KR20140070863A - Insert for test handler - Google Patents

Insert for test handler Download PDF

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Publication number
KR20140070863A
KR20140070863A KR1020120136238A KR20120136238A KR20140070863A KR 20140070863 A KR20140070863 A KR 20140070863A KR 1020120136238 A KR1020120136238 A KR 1020120136238A KR 20120136238 A KR20120136238 A KR 20120136238A KR 20140070863 A KR20140070863 A KR 20140070863A
Authority
KR
South Korea
Prior art keywords
fixing
semiconductor element
insert
support member
supporting
Prior art date
Application number
KR1020120136238A
Other languages
Korean (ko)
Inventor
나윤성
유현준
Original Assignee
(주)테크윙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)테크윙 filed Critical (주)테크윙
Priority to KR1020120136238A priority Critical patent/KR20140070863A/en
Publication of KR20140070863A publication Critical patent/KR20140070863A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to an insert for a test handler. According to the present invention, disclosed is a technique capable of fundamentally preventing problems caused by securing a thickness required to fix a support member on a contact surface by placing a fixed point of the support member in a thin film shape for preventing the separation of a semiconductor element inserted into an insertion hole downwards on the side of a body so as to completely omit the thickness required to fix the support member on the contact surface with which a terminal and a tester of the semiconductor element are electrically contacted.

Description

INSERT FOR TEST HANDLER}

The present invention relates to an insert of a test tray capable of loading semiconductor elements in a test handler.

The test handler moves semiconductor devices manufactured through a predetermined manufacturing process from a customer tray to a test tray and then tests the semiconductor devices loaded on the test tray by a tester at the same time TEST), and it is a device that moves test trays from the test tray to the customer tray by classifying the semiconductor devices according to the test result, and is already disclosed through a plurality of public documents.

The test tray is provided with an insert (INSERT) which is formed with a seating space (also referred to as an insertion hole, an insertion groove, a seating groove, or the like) that can be seated in a form in which semiconductor elements are inserted, as disclosed in Korean Patent No. 10-0801927 Respectively. And the semiconductor element seated in the seating space of the insert is supported by a support portion injection molded integrally with the body of the insert.

On the other hand, the size of the semiconductor device is reduced due to the development of integration technology, and the number of terminals is increased. As a result, the gap between the terminals of the ball type and the size of the terminals are reduced, and the electrical connection between the terminals of the semiconductor device and the tester is required to be more precise and stable.

Accordingly, Korean Patent Laid-Open Publication No. 10-1999-0082895 (entitled: Integrated Circuit Test Apparatus, hereinafter referred to as "Prior Art 1") and 10-2010-0081131 (entitled "Handler Insert" 2 ") and the like have been proposed.

In the prior art 1, the IC receiving portion (corresponding to the support member of the prior art 1) for supporting the semiconductor element is formed of an injection material of a thick plastic material as in the prior art. A guide hole (corresponding to the connection hole of the related art 1) into which the terminals of the semiconductor element can be inserted is formed in the IC accommodating portion. According to the prior art 1, since the thickness of the IC accommodating portion is thicker than the height of the terminals of the semiconductor element, the lower terminal of the semiconductor element can not be further protruded toward the tester side through the guide hole. Therefore, a contact pin in the form of a pogo pin can be inserted into the guide hole on the tester side.

However, according to the prior art 1, there is a risk that the contact pin or terminals of the semiconductor element may be damaged due to erroneous contact between the contact pin made of a metal and the terminal of the semiconductor element.

In recent years, as shown in Korean Patent Laid-open No. 10-2002-0079350 (entitled Integrated silicon contactor and its manufacturing apparatus and manufacturing method: hereinafter referred to as 'Prior art 3'), A technique of utilizing a silicon contactor having an insulating silicon portion as an electrical contact body between a terminal of a semiconductor element and a tester has been considered. That is, the silicon contactor is formed on the tester side and the conductive silicon portion of the silicon contactor is brought into electrical contact with the terminals of the semiconductor element. At this time, the conductive silicon portion can be electrically connected only when it is sufficiently pressed by about 0.10 to 0.11 mm by the terminal of the semiconductor element. In this prior art 3, since the degree of protrusion of the conductive silicon part of the silicon contactor is very short, it is difficult to utilize it in the prior art 1.

Therefore, as in the conventional art 2, a technique of forming a support member (referred to as reference numeral 120, corresponding to the IC accommodating portion of the prior art 1) for supporting a semiconductor element into a thin film made separately from the insert body It was proposed. Of course, the support member is formed with connection holes (corresponding to the guide holes of the prior art 1, which may be referred to as open holes) for setting the precise position of the semiconductor element while opening the terminals of the semiconductor element to the tester side. In this prior art 2, the lower terminal of the semiconductor element is further projected to the tester side through the connection hole. Accordingly, the bottom of the terminal of the semiconductor element can be pressed by pressing the conductive silicon portion of the silicon contactor (referred to as 'elastic sheet' in Prior Art 2) (referred to as 'contactor' in Prior Art 2) The terminal and the tester side can be electrically connected to each other.

However, since the elastic sheet of the prior art 2 has a thin thickness, a frame for fixing the elastic sheet at the time of electrical connection between the semiconductor element and the tester may come into contact with the insert, resulting in damage to the insert.

In addition, according to the prior art 2, a bolt having a thread is used to fix the support member to the insert body. To fix the support member to the insert body with the bolt, a tool (a driver or a lent) The head of the bolt must have a minimum thickness. And the contact with the frame for fixing the elastic sheet by the amount of protrusion of the head of the bolt or design constraints.

Accordingly, the applicant of the present invention has found that the pressing part of the fixing member (according to the prior art 2, the head of the bolt, the head of the bolt, And the thickness of a portion of the substrate is minimized.

However, in the past, it is a matter of course that the further development of the integration technology to be advanced in the future leads to an increase in the number of terminals of the semiconductor element, a finer interval between the terminals of the semiconductor element, and a reduction in the height of the terminals of the semiconductor element. In this case, the distance between the conductive silicon portions of the silicon contactor must also be narrowed, and the height thereof must also be lowered to prevent a short due to contact interference between neighboring conductive silicon portions. This makes it possible to foresee that the pressing portion of the fixing member may have a design limit by the thickness even if it has a very fine thickness.

It is an object of the present invention to provide a technique which can be further omitted from the prior art, in which the thickness necessary for fixing the support member on the surface where the terminals of the semiconductor element and the tester are electrically contacted can be completely omitted.

According to an aspect of the present invention, there is provided an insert for a test handler, including: a body having an insertion hole through which a semiconductor device can be inserted; A supporting member for supporting the semiconductor element inserted into the insertion hole at one side of the insertion hole; A fixing member for fixing the supporting member to the body; And a lever device for holding the semiconductor element in the insertion hole; Wherein the support member is formed with openings for opening the terminals of the semiconductor element to the tester side so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side, part; And a fixing portion that is bent at a predetermined angle from the support portion and fixed to the body by the fixing member; .

The fixing portion is fixed to the side surface of the body by the fixing member in contact with the side surface of the body.

The supporting member further has a cutting portion on a boundary line between the supporting portion and the fixing portion.

According to the present invention, since the thickness necessary for securing the supporting member on the contact surface where the terminal of the semiconductor element and the tester are in electrical contact can be completely omitted, it is possible to secure the thickness required for securing the supporting member on the contact surface The problem can be prevented at the source.

1 is a schematic plan view of an insert for a test handler according to an embodiment of the present invention.
Figure 2 is a schematic bottom perspective view of the insert for the test handler of Figure 1;
Figure 3 is a perspective view of a support member applied to the insert for the test handler of Figure 1;
Figure 4 is a first application example to the support member of Figure 3;
Figure 5 is a second application example to the support member of Figure 3;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For simplicity of description, redundant description is omitted or compressed as much as possible.

FIG. 1 is a plan view of an insert 100 for a test handler according to an embodiment of the present invention, and FIG. 2 is a schematic bottom perspective view of the insert 100 of FIG. 1 viewed from below.

1 and 2, the insert 100 according to the present embodiment includes a body 110, a support member 120, a fixing member 130, and a lever device 140 and the like.

A total of four fixing holes 112 are formed in the body 110, two on both sides of the side where the insertion hole 111 and the lever device 140 are not provided.

A semiconductor element (not shown) is inserted and seated in the insertion hole 111 and is opened in the vertical direction.

The four fixing holes 112 are formed for the purpose of fixing the supporting member 120.

The support member 120 is provided as a very thin film and has a support portion 121 and a fixing portion 122 as shown in Fig.

The support portion 121 supports the semiconductor element from the lower side of the insertion hole 111 so that the semiconductor element inserted into the insertion hole 111 is prevented from falling downward. Openings 121a for opening the terminals of the semiconductor element to the tester side are formed in the support portion 121 so that the terminal of the semiconductor element being supported can be electrically connected to the tester (not shown) .

The fixing part 122 is bent upward at an angle of 90 degrees from the supporting part 121 and is fixed to the body 110 by the fixing member 130 in contact with the side surface of the body 110. The fixing part 122 includes four positioning holes 122a that allow the fixing member 130 to be coupled to the supporting member 120 while setting the mounting position of the supporting member 120, And is formed at a position corresponding to the four fixing holes 112 in the fixing hole 112. [ Of course, the angle of deflection between the supporting part and the fixing part does not necessarily have to be 90 degrees, and it can be changed to the angle of the inclination depending on the degree of inclination of the side surface of the body.

For reference, when four or more fixing members are used, the number of fixing holes of the body and the positioning holes of the supporting members may be increased in proportion to the number of fixing members.

The fixing member 130 is provided to fix the fixing portion 122 of the supporting member 120 to both sides of the body 110. [ The fixing member 130 may be a bolt or a compression pin as in the prior art, and may be further provided with an adhesive.

The lever device 140 is provided for holding a semiconductor element in the insertion hole 111 and includes a lever 142 which is rotatable and a spring 142 that applies an elastic force to the lever 141 as is well known.

Since the pressing portion 130 of the fixing member 130 is located on the side surface of the insert 100, the thickness of the pressing portion of the fixing member 130 is smaller than the thickness of the semiconductor element, So that it can be independent of the electrical contact surface.

The fixing member 130 and the fixing hole 112 referred to in the present invention have the same diameter as each other as shown in Fig. 2, so that the fixing member 130 can be prevented from being fitted to the fixing hole 112 And the fixing member is divided into an interference fit terminal and a positioning terminal in the manner described in the patent application (Application No. 10-2012-0089602) filed by the applicant of the present invention, wherein the diameter of the fixing hole corresponding to the fixing member May be configured to be less than the diameter of the interference fit end for interference fit.

≪ First application example to support member >

The support member 120A of Fig. 4 is a first application example to the support member 120 of Fig.

The supporting member 120A according to Fig. 4 has a cutting portion 123 on the boundary line b (bending line) between the supporting portion 121A and the fixing portion 122A. According to this support member 120A, it is easy to fold the fixing portion 122A at an angle of 90 degrees with respect to the support portion 121A at the time of assembling the insert 100. [ Of course, the cutting portion is not limited to the shape of the hole as shown in Fig. 4 but may be cut into a simple line shape.

≪ Second application example to support member >

The support member 120B of Fig. 5 is a second application example to the support member 120 of Fig.

The supporting member 120B according to Fig. 5 is provided with fixing portions 122B and 122B 'on all sides of the supporting portion 121B. Therefore, the support member 120B can be more stably fixed to the body. Here, when the supporting member 120B is engaged with the body, the fixing portions 122B 'on the side where the labyrinth device is located should be provided avoiding the position of the labyrinth device.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the present invention is not limited thereto. It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

100: Insert
110: Body
111: insertion hole 112: fixing hole
120, 120A, 120B: support member
121, 121A, 121B:
121a: opening hole
122, 122A, 122B, 122B '
122a: Positioning hole
123: Cutting portion
130: Fixing member
140:

Claims (3)

A body having an insertion hole into which a semiconductor device can be inserted;
A supporting member for supporting the semiconductor element inserted into the insertion hole at one side of the insertion hole;
A fixing member for fixing the supporting member to the body; And
A lapping device for holding the semiconductor element in the insertion hole; Lt; / RTI >
Wherein the support member comprises:
A support portion having openings for opening the terminals of the semiconductor element to the tester side so that the terminal of the semiconductor element supported by the support member can be electrically connected to the tester side; And
A fixing part which is bent at a predetermined angle from the supporting part and is fixed to the body by the fixing member; ≪ RTI ID = 0.0 >
Insert for test handler. The method according to claim 1,
And the fixing portion is fixed to the side surface of the body by the fixing member while being in contact with the side surface of the body
Insert for test handler. The method according to claim 1,
Characterized in that the supporting member further has a cutting portion on a boundary line between the supporting portion and the fixing portion
Insert for test handler.






KR1020120136238A 2012-11-28 2012-11-28 Insert for test handler KR20140070863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120136238A KR20140070863A (en) 2012-11-28 2012-11-28 Insert for test handler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120136238A KR20140070863A (en) 2012-11-28 2012-11-28 Insert for test handler

Publications (1)

Publication Number Publication Date
KR20140070863A true KR20140070863A (en) 2014-06-11

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ID=51125485

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120136238A KR20140070863A (en) 2012-11-28 2012-11-28 Insert for test handler

Country Status (1)

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KR (1) KR20140070863A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170090818A (en) * 2016-01-29 2017-08-08 (주)테크윙 Insert for test handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170090818A (en) * 2016-01-29 2017-08-08 (주)테크윙 Insert for test handler

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