CN107024605B - Testing, sorting machine plug connector - Google Patents
Testing, sorting machine plug connector Download PDFInfo
- Publication number
- CN107024605B CN107024605B CN201710043973.7A CN201710043973A CN107024605B CN 107024605 B CN107024605 B CN 107024605B CN 201710043973 A CN201710043973 A CN 201710043973A CN 107024605 B CN107024605 B CN 107024605B
- Authority
- CN
- China
- Prior art keywords
- jack
- semiconductor element
- support member
- test
- open bore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
Abstract
The present invention relates to a kind of testing, sorting machine plug connectors.Testing, sorting machine plug connector according to the present invention includes: support member, for being inserted into the semiconductor element of the jack from the support of the side of jack；Fixation member, for the support member to be fixed on the main body；Locking devicen, for maintaining semiconductor element in the jack, wherein, the support member is formed with for multiple open bores that the terminal of semiconductor element is open towards test pusher side, so as to be in electrical contact with the test jack of test machine by the terminal for the semiconductor element that the support member is supported, and the support member is in the accommodating space with the opposite surface side of test jack opposite direction with the flexible material being pushed out that can accommodate test jack when the termination contact of semiconductor element is in test jack, accordingly, it can prevent the flexible material of test jack being pushed out from oppressing the support member.Therefore, the damage of the terminal as caused by support member will not occur.
Description
Technical field
The present invention relates to the plug connectors that one kind can load the test pallet of semiconductor element in testing, sorting machine
(insert)。
Background technique
Testing, sorting machine has been disclosed by numerous open files as following equipment: will pass through scheduled system
The semiconductor element for making technique manufacture is moved to test pallet (TEST TRAY) from client's pallet (CUSTOMER TRAY), then
It provides and supports so that the semiconductor element for being placed in test pallet can while be tested by means of test machine (TESTER)
(TEST), grade separation semiconductor element and according to test result is pressed, and is moved to client's pallet from test pallet.
Test pallet has multiple plug connectors to load semiconductor element.Existing plug connector discloses specially such as South Korea
Sharp No. 10-2014-0043235 like that, and the anticreep platform for preventing the lower section of semiconductor element to be detached from, which is integrally molded, to be taken shape in
Main body.However, due to the prosperity of integrated technology, the size of terminal is gradually reduced, then such as KR published patent 10-2014-
No. 0024495 (denomination of invention: testing, sorting machine plug connector；Hereinafter referred to as " prior art ") etc. like that, be applied to film shape
The support member of state.
With reference to the prior art, the open bore for being formed in support member should have to be adequately inserted for the terminal of semiconductor element
Size.Therefore, the maximum allowance of size possessed by the terminal of open bore being sized to semiconductor element, partly lead
Tolerance between the test jack of the terminal and associated contact of spacing tolerance and semiconductor element between the terminal of volume elements part
The maximum size being added.For example, if the size of the terminal of semiconductor element is (the tolerance portion diameter 0.23mm ± 0.05mm
Point), then its maximum size becomes diameter 0.28mm.Here, if the spacing tolerance between the terminal of semiconductor element and half
Tolerance between the terminal of conductor element and the test jack for being contacted with associated terminal is ± 0.04mm, then the size tool of open bore
There is the diameter of 0.32mm.That is, only when diameter of the size of open bore with 0.32mm, partly being led when considering all tolerances
The terminal of volume elements part can enter and leave open bore interference-free.If in all tolerances being the optimum condition of 0.00mm,
Then as shown in Figure 1, the terminal of semiconductor element is most preferably located at the middle of open bore.As reference, Fig. 1 is from plug connector
The figure of semiconductor element is observed below, wherein it is to be distinguish with open bore that semiconductor element is illustrated with chain-dotted line.
In general, most important technology segment is the test of semiconductor element and test machine in the test of semiconductor element
Electrical contact between socket.However, the size of terminal is smaller and smaller with the lasting prosperity of integrated technology, between terminal between
Away from becoming narrower.Accordingly, the relative tolerance of the spacing between the size or terminal of the terminal of semiconductor element will be required to subtract
It is small, proportionally with this, the big closed tolerance of open bore will be required also to narrow down to extremely fine degree.In the case, may be used
To expect that following situation frequently occurs: being contacted with the terminal of test jack by open bore and constituted the inner wall of open bore
Face is contacted with each other in the form of interference insertion etc. due tos tolerance etc..
In addition, recently other than pogo-pins type, PCR (pressure-sensitive conductive rubber；Pressure Conductive
Rubber) type is applied to the test jack of test machine.In general, shown in (a) of the test jack of PCR type such as Fig. 2, by non-
The morphosis of conductive silicon position CS is embedded in electric conductivity silicon position NS.Electric conductivity silicon position CS is because filling conductive powder
End and can squeeze when constitute conducting channel, non-conductive silicon position NS is then only made of silicon.Then, the terminal of semiconductor element
It is contacted with electric conductivity silicon position CS, to be electrically coupleable to test machine.
However, the problem of test jack about this PCR type, can refer to Korean granted patent 10-1179545
Number.As shown in (b) and (c) of Fig. 2, when the terminal T-phase of semiconductor element D is connected to the electric conductivity silicon position CS of test jack TS
When, because of the pressing at abutted surface position, make non-conductive silicon position NS as abutted surface place outer profile position to support member
Side is pushed out and bulging.And it as previously mentioned, is in when between the inner surface of the terminal T and composition open bore H of semiconductor element D
(referring to the position A) when the state contacted in a manner of no spacing, the abutted surface position outer profile of terminal T and electric conductivity silicon CS to connect
Non-conductive silicon position NS will it is prominent to support member side and to support member apply oppress.Then, the inner wall of open bore H
Relative displacement or flexible deformation occur for surface side, and terminal T is clamped or scratched, this will directly result in the quotient of semiconductor element D
Product damage.
Summary of the invention
The purpose of the present invention is to provide a kind of following technologies: when the terminal of semiconductor element and test jack are in electrical contact
When, even if will not be had an impact to support member, Huo Zheke in the case where the flexible material position of test jack is pushed out
Minimize its influence.
In order to reach purpose as described above, the testing, sorting machine plug connector of the first form according to the present invention, comprising:
Main body is formed with the jack for being inserted into semiconductor element；Support member, from the side of the jack, support is inserted into described insert
The semiconductor element in hole；The support member is fixed on the main body by fixation member；And locking devicen, for described
Semiconductor element is maintained in jack, wherein the support member be formed with for by the terminal of semiconductor element towards test machine
The open multiple open bores in side, so as to be in electrical contact with test machine by the terminal for the semiconductor element that the support member is supported
Test jack, the support member are in the test jack with pressure-sensitive conductive rubber (PCR) type for being present in test machine opposite
Opposite surface side has the receiving that the flexible material being pushed out can be accommodated when the termination contact of semiconductor element is in test jack
Space, so as to prevent the flexible material of test jack being pushed out from oppressing the support member.
The accommodating space is equipped with as follows: at least part open bore in the multiple open bore is formed as institute
The internal diameter for stating opposite surface side is bigger with the internal diameter of the opposite side of the opposite surface opposite side compared with being located at.
The inner wall for constituting a part of open bore forms inclination from the opposite side towards the opposite surface side, thus
The internal diameter of the opposite surface side is set to be even larger than the internal diameter of the opposite side.
The inner wall for constituting a part of open bore forms step shape, so that the internal diameter of the opposite surface side be made to be even larger than
The internal diameter of the opposite side.
The accommodating space is formed in a part of open bore side in the multiple open bore, removes in the multiple open bore
The quantity of remaining open bore except a part of open bore is more than the quantity of a part of open bore.
The internal diameter of the opposite side of a part of open bore is less than the internal diameter of remaining open bore.
The internal diameter of the opposite surface side of a part of open bore be identical to or greater than remaining open bore internal diameter.
It according to the present invention, can also even if the non-conductive silicon position of test jack being pushed out is prominent to support member side
Associated projection position is accommodated by means of the accommodating space of support member.Therefore, associated projection position will not produce support member
Raw compressing etc. influences, and accordingly, the inner wall for constituting open bore will not generate any influence to terminal, so terminal can be prevented
Damage.
Detailed description of the invention
Fig. 1 and Fig. 2 be for illustrate the prior art and its problem with reference to figure.
Fig. 3 is the schematic plan view about testing, sorting machine according to an embodiment of the invention.
Fig. 4 is the general view about the plug connector for being applied to testing, sorting machine.
Fig. 5 is general open bore set in the support member about the plug connector of Fig. 4 with reference to figure.
Fig. 6 is specific open bore set in the support member about the plug connector of Fig. 4 with reference to figure.
Fig. 7 is the function of support member set in the plug connector for explanatory diagram 4 with reference to figure.
Fig. 8 is the variation for the support member being applied in plug connector for explanatory diagram 4 with reference to figure.
Symbol description
IT: plug connector IT1: main body
IT1a: jack IT2: support member
H0: general open bore H1: specific open bore
ES: accommodating space IT3: locking devicen
Specific embodiment
Hereinafter, with reference to attached drawing and to being illustrated according to preferred embodiment present invention as described above, in order to illustrate
It is brevity, the technology or duplicate explanation that have been known are omitted or compressed as far as possible.
<testing, sorting machine>
Fig. 3 is that the general plan of the testing, sorting machine 300 about embodiment according to the present invention constitutes figure.
As shown in figure 3, testing, sorting machine 300 includes: test pallet 310, the first manipulator 320, the first rotator
(Rotator) 330, test chamber 340, the second rotator 350 and the second manipulator 360.
Test pallet 310 has the multiple plug connectors that can dispose semiconductor element.This test pallet 310 is along following
Closed path C circulation: from first position P1By test position TP and second position P2, and first position P is arrived in linking again1.?
This, for plug connector, otherwise allocated part and illustrated below.
Semiconductor element is loaded (loading) and arrived by the first manipulator 320 is located at first position P1Test pallet 310.
First rotator 330 is used to that semiconductor element to be made to load the test pallet 310 finished to be rotated into vertical state.
Test chamber 340 is equipped with so that for testing semiconductor element, which, which is placed in, is in test position TP
Vertical state test pallet 310.For this purpose, the inside of test chamber 340 remains the test temperature based on semiconductor element
The ambient condition of condition.
Second rotator 350 is horizontal for being rotated into the test pallet 310 of the vertical state from test chamber 340
State.
Second manipulator 360 comes second position P from horizontality2Test pallet 310 in unload (unloading)
Semiconductor element.
It should be noted that test pallet 310 can be recycled along the reverse direction of closed path C according to test temperature condition.In addition,
The work of the effect of first manipulator 320 and the second manipulator 360 and the first rotator 330 and the second rotator 350 at this moment
With conversion.
Continue to carry out the example for the plug connector being equipped in the test pallet 310 in testing, sorting machine 300 as described above
Explanation.
<embodiment about plug connector>
With reference to the plan view of Fig. 4, plug connector IT according to first embodiment includes main body IT1, support member IT2 and one
To locking devicen IT3.
The jack IT1a for semiconductor element insertion is formed in main body IT1.
Support member IT2 is inserted into the semiconductor element of jack IT1a from the support of the downside of jack IT1a.In this support
In component IT2, for multiple open bore H that the terminal of semiconductor element is open towards the test jack side of test machine0、H1Shape
At the corresponding position in the position of the terminal of Cheng Yuyu semiconductor element.
In addition, as shown in figure 5, open bore H0、H1In multiple general open bore H0Internal diameter r0Even if having consider tolerance
Also it is enough the internal diameter r for being inserted into the terminal T of semiconductor element0.Therefore, it is inserted into general open bore H0Terminal T and constitute general
Open bore H0Inner wall be separated by a certain degree.
In addition, open bore H0、H1In, it is located at the specific open bore H of minority of quadrangle edge1With accurate setting half
The function of the position of conductor element.For this purpose, as shown in fig. 6, in relationship between support member IT2 and test jack TS, it is right
In specific open bore H1For, the opposite surface (LF with test jack TS opposite direction；Below in Fig. 6) the internal diameter r of sideLIt is larger, on the contrary
In the opposing face (UF of opposite surface LF；The upper surface of in Fig. 6) the internal diameter r of sideULess than the internal diameter r of the side opposite surface LFL.In addition, opposing face
The internal diameter r of the side UFUAlthough being less than general open bore H0Internal diameter r0, however the almost the same terminal T in semiconductor element D
Diameter, or minutely it is greater than the diameter.Accordingly, it is placed in the terminal T of the semiconductor element D of the jack IT1a of plug connector IT
In, correspond to specific open bore H1Special terminal T be inserted into specific open bore H1While, it can accurately set semiconductor
The position of element D.It should be noted that Fig. 4 win and amplifier section in, will be specific in order to help to be expressly understood that the present invention
Open bore H1Size and general open bore H0Size exaggerated relative and illustrate.
On the other hand, specific open bore H is constituted1Inner wall IW have internal diameter with from opposing face UF tend to opposite surface LF
And the inclination to become larger.Then, it is able to ensure following accommodating space ES in the side opposite surface LF of support member IT2: even if half
The silicon of test jack TS is pushed out and protrudes when the terminal T of conductor element touches test jack TS, can also accommodate related prominent
Position out.
Locking devicen IT3 is for maintaining semiconductor element in jack IT1a.
Conduct flexible material of the plug connector IT as described above in the special terminal T compressing test jack TS of semiconductor element
Electric conductivity silicon position CS when, as shown in (a) and (b) of Fig. 7, led although the flexible material of test jack TS being pushed out is i.e. non-
Electrical silicon position NS is prominent to the side support member IT2, however associated projection divides PP to be but accommodated in accommodating space ES, thus not
Plus-pressure can be generated to support member IT2.Thus, there is no the hidden danger of special terminal T damage, and can be reserved for semiconductor element D
Commodity.In addition, in order to so make accommodating space ES sufficiently accommodate the protrusion PP of non-conductive silicon position NS, it is specific to open
Discharge hole H1The side opposite surface LF internal diameter rLIt is preferably at least identical or be greater than general open bore H0Internal diameter r0。
As reference, if specific open bore H1Excessively, then can the terminal T of intercalation increase, then possibly can not be by means of
Second manipulator 360 and suitably realize absorption pick up.Therefore, specific open bore H1It is preferred that being equipped with following quantity: with by its
Except remaining general open bore H0Quantity compare, specific open bore H1Quantity it is quite few.That is, general open bore H0Number
Amount should be more than specific open bore H1Quantity.
<variation about support member>
In the above-described embodiments, support member IT2 can be deformed as illustrated in fig. 8.
With reference to Fig. 8, specific open bore H is constituted1Inner wall be formed as step shape, to make pair of support member IT2
It is able to ensure following accommodating space ES to the face side LF: even if the i.e. non-conductive silicon of the flexible material of test jack TS is to support portion
The side part IT2 is prominent, can also accommodate associated projection position.Then, according to this modification, prevented also from the end of semiconductor element D
Sub- T is damaged because of support member IT2.
In addition, the processing of support member IT2 as described above extremely can fine be completed using laser cutting.
As reference, in the present embodiment, by specific open bore H1Only it is formed in the quadrangle corner of support member IT2
Position, however according to embodiment, it can also be by specific open bore H1It is formed in any position.Certainly, either which kind of situation, receiving
Space ES requires to be formed in specific open bore H1The outer profile of side.
As described above, the present invention is specifically illustrated by reference to the embodiment of attached drawing, however above-described embodiment is
Preferable example of the invention, therefore present invention should not be construed as limited to above-described embodiment, interest field of the invention should manage
Solution is claims and its equivalent concepts.
Claims (6)
1. a kind of testing, sorting machine plug connector, comprising:
Main body is formed with the jack for being inserted into semiconductor element；
Support member, from the side of the jack, support is inserted into the semiconductor element of the jack；
The support member is fixed on the main body by fixation member；And
Locking devicen, for maintaining semiconductor element in the jack,
Wherein, the support member is formed with for multiple openings that the terminal of semiconductor element is open towards test pusher side
Hole, so as to the test jack of test machine is in electrical contact with by the terminal for the semiconductor element that the support member is supported,
The support member has in the opposite opposite surface side of the test jack with the pressure-sensitive conductive rubber type for being present in test machine
There is the accommodating space that the flexible material being pushed out can be accommodated when the termination contact of semiconductor element is in test jack, so as to
Enough prevent the flexible material of test jack being pushed out from oppressing the support member,
The accommodating space is equipped with as follows:
At least part open bore in the multiple open bore is formed as the internal diameter of the opposite surface side compared in contrast to described
The internal diameter of the opposite side of opposite surface side is bigger.
2. testing, sorting machine plug connector as described in claim 1, wherein constitute the inner wall of a part of open bore from institute
It states opposite side and forms inclination towards the opposite surface side, so that the internal diameter of the opposite surface side be made to be even larger than the opposite side
Internal diameter.
3. testing, sorting machine plug connector as described in claim 1, wherein the inner wall for constituting a part of open bore is formed
Step shape, so that the internal diameter of the opposite surface side be made to be even larger than the internal diameter of the opposite side.
4. a kind of testing, sorting machine plug connector, comprising:
Main body is formed with the jack for being inserted into semiconductor element；
Support member, from the side of the jack, support is inserted into the semiconductor element of the jack；
The support member is fixed on the main body by fixation member；And
Locking devicen, for maintaining semiconductor element in the jack,
Wherein, the support member is formed with for multiple openings that the terminal of semiconductor element is open towards test pusher side
Hole, so as to the test jack of test machine is in electrical contact with by the terminal for the semiconductor element that the support member is supported,
The support member has in the opposite opposite surface side of the test jack with the pressure-sensitive conductive rubber type for being present in test machine
There is the accommodating space that the flexible material being pushed out can be accommodated when the termination contact of semiconductor element is in test jack, so as to
Enough prevent the flexible material of test jack being pushed out from oppressing the support member,
The accommodating space is formed in a part of open bore side in the multiple open bore, in addition to institute in the multiple open bore
The quantity for stating remaining open bore except a part of open bore is more than the quantity of a part of open bore.
5. testing, sorting machine plug connector as claimed in claim 4, wherein the opposite side of a part of open bore it is interior
Diameter is less than the internal diameter of remaining open bore.
6. testing, sorting machine plug connector as claimed in claim 5, wherein the opposite surface side of a part of open bore it is interior
Diameter be identical to or greater than remaining open bore internal diameter.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160011647A KR102470315B1 (en) | 2016-01-29 | 2016-01-29 | Insert for test handler |
| KR10-2016-0011647 | 2016-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107024605A CN107024605A (en) | 2017-08-08 |
| CN107024605B true CN107024605B (en) | 2019-10-22 |
Family
ID=59526165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710043973.7A Active CN107024605B (en) | 2016-01-29 | 2017-01-19 | Testing, sorting machine plug connector |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102470315B1 (en) |
| CN (1) | CN107024605B (en) |
| TW (1) | TWI628440B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101967401B1 (en) * | 2017-12-29 | 2019-04-10 | 에스케이하이닉스 주식회사 | Test socket |
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| CN1741261A (en) * | 2004-08-23 | 2006-03-01 | 上海乐金广电电子有限公司 | Voltage reducing packaged test socket |
| JP2006084252A (en) * | 2004-09-15 | 2006-03-30 | Matsushita Electric Ind Co Ltd | Inspection device for semiconductor device and its manufacturing method |
| WO2013042907A2 (en) * | 2011-09-23 | 2013-03-28 | Shin Jong Cheon | Semiconductor testing socket |
| CN103785619A (en) * | 2012-10-26 | 2014-05-14 | 泰克元有限公司 | Insert for test sorting machine |
| CN104971908A (en) * | 2014-04-10 | 2015-10-14 | 泰克元有限公司 | Test sorting machine, propelling device thereof, test tray, and interface board for test machine |
| CN105008940A (en) * | 2013-02-19 | 2015-10-28 | 株式会社Isc | Test socket with high density conduction section |
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| US6229320B1 (en) * | 1994-11-18 | 2001-05-08 | Fujitsu Limited | IC socket, a test method using the same and an IC socket mounting mechanism |
| US20030155907A1 (en) * | 2002-02-19 | 2003-08-21 | Ultratera Corporation, Taiwan, R.O.C. | Test method and test device for integrated circuits |
| KR101032419B1 (en) * | 2009-03-18 | 2011-05-03 | 에버테크노 주식회사 | Carrier Module for Test Handler |
| KR101030033B1 (en) | 2010-11-10 | 2011-04-20 | 강우테크 주식회사 | Test tray for testing led |
| KR101032648B1 (en) | 2011-02-10 | 2011-05-06 | 주식회사 아이에스시테크놀러지 | Socket for electrical test |
| JP5872391B2 (en) | 2012-06-22 | 2016-03-01 | 株式会社アドバンテスト | Electronic component testing equipment |
| KR101706982B1 (en) * | 2012-08-16 | 2017-02-16 | (주)테크윙 | Insert for test handler |
| KR101419364B1 (en) * | 2012-09-11 | 2014-07-16 | 주식회사 아이에스시 | Insert for handler |
| KR20140070863A (en) * | 2012-11-28 | 2014-06-11 | (주)테크윙 | Insert for test handler |
-
2016
- 2016-01-29 KR KR1020160011647A patent/KR102470315B1/en active IP Right Grant
- 2016-12-29 TW TW105143767A patent/TWI628440B/en active
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2017
- 2017-01-19 CN CN201710043973.7A patent/CN107024605B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741261A (en) * | 2004-08-23 | 2006-03-01 | 上海乐金广电电子有限公司 | Voltage reducing packaged test socket |
| JP2006084252A (en) * | 2004-09-15 | 2006-03-30 | Matsushita Electric Ind Co Ltd | Inspection device for semiconductor device and its manufacturing method |
| WO2013042907A2 (en) * | 2011-09-23 | 2013-03-28 | Shin Jong Cheon | Semiconductor testing socket |
| CN103785619A (en) * | 2012-10-26 | 2014-05-14 | 泰克元有限公司 | Insert for test sorting machine |
| CN105008940A (en) * | 2013-02-19 | 2015-10-28 | 株式会社Isc | Test socket with high density conduction section |
| CN104971908A (en) * | 2014-04-10 | 2015-10-14 | 泰克元有限公司 | Test sorting machine, propelling device thereof, test tray, and interface board for test machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI628440B (en) | 2018-07-01 |
| CN107024605A (en) | 2017-08-08 |
| KR102470315B1 (en) | 2022-11-25 |
| TW201727239A (en) | 2017-08-01 |
| KR20170090818A (en) | 2017-08-08 |
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