TWI503557B - Insert for test handler - Google Patents

Description

Test sorter plugin

The present invention relates to an insert that can be used to load a test disc of a semiconductor component in a test sorter.

The test sorter is a type of semiconductor component manufactured by a predetermined manufacturing process after being moved from a customer disk (CUSTOMER TRAY) to a test disk (TEST TRAY), so that the semiconductor component mounted on the test disk can be simultaneously tested (TESTER) A device that provides support (TEST) and classifies semiconductor components based on test results and moves from test disks to client disks has been disclosed in various publications.

The test disk is provided with an insert for arranging a semiconductor element, and the Korean Patent Application No. 10-2012-0089602 (invention name: plug-in for test sorter, hereinafter referred to as prior art 1) or Korean Patent Application 10-2012 No. -0107985 (invention name: plug-in for test sorting machine, hereinafter referred to as prior art 2).

Referring first to the prior art 1, the open hole formed in the support member has a size in which the terminal of the semiconductor element can be sufficiently inserted. Therefore, it will be open The size of the hole is determined as the maximum size at which the maximum tolerance of the terminals of the semiconductor element, the tolerance between the terminals of the semiconductor element, and the tolerance between the sockets in contact with the terminals of the semiconductor element are added. For example, if the terminal of the semiconductor element is assumed to have a diameter of 0.23 mm ± 0.05 mm (tolerance portion), its maximum diameter is 0.28 mm. That is, it is assumed that the tolerance between the terminals of the semiconductor element and the tolerance of the socket in contact with the terminal of the semiconductor element is ±0.04 mm, and the opening hole has a diameter of 0.32 mm. That is, when all the tolerances are considered, only the open hole has a diameter of 0.32 mm in order to allow the terminals of the semiconductor element to enter and exit the opening without restriction. Under the optimum conditions of all tolerances of 0.00 mm, as shown in Fig. 1, the terminals of the semiconductor element are preferably located in the center of the open hole. It should be noted that FIG. 1 is a view of the semiconductor element viewed from the lower surface of the insert, wherein the semiconductor element is indicated by a one-dot chain line for the purpose of facilitating the distinction between the open hole and the same manner as in FIG. 7 to be described later. The illustration is shown.

Further, also in the prior art 2, as shown in Fig. 2, the terminal of the semiconductor element can be appropriately guided by the guide groove only under the condition that the radius of the guide groove reaches 0.32 mm/2.

In general, the most important technical aspect in the testing of semiconductor components is the electrical contact between the semiconductor component and the tester socket. Therefore, the position of the terminal of the semiconductor element is precisely matched with the position of the tester socket, and this necessity becomes more and more urgent as the size of the terminal of the semiconductor element becomes smaller as the technology is developed.

In addition, the test sorter has a vertical test sorter (also known as a side dock test sorter) and a horizontal test sorter (also known as a head). The docking test sorting machine), wherein the former completes the testing of the semiconductor component under the condition that the test disc is in the upright state in the vertical direction, and the latter completes the testing of the semiconductor component under the condition that the test disc is erected in the horizontal direction. As shown in FIG. 3, especially in the vertical test sorter, since the test disc is erected in the vertical direction, the insert and the semiconductor component disposed on the insert are tested in an upright state, so as shown in FIG. The semiconductor element is placed at the lowermost position in the open hole of the insert under its own weight, and there is a remaining space in the left and right direction, so it may be shifted to one side. Therefore, in the vertical test sorter, the insert is designed to set the position of the semiconductor component terminal to be contacted on the tester socket with reference to the lower end of the semiconductor component.

An object of the present invention is to provide a technique for causing an open hole or a guide groove of a card to have a function of guiding a terminal of a semiconductor element in an optimum position.

In order to achieve the above and the object, the insert for a test handler according to the first aspect of the present invention includes: a main body formed with a insertion hole for inserting a semiconductor element; and a support member that is inserted from one side of the insertion hole a semiconductor component in the socket; a fixing member that fixes the support member to the body; and a latching device for holding the semiconductor component in the socket, wherein the support member is formed with a tester for forming Opening the open hole of the semiconductor element terminal such that the terminal of the semiconductor element supported by the support member can be electrically connected to the test machine side, and at least one specific open hole of the open hole includes: an amplifying portion, Having a radius of curvature greater than a radius of a terminal of the semiconductor component; the guiding portion having a radius of curvature different from the amplifying portion The radius of curvature is such that the terminals of the semiconductor component are guided.

Preferably, the guiding portion has a radius of curvature smaller than a radius of curvature of the amplifying portion.

Preferably, the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element is in a vertical state.

Preferably, the radius of curvature of the guiding portion is equal to the radius of the terminal of the semiconductor element.

Preferably, the specific open hole further includes a connecting portion connecting the amplifying portion and the guiding portion, and the connecting portion has a shape in which a width is narrower toward a lower side when the test disk is in a vertical state. .

Also, in order to achieve the above and the object, the plug for a test sorter according to the second aspect of the present invention includes: a main body formed with a socket for inserting a semiconductor element; and a latching means for holding the semiconductor element in the In the socket, wherein the main body has a guiding groove formed on the retaining projection, the retaining projection protruding toward the opposite side in the horizontal direction to prevent the semiconductor component inserted into the insertion hole from forming the plug a quadrangular open surface of the lower surface of the hole is detached downward, and at least one of the guiding grooves includes: a guiding portion for guiding a terminal of the semiconductor element; and an amplifying portion that is expanded to have a ratio The maximum width of the part is greater.

Preferably, the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element is in a vertical state.

Preferably, the radius of curvature of the guiding portion and the end of the semiconductor component The radius of curvature of the sub is equal.

Moreover, in order to achieve the objects as described above and above, the insert for a test sorter according to the third aspect of the present invention includes: a main body formed with an insertion hole for inserting the semiconductor element; and a support member that is inserted and inserted from one side of the insertion hole a semiconductor component in the jack; a fixing member fixing the support member to the main body; and a latching device for holding the semiconductor component in the jack, wherein the support member is formed with The test machine opens the open hole of the semiconductor element terminal such that the terminal of the semiconductor element supported by the support member is electrically connected to the test machine side, and the lower end of at least one of the open holes is at a higher than vertical In the state, the lower end of the other common open holes arranged side by side in the horizontal direction is at a higher position.

Also, in order to achieve the above and the object, the insert for a test sorter according to the fourth aspect of the present invention includes: a main body formed with a socket for inserting a semiconductor element; and a latching means for holding the semiconductor element in the In the socket, wherein the main body has a guiding groove formed on the retaining projection, the retaining projection protruding toward the opposite side in the horizontal direction to prevent the semiconductor component inserted into the insertion hole from forming the plug The quadrilateral open face of the lower surface of the hole is detached downward, and the lower end of at least one of the guide grooves is at a higher position than the lower end of the other common guide grooves arranged side by side in the horizontal direction in the vertical state on.

According to the present invention, since the position of the terminal of the semiconductor element can be set by the specific opening or guiding groove, the terminal of the semiconductor element can be located at a point which is closest to the ideal position, thereby having an effect of improving product reliability.

IS1, IS2‧‧‧ plugin

61, 91‧‧‧ subject

61a, 91a‧‧‧ jack

91b‧‧‧Protection

62‧‧‧Support parts

63‧‧‧Fixed parts

64, 94‧‧‧Latch device

S‧‧‧ guiding slot

S ₀ ‧‧‧Ordinary guide slot

S ₁ ‧‧‧Specific guide slot

H‧‧‧Open hole

H ₀ ‧‧‧Ordinary open hole

H ₁ ‧‧‧Specific open hole

E‧‧‧Expanding Department

G‧‧‧Guidance

J‧‧‧Connecting Department

Figure 1 shows the shape of an open hole in a card according to prior art 1.

Figure 2 shows the shape of the guiding groove on the insert according to prior art 2.

3 and 4 are reference diagrams for explaining the background art.

Figure 5 is a schematic plan view of a test handler in accordance with an embodiment of the present invention.

Figure 6a is a schematic plan view of an insert in accordance with a first embodiment of the present invention.

Figure 6b is a perspective view of the plug-in of Figure 6a for ease of viewing from the bottom surface.

7 and 8 are reference diagrams for explaining the action of a specific open hole in the insert according to Fig. 6.

Figure 9 is a schematic plan view of an insert in accordance with a second embodiment of the present invention.

FIG. 10 is a reference diagram for explaining a plug-in according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described with reference to the drawings, and the description of known techniques or duplicates will be omitted or reduced as much as possible for the sake of brevity.

<Test Sorter>

Figure 5 is a summary of a test sorter 500 in accordance with an embodiment of the present invention. The sex plane constitutes a picture.

As shown in FIG. 5, the test handler 500 includes a test disc 510, a loading device 520, a first rotor 530, a test chamber 540, a second rotor 550, and an unloading device 560.

The test disc 510 has a plurality of inserts on which semiconductor components can be placed. The plugin will be described later in a separate space.

The loading device 520 loads the semiconductor component onto the test disc 510 at the loading position (LP: Loading Position).

The first rotor 530 rotates the test disc 510 that has completed the loading of the semiconductor element to a vertical state.

The test chamber 540 is used to test a semiconductor component mounted on the test disc 510 in a vertical state at a test position (TP: Test Position). To this end, the interior of the test chamber 540 maintains an environmental state that accommodates the temperature conditions of the semiconductor component test.

The second rotor 550 rotates the test disc 510 from the vertical state of the test chamber 540 to a horizontal state.

The unloading device 560 unloads the semiconductor element from the test disc 510 that reaches the unloading position (UP: Unloading Position) in a horizontal state.

Next, an example of the plug-in equipped in the test tray 510 in the test sorter 500 will be described.

<The first example of a plugin>

Referring to the plan view of Fig. 6a and the bottom perspective view of Fig. 6b, the insert IS1 according to the first example comprises a main body, a support member 62, a fixing member 63, and a latch Device 64.

An insertion hole 61a into which a semiconductor element can be inserted is formed on the main body 61.

The support member 62 supports the semiconductor element inserted into the insertion hole 61a on the lower side of the insertion hole 61a. The support member 62 has a plurality of open holes H for opening the terminals of the semiconductor element to the socket side of the tester, and is formed at a position corresponding to the terminal position of the semiconductor element.

In addition, the specific open hole H _{1 of the} plurality of open holes H does not have the remaining common open holes (circular open holes having the same radius of curvature at all positions of the open hole boundary) H ₀ -like circular shape having a uniform radius, Rather, it is formed in a shape in which the semiconductor element is to be mounted on the test disk 510 or the semiconductor element is erected in a vertical state to facilitate the terminal position of the semiconductor element to be guided by the open hole. Thereby, the specific opening hole H ₁ has the amplification portion E, the guide portion G, and the connection portion J.

Hereinafter, each part will be described by taking a case where the test disk 510 is in a vertical state and the plug-in IS1 and the semiconductor element are placed in a vertical state as an example.

The amplifying portion E serves as an upper semicircular region, reflecting all the tolerances mentioned in the background art, which have a larger radius of curvature (for example, 0.32 mm/2) than the radius of the terminal of the semiconductor element.

The guide portion G serves as a lower region of the specific opening hole H ₁ and satisfies all the tolerances of 0.00 mm, and has a radius of curvature equal to the radius of the terminal of the semiconductor element (for example, 0.23 mm/2).

The connection portion J is a region where the amplification portion E and the guide portion G are connected. The connection portion J has a tilt which is narrower toward the lower side so as to guide the terminal of the semiconductor element in the vertical state toward the guide portion G.

The fixing member 63 fixes the support member 62 to the main body 61 side.

The latching device 64 holds the semiconductor component within the receptacle 61a.

In the plug-in IS1 constructed as described above, if the test disc 510 is in a vertical state and the plug-in IS1 and the semiconductor element are placed in a vertical state, as shown in FIG. 7, since the position of the terminal T of the semiconductor element is specified by the open hole H _Since the guide portion G of ₁ is set, even if an impact occurs during the shaking or movement of the test disc 510, the position of the semiconductor element can be accurately set during the test. That is, since the specific configuration of the open hole ₁ H, thus the disc 510 in the test stand as an ordinary open hole H H open pores particular end position of _a vertical position than when arranged horizontally side by side above a predetermined lower end position of ₀ height d, i.e. the terminal T position of the semiconductor element is set to not ordinary open hole H a lower end contacting the lower end of the ordinary opening hole H in addition to the specific open hole _{H. 1} at ₀ semiconductor element terminal T _0, but the semiconductor element The center C of the terminal T coincides with the center C' of the ordinary open hole H ₀ . Therefore, from this point of view, the guiding portion G can serve as a position setting portion for determining the terminal position of the semiconductor element, whereby precise contact between the terminal T of the semiconductor element and the socket of the testing machine can be ensured.

Of course, the particular open hole H can have more than _one, but if all of the open hole ₁ H is formed, since a terminal of the semiconductor element may be sandwiched between the guide portion G, so only the open hole H is preferred for a particular open hole H A part of it is formed as a specific open hole H ₁ .

Further, although the specific opening hole H ₁ may be at any position, since the lower end of the insertion hole 61a (or the lower end of the semiconductor element) becomes a reference line when the plug-in IS1 and the semiconductor element are in a vertical state, it is preferably formed Among the terminals of the semiconductor element, the terminal at the lowermost side is inserted.

If you encounter a case where the semiconductor element over the set of terminals is greater than the size (diameter of 0.23mm) (e.g., a diameter of the terminal is 0.27mm), the terminals of the semiconductor element may be slightly shifted upward in the side of _a particular open hole H, but with reference to 8 that in this case may have been considered by means of the diameters of all tolerances terminal T E the amplification portion of the semiconductor element is accommodated in a particular open hole H _1.

<Second example of plugin>

Referring to the plan view of Fig. 9, the insert IS2 according to the second example includes a main body 91 and a latching device 94.

An insertion hole 91a into which a semiconductor element can be inserted is formed on the main body 91. Further, the main body 91 has a detachment preventing projection 91b that protrudes toward the opposite side in the horizontal direction on the quadrangular open surface that constitutes the insertion hole 91a, so as to prevent the semiconductor element inserted into the insertion hole 91a from being detached downward. Further, a plurality of guide grooves S for guiding the terminals of the semiconductor element are formed on the detachment preventing projection 91b.

The specific guide groove S _{1 in the} guide groove S has a guide portion G and an amplification portion E different from the remaining normal guide grooves S ₀ .

The guide portion G has the same radius of curvature as the terminal of the ideal size (for example, a radius of about 0.23 mm/2) for guiding the terminals of the semiconductor element during the loading operation or when the test disc 510 is in the vertical state.

Amplification enlarged portion E is designed to have a width greater than the guide portion G of the maximum width W, whereby the case is formed larger than the desired size of the semiconductor can be specified in the corresponding guide groove S ₁ contained in the terminal of the semiconductor element The terminal of the component. Here, the amplification portion E has an inclination of a shape in which the width is narrower toward the lower side, so that the terminal of the semiconductor element in the vertical state is guided to the guide portion G.

In the present preferred embodiment it is also a particular embodiment the guide groove S ₁ formed on the semiconductor element when a vertical upright state of the terminal can be located on the lowermost side of the insertion position, and in order to properly set the vertical direction of the semiconductor element terminals The position is such that the lower end of the specific guide groove S ₁ is at a position higher than the lower end of the normal guide groove S ₀ arranged side by side in the horizontal direction by a predetermined height d.

A latching device 94 is used to hold the semiconductor component within the receptacle 91a.

In addition, the inserts IS1 and IS2 described with reference to FIGS. 6a and 9 consider a case where the radius of curvature of the guide portion G (or the position setting portion) is relatively small, but when considering the upper and lower heights of the terminals of the semiconductor element, it may be regarded as specific In the embodiment, as shown in (a) and (b) of FIG. 10, the radius of curvature of the specific opening hole H ₂ or the specific guiding groove S ₂ is set to be larger than the radius of curvature of the ordinary opening hole H ₀ or the normal guiding groove S ₀ . At the same time, the lower end of the specific open hole H ₂ or the specific guide groove S ₂ is placed side by side in the horizontal direction (horizontal direction in the state of standing vertically in the test disk), and the lower end of the normal open hole H ₀ or the normal guide groove S ₀ Above the predetermined height d.

Of course, since the positions of the semiconductor element terminals can be accurately set not only in the up and down direction but also in the left and right direction, the embodiments of FIGS. 6a and 9 may be more accurate than the plugs IS1 and IS2 according to FIGS. 6a and 9. The embodiment of Figure 10 is more preferred.

The above is an example of a vertical test sorting machine, but if it is in accordance with Korean Laid-Open Patent Publication No. 10-2008-0062984 (invention name: test insert inserting component for test sorter and test sorter) The present invention employs a technique of applying a voltage to a semiconductor element disposed on a card to sort semiconductor elements toward one side, or employing other semiconductor element sorting techniques It is also fully applicable to horizontal test sorters. Also in this case, the position of the guiding portion can be changed in accordance with the direction in which the semiconductor element is pressed.

As described above, the present invention has been specifically described by way of embodiments in conjunction with the accompanying drawings. However, since the above-described embodiments are merely preferred embodiments of the present invention, it is not considered that the present invention is limited to the above-described embodiments. The scope and equivalents thereof are to be understood as the scope of the invention.

IS1‧‧‧ plugin

61‧‧‧ Subject

61a‧‧‧ jack

62‧‧‧Support parts

63‧‧‧Fixed parts

64‧‧‧Latch device

E‧‧‧Expanding Department

J‧‧‧Connecting Department

G‧‧‧Guidance

H‧‧‧Open hole

H ₀ ‧‧‧Ordinary open hole

H ₁ ‧‧‧Specific open hole

Claims (9)

An insert for testing a sorter, comprising: a body formed with a socket for inserting a semiconductor component; a support member supporting a semiconductor component inserted into the jack from a side of the receptacle; a fixing member The support member is fixed to the main body; a latching device for holding the semiconductor element in the insertion hole, wherein the support member is formed with an open hole for opening the terminal of the semiconductor element toward the test machine, so that a terminal of the semiconductor element supported by the support member is electrically connected to the test machine side, and at least one specific open hole of the open hole includes: an amplifying portion having a radius of curvature larger than a terminal radius of the semiconductor element; a guiding portion having a radius of curvature different from a radius of the amplifying portion, thereby guiding a terminal of the semiconductor element, wherein the specific opening hole is for guiding the semiconductor element when the semiconductor element is rotated to a vertical state The terminal of the semiconductor component. The insert for a test sorter as claimed in claim 1, wherein the guide portion has a radius of curvature smaller than a radius of curvature of the amplifying portion. The insert for a test sorter as recited in claim 1, wherein the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element is in a vertical state. The plug for a test sorter as claimed in claim 1, wherein the specific open hole further includes a connection portion connecting the amplifying portion and the guiding portion, and The connecting portion has a shape in which the width of the lower side is narrower when the test disk is in a vertical state. An insert for testing a sorter, comprising: a body formed with a socket for inserting a semiconductor component; and a latching device for holding the semiconductor component in the socket, wherein the body has a guiding groove, the guiding The groove is formed on the detachment preventing protrusion which protrudes toward the opposite side in the horizontal direction to prevent the semiconductor element inserted into the insertion hole from being separated downward on the quadrangular open surface constituting the lower surface of the insertion hole And at least one specific guiding groove of the guiding groove includes: a guiding portion for guiding a terminal of the semiconductor element; and an amplifying portion that is expanded to have a width larger than a maximum width of the guiding portion, wherein the A specific guiding groove is used to guide the terminal of the semiconductor element when the semiconductor element is rotated to a vertical state. The insert for a test sorter as recited in claim 5, wherein the at least one specific open hole is formed at a position where the terminal at the lowermost side can be inserted when the semiconductor element is in a vertical state. The insert for a test sorter as described in any one of claims 1 to 6, wherein a radius of curvature of the guide portion is equal to a radius of curvature of a terminal of the semiconductor element. An insert for testing a sorter, comprising: a body formed with a socket for inserting a semiconductor component; and a support member inserted from a side of the jack into the jack a semiconductor component; a fixing member for fixing the support member to the main body; and a latching device for holding the semiconductor component in the insertion hole, wherein the support member is formed with an opening for opening the semiconductor component toward the test machine An open hole of the terminal such that a terminal of the semiconductor element supported by the support member is electrically connected to the tester side, and a lower end of at least one of the open holes is in a horizontal direction than a vertical state The lower end of the other common open holes are arranged side by side at a higher position. An insert for testing a sorter, comprising: a body formed with a socket for inserting a semiconductor component; and a latching device for holding the semiconductor component in the socket, wherein the body has a guiding groove, the guiding The groove is formed on the detachment preventing protrusion which protrudes toward the opposite side in the horizontal direction to prevent the semiconductor element inserted into the insertion hole from being separated downward on the quadrangular open surface constituting the lower surface of the insertion hole And the lower ends of at least one of the guide grooves are at a higher position than the lower ends of the other common guide grooves arranged side by side in the horizontal direction in the vertical state.