other.

At the time shown in FIG. 4, IC package 200 includes latch 160 and floating plate 14.
The contact portion 13 of the contact 130
1 and the pad 201 of the IC package 200 are not in contact with each other. Therefore, the contact 130 does not receive a pressing force and is not deformed, so that the contact portion 131 and the terminal portion 134 of the contact 130 are, as shown in FIG.
It is on a straight line in the vertical direction. When the IC package 200 and the floating plate 140 are integrally pushed down by the pressing force of the latch 160, the pad 201 of the IC package 200 and the contact portion 131 of the contact 130 come into contact with each other. Further, the pressing force of the latch 160 causes the contact 130 to start deforming.

At this time, the pressing force W of the latch 160 is directed vertically downward, but the force F for deforming the contact 130 is not directed vertically downward, but as shown in FIG. It acts on the curved portion 132 in the normal direction at the intersection A of the contact portion 131 of the 130 and the curved portion 132. By the way, floating plate 1
Since 40 has a structural clearance with respect to the socket substrate 110, the floating plate 140
Has a structure that can move left and right. Therefore, the contact portion 131 at the tip of the contact 130 is integrated with the IC package 200 and the floating plate 140 by the component force of the contact deforming force F in the vertical direction and the horizontal direction, and the position shown in FIG. It can move further down and to the left. In other words, contact 13
0 deforms to a state in which it is tilted forward in the direction opposite to the curved portion 132. The horizontal component of the contact deformation force F is the contact portion 131 of the contact 130 and the bending portion 1.
The smaller the angle θ formed with 32, the greater the effect.

As a result, the floating plate 140
Has a structural clearance with respect to the socket substrate 110 as described above, the IC package 200
Both can be moved to the left (see FIG. 5). The floating plate 140 contacts the socket substrate 110 depending on the magnitude of the force. Of course, the larger the number of contacts 130, the greater the force applied.

The deformation of the contact 130 as described above and the resulting floating plate 14
By moving 0, in the conventional IC socket 100,
In the IC package 200, originally, the contact portion 131 of the contact 130 is pushed vertically downward from the initial position, so that a predetermined spring load, which should be obtained from the contact 130 having elastic force, cannot be obtained. However, depending on the size of the clearance, the floating plate 140 may also move significantly, which may cause the floating plate 140 to fall outside the predetermined spring load allowable range. Further, the socket substrate 11 of the floating plate 140
When the contact force with respect to 0 becomes large, the floating plate 140 may be deformed. This is IC
This makes the electrical contact between the pad 201 of the package 200 and the contact portion 132 of the contact 130 unstable, and as a result impairs the reliability of the IC socket 100 used in the burn-in test of the IC package 200, which is not desirable.

In view of the above problems, the present invention provides an IC socket having a simple structure, in which the contacts are not moved forward and the floating plate is not moved by the contacts, and thus the reliability is high. It is an object.

[0020]

In order to achieve the above object, an IC socket according to the present invention is a socket substrate, a floating plate on which an IC package provided on the socket substrate so as to be vertically movable is mounted, and the IC. A contact portion that is electrically connected to the package, a bending portion that applies an elastic force, a contact that has a fixing portion and a terminal portion that are fixed to the socket substrate, and the IC package is sandwiched between the floating plate, In an IC socket including a pressing body that presses down the IC package and the floating plate to elastically bring the IC package and the contact into contact with each other, the curved portions of adjacent contact rows of the contacts have opposite directions. It is characterized by being arranged as follows.

Further, in the IC socket of the present invention, it is preferable that the pressing body is formed by a cover provided on the socket substrate so as to be vertically movable, and a latch interlocked with the vertical movement of the cover.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an IC socket according to the present invention will be described with reference to FIGS. 1 is a top view of the floating plate, and FIG. 2 is a partially enlarged cross-sectional view showing the contacts arranged in the odd and even rows in FIG. The IC socket 100 of the present invention is
As a basic configuration, the socket substrate 11 is similar to the conventional example.
0, a cover 120, a contact 130, a floating plate 140, a latch 160, and a terminal alignment plate 170 (see FIG. 3). In addition, the contact 130
It is similar to the conventional example in that it is composed of the contact portion 131, the curved portion 132, the fixing portion 133, and the terminal portion 134 (see FIGS. 2 and 4 or 5).

In the IC socket 100 of the present invention, as shown in FIG. 1, the contacts 130 facing the through-holes 141 formed in the floating plate 140 are oriented in opposite directions in each adjacent row. Different from the conventional example.

As shown in FIG. 1, the contact 130 facing the through hole 141 of the first row (A1 row) of the floating plate 140 is the same as in the conventional example shown in FIG.
The curved portion 132 of the contact 130 is arranged so as to project rightward. On the other hand, as shown in FIG. 2, the contacts 130 facing the through holes 141 of the second row (B1 row) of the floating plate 140 are arranged so that the curved portions 132 of the contacts 130 protrude leftward. Has been done. Hereinafter, the contacts 130 are arranged so that such arrangement is alternately repeated for each column.

By arranging the contacts 130 in this manner, when the contacts 130 are pressed in the vertical direction by the latch 160, the directions of the forces for deforming the contacts 130 in the rows A and B are opposite. Become. That is, in this embodiment, since the curved portions 132 of the contacts 130 arranged in odd rows (An rows) are all projected to the right, the contacts 130 are arranged as described in the above-mentioned conventional example. It falls down to the lower left and tries to move the floating plate 140 to the left (see FIG. 5). On the other hand, since the curved portions 132 of the contacts 130 arranged in the even-numbered rows (Bn rows) are all projected to the left, the contacts 130 are tilted to the lower right when considering the description of the conventional example. , Trying to move the floating plate 140 to the right (see FIG. 2). Since the number of contacts 130 arranged in each row is the same, the forces that deform the contacts 130 to the left and right are offset, the floating plate 140 does not move, and the contacts 130 only deform vertically below. , The contact portion 131 of the contact 130 and I
The pads 201 of the C package 200 come into contact with each other under a predetermined pressing force.

In the present embodiment, the contacts 130 are arranged so that the curved portions 132 of the contacts 130 project rightward in the odd rows and leftward in the even rows, respectively. Is not limited to this structure. That is, the odd-numbered columns may face left and the even-numbered columns may face right. Further, instead of alternately arranging the contacts in the lateral direction in the opposite direction as in the above-described embodiment, the contacts may be arranged in the longitudinal direction in the opposite direction alternately. In short, in the contact rows adjacent to each other, the contacts may be arranged such that the curved portions of the contacts in each row face in the opposite direction.

Further, in the IC socket of this embodiment, the IC package 2 is provided between the floating plate 140 and the IC socket 2.
00, and the floating plate 1
Although the latch 160 interlocking with the cover 120 is used as a mechanism for integrally pushing down the IC package 200 and the IC package 200, the present invention is not limited to this. For example, an independent pressing body may be used as a mechanism for holding the IC package between the floating plate and the floating plate and the IC package by pressing them together.

[0028]

As described above, in the IC socket of the present invention, the contacts are arranged so that the curved portions of the adjacent contact rows are oriented in opposite directions. A predetermined contact pressure between the IC package and the contact of the IC socket can be obtained without moving the plate. Therefore, the IC socket according to the present invention can obtain higher reliability.

[Brief description of drawings]

FIG. 1 is a top view of a floating plate of an IC socket according to the present invention.

FIG. 2 is a partially enlarged cross-sectional view showing contacts arranged in rows A and B in FIG.

FIG. 3 is a schematic cross-sectional view of an IC socket of the present invention and a conventional IC socket.

FIG. 4 is a partially enlarged cross-sectional view showing a state immediately before an IC package is pushed down together with a floating plate by a latch.

FIG. 5 is a partially enlarged cross-sectional view showing a state in which the IC package is in contact with the contact and the contact is being pressed by the latch.

[Explanation of symbols]

100 IC socket 110 socket board 120 cover 130 contacts 131 Contact part (of contact) 132 Curved part (of contact) 133 Fixed part (of contact) 134 Terminal part (of contact) 140 floating plate 141 through hole 142 Positioning mechanism 150 latch 160 terminal alignment plate 200 IC package 201 pad

Continued front page    F-term (reference) 2G003 AA07 AG01 AG12 AG16 AH05                 2G011 AA02 AA15 AB01 AB07 AC14                       AE03 AF02                 5E024 CA18 CA19 CB04

Claims (2)

[Claims] 1. A socket substrate, a floating plate on which is mounted an IC package that is vertically movable on the socket substrate, a contact portion electrically connected to the IC package, and a bending portion that gives an elastic force. A contact having a fixing portion and a terminal portion fixed to the socket substrate, and the IC package sandwiched between the floating plate and the IC package and the floating plate are pushed down to contact the IC package and the contact. An IC socket, comprising: a pressing body for elastically contacting each other, wherein the contacts are arranged such that the curved portions of adjacent contact rows are oriented in opposite directions. 2. A cover provided on the socket substrate so as to be movable up and down and a latch interlocked with the vertical movement of the cover, wherein the pressing body is formed of the cover and the latch. The IC socket according to claim 1, which is characterized in that.