CN106862093B - Plug-in for test handler - Google Patents
Plug-in for test handler Download PDFInfo
- Publication number
- CN106862093B CN106862093B CN201710049963.4A CN201710049963A CN106862093B CN 106862093 B CN106862093 B CN 106862093B CN 201710049963 A CN201710049963 A CN 201710049963A CN 106862093 B CN106862093 B CN 106862093B
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- China
- Prior art keywords
- semiconductor element
- guide groove
- terminal
- specific
- insertion hole
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a plug-in for a test handler. The invention discloses a technology for improving product reliability by forming a guide part with a radius equal to the size of a terminal of a semiconductor element on an open hole formed on a supporting component of a plug-in or a guide groove formed on a retaining projection so as to accurately set the position of the semiconductor element.
Description
The application is a divisional application of an invention patent application 'plug-in for test sorting machine' with application number of 201310426373.0, application date of 2013, 09 and 18.
Technical Field
The present invention relates to a card for a test tray used for loading semiconductor elements in a test handler.
Background
A TEST handler is an apparatus that moves semiconductor devices manufactured through a predetermined manufacturing process from a CUSTOMER TRAY (CUSTOMER TRAY) to a TEST TRAY (TEST TRAY), provides support for enabling the semiconductor devices loaded on the TEST TRAY to be tested (TEST) by a TESTER at the same time, and classifies the semiconductor devices according to TEST results and moves the semiconductor devices from the TEST TRAY to the CUSTOMER TRAY, and is disclosed in various publications.
The test tray is provided with a card for mounting semiconductor elements, for which reference is made to korean patent application No. 10-2012-0089602 (title of the invention: card for test handler, hereinafter referred to as prior art 1), korean patent application No. 10-2012-0107985 (title of the invention: card for test handler, hereinafter referred to as prior art 2), and the like.
Referring first to prior art 1, the open holes formed in the support member are sized to allow the terminals of the semiconductor element to be inserted sufficiently. Therefore, the size of the open hole is determined as the maximum size that adds the maximum tolerance possessed by the terminals of the semiconductor element, the tolerance between the terminals of the semiconductor element, and the tolerance between the sockets that are in contact with the terminals of the semiconductor element. For example, if it is assumed that the terminal of the semiconductor element has a diameter of 0.23mm ± 0.05mm (tolerance portion), the maximum diameter size thereof is 0.28 mm. That is, assuming again that the tolerance between the terminals of the semiconductor element and the tolerance between the sockets in contact with the terminals of the semiconductor element are ± 0.04mm, the open hole is to have a diameter of 0.32 mm. That is, when all tolerances are taken into consideration, only the open hole has a diameter of 0.32mm in size, so that the terminal of the semiconductor element can be freely put out of and put into the open hole. Under the optimum condition that all tolerances are 0.00mm, the terminal of the semiconductor element is preferably located at the very center of the open hole as shown in fig. 1. Note that fig. 1 is a view of the semiconductor element as viewed from the lower surface of the package, in which the semiconductor element is indicated by a one-dot chain line, and is illustrated in the same manner in fig. 7 to be described later for the purpose of facilitating the distinction from the open hole.
Further, in prior art 2, as shown in fig. 2, the terminals of the semiconductor element can be properly guided by the guide grooves only under the condition that the radius of the guide grooves reaches 0.32 mm/2.
Generally, the most important technical link in the testing of semiconductor devices is the electrical contact between the semiconductor device and the socket of the tester. Therefore, the position of the semiconductor element terminal is required to correspond precisely to the position of the tester socket, and the necessity is more and more urgent as the size of the semiconductor element terminal becomes smaller due to the development of the technology.
In addition, among the test handlers, there are a vertical type test handler (also referred to as a side-docking type test handler) which performs a test of a semiconductor element under a condition that the test tray is in a vertically upright state, and a horizontal type test handler (also referred to as a head-docking type test handler) which performs a test of a semiconductor element under a condition that the test tray is in a horizontally upright state. As shown in fig. 3, particularly in the vertical type test handler, since the card and the semiconductor element seated on the card are tested in a standing state because the test tray stands in the vertical direction, the semiconductor element will be at the lowermost position in the open hole of the card by its own weight as shown in fig. 4, and may be deviated to one side because there is also a surplus space in the left and right direction. The card is designed in the vertical test handler to set the position of the semiconductor element terminals to be contacted on the socket of the tester with reference to the lower end of the semiconductor element.
Disclosure of Invention
The present invention provides a technique for providing an open hole or a guide groove of a package with a function of guiding a terminal of a semiconductor element to an optimum position.
In order to achieve the above object, a test handler insert according to a first aspect of the present invention includes: a body formed with an insertion hole for inserting a semiconductor element; a supporting member supporting the semiconductor element inserted into the insertion hole from one side of the insertion hole; a fixing member that fixes the support member to the main body; a latch device for holding the semiconductor element in the socket, wherein the support member is formed with an open hole for opening the terminal of the semiconductor element toward the tester so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side, and at least one specific open hole among the open holes includes: an amplification part having a radius of curvature larger than a radius of a terminal of the semiconductor element; and a guide portion having a radius of curvature different from the radius of curvature of the amplification portion, for guiding a terminal of the semiconductor element.
Preferably, the guide part has a radius of curvature smaller than that of the amplification part.
Preferably, the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state.
Preferably, the radius of curvature of the guide portion is equal to the radius of the semiconductor element terminal.
Preferably, the specific open hole further includes a connecting portion connecting the amplification portion and the guide portion, and the connecting portion has a shape in which a width is narrower toward a lower side when the test tray is in a vertical state.
In order to achieve the above object, a test handler plug according to a second aspect of the present invention includes: a body formed with an insertion hole for inserting a semiconductor element; a latch device for holding the semiconductor element in the jack, wherein the main body has guide grooves formed on anti-drop projections projecting toward opposite sides in a horizontal direction to prevent the semiconductor element inserted into the jack from being dropped downward on a quadrangular open face constituting a lower surface of the jack, and at least one specific guide groove of the guide grooves includes: a guide portion for guiding a terminal of the semiconductor element; and an amplification part which is amplified to have a width larger than the maximum width of the guide part.
Preferably, the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state.
Preferably, the radius of curvature of the guide portion is equal to the radius of curvature of the terminal of the semiconductor element.
In order to achieve the above object, a test handler according to a third aspect of the present invention includes: a body formed with an insertion hole for inserting a semiconductor element; a supporting member supporting the semiconductor element inserted into the insertion hole from one side of the insertion hole; a fixing member that fixes the support member to the main body; and a latch device for holding the semiconductor element in the socket, wherein the support member is formed with open holes for opening terminals of the semiconductor element toward the tester so that the terminals of the semiconductor element supported by the support member are electrically connected to the tester side, and a lower end of at least one specific open hole among the open holes is at a position higher than lower ends of other normal open holes arranged side by side in the horizontal direction in a vertical state.
In order to achieve the above object, a test handler plug according to a fourth aspect of the present invention includes: a body formed with an insertion hole for inserting a semiconductor element; a latch device for holding the semiconductor element in the jack, wherein the main body has guide grooves formed on anti-drop projections which project toward opposite sides in the horizontal direction to prevent the semiconductor element inserted into the jack from dropping downward on a quadrangular open face constituting a lower surface of the jack, and a lower end of at least one specific guide groove among the guide grooves is at a position higher than lower ends of other general guide grooves arranged side by side in the horizontal direction in a vertical state.
According to the present invention, since the position of the terminal of the semiconductor element can be set by specifying the opening hole or the guide groove, the terminal of the semiconductor element can be positioned at a point close to an ideal position to the maximum extent, and the product reliability can be improved.
Drawings
Figure 1 shows the shape of an open aperture in an insert according to prior art 1.
Fig. 2 shows the shape of the guide groove on the insert according to prior art 2.
Fig. 3 and 4 are reference diagrams for explaining the background art.
Fig. 5 is a schematic plan view of a test handler according to an embodiment of the present invention.
Fig. 6a is a diagrammatic plan view of an insert according to a first embodiment of the invention.
Fig. 6b is a perspective view illustrated for convenience of viewing the insert of fig. 6a from the bottom surface.
Fig. 7 and 8 are reference views for explaining the function of a specific open hole in the insert according to fig. 6.
Fig. 9 is a diagrammatic plan view of an insert according to a second embodiment of the invention.
Fig. 10 is a reference view for explaining an insert according to another embodiment of the present invention.
Description of the symbols:
IS1, IS 2: inserts 61, 91: main body
61a, 91 a: the insertion hole 91 b: anti-drop protrusion
S: guide groove S0: common guide groove
S1: specific guide groove G: guide part
E: amplification unit 62: support member
H: open hole H0: general open pore
H1: specific open pore E: amplification part
G: a guide part J: connecting part
63: fixing members 64, 94: latch device
Detailed Description
Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, and descriptions of known technologies and overlapping contents will be omitted or reduced as much as possible for the sake of simplicity of the description.
<Test sorting machine>
Fig. 5 is a schematic plan configuration view of a test handler 500 according to an embodiment of the present invention.
As shown in fig. 5, the test handler 500 includes a test tray 510, a loading device 520, a first rotor 530, a test chamber 540, a second rotor 550, and an unloading device 560.
The test tray 510 has a plurality of inserts on which semiconductor devices can be mounted. Wherein the insert will be described later with a separate spread.
The Loading device 520 loads (loads) the semiconductor elements on the test tray 510 located at a Loading Position (LP).
The first rotor 530 rotates the test tray 510, on which the loading of the semiconductor elements is completed, into a vertical state.
The Test chamber 540 is used to Test semiconductor elements loaded on the Test tray 510 in a vertical state at a Test Position (TP). For this reason, the inside of the test chamber 540 maintains an environmental state adapted to the test temperature conditions of the semiconductor device.
The second rotor 550 rotates the test tray 510 in a vertical state from the test chamber 540 to a horizontal state.
The Unloading unit 560 unloads (Unloading) the semiconductor elements from the test tray 510 that has reached an Unloading Position (UP) in a horizontal state.
Next, an example of the card mounted on the test tray 510 in the test handler 500 will be described.
<First example relating to insert>
Referring to the plan view of fig. 6a and the bottom perspective view of fig. 6b, the insert IS1 according to the first example includes a main body, a support member 62, a fixing member 63, and a latch 64.
The body 61 is formed with an insertion hole 61a into which a semiconductor element can be inserted.
The support member 62 supports the semiconductor element inserted into the insertion hole 61a at the lower side of the insertion hole 61 a. The support member 62 has a plurality of open holes H for opening the terminals of the semiconductor device to the socket side of the tester, and is formed at a position corresponding to the positions of the terminals of the semiconductor device.
In addition, a specific open hole H among the plurality of open holes H1Without the remaining ordinary open holes (circular open holes having the same radius of curvature at all positions of the open hole boundary) H0The semiconductor device is formed in a circular shape having a uniform radius, and is formed in a shape that facilitates the position of the terminal of the semiconductor device to be guided by the open hole when the semiconductor device is mounted on the test tray 510 or the semiconductor device is erected in a vertical state. Thereby specifying the open hole H1Comprises an amplification part E, a guide part G, and a junction part J.
Hereinafter, each part will be described by taking as an example a case where the test tray 510 stands upright and the package IS1 and the semiconductor element stand upright.
The enlarged portion E, which is an upper semicircular region reflecting all the tolerances mentioned in the background art, has a radius of curvature larger than that of the semiconductor element terminal (e.g., 0.32 mm/2).
The guide part G is used as a specific open hole H1Lower side region ofAnd a domain satisfying a condition that all the tolerances are 0.00mm, which has a radius of curvature equal to a radius of a terminal of the semiconductor element (e.g., 0.23 mm/2).
The junction J is a region connecting the amplification part E and the guide part G. The connecting portion J has a shape that is inclined to be narrower toward the lower side so as to guide the semiconductor element terminal in a vertical state to the guide portion G.
The fixing member 63 fixes the support member 62 to the main body 61 side.
The latch 64 holds the semiconductor element in the insertion hole 61 a.
In the package IS1 configured as described above, if the test tray 510 stands upright and the package IS1 and the semiconductor element stand upright, the position of the terminal T of the semiconductor element IS specified by the opening hole H as shown in fig. 71The guide portion G is set, so that even if an impact occurs during shaking or movement of the test tray 510, the position of the semiconductor element can be accurately set at the time of testing. Namely, the specific open holes H are provided1So that the open hole H is specified when the test tray 510 stands in a vertical state1Is located lower than the common open holes H arranged side by side in the horizontal direction0Is higher than the predetermined height d, i.e., the terminal T of the semiconductor element is set to a position excluding the specific open hole H1Other than ordinary open holes H0The lower end of the terminal T of the semiconductor element is not connected with the common open hole H0While the center C of the terminal T of the semiconductor element is in contact with the ordinary open hole H0The centers C' of which coincide. Therefore, from this point of view, the guide portion G can function as a position setting portion for determining the terminal position of the semiconductor element, whereby precise contact between the terminal T of the semiconductor element and the socket of the tester can be ensured.
Of course, the specific open hole H1There may be a plurality of them, however, if all the open holes H are formed as the specific open holes H1Since the terminals of the semiconductor element may be sandwiched by the guide portions G, it is preferable that only a part of the open holes H be formed as the specific open holes H1。
And, although the hole H is specified to be opened1Any position IS possible, however, since the lower end of the insertion hole 61a (or the lower end of the semiconductor element) becomes a reference line when the plug IS1 and the semiconductor element stand in the vertical state, it IS preferable to form the position where the terminal at the lowermost side among the terminals of the semiconductor element can be inserted.
If a case where the terminal of the semiconductor element is larger than an ideal set size (diameter of 0.23 mm) is encountered (for example, the diameter of the terminal is 0.27mm), the terminal of the semiconductor element may be opened at a specific hole H1Although slightly shifted upward, as can be seen from FIG. 8, in this case, the terminal T of the semiconductor element can be accommodated in the specific opening hole H by the enlarged portion E having a diameter in consideration of all tolerances1In (1).
<Second example of an insert>
Referring to the plan view of fig. 9, the card IS2 according to the second embodiment includes a main body 91 and a latch 94.
The body 91 is formed with an insertion hole 91a into which a semiconductor element is inserted. The body 91 has retaining projections 91b projecting horizontally toward opposite sides on a rectangular open surface constituting the lower surface of the insertion hole 91a, so as to prevent the semiconductor element inserted into the insertion hole 91a from coming off downward. The retaining projection 91b is formed with a plurality of guide grooves S for guiding the terminals of the semiconductor element.
Specific ones of the guide grooves S1And the other common guide grooves S0Different from the above, the kit has a guide part G and an amplification part E.
The guide portion G has the same radius of curvature (e.g., a radius of about 0.23mm/2) as that of a terminal of a desired size, and serves to guide the terminal of the semiconductor element at the time of loading work or when the test tray 510 stands upright.
The enlarged portion E is designed to be enlarged to have a width larger than the maximum width W of the guide portion G, so that even in the case where the terminal of the semiconductor element is formed to be larger than the ideal size, it is possible to provide a specific guide groove S corresponding thereto1In which the terminals of the semiconductor element are accommodated. The enlarged portion E has an inclination such that the width thereof becomes narrower toward the lower side so as to connect the terminals of the semiconductor element in a vertical stateIs guided to the guide portion G.
In the present embodiment, too, it is preferable to specify the guide groove S1Formed at a position where the terminal at the lowest side can be inserted when the semiconductor element is in a vertical state, and a specific guide groove S is formed to appropriately set the position of the terminal of the semiconductor element in the vertical direction1With the lower ends of the common guide grooves S arranged side by side in a more horizontal direction0Is higher than the predetermined height d.
The latch 94 is used to hold the semiconductor element in the insertion hole 91 a.
The inserts IS1 and IS2 described with reference to fig. 6a and 9 consider the case where the radius of curvature of the guide portion G (or the position setting portion) IS relatively small, but when the vertical height of the semiconductor element terminal IS mainly considered, the specific open hole H may be specified as shown in fig. 10 (a) and (b) depending on the specific implementation2Or a specific guide groove S2Is set to be larger than the general open hole H0Or a common guide groove S0While making the specific open hole H2Or a specific guide groove S2Are arranged side by side in a horizontal direction (horizontal direction in a state of standing vertically on the test tray) than the lower ends of the common open holes H0Or a common guide groove S0Is higher than the predetermined height d.
Of course, the embodiment of fig. 6a and 9 may be more preferable than the embodiment of fig. 10 because the position of the terminals of the semiconductor element can be accurately set not only in the up-down direction but also in the left-right direction according to the inserts IS1, IS2 of fig. 6a and 9.
The above has been explained by taking the vertical type test handler as an example, however, if a technique of pressing the semiconductor elements mounted on the card toward one side to sort the semiconductor elements is adopted according to korean laid-open patent No. 10-2008-0062984 (title of the invention: insertion assembly of the test tray for the test handler and the test handler), etc., or another semiconductor element sorting technique is adopted, the present invention can be fully applied to the horizontal type test handler. And in this case, the position of the guide portion may be changed according to the direction in which the semiconductor element is pressed.
As described above, the present invention has been specifically described by way of the embodiments with reference to the accompanying drawings, however, since the above embodiments are only preferred embodiments of the present invention, the present invention should not be construed as being limited to the above embodiments, and the scope of the right of the present invention is to be understood by the claims and their equivalents.
Claims (4)
1. A package for a test handler, comprising:
a body formed with an insertion hole for inserting a semiconductor element;
a supporting member supporting the semiconductor element inserted into the insertion hole from one side of the insertion hole;
a fixing member that fixes the support member to the main body;
a latch device for holding the semiconductor element in the receptacle,
wherein the support member is formed with an open hole for opening the terminal of the semiconductor device toward the tester so that the terminal of the semiconductor device supported by the support member is electrically connected to the tester side,
at least one specific one of the open holes is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state to guide and set the position of the terminal of the semiconductor element, whereby the position of the semiconductor element can be accurately set,
the radius of curvature of at least a part of the section of the specific open hole is set to be larger than the radius of curvature of the general open holes except the specific open hole, and the lower ends of the specific open holes are positioned higher than the lower ends of the general open holes arranged side by side in the horizontal direction by a predetermined height, so that when the semiconductor element stands in the vertical state, the positions of the terminals of the semiconductor element are set such that the lower ends of the terminals of the semiconductor element do not contact the lower ends of the general open holes at the general open holes except the specific open hole, but the centers of the terminals of the semiconductor element coincide with the centers of the general open holes.
2. A package for a test handler, comprising:
a body formed with an insertion hole for inserting a semiconductor element;
a latch device for holding the semiconductor element in the receptacle,
wherein the body has guide grooves formed on retaining projections projecting toward opposite sides in the horizontal direction to prevent the semiconductor element inserted into the insertion hole from being detached downward on a quadrangular open surface constituting a lower surface of the insertion hole,
at least one specific guide groove among the guide grooves is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state to guide and set the position of the terminal of the semiconductor element, whereby the position of the semiconductor element can be accurately set,
the specific guide groove is formed so that a curvature radius of at least a partial section thereof is set larger than a curvature radius of the normal guide groove except the specific guide groove, while a lower end of the specific guide groove is located at a position higher than a lower end of the normal guide groove arranged side by side in a horizontal direction by a predetermined height, so that the lower end of the terminal of the semiconductor element is not in contact with the lower end of the normal guide groove at the normal guide groove except the specific guide groove when the semiconductor element stands in a vertical state.
3. A package for a test handler, comprising:
a body formed with an insertion hole for inserting a semiconductor element;
a supporting member supporting the semiconductor element inserted into the insertion hole from one side of the insertion hole;
a fixing member that fixes the support member to the main body;
a latch device for holding the semiconductor element in the receptacle,
wherein the support member is formed with an open hole for opening the terminal of the semiconductor device toward the tester so that the terminal of the semiconductor device supported by the support member is electrically connected to the tester side,
at least one specific one of the open holes is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state to guide and set the position of the terminal of the semiconductor element, whereby the position of the semiconductor element can be accurately set,
the radius of curvature of at least a part of the section of the specific open hole is set to be smaller than the radius of curvature of the general open holes except the specific open hole, and the lower ends of the specific open holes are positioned higher than the lower ends of the general open holes arranged side by side in the horizontal direction by a predetermined height, so that when the semiconductor element stands in the vertical state, the positions of the terminals of the semiconductor element are set such that the lower ends of the terminals of the semiconductor element do not contact the lower ends of the general open holes at the general open holes except the specific open hole, but the centers of the terminals of the semiconductor element coincide with the centers of the general open holes.
4. A package for a test handler, comprising:
a body formed with an insertion hole for inserting a semiconductor element;
a latch device for holding the semiconductor element in the receptacle,
wherein the body has guide grooves formed on retaining projections projecting toward opposite sides in the horizontal direction to prevent the semiconductor element inserted into the insertion hole from being detached downward on a quadrangular open surface constituting a lower surface of the insertion hole,
at least one specific guide groove among the guide grooves is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element stands in a vertical state to guide and set the position of the terminal of the semiconductor element, whereby the position of the semiconductor element can be accurately set,
the specific guide groove is provided with a curvature radius of at least a partial section thereof smaller than that of the normal guide groove other than the specific guide groove, while the lower end of the specific guide groove is positioned higher than the lower end of the normal guide groove arranged side by side in the horizontal direction by a predetermined height, so that the lower end of the terminal of the semiconductor element is not in contact with the lower end of the normal guide groove at the normal guide groove other than the specific guide groove when the semiconductor element stands in the vertical state.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0119984 | 2012-10-26 | ||
| KR1020120119984A KR101955194B1 (en) | 2012-10-26 | 2012-10-26 | Insert for test handler |
| CN201310426373.0A CN103785619B (en) | 2012-10-26 | 2013-09-18 | Testing, sorting machine plug-in unit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310426373.0A Division CN103785619B (en) | 2012-10-26 | 2013-09-18 | Testing, sorting machine plug-in unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106862093A CN106862093A (en) | 2017-06-20 |
| CN106862093B true CN106862093B (en) | 2020-01-03 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710049963.4A Active CN106862093B (en) | 2012-10-26 | 2013-09-18 | Plug-in for test handler |
| CN201310426373.0A Active CN103785619B (en) | 2012-10-26 | 2013-09-18 | Testing, sorting machine plug-in unit |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310426373.0A Active CN103785619B (en) | 2012-10-26 | 2013-09-18 | Testing, sorting machine plug-in unit |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101955194B1 (en) |
| CN (2) | CN106862093B (en) |
| TW (1) | TWI503557B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101535245B1 (en) * | 2013-09-27 | 2015-07-09 | 세메스 주식회사 | Insert assembly of test tray |
| KR102252638B1 (en) * | 2015-05-04 | 2021-05-17 | (주)테크윙 | Insert for test handler |
| KR102229229B1 (en) * | 2015-06-17 | 2021-03-18 | (주)테크윙 | Insert for test handler |
| KR102470315B1 (en) * | 2016-01-29 | 2022-11-25 | (주)테크윙 | Insert for test handler |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338849A (en) * | 2010-07-15 | 2012-02-01 | 泰克元有限公司 | Insert for test handler |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08146086A (en) * | 1994-11-24 | 1996-06-07 | Advantest Corp | Tray insert of test tray of handler for ic tester |
| JP2005134373A (en) * | 2003-10-09 | 2005-05-26 | Alps Electric Co Ltd | Connection device using spiral contactor |
| US20070103179A1 (en) * | 2005-11-10 | 2007-05-10 | Silicon Integrated Systems Corp. | Socket base adaptable to a load board for testing ic |
| JP2007227341A (en) * | 2006-01-30 | 2007-09-06 | Alps Electric Co Ltd | Guide member, connecting board with guide member, and method for manufacturing guide member |
| KR200427177Y1 (en) | 2006-07-06 | 2006-09-20 | 주식회사 오킨스전자 | Semiconductor Chip Carrier |
| KR200444066Y1 (en) * | 2007-04-19 | 2009-04-10 | (주)테크윙 | Insert for test handler |
| KR100892606B1 (en) * | 2007-08-23 | 2009-04-08 | 파워테크 테크놀로지 인코포레이티드 | Universal insert tool for fixing a bga package under test |
| KR100898411B1 (en) * | 2007-09-12 | 2009-05-21 | 주식회사 오킨스전자 | Carrier for semiconductor chip |
| KR101495201B1 (en) * | 2008-12-19 | 2015-02-24 | 삼성전자주식회사 | Insert module for test handler and method of manufacturing the same |
| KR101016327B1 (en) * | 2009-05-18 | 2011-02-22 | 주식회사 티에프이스트포스트 | Insert carrier of Semiconductor Package |
| JP2011003423A (en) * | 2009-06-19 | 2011-01-06 | Alps Electric Co Ltd | Connection device |
| KR101532952B1 (en) * | 2010-06-23 | 2015-07-01 | (주)테크윙 | Method for unloading semiconductor device in testhandler |
| WO2011162430A1 (en) * | 2010-06-24 | 2011-12-29 | Lee Jae Hak | Insert for handler |
-
2012
- 2012-10-26 KR KR1020120119984A patent/KR101955194B1/en active Application Filing
-
2013
- 2013-09-18 CN CN201710049963.4A patent/CN106862093B/en active Active
- 2013-09-18 CN CN201310426373.0A patent/CN103785619B/en active Active
- 2013-09-23 TW TW102134135A patent/TWI503557B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102338849A (en) * | 2010-07-15 | 2012-02-01 | 泰克元有限公司 | Insert for test handler |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101955194B1 (en) | 2019-03-08 |
| CN103785619B (en) | 2017-03-01 |
| TW201418734A (en) | 2014-05-16 |
| CN106862093A (en) | 2017-06-20 |
| TWI503557B (en) | 2015-10-11 |
| CN103785619A (en) | 2014-05-14 |
| KR20140057700A (en) | 2014-05-14 |
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