KR20190024925A - Insert for test handler - Google Patents

Abstract

The present invention relates to an insert for a test handler, and to a test handler. According to the present invention, disclosed is a technique which improves reliability of a product by forming a guide portion having the same radius as the terminal size of a semiconductor element in an opening hole formed in a support member of the insert or a guide groove formed in a separation preventing protrusion and finely setting the position of the semiconductor element.

Description

INSERT FOR TEST HANDLER}

The present invention relates to an insert of a test tray capable of loading semiconductor elements in a test handler.

The test handler moves semiconductor devices manufactured through a predetermined manufacturing process from a customer tray to a test tray and then tests the semiconductor devices loaded on the test tray by a tester at the same time TEST), and it is a device that moves test trays from the test tray to the customer tray by classifying the semiconductor devices according to the test result, and is already disclosed through a plurality of public documents.

In the test tray, Korean Patent Application No. 10-2012-0089602 (entitled "Tester Handler Insert", hereinafter referred to as "Prior Art 1") and Korean Patent Application No. 10-2012-0107985 An insert, which is referred to as " Prior Art 2 " hereinafter), is provided.

First, referring to Prior Art 1, the open hole formed in the support member must have such a size that the terminals of the semiconductor element can be sufficiently inserted. Therefore, the size of the open hole is determined by the maximum size obtained by adding the tolerance between the maximum tolerance of the terminals of the semiconductor element and the terminals of the semiconductor element and the tolerance between the sockets contacting the terminals of the semiconductor element. For example, if the size of the terminal of the semiconductor element is 0.23 mm ± 0.05 mm (tolerance portion), the maximum size is 0.28 mm in diameter. Assuming that the tolerance between the terminals of the semiconductor element and the sockets contacting the terminals of the semiconductor element is ± 0.04 mm, the size of the open hole has a diameter of 0.32 mm. That is, when all the tolerances are taken into consideration, the terminal of the semiconductor element can enter and exit the open hole without interference only when the size of the open hole is 0.32 mm in diameter. It is most preferable that the terminal of the semiconductor element is located at the center of the open hole, as shown in Fig. 1, under the optimum condition in which all of the confinement is 0.00 mm. For reference, FIG. 1 is a view when a semiconductor device is viewed from an insert bottom. Here, a dotted line indicates a semiconductor device for identification with an opening, and FIG.

Also in the prior art 2, as shown in Fig. 2, the radius of the guide groove should be 0.32 mm / 2 so that the terminals of the semiconductor element can be guided properly by the guide grooves.

Generally, the most important technical part in testing semiconductor devices is the electrical contact between the semiconductor device and the socket of the tester. Therefore, the position of the terminal of the semiconductor element needs to correspond to the position of the socket of the tester, and this necessity is more urgently required as the size of the terminal of the semiconductor element becomes smaller as the technology is developed.

On the other hand, the test handler includes a vertical type test handler (also called a side docking type test handler) that allows the semiconductor device to be tested with the test tray standing vertically, and a semiconductor device test (Sometimes referred to as an underhead docked test handler). In particular, in the vertical type test handler, as the test tray is vertically erected as shown in Fig. 3, the test is carried out with the semiconductor element seated on the insert and the insert standing up as the test tray stands upright. Is located at the lowest position on the open hole of the insert by means of the insert, and there is a clearance even in the lateral direction so that it can be offset toward one side. Therefore, in the vertical type test handler, the insert is designed so that the terminal position of the semiconductor element to be brought into contact with the socket of the tester is set with reference to the lower end of the semiconductor element.

The present invention provides a technique for imparting a function of guiding a terminal of a semiconductor element to be in the most ideal position to an opening of an insert or a guide groove.

To achieve the above object, according to a first aspect of the present invention, there is provided an insert for a test handler, comprising: a body having an insertion hole into which a semiconductor device can be inserted; A supporting member for supporting the semiconductor element inserted into the insertion hole at one side of the insertion hole; A fixing member for fixing the supporting member to the body; And a latch device for holding the semiconductor element in the insertion hole; Wherein openings for opening the terminals of the semiconductor device to the tester side are formed in the support member so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side, The at least one specific opening defines an enlarged portion having a radius of curvature greater than a radius of the terminal of the semiconductor element; And a guide portion for guiding a terminal of the semiconductor element by having a radius of curvature different from a radius of curvature of the extension portion; .

The radius of curvature of the guide portion is preferably smaller than the radius of curvature of the extended portion.

It is preferable that the at least one specific opening is formed at a position where the lower-most terminal can be inserted when the semiconductor element is vertically erected.

The radius of curvature of the guide portion is preferably equal to the radius of the terminal of the semiconductor element.

The specific opening may further include a joint portion connecting the extension portion and the guide portion, and the joint portion may have a width narrower toward the lower side in a state where the test tray is vertically erected.

According to another aspect of the present invention, there is provided an insert for a test handler, including: a body having an insertion hole into which a semiconductor device can be inserted; And a latch device for holding the semiconductor element in the insertion hole; Wherein the body has guide grooves formed in a separation protrusion protruding from the opposite side in the horizontal direction so as to prevent downward deviation of the semiconductor element inserted into the insertion space in a square opening face of the lower surface of the insertion hole, At least one specific guide groove of the guide grooves includes: a guide portion for guiding a terminal of the semiconductor element; And an enlarged portion that is wider than a maximum width of the guide portion; .

Preferably, the at least one specific guide groove is formed at a position where the lower-most terminal can be inserted when the semiconductor device is vertically erected.

The radius of the guide portion is preferably equal to the radius of the terminal of the semiconductor element.

According to a third aspect of the present invention, there is provided an insert for a test handler, comprising: a body having an insertion hole into which a semiconductor device can be inserted; A supporting member for supporting the semiconductor element inserted into the insertion hole at one side of the insertion hole; A fixing member for fixing the supporting member to the body; And a latch device for holding the semiconductor element in the insertion hole; Wherein openings for opening the terminals of the semiconductor device to the tester side are formed in the support member so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side, The lower ends of at least one specific opening are located higher than the lower ends of the other general openings arranged in the horizontal direction in the vertical state. According to a fourth aspect of the present invention, there is provided an insert for a test handler, comprising: a body having an insertion hole into which a semiconductor device can be inserted; And a latch device for holding the semiconductor element in the insertion hole; Wherein the body has guide grooves formed in a separation protrusion protruding from the opposite side in the horizontal direction so as to prevent downward deviation of the semiconductor element inserted into the insertion space in a square opening face of the lower surface of the insertion hole, The lower ends of at least one specific guide groove of the guide grooves are positioned higher than the lower ends of other general open holes arranged in a horizontal direction in a vertical state.

According to the present invention, since the terminal position of the semiconductor element can be set by the specific opening or the guide groove, the terminal of the semiconductor element can be positioned as close as possible to the ideal position, thereby improving the reliability of the product.

Fig. 1 shows the shape of the opening in the insert according to the prior art 1. Fig.
Fig. 2 shows the shape of the guide groove in the insert according to Prior Art 2. Fig.
Figures 3 and 4 are reference diagrams for reference to the description of the background art.
5 is a conceptual top view of a test handler according to an embodiment of the present invention.
6A is a schematic plan view of an insert according to a first example of the present invention.
6B is a perspective view showing the insert of Fig.
Figs. 7 and 8 are reference views for explaining the role of a specific opening in the insert according to Fig. 6. Fig.
9 is a schematic plan view of an insert according to a second example of the present invention.
10 is a reference diagram for describing an insert according to another example of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, in which description or redundant description is omitted or compressed for simplicity of description.

<Test handler>

5 is a schematic plan view of a test handler 500 according to an embodiment of the present invention.

5, the test handler 500 includes a test tray 510, a loading device 520, a first rotator 530, a test chamber 540, a second rotator 550, and an unloading device 560 ).

The test tray 510 has a plurality of inserts on which the semiconductor elements can be seated. Here, the inserts will be described separately in a separate table of contents.

The loading device 520 loads the semiconductor device into the test tray 510 located at the loading position LP.

The first rotator 530 rotates the test tray 510 in which the loading of the semiconductor device is completed to a vertical state.

The test chamber 540 is provided for the testing of the semiconductor devices loaded in the vertical test tray 510 in the test position TP. To this end, the interior of the test chamber 540 is maintained in an environmental condition according to the test temperature conditions of the semiconductor device.

The second rotator 550 horizontally rotates the test tray 510 in a vertical state from the test chamber 540.

The unloading apparatus 560 unloads the semiconductor element from the on test tray 510 in the unloading position UP in a horizontal state.

Next, an example of an insert included in the test tray 510 in the test handler 500 will be described.

<First Example of Insert>

Referring to the plan view of FIG. 6A and the bottom perspective view of FIG. 6B, the insert IS1 according to the first example includes a body 61, a support member 62, a fixing member 63 and a latch device 64.

The body 61 is formed with an insertion hole 61a into which a semiconductor device can be inserted.

The support member 62 supports the semiconductor element inserted into the insertion hole 61a from the lower side of the insertion hole 61a. In this support member 62, a plurality of open holes H for opening the terminals of the semiconductor element to the socket side of the tester are formed at positions corresponding to the positions of the terminals of the semiconductor element.

On the other hand, of the open holes H, the specific open hole H ₁ has a circular shape of the same radius as the remaining regular open hole H ₀ (open hole having a circular shape having the same radius of curvature at all points of the hole edge) The position of the terminal of the semiconductor element can be guided by the open hole when the semiconductor element is loaded into the test tray 510 or when the semiconductor element is vertically erected. Thus, the specific opening H ₁ has the extended portion E, the guiding portion G and the jointed portion J.

The explanation below will be made by setting up the test tray 510 in a vertical state so that the insert IS1 and the semiconductor element are vertically erected.

The extension portion E has a radius of curvature larger than the radius of the terminal of the semiconductor element (for example, 0.32 mm / 2) by reflecting all the tolerances mentioned in the background art as the upper half-circle region.

The guide portion G has a radius of curvature equal to the radius of the terminal of the semiconductor element (for example, 0.23 mm / 2) under the condition that all the tolerances are 0.00 mm as a region below the specific opening H ₁ .

The joint portion J is an area connecting the extended portion E and the guiding portion G. Here, the joint portion F has a shape such that the width becomes narrower toward the lower side so that the terminal of the semiconductor device in the vertical state can be guided to the guide portion G. [

The fixing member 63 fixes the supporting member 62 to the body 61 side.

The latch device 64 holds the semiconductor element in the insertion hole 61a.

When the insert IS1 and the semiconductor element are vertically erected so that the test tray 510 is vertically erected in the insert IS1 having the above-described configuration, the terminal T of the semiconductor element as shown in Fig. Since the position is set by the guide portion G of the opening H ₁ , the position of the semiconductor element can be precisely set during the test even if the test tray 510 is shaken or an impact occurs during the movement. That is, due to the structure of a particular opening hole (H ₁₎ above the test vector 510 is located at the bottom of a particular opening hole (H ₁₎ in the erected state in the vertical plain introducing hole (H a side-by-side position in a horizontal direction since ₀₎ higher by a predetermined height (d) than the position of the lower end of, the lower the normal opening hole (H _0, of a particular openings (terminal (T) of the semiconductor elements in the general opening hole (H _0), except for H ₁₎ The position of the terminal T of the semiconductor element is set such that the center C of the terminal T of the semiconductor element coincides with the center C 'of the general open hole H ₀ . Therefore, in this respect, the guiding portion G functions as a positioning portion for determining the position of the terminals of the semiconductor element, thereby making it possible to ensure the precise contact between the terminal T of the semiconductor element and the socket of the tester.

Of course, certain open hole (H ₁₎ is a plurality clear up, but if all the openings (H) a specific opening hole (H ₁₎ as if guide portion (G), so that the terminal of the semiconductor device can become jammed opening hole (H to form Are formed with a specific opening H ₁ .

Furthermore, the particular opening hole (H _1), but the relationship, even in any position, the insert (IS1) and the semiconductor element is lower (or bottom of the semiconductor element) of the insertion hole (61a) when erected to a vertical position since the baseline semiconductor It is preferable that the lowermost one of the terminals of the device is formed at a position where the terminal can be inserted.

If the terminal of the semiconductor element is larger than the ideal setting size (diameter of 0.23 mm) (for example, when the terminal diameter is 0.27 mm), the terminal of the semiconductor element is slightly upward in the specific opening H ₁ The terminal T of the semiconductor element can be accommodated in the specific opening H ₁ by the extended portion E having a diameter taking all the tolerances into consideration as shown in Fig.

&Lt; Second Example of Insert >

9, the insert IS2 according to the second example includes a body 91 and a latch device 94. As shown in Fig.

The body 91 is formed with an insertion hole 91a into which a semiconductor element can be inserted. The body 91 is provided with a separation preventing tongue 91b protruding horizontally to prevent the semiconductor device inserted into the insertion hole 91a from being downwardly displaced in a square opening face constituting the lower surface of the insertion hole 91a I have. And guide grooves S for guiding the terminals of the semiconductor element are formed in the separation preventing edge 91b.

The specific guide groove S _{1 of the} guide grooves S has a guide portion G and an extended portion E unlike the other general guide grooves S ₀ .

The guide portion G has the same radius of curvature as the terminal of the ideal size (e.g., a radius of about 0.23 mm / 2) and is used to hold the terminal of the semiconductor element in the loading operation or when the test tray 310 is vertically erected Guide.

Extended portions (E) is a terminal of the semiconductor element to the guide portion (G) a maximum width (W) by being extended to a wider width than that in the case where the semiconductor device terminals largely formed than the ideal size of a particular guide grooves (S ₁₎ of It is designed to be acceptable. Here, the extended portion E has such a shape that the width becomes narrower toward the lower side so that the terminal of the semiconductor element in the vertical state can be guided to the guide portion G. [

Also in this example, it is preferable that the specific guide groove S ₁ is formed at a position where the lower-most terminal can be inserted when the semiconductor element is vertically erected, and the position of the terminal of the semiconductor element in the up- The lower end of the specific guide groove S ₁ is positioned higher than the lower end of the general guide groove S ₀ in the horizontal direction by a predetermined height d.

The latch device 74 holds the semiconductor element in the insertion hole 71a.

Although the inserts IS1 and IS2 described with reference to Figs. 6A and 9 are considered to have a relatively small radius of curvature of the guide portion G or the positioning portion, considering the vertical height of the terminals of the semiconductor element The radius of curvature of the specific opening H ₂ or the specific guide groove S ₂ is set to the general opening H ₀ or the general guide H ₂ as shown in FIGS. 10 (a) and 10 (b) In which the specific opening H ₂ and the lower end of the specific guide groove S ₂ are located in the horizontal direction (the horizontal direction in a state where the specific guide groove S ₂ is erected perpendicularly to the test tray) while being larger than the radius of curvature of the groove S ₀ May be positioned higher than the lower ends of the open hole (H ₀ ) or the general guide groove (S ₀ ) by a predetermined distance (d).

Of course, since the positions of the terminals of the semiconductor element can be precisely set not only in the vertical direction but also in the lateral direction according to the inserts IS1 and IS2 of FIGS. 6A and 9, May be desirable.

Although the embodiment described above is described by taking a vertical test handler as an example, it is possible to use a vertical test handler which is seated on an insert as in Korean Patent Laid-Open No. 10-2008-0062984 (entitled &quot; insert module and test handler of test tray for test handler & The present invention can be applied to a horizontal test handler as long as technology for aligning semiconductor devices by pressing the semiconductor element to one side or other semiconductor element alignment technique is applied. In this case, the position of the guide portion may be changed depending on the direction in which the semiconductor element is pressed.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

IS1, IS2: Insert
61, 91: Body
61a, 91a: insertion hole
91b:
S: guide home
S ₀ : General guide home
S ₁ : Specific guide home
G: Guide section
E: Extended portion
62: Support member
H: opening hole
H ₀ : Normal open hole
H ₁ : Specific opening hole
E: Extended portion
G: Guide section
J: joint part
63: Fixing member
64, 94: latch device

Claims (2)

A body having an insertion hole into which a semiconductor device can be inserted;
A supporting member for supporting the semiconductor element inserted into the insertion hole at one side of the insertion hole;
A fixing member for fixing the supporting member to the body; And
A latch device for holding the semiconductor element in the insertion hole; Lt; / RTI &gt;
Wherein the support member is formed with open holes for opening the terminal of the semiconductor element to the tester side so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side,
At least one specific opening of the openings is formed at a position where the lowest -ermost terminal can be inserted when the semiconductor element is vertically erected so as to guide and set the position of the terminal of the semiconductor element, Lt; RTI ID = 0.0 &gt; settled &lt; / RTI &
When the semiconductor element is vertically erected, the lower end of the terminal of the semiconductor element does not come into contact with the lower end of the general open hole in the general open holes except for the specific open hole, And the position of the terminal of the semiconductor element is set so as to match
Insert for test handler. A body having an insertion hole into which a semiconductor device can be inserted; And
A latch device for holding the semiconductor element in the insertion hole; Lt; / RTI &gt;
Wherein the body has guide grooves formed in a separation protrusion protruding in the horizontal direction to prevent downward departure of the semiconductor element inserted into the insertion space in a rectangular opening face constituting the lower surface of the insertion hole,
At least one specific guide groove of the guide grooves is formed at a position where the terminal at the lowest position can be inserted when the semiconductor element is vertically erected so as to guide and set the position of the terminal of the semiconductor element, Lt; RTI ID = 0.0 &gt; settled &lt; / RTI &
The lower end of the terminal of the semiconductor element does not contact the lower end of the general guide groove in the general guide grooves except for the specific guide groove when the semiconductor element is vertically erected.
Insert for test handler.

Images