TWI628440B - Insert for test handler - Google Patents

Abstract

The invention relates to a connector for testing a sorting machine. The connector for a test and sorting machine according to the present invention includes a support member for supporting a semiconductor element inserted into the socket from one side of the socket, and a fixing member for fixing the support member to the socket. A main body; a latch device for maintaining a semiconductor element in the socket, wherein the support member is formed with a plurality of opening holes for opening a terminal of the semiconductor element toward a tester side so as to be held by the support member The terminal of the supported semiconductor element is in electrical contact with the test socket of the testing machine, and the supporting member has a side facing the test socket opposite to the test socket. The supporting member is pushed when the terminal of the semiconductor element is in contact with the test socket. The flexible material storage space can prevent the pushed flexible material of the test socket from pressing the support member. Therefore, damage to the terminal caused by the supporting member does not occur.

Description

Connectors for test sorters

The invention relates to an insert of a test tray capable of placing semiconductor components in a test sorter.

The test sorting machine has been disclosed through numerous public files as a device that moves semiconductor components manufactured through a predetermined manufacturing process from a customer tray (CUSTOMER TRAY) to a test tray (TEST TRAY), and then provides support for placement The semiconductor components in the test tray can be tested (TEST) at the same time with the help of a tester (TESTER), and the semiconductor components are classified by grade according to the test results and moved from the test tray to the customer tray.

The test tray includes a plurality of connectors for mounting a semiconductor element. The existing connector is integrally injection-molded to the main body, as in Korean Patent Publication No. 10-2014-0043235, and an anti-detachment table for preventing the lower part of the semiconductor element from detaching. However, due to the development of integrated technology, the size of the terminals has gradually decreased, so as in Korean Public Patent No. 10-2014-0024495 (Invention Name: Plug for Test Sorter; hereinafter referred to as "the prior art"), etc., It is applied to a supporting member in the form of a film.

Referring to the prior art, the opening hole formed in the support member should have a size that can sufficiently insert the terminal of the semiconductor element. Therefore, the size of the open hole is determined by adding the maximum tolerance of the size of the terminals of the semiconductor element, the spacing tolerance between the terminals of the semiconductor element, and the tolerance between the terminal of the semiconductor element and the test socket in contact with the contact. The largest size. For example, if the size of a terminal of a semiconductor element is 0.23 mm ± 0.05 mm in diameter (tolerance portion), the maximum size thereof becomes 0.28 mm in diameter. Here, if the tolerance between the terminals of the semiconductor element and the tolerance between the terminal of the semiconductor element and the test socket contacting the relevant terminal is ± 0.04 mm, the size of the open hole has a diameter of 0.32 mm. That is, when all tolerances are taken into consideration, only when the size of the open hole has a diameter of 0.32 mm, the terminals of the semiconductor element can enter and exit the open hole without interference. If the best condition is that all tolerances are 0.00mm, as shown in FIG. 1, the terminal of the semiconductor element is preferably located in the middle of the open hole. For reference, FIG. 1 is a view of a semiconductor element viewed from below the connector, and the semiconductor element is illustrated with a dot-dash line in order to distinguish it from an open hole.

Generally, the most important technical part in the testing of semiconductor elements is the electrical contact between the semiconductor element and the test socket of the testing machine. However, with the continuous development of integrated technology, the size of terminals has become smaller and smaller, and the spacing between terminals has become narrower. According to this, the related tolerance of the size of the terminal of the semiconductor element or the pitch between the terminals must be reduced, and in proportion to this, the size tolerance of the required open hole must also be reduced to a very fine degree. In this case, it is expected that the following situations frequently occur: the terminal that contacts the test socket through the open hole and the inner wall surface forming the open hole contact each other in the form of interference insertion due to tolerance or the like.

In addition, in addition to a pogo pin type, a PCR (Pressure Conductive Rubber) type has recently been applied as a test socket of a tester. Generally, as shown in FIG. 2 (a), a PCR-type test socket has a configuration in which a conductive silicon portion CS is embedded in a non-conductive silicon portion NS. The conductive silicon portion CS is filled with a conductive powder to form a conductive circuit during extrusion, and the non-conductive silicon portion NS is composed of silicon only. Then, the terminal of the semiconductor element comes into contact with the conductive silicon portion CS, and can be electrically connected to the tester.

However, regarding the problems of this PCR type test socket, please refer to Korean Patent No. 10-1179545. As shown in (b) and (c) of FIG. 2, when the terminal T of the semiconductor element D is connected to the conductive silicon portion CS of the test socket TS, the contact surface area is pressed outside the contact surface location. The non-conductive silicon portion NS of the outline portion is pushed toward the support member side and bulged. Furthermore, as described above, when the terminal T of the semiconductor element D and the inner surface constituting the open hole H are in a state of non-pitch contact (see part A), the contact surface between the terminal T and the conductive silicon CS The non-conductive silicon portion NS of the outer contour of the portion will protrude toward the support member side and apply pressure to the support member. As a result, the inner wall surface side of the open hole H undergoes relative displacement or elastic deformation, and the terminal T is pinched or scratched, which will directly cause damage to the product of the semiconductor element D.

An object of the present invention is to provide a technology that, when a terminal of a semiconductor element is in electrical contact with a test socket, even if the flexible material part of the test socket is pushed, it will not affect the support member or can minimize Its impact.

In order to achieve the aforementioned object, a plug for a test and sorting machine according to a first aspect of the present invention includes a main body formed with a jack capable of inserting a semiconductor element, and a support member supported from one side of the jack. A semiconductor element inserted into the socket; a fixing member that fixes the support member to the main body; and a latch device for maintaining a semiconductor element in the socket, wherein the support member is formed with The plurality of openings of the terminals of the semiconductor element are opened toward the tester side, so that the terminals of the semiconductor element supported by the support member are in electrical contact with the test socket of the tester. A conductive rubber (PCR) type test socket has a storage space capable of accommodating the pushed flexible material when the terminals of the semiconductor socket are in contact with the opposite side of the test socket, thereby preventing the test socket from being pushed and flexible. The material presses the support member.

The accommodation space is provided in such a manner that at least a part of the plurality of open holes is formed such that an inner diameter of the facing surface side is larger than an inner diameter of the facing surface side opposite to the facing surface. Bigger.

The inner wall constituting the part of the open hole is inclined from the opposite surface side toward the facing surface side so that the inside diameter of the facing surface side is larger than the inside diameter of the opposite surface side.

The inner wall constituting the part of the open hole is formed in a stepped shape so that the inner diameter of the facing surface side is larger than the inner diameter of the opposite surface side.

The accommodating space is formed on a side of a part of the plurality of open holes, and the number of the remaining open holes except the part of the plurality of open holes is greater than the number of the part of the open holes.

An inner diameter of an opposite surface side of the part of the open holes is smaller than an inner diameter of the remaining open holes.

The inner diameter of the facing surface side of the part of the open holes is the same as or larger than the inner diameter of the remaining open holes.

According to the present invention, even if the pushed non-conductive silicon portion of the test socket protrudes toward the support member side, the relevant protruding portion can be accommodated by the storage space of the support member. Therefore, the relevant protruding portion does not affect the support member, etc., and accordingly, the inner wall surface constituting the opening hole does not affect the terminal in any way, so that the terminal can be prevented from being damaged.

Hereinafter, preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings. For the sake of brevity of description, known or repeated descriptions of known techniques are omitted or compressed as much as possible. ＜ Test sorting machine ＞

FIG. 3 is a schematic plan configuration diagram of a test sorter 300 according to an embodiment of the present invention.

As shown in FIG. 3, the test sorting machine 300 includes a test tray 310, a first robot 320, a first rotator 330, a test chamber 340, a second rotator 350, and a second robot 360.

The test tray 310 has a plurality of connectors into which semiconductor components can be placed. The test tray 310 circulates along a closed path C as follows: it passes from the first position P1 to the test position TP and the second position P2, and is connected to the first position P1 again. Here, the connector will be separately assigned and described later.

The first robot arm 320 loads the semiconductor element to the test tray 310 located at the first position P1.

The first rotator 330 is used to rotate the test tray 310 on which the semiconductor elements have been loaded into a vertical state.

A test chamber 340 is provided for testing a semiconductor element, which is placed on a test tray 310 in an upright state at a test position TP. For this reason, the inside of the test chamber 340 is maintained in an environmental state based on a test temperature condition of the semiconductor element.

The second rotator 350 is used to rotate the test tray 310 in a vertical state from the test chamber 340 to a horizontal state.

The second robot arm 360 unloads the semiconductor element from the test tray 310 that has come to the second position P2 in a horizontal state.

It should be noted that according to the test temperature conditions, the test tray 310 may be circulated in the reverse direction of the closed path C. In addition, the roles of the first robot 320 and the second robot 360 and the roles of the first rotator 330 and the second rotator 350 are switched at this time.

The description of the example of the plug-in provided in the test tray 310 in the aforementioned test sorter 300 is continued.

<Examples of Plugs>

Referring to the plan view of FIG. 4, the connector IT according to the first embodiment includes a main body IT1, a support member IT2, and a pair of latching devices IT3.

The main body IT1 is formed with an insertion hole IT1a into which a semiconductor element can be inserted.

The support member IT2 supports a semiconductor element inserted into the socket IT1a from the lower side of the socket IT1a. In such a support member in IT2 for open toward the terminal of the semiconductor device tester testing a plurality of socket-side opening hole H _0, H ₁ is formed at a position a position corresponding to the terminals of a semiconductor element.

In addition, as shown in FIG. 5, the inner diameter r0 of the plurality of general open holes H ₀ among the open holes H ₀ and H ₁ has an inner diameter r0 sufficient to allow the terminal T of the semiconductor element to be inserted even in consideration of tolerances. Therefore, the terminal T inserted into the general open hole H ₀ is separated from the inner wall surface constituting the open hole H ₀ to some extent.

In addition, among the open holes H ₀ and H ₁ , a few specific open holes H ₁ located at the corners of the four corners have a function of accurately setting the position of the semiconductor element. For this reason, as shown in FIG. 6, in the relationship between the supporting member IT2 and the test socket TS, for a specific open hole H ₁ , the facing surface (LF; lower surface in FIG. 6) opposite to the test socket TS The inner diameter rL on the) side is large, and the inner diameter rU on the side opposite to the facing surface LF (UF; upper surface in FIG. 6) is smaller than the inner diameter rL on the facing surface LF side. In addition, although the inner diameter rU on the opposite surface UF side is smaller than the inner diameter r0 of the general open hole H ₀ , it is almost the same as or slightly larger than the diameter of the terminal T of the semiconductor element D. Accordingly, the semiconductor element terminal T D is disposed in the connector receptacle IT1a IT, which corresponds to _a specific open pores while specific terminals T H ₁ is inserted into a particular open hole H, the semiconductor element can be accurately set D's position. In addition, in the extraction and enlargement part of FIG. 4, in order to facilitate a clear understanding of the present invention, the size of the specific open hole H _{1 and} the size of the general open hole H ₀ are relatively exaggerated and illustrated.

On the other hand, H constituting the specific surface of the open hole wall IW ₁ has an inner diameter increases toward the surface of the LF becomes large from the opposite surface inclined UF. Therefore, the accommodating space ES is ensured on the LF side of the opposing surface of the support member IT2. Even if the silicon of the test socket TS is pushed and protruded when the terminal T of the semiconductor element contacts the test socket TS, the relevant protruding portion can be accommodated. .

The latch device IT3 is used to maintain a semiconductor element in the jack IT1a.

When the connector IT described above presses the conductive silicon portion CS of the test socket TS as a flexible material when the specific terminal T of the semiconductor element is pressed, as shown in (a) and (b) of FIG. The non-conductive silicon portion NS, which is the pushed flexible material, protrudes toward the support member IT2 side, but the relevant protruding portion PP is accommodated in the accommodation space ES, so that no pressure is applied to the support member IT2. Therefore, there is no hidden danger of damage to the specific terminal T, and the commerciality of the semiconductor element D can be preserved. In addition, in order to sufficiently accommodate the protruding portion PP of the non-conductive silicon site NS in this manner, the inner diameter rL of the facing surface LF side of the specific open hole H ₁ is preferably at least the same or larger than the inner diameter r ₀ of the general open hole H ₀ . .

For reference, if there are too many specific open holes H ₁ , the number of terminals T that can be inserted is increased, so that the second robot 360 may not be able to properly realize the pick-up. Thus, a particular open hole H ₁ is preferably provided in an amount as follows: compared with the number of open pores remaining ships which except H _0, H ₁ specific number of open pores is very small. That is, the number of general open holes H ₀ should be more than the number of specific open holes H ₁ .

<About a modification of a support member>

In the above embodiment, the support member IT2 may be deformed as shown in FIG. 8.

Referring to FIG. 8, the inner wall surface constituting the specific opening hole H ₁ is formed in a stepped shape, so that the LF side of the facing surface of the supporting member IT2 can secure the following storage space ES: Even if the non-conductive silicon, which is a flexible material of the test socket TS, The support member IT2 protrudes from the side, and can also accommodate related protruding parts. Therefore, according to this modification, it is also possible to prevent the terminal T of the semiconductor element D from being damaged by the support member IT2.

In addition, the processing of the support member IT2 as described above can be performed extremely delicately by laser cutting.

For reference, in the present embodiment, a particular open hole H ₁ is formed only at the four corners of the corner portion of the supporting member IT2, however, according to the embodiment, it may be a specific H ₁ open hole is formed at any position. Of course, in any case, the storage space ES needs to be formed on the outer contour of the specific open hole H ₁ side.

As mentioned above, the present invention has been described in detail through the embodiments with reference to the accompanying drawings. However, the above embodiments are only preferred examples of the present invention, so it should not be understood that the present invention is limited to the above embodiments. The scope of patent applications and their equivalent concepts.

IT‧‧‧Socket

IT1‧‧‧ Subject

IT1a‧‧‧jack

IT2‧‧‧ support parts

H ₀ ‧‧‧General open hole / open hole

H ₁ ‧‧‧Specific open hole / open hole

ES‧‧‧ Containment Space

IT3‧‧‧Latching device

1 and 2 are reference diagrams for explaining the related art and its problems.

FIG. 3 is a schematic plan view of a test sorter according to an embodiment of the present invention.

Fig. 4 is a schematic plan view of a connector applied to a test sorter.

FIG. 5 is a reference view of a general open hole provided in a support member of the connector of FIG. 4.

FIG. 6 is a reference diagram regarding a specific open hole provided in a support member of the connector of FIG. 4.

FIG. 7 is a reference diagram for explaining a function of a support member provided in the connector of FIG. 4.

FIG. 8 is a reference diagram for explaining a modification example of the support member applied to the connector of FIG. 4.

no

no

Claims (6)

A connector for a test sorting machine includes a main body formed with a jack capable of inserting a semiconductor element; a support member supporting a semiconductor element inserted into the jack from one side of the jack; and a fixing member that The support member is fixed to the main body; and a latch device for maintaining a semiconductor element in the socket, wherein the support member is formed with a plurality of opening holes for opening a terminal of the semiconductor element toward a tester side. So that the terminals of the semiconductor element supported by the supporting member are in electrical contact with the test socket of the testing machine, the supporting member has a facing surface side facing the test socket of the pressure-sensitive conductive rubber type existing in the testing machine. An accommodation space capable of accommodating the pushed flexible material when the terminal of the semiconductor element contacts the test socket can prevent the pushed flexible material of the test socket from compressing the supporting member, wherein the accommodation space is provided as follows: At least a part of the plurality of open holes is formed such that an inner diameter of the facing surface side is located opposite to the facing surface. The larger the inner diameter of the opposite surface side. As in the connector for a test sorter of claim 1, wherein the inner wall constituting the part of the open hole is inclined from the opposite surface side toward the facing surface side, so that the inside of the facing surface side The diameter is larger than the inner diameter on the opposite surface side. As in the connector for a test sorter of claim 1, wherein the inner wall constituting the part of the open hole is formed in a step shape so that the inner diameter of the facing surface side is larger than the inner diameter of the opposite surface side. A connector for a test sorting machine includes a main body formed with a jack capable of inserting a semiconductor element; a support member supporting a semiconductor element inserted into the jack from one side of the jack; and a fixing member that The support member is fixed to the main body; and a latch device for maintaining a semiconductor element in the socket, wherein the support member is formed with a plurality of opening holes for opening a terminal of the semiconductor element toward a tester side. So that the terminals of the semiconductor element supported by the supporting member are in electrical contact with the test socket of the testing machine, the supporting member has a facing surface side facing the test socket of the pressure-sensitive conductive rubber type existing in the testing machine. An accommodation space capable of accommodating the pushed flexible material when the terminals of the semiconductor element are in contact with the test socket, thereby preventing the pushed flexible material of the test socket from compressing the support member, wherein the accommodation space is formed in the multiple Part of the open holes on the side of the plurality of open holes, and the number of the remaining open holes in the plurality of open holes except the part of the open holes Portion to the number of open pores. As in the connector for a test sorter of claim 4, wherein the inner diameter of the part of the open hole on the opposite side is smaller than the inner diameter of the remaining open holes. The plug-in connector for a test and sorting machine according to claim 5, wherein the inner diameter of the facing surface side of the part of the open holes is the same as or larger than the inner diameter of the remaining open holes.