TW201727239A - Insert for test handler preventing the supportive member from being pressed by the pushed flexible materials of the testing socket - Google Patents

Abstract

Disclosed is an insert for test handler, which includes: a supportive member for supporting a semiconductor component inserted into a hole from one side of the hole; a fixing member for fixing the supportive member to a main body; and a latching device for holding the semiconductor component in the hole. Wherein the supportive member is formed with a plurality of opening holes that are used to enable terminals of the semiconductor member to face towards the testing machine in an opening manner, thereby enabling the terminals of the semiconductor member supported by the supportive member to be electrically connected to a test socket on the testing machine, in addition, the supportive member is provided with a receiving space on a surface opposite to the test socket, in which the receiving space is capable of receiving pushed flexible materials while the terminals of the semiconductor component contact the test socket. The disclosed is able to prevent the supportive member from being pressed by the pushed flexible materials of the testing socket, accordingly. Therefore, terminal damages resulted from supportive member will not happen.

Description

Test the separator for the sorter

The present invention relates to an insert of a test tray on which a semiconductor component can be placed in a test handler.

The test sorter has been disclosed as a device as follows: a semiconductor component manufactured through a predetermined manufacturing process is moved from a customer tray (CUSTOMER TRAY) to a test tray (TEST TRAY), and then support is provided for mounting. The semiconductor components of the test tray can be tested (TEST) by means of a test machine (TESTER) at the same time, and the semiconductor components are sorted according to the test results and moved from the test tray to the customer tray.

The test tray has a plurality of connectors for mounting the semiconductor elements. The conventional plug-in member is integrally injection-molded to the main body for preventing the detachment of the lower side of the semiconductor element as in the case of the Korean Patent Publication No. 10-2014-0043235. However, as the integration technology is developed, the size of the terminal is gradually reduced, and thus, as in Korean Patent Publication No. 10-2014-0024495 (invention name: connector for test sorter; hereinafter referred to as "prior art"), Applied to the support member in the form of a film.

Referring to the prior art, the open hole formed in the support member should have a size sufficient for the terminal of the semiconductor element to be sufficiently inserted. Therefore, the size of the open hole is determined by adding the maximum tolerance of the size of the terminal of the semiconductor element, the pitch tolerance between the terminals of the semiconductor element, and the tolerance between the terminal of the semiconductor element and the test socket of the related contact. The largest size. For example, if the size of the terminal of the semiconductor element is 0.23 mm ± 0.05 mm in diameter (tolerance portion), its maximum size becomes 0.28 mm in diameter. Here, if the pitch tolerance between the terminals of the semiconductor element and the tolerance between the terminal of the semiconductor element and the test socket contacting the relevant terminal are ±0.04 mm, the size of the open hole has a diameter of 0.32 mm. That is, when all the tolerances are taken into consideration, only when the size of the open hole has a diameter of 0.32 mm, the terminals of the semiconductor element can enter and exit without interference to the open hole. If the optimum condition is that all tolerances are 0.00 mm, as shown in Fig. 1, the terminals of the semiconductor element are preferably located in the middle of the open hole. For reference, FIG. 1 is a view of a semiconductor element viewed from under the connector, wherein the semiconductor element is illustrated by a dashed line in order to distinguish it from the open hole.

In general, the most important technical part in the testing of semiconductor components is the electrical contact between the semiconductor component and the test socket of the tester. However, as the integration technology continues to develop, the size of the terminals becomes smaller and smaller, and the spacing between the terminals becomes narrower. Accordingly, the size of the terminal of the semiconductor element or the tolerance of the pitch between the terminals is required to be reduced, and in proportion to this, the size tolerance of the open hole must be reduced to an extremely fine degree. In this case, it is expected that the case where the terminal contacting the test socket through the open hole and the inner wall surface constituting the open hole are in contact with each other in the form of interference insertion or the like due to tolerance or the like.

In addition, recently, in addition to the pogo pin type, a PCR (Pressure Conductive Rubber) type is applied as a test socket of a test machine. In general, as shown in FIG. 2(a), the PCR type test socket is configured by embedding a conductive defect portion CS in the non-conductive flaw portion NS. The conductive defect portion CS is filled with a conductive powder to form a conductive circuit when extruded, and the non-conductive conductive portion NS is composed only of tantalum. Thus, the terminals of the semiconductor element are in contact with the conductive germanium portion CS so as to be electrically connectable to the tester.

However, regarding the problem of the test socket of this type of PCR, reference is made to Korean Patent No. 10-1179545. As shown in (b) and (c) of FIG. 2, when the terminal T of the semiconductor element D is in contact with the conductive defect portion CS of the test socket TS, it is made to be outside the contact surface due to the pressing of the contact surface portion. The non-conductive 矽 portion NS of the contour portion is pushed and bulged toward the support member side. Further, as described above, when the terminal T of the semiconductor element D and the inner surface constituting the open hole H are in a state of being contacted in a non-pitch manner (see the A portion), the interface between the terminal T and the conductive 矽CS is as follows. The non-conductive crucible portion NS of the outer contour of the portion will protrude toward the side of the support member and exert pressure on the support member. Then, the inner wall surface side of the open hole H undergoes relative displacement or elastic deformation, and the terminal T is pinched or scratched, which directly causes damage to the commodity of the semiconductor element D.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technique in which when a terminal of a semiconductor element is in electrical contact with a test socket, even if the flexible material portion of the test socket is pushed, the support member is not affected, or may be minimized. Transform its influence.

In order to achieve the object of the foregoing, a connector for a test sorter according to a first aspect of the present invention includes: a main body formed with a socket into which a semiconductor element can be inserted; and a support member supported from one side of the jack a semiconductor component inserted into the jack; a fixing member that fixes the support member to the body; and a latching device for maintaining a semiconductor component in the receptacle, wherein the support member is formed for a plurality of open holes of the semiconductor element open toward the tester side such that the terminals of the semiconductor component supported by the support member are in electrical contact with the test socket of the test machine, the support member being in pressure with the test machine The opposite side of the test socket of the type of the conductive conductive rubber (PCR) has a receiving space capable of accommodating the pushed flexible material when the terminal of the semiconductor element contacts the test socket, thereby preventing the pushed flexible of the test socket The material compresses the support member.

The accommodating space is provided in such a manner that at least a part of the plurality of open holes is formed such that an inner diameter of the opposite surface side is smaller than an inner diameter of an opposite side of the side opposite to the opposite side Bigger.

The inner wall constituting the part of the open hole is inclined from the opposite surface side toward the opposite surface side such that the inner diameter of the opposing surface side is larger than the inner diameter of the opposite surface side.

The inner wall constituting the part of the open hole is formed in a stepped shape such that the inner diameter of the opposing surface side is larger than the inner diameter of the opposite surface side.

The receiving space is formed on a part of the plurality of open holes, and the number of the remaining open holes except the part of the open holes is greater than the number of the open holes.

The inner diameter of the opposite side of the portion of the open hole is smaller than the inner diameter of the remaining open hole.

The inner diameter of the opposite side of the portion of the open hole is the same as or larger than the inner diameter of the remaining open hole.

According to the present invention, even if the pushed non-conductive 矽 portion of the test socket protrudes toward the support member side, the relevant protruding portion can be accommodated by the accommodating space of the support member. Therefore, the relevant protruding portion does not exert an influence on the supporting member, etc., and accordingly, the inner wall surface constituting the opening hole does not have any influence on the terminal, so that damage of the terminal can be prevented.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings, and the well-known or repetitive description is omitted or compressed as much as possible for the sake of simplicity of the description. <Test Sorter>

FIG. 3 is a schematic plan view of a test sorter 300 in accordance with an embodiment of the present invention.

As shown in FIG. 3, the test sorter 300 includes a test tray 310, a first robot 320, a first rotator 330, a test chamber 340, a second rotator 350, and a second robot 360.

The test tray 310 has a plurality of connectors that can house semiconductor components. This test tray 310 is circulated along a closed path C as follows: from the first position P1 through the test position TP and the second position P2, and again to the first position P1. Here, for the connector, a separate portion is allocated and will be described later.

The first robot 320 loads the semiconductor component to the test tray 310 at the first position P1.

The first rotator 330 is for rotating the test tray 310 on which the semiconductor element has been loaded into a vertical state.

A test chamber 340 is provided for testing a semiconductor component that is placed in a test tray 310 in a vertical state at a test location TP. To this end, the interior of the test chamber 340 remains in an environmental state based on the test temperature conditions of the semiconductor component.

The second rotator 350 is for rotating the test tray 310 from the vertical state of the test chamber 340 to a horizontal state.

The second robot 360 unloads the semiconductor component from the test tray 310 that has reached the second position P2 in a horizontal state.

It should be noted that the test tray 310 can circulate in the reverse direction of the closed path C according to the test temperature conditions. In addition, the roles of the first robot 320 and the second robot 360 and the roles of the first rotator 330 and the second rotator 350 are switched at this time.

An example of the connector provided in the test tray 310 in the test sorter 300 as described above will be described. <About the embodiment of the connector>

Referring to the plan view of FIG. 4, the connector IT according to the first embodiment includes a main body IT1, a support member IT2, and a pair of latch devices IT3.

A jack IT1a into which a semiconductor element can be inserted is formed in the main body IT1.

The support member IT2 supports the semiconductor element inserted into the insertion hole IT1a from the lower side of the insertion hole IT1a. In such a supporting member IT2, a plurality of opening holes H0, H1 for opening the terminals of the semiconductor element toward the test socket side of the testing machine are formed at positions corresponding to the positions of the terminals of the semiconductor element.

Further, as shown in FIG. 5, the inner diameter r0 of the plurality of general open holes H0 in the open holes H0, H1 has an inner diameter r0 sufficient to insert the terminal T of the semiconductor element even in consideration of the tolerance. Therefore, the terminal T inserted into the general opening hole H0 is spaced apart from the inner wall surface constituting the opening hole H0 by a certain extent.

Further, among the open holes H0 and H1, a small number of specific open holes H1 located at the corners of the four corners have a function of accurately setting the position of the semiconductor element. To this end, as shown in FIG. 6, in the relationship between the support member IT2 and the test socket TS, for the specific open hole H1, the opposite face (LF; below in FIG. 6) opposite to the test socket TS The inner diameter rL of the side is large, and the inner diameter rU on the opposite side (UF; upper surface in FIG. 6) side opposite to the opposing surface LF is smaller than the inner diameter rL on the opposite surface LF side. Further, the inner diameter rU on the opposite surface UF side is smaller than the inner diameter r0 of the general open hole H0, but is almost the same as the diameter of the terminal T of the semiconductor element D, or slightly larger than the diameter. According to this, in the terminal T of the semiconductor element D of the insertion hole IT1a of the connector IT, the specific terminal T corresponding to the specific opening hole H1 is inserted into the specific opening hole H1, and the semiconductor element D can be accurately set. position. In addition, in the extracting and enlargement part of FIG. 4, in order to contribute to a clear understanding of this invention, the magnitude|size of the specific opening hole H1 and the size of the general opening hole H0 are shown in the exaggeration.

On the other hand, the inner wall surface IW constituting the specific opening hole Ho has an inclination in which the inner diameter becomes larger as it goes from the opposite surface UF toward the opposite surface LF. Therefore, on the side of the opposing surface LF of the support member IT2, the accommodating space ES is ensured: even if the cymbal of the test socket TS is pushed and protruded when the terminal T of the semiconductor element contacts the test socket TS, the relevant protruding portion can be accommodated. .

The latch device IT3 is used to maintain the semiconductor element within the jack IT1a.

When the connector IT as described above presses the conductive defect portion CS as the flexible material of the test socket TS at the specific terminal T of the semiconductor element, as shown in (a) and (b) of FIG. 7, although the test socket TS is The pushed flexible material, that is, the non-conductive 矽 portion NS protrudes toward the support member IT2 side, but the relevant protruding portion PP is accommodated in the accommodating space ES, so that no pressure is applied to the support member IT2. Therefore, there is no hidden danger of damage of the specific terminal T, and the commerciality of the semiconductor element D can be preserved. Further, in order to sufficiently accommodate the protruding portion PP of the non-conductive 矽 portion NS in the accommodating space ES, the inner diameter rL of the counter surface LF side of the specific opening hole Ho is preferably at least the same or larger than the inner diameter r0 of the general opening hole H0.

For reference, if the specific opening hole H1 is excessive, the interposable terminal T is increased, and thus the pickup pickup may not be properly realized by the second robot hand 360. Therefore, the specific open hole H1 is preferably provided in the following number: the number of the specific open holes H1 is considerably small compared to the number of the remaining general open holes Ho excluding them. That is, the number of general open holes Ho should be more than the number of specific open holes H1. <Modification of Support Member>

In the above embodiment, the support member IT2 can be deformed as shown in FIG.

Referring to Fig. 8, the inner wall surface constituting the specific opening hole H1 is formed in a stepped shape, so that the opposing surface LF side of the support member IT2 ensures the following accommodation space ES: even if the flexible material of the test socket TS is non-conductive slanting support The member IT2 is protruded from the side, and the relevant protruding portion can also be accommodated. Therefore, according to the present modification, it is also possible to prevent the terminal T of the semiconductor element D from being damaged by the support member IT2.

Further, the processing of the support member IT2 as described above can be performed extremely delicately by laser cutting.

For reference, in the present embodiment, the specific opening hole H1 is formed only at the corner portion of the support member IT2, but according to the embodiment, the specific opening hole H1 may be formed at an arbitrary position. Of course, in any case, the accommodating space ES needs to have an outer contour formed on the side of the specific opening H1.

The present invention has been specifically described by the embodiments of the present invention, and the foregoing embodiments are only preferred examples of the present invention. The scope of patent application and its equivalent concept.

IT‧‧‧ connectors
IT11‧‧‧ Subject
IT1a‧‧‧ jack
IT2‧‧‧Support parts
Ho‧‧‧General open hole
H1‧‧‧ specific open hole
ES‧‧‧ containment space
IT3‧‧‧Latch device

1 and 2 are reference diagrams for explaining the prior art and its problems.

Figure 3 is a schematic plan view of a test handler in accordance with one embodiment of the present invention.

Figure 4 is a schematic plan view of a connector for use in a test sorter.

Fig. 5 is a reference view of a general open hole provided in the support member of the connector of Fig. 4.

Fig. 6 is a reference view of a specific open hole provided in the support member of the connector of Fig. 4.

Fig. 7 is a reference diagram for explaining the function of the support member provided in the connector of Fig. 4.

Fig. 8 is a reference view for explaining a modification of the support member applied to the connector of Fig. 4;

no

no

IT2‧‧‧Support parts

H1‧‧‧ specific open hole

Claims (7)

A connector for testing a sorting machine, comprising: a body formed with a socket into which a semiconductor element can be inserted; a support member that supports a semiconductor component inserted into the jack from a side of the socket; a fixing member The support member is fixed to the main body; and a latching device for maintaining a semiconductor element in the insertion hole, wherein the support member is formed with a plurality of open holes for opening a terminal of the semiconductor element toward the tester side So that the terminals of the semiconductor element supported by the support member are in electrical contact with the test socket of the test machine, the support member having a facing side opposite to the test socket of the pressure-sensitive conductive rubber type present in the test machine When the terminal of the semiconductor element contacts the test socket, it can accommodate the accommodating space of the pushed flexible material, thereby preventing the pushed flexible material of the test socket from pressing the support member. The connector for a test sorter according to claim 1, wherein the accommodating space is provided in such a manner that at least a part of the plurality of open holes are formed such that an inner diameter of the opposite side is located The inner diameter on the side opposite to the side opposite to the opposite surface is larger. The test sorting machine insert of claim 2, wherein an inner wall constituting the part of the open hole is inclined from the opposite side to the opposite side so that the inner side of the opposite side The diameter is larger than the inner diameter of the opposite side. The test sorter insert of claim 2, wherein an inner wall constituting the part of the open hole is formed in a stepped shape such that an inner diameter of the opposite surface side is larger than an inner diameter of the opposite side. The connector for a test sorter according to claim 1, wherein the accommodating space is formed on a part of the plurality of open holes on an open hole side, and the plurality of open holes are apart from the part of the open holes The number of remaining open holes is greater than the number of open open holes. The test sorting machine insert of claim 5, wherein an inner diameter of the opposite side of the portion of the open hole is smaller than an inner diameter of the remaining open hole. The test sorter insert of claim 6, wherein the inner diameter of the opposite side of the portion of the open hole is the same as or larger than the inner diameter of the remaining open holes.