CN103785619A - Insert for test sorting machine - Google Patents

Insert for test sorting machine Download PDF

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Publication number
CN103785619A
CN103785619A CN201310426373.0A CN201310426373A CN103785619A CN 103785619 A CN103785619 A CN 103785619A CN 201310426373 A CN201310426373 A CN 201310426373A CN 103785619 A CN103785619 A CN 103785619A
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CN
China
Prior art keywords
semiconductor element
terminal
jack
test
open bore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310426373.0A
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Chinese (zh)
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CN103785619B (en
Inventor
罗闰成
刘晛准
黄正佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Techwing Co Ltd
Original Assignee
Techwing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techwing Co Ltd filed Critical Techwing Co Ltd
Priority to CN201710049963.4A priority Critical patent/CN106862093B/en
Publication of CN103785619A publication Critical patent/CN103785619A/en
Application granted granted Critical
Publication of CN103785619B publication Critical patent/CN103785619B/en
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Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to an insert for a test sorting machine and discloses a technique for forming a radius guiding portion same as the size of the terminal of a semiconductor element so as to accurately set the position of the semiconductor element for improving product reliability by means of an open hole formed on a supporting component formed on the insert or a guiding groove formed on an anti-falling protrusion.

Description

Test handler plug-in unit
Technical field
The present invention relates to a kind of plug-in unit that loads the test panel of semiconductor element in Test handler that is used in.
Background technology
Test handler is that a kind of semiconductor element that the manufacturing process by predetermined is manufactured moves to test panel (TEST TRAY) afterwards from client's dish (CUSTOMER TRAY), for semiconductor element tested test-run a machine (TESTER) test (TEST) simultaneously that makes to be loaded on test panel provides support, and according to test result, semiconductor element is carried out grade separation and moves to from test panel the device that client is coiled, it is disclosed by many pieces of open files.
The plug-in unit for settling semiconductor element on test panel, is equipped with, can be with reference to No. 10-2012-0089602 (denomination of invention: Test handler plug-in unit of korean patent application to this, hereinafter referred to as prior art 1) or No. 10-2012-0107985, korean patent application (denomination of invention: Test handler plug-in unit, hereinafter referred to as prior art 2) etc.
First with reference to prior art 1, be formed at open bore on support component to have semiconductor element terminal the size that can fully insert.Therefore the tolerance between maximum allowance, the semiconductor element terminal that, the size of open bore is defined as the terminal of semiconductor element is had and and the socket of the termination contact of semiconductor element between the full-size that is added of tolerance.For example, if the terminal of supposition semiconductor element has 0.23mm ± 0.05mm(tolerance part) big or small diameter, its maximum gauge size is 0.28mm.That is, then suppose tolerance between the terminal of semiconductor element and and the socket of the termination contact of semiconductor element between tolerance be ± 0.04mm, open bore will have the diameter of 0.32mm size.,, when considering when all tolerances, the diameter that only has open bore to have 0.32mm size just can make the terminal of the semiconductor element open bore of coming in and going out without restriction.Be in all tolerances under the optimal conditions of 0.00mm, as shown in Figure 1, the terminal of semiconductor element is preferably placed at the centre of open bore.Should be noted, Fig. 1 observes the figure of semiconductor element from plug-in unit lower surface, wherein, why represents semiconductor element with a chain-dotted line, be for the ease of and open bore between differentiation, in the Fig. 7 that will illustrate in the back, also illustrate in the same manner.
And, in prior art 2, also as shown in Figure 2, only under reaching the condition of 0.32mm/2, the radius of guiding groove just can make the terminal of semiconductor element obtain the guide properly of guiding groove.
Conventionally, in the test of semiconductor element, most important sport technique segment is electrically contacting between semiconductor element and test machine socket.Therefore, the position of semiconductor element terminal is accurately corresponding with the position of test machine socket, and the semiconductor element terminal sizes brought along with the prosperity of technology of this necessity diminishes and more and more urgent.
In addition, in Test handler, there are vertical Test handler (being also referred to as side dock Test handler) and horizontal Test handler (being also referred to as a dock Test handler), wherein the former vertically completes the test of semiconductor element under the condition of erectility at test panel, and the latter completes the test of semiconductor element under the condition of test panel along continuous straight runs erectility.As shown in Figure 3, especially in vertical Test handler because test panel vertically uprightly makes plug-in unit and be placed under the state that the semiconductor element on plug-in unit erecting and tested, therefore as shown in Figure 4, semiconductor element under Gravitative Loads by the position in lower side in the open bore of plug-in unit, and owing to also there being remaining space on left and right directions, therefore may offset to one side.So be take the lower end of semiconductor element as benchmark is set the position that will contact the terminal of the semiconductor element on test machine socket by insert design in vertical Test handler.
Summary of the invention
The object of the present invention is to provide the technology of terminal that a kind of open bore that makes plug-in unit or guiding groove have the guiding semiconductor element function in optimal location.
In order to reach object as above, according to the present invention, the Test handler of the first form comprises with plug-in unit: main body, is formed with the jack for inserting semiconductor element; Support component, supports from a side of described jack the semiconductor element inserting described jack; Fixed part, is fixed on described main body by described support component; Locking devicen, for semiconductor element is remained in described jack, wherein, on described support component, be formed with for the open bore towards the open semiconductor element terminal of test machine direction, so that can be electrically connected to test pusher side by the terminal of the semiconductor element that described support component supported, and at least one the specific open bore in described open bore comprises: amplification portion, has the radius of curvature larger than the terminal radius of semiconductor element; Guide portion, has the radius of curvature of the radius of curvature size that is different from described amplification portion, thereby the terminal of semiconductor element is guided.
Preferably, the radius of curvature of described guide portion is less than the radius of curvature of described amplification portion.
Preferably, described at least one specific open bore is formed on the position that can make the insertion of the terminal in lower side in the time that semiconductor element stands as vertical state.
Preferably, the radius of curvature of described guide portion equates with the radius of semiconductor element terminal.
Preferably, described specific open bore also comprises the connecting portion that connects described amplification portion and described guide portion, and described connecting portion has in the time that test panel stands as vertical state more to the narrower form of downside width.
And in order to reach object as above, according to the present invention, the Test handler of the second form comprises with plug-in unit: main body, is formed with the jack for inserting semiconductor element; Locking devicen, for semiconductor element is remained in described jack, wherein, described main body has guiding groove, this guiding groove is formed in anticreep projection, this anticreep projection departs from towards below with the semiconductor element that prevents from inserting in described jack towards the opposite side in horizontal direction is outstanding on the quadrangle open surface of lower surface that forms described jack, and at least one particular pilot groove in described guiding groove comprises: guide portion, for guiding the terminal of semiconductor element; Amplification portion, amplification and there is the width larger than the Breadth Maximum of described guide portion.
Preferably, described at least one specific open bore is formed on the position that can make the insertion of the terminal in lower side in the time that semiconductor element stands as vertical state.
Preferably, the radius of curvature of the radius of curvature of described guide portion and the terminal of semiconductor element equates.
And in order to reach object as above, according to the present invention, the Test handler of the 3rd form comprises with plug-in unit: main body, is formed with the jack for inserting semiconductor element; Support component, supports from a side of described jack the semiconductor element inserting described jack; Fixed part, is fixed on described main body by described support component; Locking devicen, for semiconductor element is remained in described jack, wherein, on described support component, be formed with for the open bore towards the open semiconductor element terminal of test machine direction, so that be electrically connected on test pusher side by the terminal of the semiconductor element that described support component supported, and on the Geng Gao position, lower end of other common open bore of being arranged side by side in the horizontal direction under than vertical state of the lower end of at least one specific open bore in described open bore.
And in order to reach object as above, according to the present invention, the Test handler of the 4th form comprises with plug-in unit: main body, is formed with the jack for inserting semiconductor element; Locking devicen, for semiconductor element is remained in described jack, wherein, described main body has guiding groove, this guiding groove is formed in anticreep projection, this anticreep projection departs from towards below with the semiconductor element that prevents from inserting in described jack towards the opposite side in horizontal direction is outstanding on the quadrangle open surface of lower surface that forms described jack, and on the Geng Gao position, lower end of other normal guidance grooves of being arranged side by side in the horizontal direction under than vertical state of the lower end of at least one particular pilot groove in described guiding groove.
According to the present invention, owing to can setting by specific open bore or guiding groove the position of the terminal of semiconductor element, therefore the terminal of semiconductor element can be positioned on the point that approaches to greatest extent ideal position, thereby has the effect that can improve product reliability.
Accompanying drawing explanation
Fig. 1 represents according to the shape of the open bore on the plug-in unit of prior art 1.
Fig. 2 represents according to the shape of the guiding groove on the plug-in unit of prior art 2.
Fig. 3 and Fig. 4 are the reference diagram for background technology is described.
Fig. 5 is according to the schematic plan view of the Test handler of the embodiment of the present invention.
Fig. 6 a is the summary plane according to the plug-in unit of first embodiment of the invention.
Fig. 6 b is illustrated stereogram for the ease of the plug-in unit from bottom surface observation Fig. 6 a.
Fig. 7 and Fig. 8 are for illustrating according to the reference diagram of the effect of the specific open bore of plug-in unit of Fig. 6.
Fig. 9 is the summary plane according to the plug-in unit of second embodiment of the invention.
Figure 10 is for the reference diagram of plug-in unit is according to another embodiment of the present invention described.
Symbol description:
IS1, IS2: plug-in unit 61,91: main body
61a, 91a: jack 91b: anticreep projection
S: guiding groove S0: normal guidance groove
S1: particular pilot groove G: guide portion
E: amplification portion 62: support component
H: open bore H0: common open bore
H1: specific open bore E: amplification portion
G: guide portion J: connecting portion
63: fixed part 64,94: locking devicen
The specific embodiment
Below, with reference to the accompanying drawings of according to a preferred embodiment of the invention above-mentioned, and concise and to the point property in order to illustrate, omit as far as possible or reduction for the explanation of known technology or duplicate contents.
< Test handler >
Fig. 5 is to according to the summary plane pie graph of the Test handler 500 of the embodiment of the present invention.
As shown in Figure 5, Test handler 500 comprises test panel 510, loading attachment 520, the first rotor 530, test cabinet 540, the second rotor 550 and discharge mechanism 560.
On test panel 510, there are the multiple plug-in units that can settle semiconductor element.Wherein, will describe with independent length in the back for plug-in unit.
Loading attachment 520 loads (loading) in being positioned on the test panel 510 of " loaded " position (LP:Loading Position) by semiconductor element.
The test panel 510 of the loading that completes semiconductor element is rotated to be vertical state by the first rotor 530.
Test cabinet 540 is tested for the semiconductor element loading on the test panel 510 of the vertical state in test position (TP:Test Position).For this reason, the inner sustain of test cabinet 540 adapts to the ambient condition of semiconductor element test temperature conditions.
The the second rotor 550 in the future test panel 510 of the vertical state of self-test chamber 540 rotates to be level.
Discharge mechanism 560 is from arriving test panel 510 unloading (unloading) semiconductor elements of unloading position (UP:Unloading Position) with level.
Then the example that is provided to the plug-in unit of test panel 510 in above-mentioned Test handler 500 is described.
< is about the first case > of plug-in unit
With reference to the bottom isometric view of plane and Fig. 6 b of Fig. 6 a, comprise main body, support component 62, fixed part 63 and locking devicen 64 according to the plug-in unit IS1 of first case.
In main body 61, be formed with the jack 61a that can insert semiconductor element.
Support component 62 supports at the downside of jack 61a the semiconductor element being inserted in jack 61a.On this support component 62, there are multiple open bore H for the terminal of semiconductor element is opened to the socket side of test machine, and are formed on the position corresponding with the terminal position of semiconductor element.
In addition, the specific open bore H in multiple open bore H 1do not there is all the other common open bore (thering is the circular open bore of same curvature radius in all positions on open bore border) H 0like consistent round-shaped of radius, be convenient to make the terminal position of semiconductor element to obtain the shape of open bore guiding but be formed as semiconductor element to be loaded into while erecting with vertical state on test panel 510 or by semiconductor element.Thus, specific open bore H 1there is the E of amplification portion, guide portion G and connecting portion J.
Below, stand as vertical state founds as the situation of vertical state as example plug-in unit IS1 and semiconductor element each several part is described take test panel 510.
The E of amplification portion, as upside semicircle region, reflects all tolerances of mentioning in background technology, and it has the radius of curvature larger than the radius of semiconductor element terminal (for example 0.32mm/2).
Guide portion G is as specific open bore H 1underside area, meet all tolerances and be the condition of 0.00mm, it has the radius of curvature (for example 0.23mm/2) equating with the terminal radius of semiconductor element.
Connecting portion J is the region of the E of ligation amplification portion and guide portion G.Wherein, connecting portion J has the more inclination to the narrower form of downside, to the semiconductor element terminal of vertical state is guided to guide portion G.
Support component 62 is fixed on main body 61 sides by fixed part 63.
Locking devicen 64 remains on semiconductor element in jack 61a.
In the plug-in unit IS1 of above-mentioned formation, if test panel 510 stands as vertical state founds as vertical state plug-in unit IS1 and semiconductor element, as shown in Figure 7, because the position of the terminal T of semiconductor element is by specific open bore H 1guide portion G set, therefore even impact, still can accurately set the position of semiconductor element in the time testing in test panel 510 rocks or be mobile., owing to thering is above-mentioned specific open bore H 1structure, therefore specific open bore H in the time that test panel 510 stands as vertical state 1lower end position than the common open bore H being arranged side by side in horizontal direction 0lower end position exceed predetermined altitude d, be except specific open bore H the terminal T set positions of semiconductor element 1common open bore H in addition 0place semiconductor element terminal T lower end not with common open bore H 0lower end in contact, but the center C of the terminal T of semiconductor element but with common open bore H 0center C ' consistent.Therefore, put from this, guide portion G can be used as the set positions portion of terminal position for determining semiconductor element, can guarantee that thus the precision between terminal T and the socket of test machine of semiconductor element contacts.
Certainly specific open bore H, 1can have multiple, if but all open bore H are formed as to specific open bore H 1, because the terminal directed section G that may have semiconductor element clamps, therefore preferably only the part in open bore H is formed as to specific open bore H 1.
And, although specific open bore H 1can be in any position, but because the lower end (or lower end of semiconductor element) of jack 61a in the time that plug-in unit IS1 and semiconductor element stand as vertical state becomes datum line, be therefore preferably formed the position that the terminal in lower side inserts in the terminal that can make semiconductor element.
Be greater than the desirable situation (diameter of for example terminal is 0.27mm) of setting size (diameter of 0.23mm) if run into the terminal of semiconductor element, the terminal of semiconductor element may be at specific open bore H 1interiorly be offset a little to upside, but also can make the terminal T of semiconductor element be contained in specific open bore H by means of thering is the E of amplification portion of the diameter of considering all tolerances in this case with reference to Fig. 8 is known 1in.
< is about the second case > of plug-in unit
With reference to the plane of Fig. 9, comprise main body 91 and locking devicen 94 according to the plug-in unit IS2 of second case.
In main body 91, be formed with the jack 91a that can insert semiconductor element.And, on the quadrangle open surface of main body 91 below it forms jack 91a, there is the anticreep projection 91b outstanding towards the opposite side of horizontal direction, to prevent that the semiconductor element inserting in jack 91a from departing from downwards.And, on anticreep projection 91b, be formed with multiple guiding groove S of the terminal for guiding semiconductor element.
Particular pilot groove S in guiding groove S 1with all the other normal guidance groove S 0different and there is guide portion G and the E of amplification portion.
Guide portion G has the radius of curvature identical with the terminal of desirable amount (radius of for example about 0.23mm/2), for when the loading operation or guide the terminal of semiconductor element when test panel 510 stands as vertical state.
The E of amplification portion is designed to expand and has a width of the Breadth Maximum W that is greater than guide portion G, also can be at corresponding particular pilot groove S larger than desirable amount thereby be formed as at the terminal of semiconductor element 1the terminal of middle holding semiconductor element.At this, the E of amplification portion has the more inclination to the narrower form of downside width, to the terminal of the semiconductor element in vertical state is guided to guide portion G.
Also be preferably by particular pilot groove S in the present embodiment 1be formed at and in the time that semiconductor element stands as vertical state, can make to be positioned on the position that the terminal of lower side inserts, and for the position on the above-below direction of semiconductor element terminal is appropriately set, make particular pilot groove S 1the normal guidance groove S that is arranged side by side on than horizontal direction of lower end 0lower end exceed on the position of predetermined altitude d.
Locking devicen 94 is for remaining on semiconductor element in jack 91a.
In addition, what consider with reference to plug-in unit IS1, the IS2 of Fig. 6 a and Fig. 9 explanation is guide portion G(or set positions portion) the relatively little situation of radius of curvature, but in the time of the main height up and down of considering semiconductor element terminal, can look concrete performance and as Figure 10 (a) and (b) by specific open bore H 2or particular pilot groove S 2radius of curvature be set to be greater than common open bore H 0or normal guidance groove S 0radius of curvature, make specific open bore H simultaneously 2or particular pilot groove S 2the common open bore H that is arranged side by side on than horizontal direction (vertically standing on the horizontal direction under the state of test panel) of lower end 0or normal guidance groove S 0lower end exceed on the position of predetermined altitude d.
Certainly, when according to plug-in unit IS1, the IS2 of Fig. 6 a and Fig. 9, not only can on above-below direction, accurately set the position of semiconductor element terminal, and can on left and right directions, accurately set, therefore the embodiment of Fig. 6 a and Fig. 9 may be more more preferred than the embodiment of Figure 10.
More than to be illustrated as an example of vertical Test handler example, if but adopt and towards a side, the semiconductor element being placed on plug-in unit exerted pressure with the technology that semiconductor element is sorted according to Korea S's publication No. 10-2008-0062984 (denomination of invention: plug-in package and the Test handler of test panel for Test handler) etc., or adopt other semiconductor element ordering techniques, the present invention also can be applied in horizontal Test handler completely.And in this case, the position of guide portion can change according to the direction of semiconductor element pressurized.
As mentioned above, embodiment in conjunction with the drawings illustrates the present invention, but because above-described embodiment is only the preferred embodiments of the present invention, therefore can not think that the present invention is only confined to above-described embodiment, go to understand interest field of the present invention by claims and equivalent concepts thereof.

Claims (9)

1. a Test handler plug-in unit, is characterized in that, comprising:
Main body, is formed with the jack for inserting semiconductor element;
Support component, supports from a side of described jack the semiconductor element being inserted into described jack;
Fixed part, is fixed on described main body by described support component;
Locking devicen, for semiconductor element being remained in described jack,
Wherein, on described support component, be formed with for the open bore towards the open semiconductor element terminal of test machine direction, so that be electrically connected on test pusher side by the terminal of the semiconductor element that described support component supported, and at least one specific open bore in described open bore comprises:
Amplification portion, has the radius of curvature larger than the terminal radius of semiconductor element;
Guide portion, has the radius of curvature of the radius size that is different from described amplification portion, thereby the terminal of semiconductor element is guided.
2. Test handler plug-in unit as claimed in claim 1, is characterized in that, the radius of curvature of described guide portion is less than the radius of curvature of described amplification portion.
3. Test handler plug-in unit as claimed in claim 1, is characterized in that, described at least one specific open bore is formed on the position that can make the insertion of the terminal in lower side in the time that semiconductor element stands as vertical state.
4. Test handler plug-in unit as claimed in claim 1, it is characterized in that, described specific open bore also comprises the connecting portion that connects described amplification portion and described guide portion, and described connecting portion has in the time that test panel stands as vertical state more to the narrower form of downside width.
5. a Test handler plug-in unit, is characterized in that, comprising:
Main body, is formed with the jack for inserting semiconductor element;
Locking devicen, for semiconductor element being remained in described jack,
Wherein, described main body has guiding groove, this guiding groove is formed in anticreep projection, this anticreep projection is outstanding towards the opposite side in horizontal direction, depart from towards below on the quadrangle open surface of lower surface that forms described jack to prevent from being inserted into semiconductor element in described jack, and at least one particular pilot groove in described guiding groove comprises:
Guide portion, for guiding the terminal of semiconductor element;
Amplification portion, amplification and there is the width larger than the Breadth Maximum of described guide portion.
6. Test handler plug-in unit as claimed in claim 5, is characterized in that, described at least one specific open bore is formed on the position that can make the insertion of the terminal in lower side in the time that semiconductor element stands as vertical state.
7. the Test handler plug-in unit as described in any one in claim 1 to 6, is characterized in that, the radius of curvature of described guide portion equates with the radius of curvature of the terminal of semiconductor element.
8. a Test handler plug-in unit, is characterized in that, comprising:
Main body, is formed with the jack for inserting semiconductor element;
Support component, supports from a side of described jack the semiconductor element being inserted into described jack;
Fixed part, is fixed on described main body by described support component;
Locking devicen, for semiconductor element being remained in described jack,
Wherein, on described support component, be formed with for the open bore towards the open semiconductor element terminal of test machine direction, so that be electrically connected on test pusher side by the terminal of the semiconductor element that described support component supported, and on the Geng Gao position, lower end of other common open bore of being arranged side by side in the horizontal direction under than vertical state of the lower end of at least one specific open bore in described open bore.
9. a Test handler plug-in unit, is characterized in that, comprising:
Main body, is formed with the jack for inserting semiconductor element;
Locking devicen, for semiconductor element being remained in described jack,
Wherein, described main body has guiding groove, this guiding groove is formed in anticreep projection, this anticreep projection is outstanding towards the opposite side in horizontal direction, depart from towards below on the quadrangle open surface of lower surface that forms described jack to prevent from being inserted into semiconductor element in described jack, and on the Geng Gao position, lower end of other normal guidance grooves of being arranged side by side in the horizontal direction under than vertical state of the lower end of at least one particular pilot groove in described guiding groove.
CN201310426373.0A 2012-10-26 2013-09-18 Testing, sorting machine plug-in unit Active CN103785619B (en)

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KR1020120119984A KR101955194B1 (en) 2012-10-26 2012-10-26 Insert for test handler
KR10-2012-0119984 2012-10-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106111552A (en) * 2015-05-04 2016-11-16 泰克元有限公司 Testing, sorting machine plug connector
CN107024605A (en) * 2016-01-29 2017-08-08 泰克元有限公司 Testing, sorting machine plug connector

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101535245B1 (en) * 2013-09-27 2015-07-09 세메스 주식회사 Insert assembly of test tray
KR102229229B1 (en) * 2015-06-17 2021-03-18 (주)테크윙 Insert for test handler

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