TWI766753B - Socket for inspection of semiconductor devices - Google Patents

Abstract

The present invention relates to a socket for semiconductor device inspection in which the position stage moves the contact pin in the lateral direction, and the upper part of the contact pin can be moved to the intended position, The socket is equipped with: a base, which is located below the socket; a contact pin, which is arranged on the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; A position stage, which is located above the socket, restricts the position of the upper part of the above-mentioned contact pin, a guide device for accommodating the semiconductor package above the position stage; a cover, which is located over the socket and can be moved up and down; and The latch assembly is connected to the cover, and the cover rotates by moving up and down.

Description

Socket for semiconductor device inspection

The present invention relates to a socket device for semiconductor device inspection (hereinafter referred to as a "socket"), and more particularly, to a bow-shaped LGA (Land Grid Array) socket and BGA (Ball Grid Array) socket without using a separator. , By implementing the method of directly inserting the contact pin into the socket base, it brings an epoch-making reduction effect in the socket manufacturing cost compared with the conventional socket manufacturing method using the partition plate, and the existing socket manufacturing method without using the partition plate It can be applied to narrower and narrower pitches, so that the entire pitch range that can be applied to reduce socket manufacturing costs can be applied to narrow-pitch and wide-pitch semiconductor device inspection sockets.

Generally, a semiconductor device is manufactured by integrating electronic circuits on a circuit board at a high density. After the semiconductor device is manufactured and assembled into a product, it undergoes an inspection process to check whether the semiconductor package operates correctly. Such an inspection operation is performed by putting a semiconductor package into a socket device for inspection. The socket device is provided with a large number of contacts that come into contact with the semiconductor package, and the contacts provided with the semiconductor package terminals and the contact pins are brought into contact and energized, and are used for inspection. device to inspect semiconductor packages. The task of the socket used for inspection is to form an electrical connection path between the external terminals of the semiconductor package and the system. In order to inspect a plurality of semiconductor packages at one time, the main board is arranged in a matrix with a certain interval and a certain number, and is put into The inspection system is used to select devices that are defective or not in semiconductor packages. When the cover of the inspection socket is pressed down, the latch will be released, and the semiconductor package will be thrown vertically into the socket. Then, while the cover will be raised, the latch will press the upper surface of the semiconductor package, so that the The contact load between the package ball and the contactor is generated, and the electrical connection is performed for inspection. The pressing source of the semiconductor package is generated by the elastic force of the cover spring, and is established through the contact pin for the contact between the package ball and the contactor and the wire task of receiving the accompanying electrical signal. In the power generation process of semiconductor packaging, in the past, packages with wide pitches such as 1.0mm and 0.8mm (wide pitch) were the mainstream. However, due to the acceleration of the miniaturization and thinning of semiconductor packages, the pitch of semiconductor packages is also higher than that in the past. The pitch is narrower, and it is in a state of miniaturization (narrow pitch). When the pitch is larger than a certain size (when the bending state of the contact pin is wider than the pitch), when the contact pin is inserted into the socket base, it will Adjacent contact pins interfere or collide, causing problems such as failure or a state in which automatic insertion cannot be performed. Therefore, an automated device cannot be used for a pitch of a certain size (eg, 0.8 mm) or less, so there are cases where the contact pins are inserted one by one into the socket base by hand while accepting some or a certain degree of conflict. In addition to the case where the contact pins are directly inserted into the socket base by automatic or manual insertion of the conventional wide pitch or narrow pitch, when the spacer is used, the contact pin is inserted into the spacer first, and then the contact pin is inserted into the spacer. A method in which the inserted plural spacers are attached to the base of the socket and assembled. 14 to 16 show a method of inserting the contact pin (11) into the base (17) according to the prior art, as shown in A and B of FIG. 14, in the case of the method of directly inserting the base (17) , when the contact pin (11) is inserted with a large amount of conflict and interference with the adjacent pin, resulting in the deformation of the contact pin (11), in the case of a large distance (wide distance), it can be automated or inserted by hand, but in the case of a larger distance A problem arises in the case of a smaller clearance distance (narrow pitch) of the contact pin spring (12) which is automated or direct insertion. That is, in the conventional method, in order to solve the problem of the collision of the narrow pitch shown in FIG. 14A, when the pitch is narrow, it is impossible to directly insert the contact pin (11) into the base hole, Therefore, as a countermeasure against this, the method of using the spacer (15) shown in FIG. 15 is used. Also, as shown in B of FIG. 14 , even in the prior art, when the contact pins ( 11 ) are inserted, the pitch is a wide pitch that is not affected by the interference with the contact pins ( 11 ), or that the interference is slight. , the insertion of the contact pins (11) into the base holes will not pose a major problem. However, with the development of semiconductor packages and according to the needs of users, the pitch will be gradually narrowed, and various conventional methods for corresponding to the narrow pitch are established. In this case, as shown in FIGS. 15 and 16 , after the contact pins ( 11 ) are inserted into the spacers ( 15 ), a plurality of spacers ( 15 ) into which the contact pins ( 11 ) are inserted are stacked and assembled on the base. The way of the seat (17) will be used, and now the sockets are also made in this way for narrow pitches. Although it is possible to correspond to a narrow pitch in this way, the number of spacers entering a socket through the ball matrix of the semiconductor package (50) will increase mostly, and the operation process will also increase together, which becomes the original price with the increase in manufacturing costs. The reason for the rise is nothing but a structure that becomes a burden on customers. That is, in the conventional method of using the spacer (15) at a narrow pitch, several tens of spacers (15) are required for one inspection socket, so the unit price of the socket cannot be reduced in response to the cost-sensitive semiconductor manufacturing company. The limit point of the requirements, and the fact that the price competitiveness among socket manufacturing companies has become a big burden. For such a reason, in the manufacture of a socket for semiconductor device inspection, an effort is made to secure competitiveness by reducing the number of applicable parts and lowering the manufacturing unit price. In addition, the current type of semiconductor packages is a group of fine and narrow-pitch products such as mobile devices, and the demand for such a group of products is continuously increasing. As a socket manufacturing method that utilizes conventional spacers, it is impossible to respond to the price of components. The conventional manufacturing method in which the contact pins are directly inserted into such a socket base has a problem that it is impossible to cope with the fine and narrow pitches in order to reduce the requirement.

[Technical subject] An object of the present invention is to solve the above-mentioned problems, and to provide a socket that can directly insert and mount a contact pin into a socket base without using a conventional spacer even if the pitch is fine and narrow. A socket device for inspection of a semiconductor package that improves the productivity of inspection sockets with fine and narrow pitches and reduces the cost of production due to lower manufacturing cost. [technical solution] The present invention is to achieve the above object, and a socket for semiconductor device inspection is provided with: a base, which is located below the above-mentioned socket; a contact pin, which is mounted on a base hole provided on the inner side of the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; and a position stage, which is located above the socket and restricts the position of the upper part of the contact pin, The said position stage moves the said contact pin in the horizontal direction, and can move the upper part of the contact pin to the intended position. Moreover, in the said structure, after the position stage moves the said contact pin upper part, the position of the said contact pin upper part is located on the straight line (C) of the said contact pin lower part position or is close|similar. Furthermore, in the above configuration, The above-mentioned contact pin system has one or more bent contact pin springs that can be displaced in the longitudinal direction, The shape of the contact pin spring before the above-mentioned position stage moves the upper part of the above-mentioned contact pin is such that there is no interference with the adjacent contact pin during the process of installing and inserting the above-mentioned contact pin into the above-mentioned base hole, or does not interfere with the installation, After the upper part of the contact pin is moved by the position stage, the contact pin spring shape is formed in the process of attaching the contact pin to the base hole so that the adjacent contact pins interfere with each other and interfere with assembly. Moreover, in the said structure, the lower part side of the said contact pin has the pressing part which can be pressed from the upper direction. Further, in the above configuration, a semiconductor package mounting portion for accommodating the semiconductor package is provided above the position stage, When the semiconductor package is pressed from above, the semiconductor package mounting portion is lowered together with the semiconductor package, and the semiconductor package is brought into contact with the upper surface of the position stage while being guided to the semiconductor package mounting portion, so that the semiconductor package and the semiconductor The lowering of the package mounting portion stops at the intended position. In the above configuration, when the semiconductor package is lowered and the semiconductor package is in contact with the upper portion of the contact pin, the contact pin is inclined from one side of the position stage to the other side by a stroke, and after the contact is completed It is restored to the original position, whereby there is almost no vertical load on the position table, so the friction force is also eliminated, and the repulsive force of the contact pin is completely transmitted to the package ball. In the above configuration, when moving to a target position of the position table, a hook for fixing the position table at the final target position is provided, and the contact pins are arranged so as to match the electrode arrangement of the semiconductor package. Furthermore, the present invention is provided in a socket for semiconductor device inspection, including: a base, which is located below the above-mentioned socket; a contact pin, which is mounted on a base hole provided on the inner side of the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; and a position stage, which is located above the socket and restricts the position of the upper part of the contact pin, have: a semiconductor package mounting portion, which houses the semiconductor package above the position stage; a cover, which is located above the said socket and can be moved up and down; and a latch assembly, which is connected to the cover, and the cover rotates by moving up and down, The said position stand is equipped with the structure which can move the upper part of a contact pin to the desired position by moving the said contact pin in the horizontal direction. [Effect of invention] The present invention has the effect of lowering the manufacturing unit cost compared with the conventional socket manufacturing method using the spacer by directly inserting the contact pin into the socket base. In addition, in other conventional methods that do not use spacers, in the case of a narrow pitch, interference between the adjacent pins occurs during assembly of the contact pins, resulting in deformation of the contact pins, so it is only applicable to the case of a wide pitch, but In the case of the present invention, even if the pitch is narrow, the contact pins can be directly inserted into the socket base, the original cost can be reduced, and automation can be realized, which has a great effect on the improvement of the production volume. In particular, the present invention can automatically insert contact pins even at narrow pitches. Therefore, when compared with the method of inserting the contact pins directly into the socket base by hand or the process of using the spacer, the productivity is improved and the spacer is omitted. , which can achieve better price competitiveness with the reduction of the unit price of socket manufacturing.

Specific details for carrying out the invention will be described in detail with reference to the following drawings. In the present invention, various modifications can be added, and when a plurality of embodiments are possible, specific embodiments and the like are shown in the drawings and the detailed description is explained in detail. However, this is not intended to limit the embodiments of the present invention, and it must be understood that all modifications, equivalents, and substitutes included in the spirit and technical scope of the present invention are included. [Example] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 13 of the present invention. 1 is a perspective view of a socket for semiconductor device inspection according to the present invention, showing a general semiconductor device inspection socket (10), which includes: A base (20), which is located at the lower portion of the socket (10), has four support legs that form a quadrangular shape, and sandwiches a shaft to which the lower portion of the rod is fixed; and A cover (30), which is located above the base (20), is elastically pressed by four cover springs, Inside the cover (30) is a latch assembly (40) that is fixed to the base (20) and the cover (30) by shafts and rotates, and a semiconductor package (50) to be put into ) of the semiconductor package mounting portion (60). Once the cover (30) is pressed down, the cover spring will be pressed down, and the cover (30) will be lowered downwards, and once it contacts the base (20), the latch assembly (40) will be opened. With the latch assembly (40) open, the semiconductor package (50) is vertically dropped (dropped) onto the semiconductor package mounting portion (60), and once the cover (30) is placed, the latch assembly (40) will press The semiconductor package (50) and the ball (55) located under the semiconductor package (50) and the contact pin upper part (72; refer to FIG. 13) of the socket (10) are contacted and electrically connected, and various inspections are performed. The semiconductor package mounting portion (60) of the semiconductor package (50) is accommodated above the position table (80) when the ball (55) of the inspection pad at the lower part of the package is provided with the contact pin upper part (72) as described above, When the semiconductor package (50) is pressed from above, the semiconductor package mounting portion is lowered together with the semiconductor package (50), and the semiconductor package (50) is provided with a stop position surface, and the stop position surface is guided to the semiconductor package while being guided to the semiconductor package (50). The package mounting portion stops the descending of the semiconductor package and the semiconductor package mounting portion at a predetermined (target) position while contacting the upper surface of the contact pin (72) on the position stage (80; see FIG. 13 ). The above-mentioned stop position surface means that when the semiconductor package mounting portion (60) descends together with the semiconductor package (50), the package ball (55) on the lower surface of the semiconductor package mounting portion is in contact with the upper surface of the position table, that is, the upper portion of the contact pin (72). The surface to be stopped at the end is configured in such a way that the deformation of the contact pin (70) which is deformed after the contact pin (70) contacts with the package ball (55) can be collectively controlled according to the vertical distance from the start to the stop of the movement of the semiconductor package mounting portion. A stop position surface is provided in order to maintain a state optimal for the contact load between the contact pin and the package ball (55). Thereby, the contact pins (70) receive the optimum load, the deformation of the contact pins (70) is prevented, and when the package ball (55) located under the semiconductor package is in contact with the upper portion (72) of the contact pins, the optimum load can be maintained. A good contact relationship can be obtained, and the amount of deformation of the contact pin can be formed to receive the intended load in a certain manner, and a balanced pressure can be maintained, thereby obtaining the optimum contact of the socket for inspection, and preventing the contact pin (70). ) damage, etc. Thereby, the descending of the semiconductor package mounting portion is stopped at a desired position. 13 , as shown in FIG. 1 , the semiconductor package ( 50 ) descends and the semiconductor package ball ( 55 ) located at the lower part of the semiconductor package ( 50 ) comes into contact with the upper part of the contact pin ( 72 ). When the contact pin (70) on the right side of the position table (80) is inclined to the left by the stroke, the position table (80) has almost no vertical load, so the friction force also disappears, and the contact pin (70) ) repulsive force is completely transmitted to the package ball (55), and is configured to return to the right side of the original position after the above-mentioned contact is completed. At the same time, the contact pin (70) moves the position table by pulling or pushing the position table (80) to the position where the movement for inspection (returned after tilting) can be performed as described above. In this embodiment, the initial original position of the contact pin (70) is on the right side, but it may be on the right side when the contact pin (70) is placed on the left side. ) is returned to the left side of the original position when it is removed. In addition, if the lowering is not stopped under the condition below or above the intended load as described above, there may be poor contact or the amount of deformation of the contact pins is not constant, which may affect the quality of the socket or Conditions affecting the durability of the contact pins. In addition, in the configuration of the above-mentioned stop position surface, in the case of the elastic force of the cover, since the production batch and the elastic force itself vary to some extent, the contact load of the contact pin to the package ball also varies. Pressing force) > force per pin × number of applicable pins. By setting the upper pressing force to be larger than the pressing force of the pressing package, the structure can be constantly stopped at the same position, and the deformation amount of the contact pin will be reduced. It is often established, so the pin force is often established, and the socket performance is effective. 2 is a perspective view of a base (20) on which the contact pins (70) shown in FIG. 3 are mounted for contact with a semiconductor package (50), and a base hole ( 22) When the contact pins (70) are assembled, the contact pins (70) are installed as shown in FIG. That is, as shown in FIG. 3, the contact pins (70) are sequentially inserted into the base holes provided on the inner side of the base (20) for installation. At this time, the insertion order of the contact pins (70) is the contact pins. The contact spring (71) of the contact pin (70) does not cause interference with the upper part (72) of the contact pin during insertion of (70), and when interference occurs, there is a small amount of adjacent contact pins (70) that do not affect the degree of assembly. In the state of interference, they are sequentially inserted into the base (20) and installed, or a plurality of them are installed at the same time. The above-mentioned contact pin (70) is installed in the base hole (22), and is also installed by automatic insertion or manual insertion. In addition, the contact pin upper part (72) of the upper part of the contact pin (70) of the present invention is provided on the outer side (in the direction of the adjacent contact pin (70)) than the straight line (vertical line) of the contact pin lower part (73), And the upper part of the contact pin is inclined. The above-mentioned inclination is based on the straight line (C) of the lower part of the contact pin (73), and the inclination is in the range of about 0.1 degrees to 45 degrees. Adjust the tilt within the range from 45 degrees to 90 degrees. Alternatively, in addition to the above-mentioned configuration in which the upper part (72) of the contact pin is arranged on the outer side of the straight line (C) of the lower part (73) of the contact pin, the upper part (72) of the contact pin may not be inclined, and the lower part (73) ) does not coincide with a straight line, but is in a vertical state parallel to a straight line on the outside separated by a certain distance. In addition, the contact spring (71) of the contact pin (70) has one or more curved portions, and in this embodiment, it is provided with three or four curved portions. 4 is a cross-sectional view showing a plurality of contact pins ( 70 ) used in the present invention. Plural curved shapes or forms other than those shown in the drawings may be formed, and the number of curved portions may be 3 or less or 5 or more. In addition, a pressing portion (74) is provided on the contact pin lower portion (73) side, that is, on the upper side of the lower portion. The pressing portion (74) performs the task of preventing the deformation of the contact pin (70) from occurring when the pressing portion (74) is pressed from above or the like when the contact pin (70) is attached to the base hole (22). . Figures 5 and 6 show the states in which the contact pins (70) as shown in Figure 3 are attached to the plurality of contact pins (70) of the base holes (22) located at the lower inner side of the base (20), respectively. 5 and 6 described above, the arrangement of the contact pins (70) is variously applied according to the semiconductor package for inspection, and this embodiment will be described by taking the arrangement state of FIG. 6 as an example. Fig. 7 is a state in which a plurality of contact pins (70) are arranged in a square shape in the interior arrangement space as in the above-mentioned Fig. 6, and are provided in the position stand (80) so as to penetrate the upper portion (72) of the contact pins. In a state where most of the holes (hereinafter referred to as the position table holes (82)) are covered with the position table (80) installed, the upper part (72) of the contact pin in this case is a straight line (C) of the lower part of the contact pin as shown in FIG. 3 . ) as a reference, it is displayed in a state inclined to one side, and when the position table (80) with a large number of position table holes (82) is viewed horizontally in the state covering the position table hole (82), it is exposed to the position table hole (82). The upper part (72) of the contact pin on the (82) is not perpendicular to the horizontal line along the position table (80), but is slightly inclined. The above-mentioned contact pin upper part (72) does not stand vertically, but is slightly inclined, so as to be smoothly inserted into the base hole (22) provided in the inner lower part of the base (20) in a narrow pitch state, and the contact pin upper part ( The straight line 72) is set outside the straight line of the lower part of the contact pin (73), in order to avoid collision or interference between the adjacent contact pins as in the conventional case when the base hole (22) is mounted. Therefore, in order to make the above-mentioned inclined upper part (72) of the contact pin come into contact with the lower contact part of the semiconductor package (50), it must be erected vertically. Therefore, it is necessary to make the position stage (80) shown in FIG. 8 in the lateral direction, That is, the upper part (72) of the contact pin, which is inclined by being pushed to the left in the drawing, is in a vertical position. At this time, the upper part (72) of the inclined contact pin will be in a vertical position, and the above-mentioned straight line is on the contact pin as shown in FIG. That is, in order to move the position stage (80), the upper part (72) of the contact pin inserted into the position stage hole (82) provided in the position stage (80) is pulled or pushed by the contact spring (80). 71) to the correct vertical position, and the upper and lower parts (72, 73) of the contact pin will be in a straight line in a vertical state. At this time, the position of the contact pin (70) is as shown in Figure 13. It is connected to one aspect of the position table (80) and positioned. In addition, the contact pin (70) is inserted into the base without interference with the adjacent contact pin, and the contact pin upper portion (72) and the contact spring (71) can be configured to such an extent that the mounting is not hindered. Press the above-mentioned position table (80) to make the upper part of the contact pin (72) stand upright, and the position table hook (81) shown in FIG. The contact pin upper part (72) is fixed vertically by being combined and fixed (refer to FIG. 11 ), and the contact pin (70) is resisted against the repulsive force and maintained fixed. After the above-mentioned position table (80) moves the upper part (72) of the contact pin, the shape of the above-mentioned contact spring (71) is formed by abutting the contact pin (70) in the process of installing the contact pin (70) in the base hole (22). 70) Shapes that interfere with each other and hinder assembly. Fig. 9 is a view showing a state in which the position table hook (81) is not engaged with the base hook (21), and as can be seen from Figs. 7 and 8 above, the position table inserted into the position table (80) is shown The upper part (72) of the contact pin fixed to the hole (82) is inclined, and shown on the left side of FIG. In the above state, if the position table (80) is moved to the left side of the drawing by the operator or the driving device (not shown), as shown in FIG. Next, the position table hook (81) and the base hook (21) will be engaged. 12 is a perspective view showing a state in which the position table of FIGS. 10 and 11 is moved laterally and the position table hook ( 81 ) and the base hook ( 21 ) are coupled, and the package ball ( 55) The semiconductor package can be inspected by contacting the upper part of the contact pin (72) of FIG. 12 as described in the configuration of FIG. 13 . That is, the present invention has the configuration as shown in the above-mentioned FIGS. 1 to 13 , without using the spacer (15) used in the narrow pitch in the past, and even if the pitch is narrow, the contact pin (70) It is automatically attached to the base hole (22) of the base (20), and then covers the position table (80), and is fixed by the hooks (81, 21) provided on the position table (80) and the base. By the conclusion, the inclined contact pin upper part (72) is positioned vertically and correctly, and a socket for semiconductor device inspection which is the object of the present invention can be provided. Through a series of processes like the above, from the standpoint of the socket manufacturing company, the epoch-making cost reduction effect can be maximized compared to the existing socket manufacturing method. The effect of cost reduction varies depending on the semiconductor package ball matrix, but in general, spacers are mostly used in narrow pitches, so as long as spacers are not used, the price of the number of parts can be reduced, so it can be said that the narrower the space is, the more Its expected effect is greater. The embodiment described above is an example, and various corrections and modifications can be implemented by those with ordinary knowledge in the technical field to which the present invention pertains without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate the technical facts not to limit the present invention, and the scope of the technical idea of the present invention is not limited by such embodiments. The protection scope of the present invention is not necessarily interpreted by the following patent application scope, and all technical ideas within the same scope should be interpreted as being included in the right scope of the present invention.

10: Socket 15: Clapboard 16: Partition gap 17,20: Pedestal 21: Pedestal Hook 22: base hole 30: Cover 40: Lock assembly 50: Semiconductor packaging 55: Semiconductor packaging ball 60: Semiconductor Package Mounting Department 11,70: Contact pins 12,71: Contact pin spring 13,72: Contact pin upper 14, 73: Contact pin lower 74: Press part 80: Position Desk 81: Position table hook 82: Position table hole C: A straight line that touches the lower part (center line)

1 is a perspective view of a socket for semiconductor device inspection according to the present invention. [ Fig. 2 ] is a perspective view of a base mounted with contact pins for contacting with a semiconductor package. [ Fig. 3] Fig. 3 is a cross-sectional view showing a cross-section in which the contact pin of the present invention is attached to the base. [ Fig. 4] Fig. 4 is a cross-sectional view showing a plurality of contact pins used in the present invention. [ Fig. 5] Fig. 5 is a perspective view showing a state in which the contact pin of the present invention is attached to a base. [ Fig. 6] Fig. 6 is a perspective view showing another state in which the contact pin of the present invention is attached to the base. [ Fig. 7] Fig. 7 is a perspective view showing a state in which the position table is covered with the above-mentioned state of Fig. 6 . [ Fig. 8] Fig. 8 is a cross-sectional view showing a cross-section of the contact pin in the above-mentioned Fig. 7 . [ Fig. 9] Fig. 9 is a cross-sectional view showing a state in which the position table hook and the base hook are not connected. [ Fig. 10] Fig. 10 is a cross-sectional view showing a cross-section of the contact pin in a state in which the position stage shown in Fig. 9 is traversed. 11 is a cross-sectional view showing a state in which the table hook and the base hook are connected at the position of FIG. 9 . 12 is a perspective view showing the state of FIGS. 10 and 11 . 13 is a cross-sectional view showing in stages a state of contact and separation between a semiconductor package ball and a contact pin. FIG. 14 is a diagram showing whether or not the contact pins can collide with each other in the case of a conventional narrow pitch and a wide pitch. In FIG. 15 , A is a diagram showing a conventionally used spacer, and B is a diagram showing a state in which a contact pin is attached to the conventionally used spacer. 16 is a view showing a state in which contact pins are attached to and stacked on many conventional separators.

10: Socket

20: Pedestal

30: Cover

40: Lock assembly

50: Semiconductor packaging

60: Semiconductor Package Mounting Department

Claims (1)

A socket for semiconductor device inspection is characterized by comprising: a base located below the socket; a cover located above the base and elastically pressed by a plurality of cover springs; and a contact pin having One or more bendable contact pin springs that can be displaced in the vertical direction are mounted on the base hole provided on the inner side of the base, are displaced in the vertical direction, and are in contact with the semiconductor package located above; a position stage, which is a semiconductor package mounting portion for accommodating the semiconductor package above the position table; the cover positioned above the socket and movable up and down; and connected to the above The cover, the cover is a latch assembly that moves up and down and rotates, and the contact pin spring shape before the position stage moves the upper part of the contact pin, for the process of inserting the contact pin into the base hole, there is no related to the process of installation. The contact pin spring shape after the position stage moves the upper part of the contact pin to the intended position is a shape that does not interfere with the interference of the contact pin adjacent to the contact pin, or the contact pin is inserted into the base hole at the desired location. On the other hand, when mounting, interference with the adjacent contact pins occurs to hinder mounting, and the position stage moves the contact pins in the lateral direction so that the contact pins can be brought into contact with each other. The upper part of the pin is moved to the position for the above-mentioned purpose.

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