JP2007265771A - Socket for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device composed by reducing the difference between degrees of deformation of contacts adjacent to each other and thereby preventing the contacts adjacent to each other from being short-circuited to each other. <P>SOLUTION: This socket for a semiconductor device is provided with at least a socket body, a floating plate vertically movable with respect to the socket body and having a mounting surface for mounting the semiconductor device thereon, a plurality of contacts each having a horizontally projecting elastic deformation part, and each having a vertically movable contact part contacting with an external contact of the semiconductor device, and a pressing body for depressing the semiconductor device and the floating plate. The floating plate has a plurality of through-holes which the external contacts of the semiconductor device face from the upper side thereof and into which contact parts of the contacts are inserted from the lower side thereof; a first step is formed in each through-hole; a projecting part located below the first step is formed in each of the plurality of contacts; and the distance between the first step and the projecting part is set at a predetermined value. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a socket for a semiconductor device, and more particularly, to a socket for a semiconductor device having an elastically deforming portion that protrudes in a horizontal direction such as a dogleg shape or a C shape, and a contact that can be elastically displaced in a vertical direction. .

  For example, as disclosed in Patent Documents 1 and 2 and the like, sockets for semiconductor devices having elastically deforming portions protruding in the horizontal direction, such as a dogleg shape and a C shape, and having contacts that can be elastically displaced in the vertical direction. Well known from the past. This type of semiconductor device socket is a semiconductor device push-in latch or lid that can be moved relative to the socket body, and pushes the semiconductor device downward, thereby displacing the contacts attached to the socket body. An electrical contact force between the solder ball, which is an external contact of the semiconductor device, and the contact is obtained.

JP 2002-202344 A JP 2003-86315 A

  In this type of semiconductor device socket, contacts are usually arranged in accordance with the arrangement of solder balls which are external contacts of the semiconductor device. Therefore, it is necessary to prepare a socket for a semiconductor device with a different arrangement of contacts each time the type of semiconductor device mounted on the socket for a semiconductor device is different, that is, the arrangement of external contacts on the semiconductor device is different. The cost for manufacturing and storing the socket for the semiconductor device is increased including the provision of the storage space. In particular, in a socket for a semiconductor device used for a burn-in test as a screening for a semiconductor device, it is necessary to replace the socket for the semiconductor device every time the type of the semiconductor device is different, which increases the time required for the test. .

  Therefore, as means for solving such a problem as much as possible, the semiconductor device having external contacts arranged at least at the same pitch or an integer multiple pitch and having the same number of external contacts is used for the same semiconductor device. It is conceivable to use a socket. In this case, a contact may be displaced and a contact may be displaced, which may cause a short circuit between adjacent contacts.

  This short-circuit phenomenon will be briefly described with reference to FIG. FIG. 8 is an enlarged view of a main part when a semiconductor device is mounted on a conventional semiconductor device socket.

  When the semiconductor device 500 is placed on the upper surface of a floating plate 530 provided in a semiconductor device socket so as to be movable up and down, a solder ball 501 that is an external contact of the semiconductor device 500 corresponds to the floating plate 530. The through hole 531 is formed. Thereafter, as shown in the drawing, the semiconductor device 500 is pushed down in the vertical direction together with the floating plate 530 by a latch and a lid provided in the socket for the semiconductor device. As a result, the solder ball 501 of the semiconductor device 500 comes into contact with the contact portion 551 of the contact 550 of the socket for a semiconductor device, and makes electrical contact with a predetermined contact pressure by displacing the contact vertically downward.

  Here, as shown in the drawing, a semiconductor device 500 in which there is no solder ball corresponding to the middle contact 550 ′ is assumed. In this case, since the solder ball 501 does not exist, the contact portion 551 ′ of the contact 550 ′ corresponding to the solder ball 501 comes into contact with the main body of the semiconductor device 500, so that the dog-shaped elastic deformation portion 552 ′ hardly deforms. . In contrast, in the left and right contacts 550 where the solder balls 501 are present, the contact portions 551 come into contact with the solder balls 501 and are greatly displaced downward by the solder balls 501 compared to the contact portions 551 ′ of the contacts 550 ′. Therefore, the elastic deformation portion 552 is bent and deformed. As a result, in the example shown in the figure, the difference in the degree of deformation of the elastic deformation portions 552 'and 552 of the middle contact 550' and the right contact 550 is large, so that they are short-circuited. Of course, if the difference in the degree of deformation of the elastic deformation portion 552 of the contact 550, in other words, the difference in displacement of the contact portion 551 of the contact 550 is reduced, the probability of occurrence of such a short-circuit reduction is reduced. The required contact pressure between the solder ball 501 of the semiconductor device 500 and the contact portion 551 of the contact 550 cannot be obtained, and there is a possibility that stable electrical connection cannot be obtained. The short circuit phenomenon is more likely to occur as the pitch of the external contacts of a semiconductor device required for a recent semiconductor device becomes smaller.

  In view of the above-described problems, an object of the present invention is to provide a semiconductor device socket in which the difference in the degree of deformation of adjacent contacts is reduced, thereby preventing adjacent contacts from being short-circuited.

  In order to achieve the above object, a socket for a semiconductor device according to the present invention includes a socket body, a floating plate having a mounting surface on which a semiconductor device can be moved up and down with respect to the socket body, and a horizontal direction. A socket for a semiconductor device, comprising at least a plurality of contacts that have an elastically deforming portion projecting on the contact portion, and a contact portion that can contact an external contact of the semiconductor device, and a pressing body that pushes down the semiconductor device and the floating plate. The floating plate is provided with a plurality of through holes through which the external contacts of the semiconductor device face from above and into which the contact parts of the contacts are inserted from below, and each through hole is formed with a first step. Each of the plurality of contacts is formed with a protrusion positioned below the first step portion, and the distance between the step portion and the protrusion is determined by the flow. The semiconductor device in a state of being placed on the placement surface of the floating plate that is larger than the distance between the external contact of the semiconductor device and the contact portion of the contact in the state of being placed on the placement surface of the mounting plate It is set so that it may become smaller than the distance between the bottom face of this, and the contact part of the said contact.

  Furthermore, in the socket for a semiconductor device of the present invention, the floating plate is provided with a plurality of through holes into which the external contacts of the semiconductor device face from above and the contact portions of the contacts are inserted from below. A protrusion is formed, and each of the plurality of contacts is formed with a first step located below the protrusion, and the distance between the protrusion and the step depends on the mounting of the floating plate The bottom surface of the semiconductor device and the contact in a state of being placed on the placement surface of the floating plate that is larger than the distance between the external contact of the semiconductor device and the contact portion of the contact in the state of being placed on the surface It may be set to be smaller than the distance between the contact portion.

  Also in the semiconductor device socket in this case, it is preferable that each of the plurality of contacts is formed with a second step portion located above the protrusion of the through hole.

  In the present invention, in particular, a first step portion is provided in a through hole formed in the floating plate, and a contact where the contact portion is inserted into the through hole from below is provided below the first step portion of the through hole. The protrusions located at the first protrusion and the protrusions are formed at a predetermined distance, so that the deformation of adjacent contacts varies depending on the presence or absence of external contacts of the semiconductor device. A short circuit between contacts due to a difference in deformation can be prevented. In other words, the socket for a semiconductor device according to the present invention can be used for a semiconductor device having at least the same pitch or an integer multiple pitch and having a different number of external contacts, and is compatible with all semiconductor devices. It is no longer necessary to prepare a device socket. Alternatively, a protrusion is provided in the through hole formed in the floating plate, and a first step portion located below the protrusion of the through hole is formed in the contact into which the contact portion is inserted from below. In addition, a similar effect can be obtained by setting the distance between the first step portion and the protrusion to a predetermined distance.

  Furthermore, according to the present invention, by providing the second step portion with the protrusion interposed between the first step portion, deformation between the contacts can be reduced due to the design error of the external contact.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a schematic cross-sectional view of a semiconductor device socket to which the present invention is applied, and shows a state where an operation member is pushed down. FIG. 2 is an enlarged cross-sectional view of a main part of one embodiment of the present invention in a state in which the semiconductor device is not mounted in the semiconductor device socket. FIG. 3 is a diagram for explaining a mechanism for reducing the difference in the degree of contact deformation according to the present invention. FIG. 3A shows a semiconductor device mounted on a floating plate. FIG. 4 is an enlarged cross-sectional view of a main part showing a state in which a contact that has not yet been pushed down is free, and FIG. 4B is a diagram illustrating a state where the semiconductor device is pushed down and is in electrical contact with the contact at a predetermined contact pressure. It is a principal part expanded sectional view similar to (a) which shows a state. FIG. 4 is an enlarged cross-sectional view of the main part showing the deformation of the contact in the state shown in FIG. FIG. 5 is a schematic perspective view for explaining the production of a floating plate that can be used in the present invention. FIG. 6 is a schematic perspective view of another floating plate that can be used in the present invention. FIG. 7 is an enlarged sectional view of a main part of another embodiment of the present invention.

Example 1
First, the structure of the semiconductor device socket 1 to which the present invention is applied will be described.

  As shown in FIG. 1, the semiconductor device socket 1 is an open-top type socket in this embodiment, and roughly includes a socket body 10, an operation member 20, a floating plate 30, a positioning member 40, a plurality of contacts 50, and A pair of latches 60 are provided. The semiconductor device socket 1 is made of a substantially electrically insulating material except for the plurality of contacts 50.

  The socket body 10 has a substantially rectangular cross section, supports the contacts 50 through the through holes 12 formed in the bottom wall 11, and the operation member 20 and the floating plate 30 via spring members (not shown). Is supported so as to be movable up and down with respect to the socket body 10.

  The operation member 20 has the same rectangular cross-sectional shape as that of the socket body 10 and, as described above, is biased upward with respect to the socket body 10 via a spring member (not shown) such as a compression coil spring. At the same time, it is supported by the socket body 10 so as to be movable up and down. When the operation member 20 is pushed down with respect to the socket body 10, the pair of latches 60 are opened and retracted from the floating plate 30. When the push-down force is released from the operation member 20, the operation member 20 is raised by an intervening spring member (not shown) and returns to the original position. Accordingly, the pair of latches 60 are closed and advanced on the floating plate 30.

  The floating plate 30 has a mounting surface 38 on which the semiconductor device 100 is mounted on the upper surface thereof, and the floating plate 30 is vertically moved in correspondence with the solder ball 101 that is an external contact of the semiconductor device 100 to be mounted. A plurality of through holes 32 penetrating therethrough are formed. As shown in FIGS. 5 and 6, the through hole 32, which is a feature of the present invention, has a rectangular cross section similar to the cross section of the contact 50, and as shown in FIG. 2, the through hole 32. Includes an upper hole portion 32a and a lower hole portion 32c having a larger width than the upper hole portion 32a, and a first step portion 32b is formed between the upper hole portion 32a and the lower hole portion 32c. Then, the solder ball 101 of the semiconductor device 100 faces the upper hole portion 32a from above, and the contact portion 51 of the contact 50 is inserted through the lower hole portion 32c from below.

  In the present embodiment, the through hole 32 has been described as having a rectangular cross section. However, the through hole 32 is not limited to this and may have a circular cross section. Even in this case, the lower hole portion 32c preferably has a rectangular cross section as in the present embodiment. That is, with this configuration, the vertical movement of the contact 50 can be guided without being shaken.

  Further, as described above, the floating plate 30 is biased upward with respect to the socket body 10 via a spring member (not shown) and is supported so as to be movable up and down. When the device 100 is placed and the pair of latches 60 are closed, the pair of latches 60 can be pushed down by the semiconductor device 100.

  As shown in FIG. 5, the floating plate 30 is manufactured by stacking plate-like bodies 31 a, 31 b, 31 c, 31 d... Having a plurality of grooves 32 ′ having side holes 32 open on the side surfaces. They may be integrated with the connecting member 33 or the like, or may be integrally manufactured with a through hole 32 by molding as shown in FIG. Furthermore, as shown in FIGS. 5 and 6, a block having a plurality of through holes 32 arranged in a matrix may be combined with a separately created floating member to form a floating plate 30.

  The positioning members 40 are usually arranged on the mounting surface 38 of the floating plate 30 corresponding to the four corners of the semiconductor device 100 to be mounted, guide the semiconductor device 100 to the mounting surface 38, and the mounting surface 38. The semiconductor device 100 is positioned above. Therefore, it is preferable that the positioning member 40 has the inclined surface 41 and the vertical surface 42 on the inner side in order to guide the semiconductor device 100.

  The contact 50 is formed by punching a thin plate made of a conductive material. As shown in FIGS. 2, 3 (a), and 4, the contact 50 allows the contact portion 51 that contacts the solder ball 101, which is an external contact of the semiconductor device 100, and the vertical displacement of the contact portion 51. The configuration is the same as that of the conventional example in that a substantially C-shaped elastic deformation portion 52 that protrudes in the horizontal direction and a terminal portion 53 that is connected to an external contact of an electric device or a test board (not shown) are provided. In the present invention, as shown in FIGS. 2, 3 (a), and 4, the connector 50 has a pair of protrusions protruding in the left-right direction of the contact portion 51 near the elastic deformation portion 52 of the contact portion 51. 54 is formed. As shown in FIG. 3A, the protrusion 54 is provided so as to be positioned below the first step 32b formed in the through hole 32 of the floating plate 30 by a distance D when assembled. It is done. The protrusion 54 is a first step 32 b formed in the through hole 32 of the floating plate 30 as the floating plate 30 descends when the corresponding solder ball 101 of the semiconductor device 100 to be placed does not exist. The contact 50 on which the protrusion 54 is formed is forcibly displaced downward.

  In this embodiment, the pair of latches 60 are provided in a direction perpendicular to the paper surface in FIG. 1, and are rotatable with respect to the socket body 10, whereby the semiconductor pressing portions 61 of the respective latches 60 are connected to the floating plate 30. Is supported so as to be able to move forward and backward (movable in a direction perpendicular to the paper surface in FIG. 1), that is, openable and closable (detailed configuration is disclosed in JP-A-2004-55407). Or refer to Patent Document 2 above).

  The pair of latches 60 are advanced and closed on the mounting surface 38 of the floating plate 30 when the semiconductor device socket 1 is not mounted with a semiconductor device and the operation member 20 is not operated. It is configured to be in At this time, it is preferable that the pair of latches 60 themselves are also urged by the spring member in the closing direction. When the pair of latches 60 are closed, the semiconductor pressing portion 61 of each latch 60 and the mounting surface 38 of the floating plate 30 are configured to be separated from each other with a predetermined interval. The interval x (not shown) determines the contact pressure with the contact 50. As shown in FIG. 1, the pair of latches 60 can be opened and retracted from the mounting surface 38 when the operation member 20 is pushed down. At this time, the semiconductor device 100 can be mounted on the mounting surface 38 of the floating plate 30.

  When the semiconductor device 100 is placed on the placement surface 38 and the push-down force of the operation member 20 is released, the pair of latches 60 move forward on the placement surface 38 while being closed. As a result, the semiconductor pressing portions 61 of the pair of latches 60 push down the semiconductor device 100 placed on the floating plate 30 together with the floating plate 30, and normally the solder balls 101 of the semiconductor device 100 are moved to the corresponding contacts 50. Are brought into contact with the contact portion 51 of the.

  As can be understood from these descriptions, the pair of latches 60 in this embodiment function as pressing bodies that push down the semiconductor device 100 placed on the placement surface 38 of the floating plate 30 together with the floating plate 30. In other words, as long as the semiconductor device 100 and the floating plate 30 can be pushed down at the same time, the pressing body is not limited to the pair of latches 60 of this embodiment, and may be, for example, two pairs of latches. It may be a pressing body that is manually pushed down from above, or a pressing body that is attached to a lid in a clamshell type socket.

  Next, the operation when mounting the semiconductor device 100 in the semiconductor device socket 1 having the above-described configuration will be described in detail with reference to FIGS. As shown in FIGS. 3 and 4, in this embodiment, it is assumed that there is no solder ball 101 which is an external contact of the semiconductor device 100 corresponding to the middle contact 50 ′.

  In a state where the operation member 20 of the semiconductor device socket 1 is pushed down and the pair of latches 60 are retracted from the mounting surface 38 of the floating plate 30, the semiconductor device 100 is mounted on the mounting surface 38 of the floating plate 30 from above. To do.

  The semiconductor device 100 is guided by the positioning member 40, and the solder ball 101 as an external contact thereof is fitted into the corresponding through hole 32 as shown in FIG. At this time, as shown in the drawing, the contact portion 51 between the solder ball 101 and the contact 50 is in a state of being separated with a gap A. The gap A is provided so that when the semiconductor device 100 is removed from the semiconductor device socket 1, the semiconductor device 100 can be easily removed after the solder balls 101 and the contacts 50 are completely separated. It is preset. Therefore, if the protruding amount of the solder ball 101 from the bottom surface 102 of the semiconductor device 100 is B, the contact portion 51 ′ of the middle contact 50 ′ is separated from the bottom surface 102 of the semiconductor device 100 by (A + B). The gap A is preferably present but may not be present.

  When the pressing force applied to the operation member 20 is released from this state, the operation member 20 is raised to the original position by the spring member interposed between the operation member 20 and the socket body 10. As a result, the pair of latches 60 are closed and similarly returned to their original positions.

  Assuming that the contact portion 51 of the contact 50 corresponding to the solder ball 101 needs to be pushed down by a distance h so that the contact portion 51 of the solder ball 101 and the contact 50 can be brought into contact with each other with a predetermined electrical contact pressure. 100 needs to be pushed down by a distance (A + h) as shown in FIG. 3 (b). It will be understood that the amount of depression (A + h) is (thickness of semiconductor device 100−interval x).

  Here, in the present invention, when the conventional contact 50 ′ is displaced in contact with the bottom surface 102 of the semiconductor device 100, there is a possibility that it contacts the adjacent contact 50 (in this embodiment, the right adjacent contact 50) and short-circuits. (Refer to FIG. 8) In view of the fact that the difference between these displacements is reduced, as a result, as shown in FIG. 4, the object is to prevent a short circuit between the elastically deformable portions 52 ′ and 52. It is said. The present invention seeks to achieve this by increasing the amount of displacement of the contact 50 ′ and bringing it closer to the displacement of the contact 50 in order to reduce the difference in displacement between the contact 50 and the contact 50 ′. For this purpose, it is understood that it is an essential requirement for the displacement of the contact 50 ′ in FIG. 3B to displace at least the contact 50 ′ without contacting the bottom surface 102 of the semiconductor device 100. In other words, in the case shown in FIG. 3B, if the distance between the contact 50 'and the solder ball 101 is C, at least C> 0. If so, since C = A + B−D, it is understood that the distance D should be set so that at least D <A + B.

  By the way, as described above, when the semiconductor device 100 is pushed down by A + h, the middle contact 50 ′ where the solder ball 101 does not exist has the protrusion 54 ′ of the contact 50 ′ on the first step 32 b of the through hole 32. It is understood that the contact is displaced by A + h−D. Since the difference in displacement amount between the middle contact 50 ′ and the contact 50 on the right is h− (A + h−D) = DA, D = A in order to reduce the displacement amount. That is, it is desirable that C = B. However, considering the contact pressure, the distance D is set so that at least D> A.

  From the above, it is understood that the distance D between the first step 32b and the protrusion 54 is preferably set so as to be within the range of A + B> D> A in this embodiment. Is done. Thus, in the present invention, even if the external contacts are different, the semiconductor device 100 can be mounted in the same semiconductor device socket 1 without short-circuiting adjacent contacts 50 as in the conventional example. It becomes possible.

  In order to remove the mounted semiconductor device 100 from the semiconductor device socket 1, the operation member 20 is pushed in, the pair of latches 60 are retracted from the mounting surface 38 of the floating plate 30, and a manual or a vacuum suction mechanical device is used. The semiconductor device 100 may be removed from the mounting surface 38 by driving.

(Example 2)
Next, FIG. 7 shows another embodiment of the present invention. The present embodiment is different from the first embodiment only in that the members provided with the protrusions and the stepped portions are reversed, and the other configurations are completely the same. That is, in the present embodiment, a pair of left and right protrusions 34 are provided at predetermined positions in the through hole 32 of the floating plate 30, and the pair of protrusions 34 are located near the elastic deformation part 52 of the contact part 51 of the contact 50. Correspondingly, a pair of left and right recesses 55 are formed. Each concave portion 55 includes a second step portion 57 located above and in contact with the protrusion 34 and a first step portion 56 located below. When the distance between the first step portion 56 of the recess 55 and the corresponding projection 34 is D, if D is set to be within the range of A + B>D> A, as in the above embodiment, Even if the external contacts of the semiconductor device 100 are different, the adjacent contacts 50 can be mounted in the same semiconductor device socket 1 without short-circuiting.

  Although the present invention has been described with respect to the open top type socket, it can also be applied to a clamshell type socket.

It is a schematic sectional drawing of the socket for semiconductor devices to which this invention is applied, and has shown the state by which the operation member was pushed down. It is a principal part expanded sectional view of one Example of this invention of the state in which the semiconductor device is not mounted | worn with the socket for semiconductor devices. It is a figure for demonstrating the mechanism for reducing the difference of the deformation | transformation degree of the contact which concerns on this invention, (a) is although the semiconductor device is mounted on the floating plate, but still below It is a principal part expanded sectional view which shows the state in which the contact which is not pushed in is free, (b) shows the state which the semiconductor device is pushed down and is in electrical contact with the contact with predetermined contact pressure ( It is a principal part expanded sectional view similar to a). FIG. 4 is an enlarged cross-sectional view of a main part showing deformation of the contact in the state shown in FIG. It is a schematic perspective view for demonstrating manufacture of the floating plate which can be used for this invention. It is a schematic perspective view of another floating plate which can be used for this invention. It is a principal part expanded sectional view of another Example of this invention. It is a principal part enlarged view when a semiconductor device is mounted | worn with the conventional socket for semiconductor devices.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device socket 10 Socket main body 20 Operation member 30 Floating plate 32 Through-hole 32b First step part 34 Projection part 40 Positioning device 50 Contact 54 Projection part 56 First step part 57 Second step part 60 Latch (press) body)

Claims (3)

A socket body, a floating plate that can move up and down relative to the socket body and has a mounting surface on which the semiconductor device is mounted, and an elastically deforming portion that protrudes in the horizontal direction and contacts an external contact of the semiconductor device In a semiconductor device socket comprising at least a plurality of contacts whose contact portions can be moved up and down, and a pressing body that pushes down the semiconductor device and the floating plate,
The floating plate is provided with a plurality of through holes into which the external contacts of the semiconductor device face from above and into which the contact portions of the contacts are inserted from below, and each through hole is formed with a first step.
Each of the plurality of contacts is formed with a protrusion located below the first step.
The distance between the stepped portion and the protrusion is greater than the distance between the external contact of the semiconductor device and the contact portion of the contact in a state of being placed on the placement surface of the floating plate, and the floating plate A socket for a semiconductor device, wherein the socket is set to be smaller than a distance between a bottom surface of the semiconductor device and a contact portion of the contact in a state of being placed on the placement surface. A socket body, a floating plate that can move up and down relative to the socket body and has a mounting surface on which the semiconductor device is mounted, and an elastically deforming portion that protrudes in the horizontal direction and contacts an external contact of the semiconductor device In a semiconductor device socket comprising at least a plurality of contacts whose contact portions can be moved up and down, and a pressing body that pushes down the semiconductor device and the floating plate,
The floating plate has an external contact of the semiconductor device from above and a plurality of through holes into which contact portions of the contacts are inserted from below, and each through hole has a protrusion,
Each of the plurality of contacts is formed with a first step portion located below the protrusion,
The distance between the projecting portion and the stepped portion is larger than the distance between the external contact of the semiconductor device and the contact portion of the contact in a state of being placed on the placement surface of the floating plate, and the floating plate A socket for a semiconductor device, wherein the socket is set to be smaller than a distance between a bottom surface of the semiconductor device and a contact portion of the contact in a state of being placed on the placement surface. 3. The semiconductor device socket according to claim 2, wherein each of the plurality of contacts is formed with a second step portion located above the protrusion of the through hole.

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