CN1741261A - Voltage reducing packaged test socket - Google Patents
Voltage reducing packaged test socket Download PDFInfo
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- CN1741261A CN1741261A CN 200410053915 CN200410053915A CN1741261A CN 1741261 A CN1741261 A CN 1741261A CN 200410053915 CN200410053915 CN 200410053915 CN 200410053915 A CN200410053915 A CN 200410053915A CN 1741261 A CN1741261 A CN 1741261A
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- socket
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- type packaging
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Abstract
A decompression socket for packaging test consists of support element for fixing the packaging , multiple socket pins contacting with packaging , support element for fixing socket pins and decompression device being used for lowering pressure between socket pins and packaging to be external pressure of packaging test socket and being equipped with piping to insert into space between socket pins as well as power unit to provide power for having internal air flowed out through piping .
Description
(1) technical field
What the present invention relates to is direct loop encapsulation socket (socket), especially about a kind of decompression type packaging and testing socket of ball grid array package (Ball Grid Array package:BGA package) with test jack.
(2) background technology
Semiconductor element is processed to semiconductor die package through a series of encapsulation engineerings.The semiconductor die package that machines will be passed through the electric checking engineering before being provided to the user; In the above-mentioned electric checking engineering, utilize test jack to check the electrical characteristic of semiconductor die package.Here, test jack is that the electric property in the direct loop of each semiconductor element is connected to device on the tester.
Fig. 1 is the structural map of adding pressure type packaging and testing socket in the prior art.
Above-mentioned adding pressure type packaging and testing socket is made up of loam cake 1, lateral bolster support member 2, low bottom-disc 5, fixed screw 6, fixed disk 7, pressurization disk 8, socket pin 9 as shown in Figure 1.
Adding pressure type packaging and testing socket to said structure is described as follows.
At first, the fixed disk 7 that is fixed with socket pin 9 links to each other with low bottom-disc 5 by fixed screw 6.The lateral bolster support member 2 of fixing encapsulation 3 also links to each other with low bottom-disc from the side.Between above-mentioned lateral bolster support member 2, will encapsulate 3 and be put into low bottom-disc 5 tops.Exert pressure for above-mentioned encapsulation 3, the socket pin 9 of above-mentioned socket and encapsulation ball 4 are contacted, cover pressurization disk 8 and lid 1 then.
Adding pressure type packaging and testing socket with said structure in order to allow encapsulation 3 and socket pin 9 contact, is exerted pressure to pressurization disk 8 when actual engineering; Because this project is manual operation, therefore can't apply a certain size pressure to pressurization disk 8.Therefore, can cause the pressure of pressurization disk 8 can't be communicated to sealing 3 problem appearance on the whole equably.
In addition, contact more securely with socket pin 9, tend to apply excessive pressure, therefore can cause the bigger problem of socket pin 9 wear resistance ratios to occur in order to make above-mentioned encapsulation 3.
Therefore, have the adding pressure type packaging and testing socket of said structure along with the growth of service time, because the abrasion and the uneven pressure of contact between socket and the encapsulation 3, above-mentioned contact state degenerates gradually, so tests bad probability and constantly increase.
In addition, use the seam or the upside-down mounting measure of fixed cover 1 usefulness in order to exert pressure, the therefore process of ON/OFF lid 1 in the test use of adding pressure type packaging and testing socket is become be not easily, and the time loss that at this moment produces has also increased testing expense.
(3) summary of the invention
Purpose of the present invention will solve above-mentioned problems of the prior art exactly, and a kind of decompression type packaging and testing socket is provided, and can dwindle the abrasion of the socket pin contact that contacts with encapsulation, prevents incomplete contact, has reduced the bad probability of test with this.
Another object of the present invention has been removed lid of the prior art exactly, has reduced the operation and the time of separate package from the socket, and the convenience of using is provided, and has saved the testing time.
Another purpose of the present invention is exactly that the testing engineering of operating by hand in the prior art is changed into mechanization, the convenience in the use not only is provided, but also has improved the efficient of packaging and testing sockets.
The object of the present invention is achieved like this, and the decompression type encapsulation socket among the present invention is a socket of checking the encapsulation electrical characteristic, is made up of following parts: the support component of fixing described encapsulation; A most socket pin contact with above-mentioned encapsulation, and carry out current lead-through; The support component of fixing described socket pin; Decompressor drops to the pressure between above-mentioned socket pin and the encapsulation below the above-mentioned socket external pressure, and utilizes above-mentioned socket pin of this air pressure official post and encapsulation to be in contact with one another.
Above-mentioned decompressor is made up of following parts: air assembly sucks the air between above-mentioned socket pin and the encapsulation; Pipeline is inserted in the above-mentioned air assembly, and is applied as the path that inner air is flowed out to the outside; Power set provide relevant power, make inner air pass through the outside portion of above-mentioned pipeline and flow out.
Above-mentioned power set adopt any one in motor or the pump machine.
Above-mentioned air assembly forms the idle space of socket between above-mentioned socket pin, and an end of the idle space of above-mentioned socket top is provided with pore.
Above-mentioned pore is formed at the idle space top center position of above-mentioned socket, perhaps adopts around above-mentioned socket pin structure on every side.
Effect of the present invention:
Tell about as the front, decompression type packaging and testing socket of the present invention has following function.
The first, because encapsulation is not adopted mandatory mode with contacting of socket pin, therefore can reduce the abrasion of socket pin contact, and owing to there is not incomplete contact, the bad probability of test will reduce.
The second, owing to removed lid of the prior art, therefore reduced the operation and the time of separate package from the socket, and not only used and go up conveniently, also saved the testing time.
The 3rd, owing to adopt switch control packaging and testing socket simple to operate, therefore use is gone up convenient.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
(4) description of drawings
Fig. 1 is the demonstration drawing of adding pressure type packaging and testing socket of the prior art.
The a of Fig. 2 is that the 1st embodiment of decompression type packaging and testing socket among the present invention shows drawing.
The b of Fig. 2 is the plane graph of decompression type packaging and testing socket among the present invention the 1st embodiment.
The a of Fig. 3 is that the 2nd embodiment of decompression type packaging and testing socket among the present invention shows drawing.
The b of Fig. 3 is the plane graph of decompression type packaging and testing socket among the present invention the 2nd embodiment.
The symbol description of major part in the accompanying drawing:
1: lid 2: the lateral support parts
3: encapsulation 4: the encapsulation ball
5: low bottom-disc 6: fixed screw
7: fixed disk 8: pressurization disk
9: socket pin 10: pipeline
11: decompression motor 12: the idle space of socket
13: pore
(5) embodiment
With reference to the accompanying drawings, formation and the effect to decompression type packaging and testing socket embodiment of the present invention is elaborated.
The present invention is by forming with lower member:
The support component of fixing described encapsulation;
A most socket pin contact with described encapsulation, and carry out current lead-through;
The support component of fixing described socket pin;
Decompressor drops to the pressure between described socket pin and the described encapsulation below the described test jack external pressure, and utilizes described socket pin of this air pressure official post and described encapsulation to be in contact with one another.
Above-mentioned decompressor is made up of following parts:
Air assembly sucks the air between described socket pin and the encapsulation;
Pipeline is inserted in the described air assembly, and is applied as the path that inner air is flowed out to the outside;
Power set provide relevant power, make inner air pass through above-mentioned described pipeline and flow out to the outside.
Above-mentioned power set adopt any one in motor or the pump machine.
The a of Fig. 2 is the displayed map of decompression type packaging and testing socket the 1st embodiment among the present invention.
Shown in a of Fig. 2, above-mentioned packaging and testing socket is made up of following parts: the support component of fixing encapsulation 3, that is, and the low bottom-disc 5 of lateral bolster support member 2, above-mentioned lateral bolster support member 2 belows; With encapsulation ball 4 a contacted majorities socket pin 9; The support component of fixing above-mentioned socket pin 9, that is, and the fixed screw 6 of fixed disk 7, connection said fixing dish 7 and low bottom-disc 5; The power set that extract the socket inner air adopt decompression motor 11; The pipeline 10 that links to each other with above-mentioned decompression motor 11.
Packaging and testing socket with said structure can utilize decompression motor 11, extracts the air of socket inside to the outside by pipeline 10.
Structure to packaging and testing socket of the present invention illustrates in greater detail below.
Above-mentioned air assembly forms certain space between above-mentioned socket pin 9 shown in Fig. 2 a, it is called the idle space 12 of socket.The top of the idle space 12 of above-mentioned socket is provided with pore 13.And there is pipeline 10 to be inserted in the idle space 12 of above-mentioned socket by the hole on the low bottom-disc 5.Above-mentioned pipeline 10 links to each other with decompression motor 11, if start to reduce pressure motor 11, will by above-mentioned pipeline 10 will encapsulate 3 and socket pin 9 between air be discharged to the outside.
By said process, the air of packaging and testing socket inside is discharged to the outside, and the air pressure of above-mentioned socket inside will be lower than the air pressure of socket outside relatively.Because the draught head between above-mentioned socket is inside and outside, encapsulation ball 4 and socket pin 9 will be in contact with one another, and need not other physical property power from the outside.
Above-mentioned decompression motor 11 is to control (not shown) by switch.
Because said structure can just can be controlled decompression motor 11 by simple switching manipulation, therefore can realize encapsulating the contact naturally between ball 4 and the socket pin 9, but also can keep the optimum contacting state of above-mentioned encapsulation ball 4 and socket pin 9.
The b of Fig. 2 is the decompression type encapsulation socket plane graph among the present invention the 1st embodiment that looks down from above.
As scheming, look down low bottom-disc 5 from above, just can see the shape that forms pore 13 between the socket pin 9.Because above-mentioned pore 13 belows are connected with the idle space 12 of socket, therefore can be discharged to the outside by the pipeline 10 and the air of motor 11 that reduce pressure with socket inside.
The a of Fig. 3 is the 2nd an embodiment displayed map of decompression type encapsulation socket among the present invention.
Shown in a of Fig. 3, above-mentioned packaging and testing socket is made up of lateral bolster support member 2, low bottom-disc 5, socket pin 9, fixed disk 7, fixed screw 6, decompression motor 11, pipeline 10.
The a of Fig. 3 is formed on the pore of air-out around the socket pin 9 of idle space 12 tops of socket on the basis of Fig. 2 structure.
Said structure utilizes pipeline 10 and decompression motor 11 to discharge the encapsulation ball 4 of actual contact and the air between the socket pin 9 shown in a of Fig. 3, makes encapsulation ball 4 more stable with contacting of socket pin 9.(with reference to Fig. 3 circle content)
The b of Fig. 3 is the plane graph of decompression type packaging and testing socket from the present invention the 2nd embodiment that looks down.
As shown in the figure, the pore 13 of low bottom-disc 5 be formed on socket pin 9 around.The below of above-mentioned pore 13 is connected with the idle space 12 of socket, tell about as the front, by with idle space 12 connecting tubes 10 of above-mentioned socket, utilize decompression motor 11 that the air of socket inside is discharged.
In order to reduce the air pressure of socket inside, not only can use the decompression motor, but also can use decompressors such as similar vacuum pump.
Those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, and be not to be used as limitation of the invention, as long as in connotation scope of the present invention, all will drop in the scope of claims of the present invention variation, the modification of the above embodiment.
Claims (5)
1, a kind of decompression type packaging and testing socket is a socket of checking the encapsulation electrical characteristic, it is characterized in that being made up of following parts:
The support component of fixing described encapsulation;
A most socket pin contact with described encapsulation, and carry out current lead-through;
The support component of fixing described socket pin;
Decompressor drops to the pressure between described socket pin and the described encapsulation below the described test jack external pressure, and utilizes described socket pin of this air pressure official post and described encapsulation to be in contact with one another.
2, decompression type packaging and testing socket as claimed in claim 1 is characterized in that:
Described decompressor is made up of following parts:
Air assembly sucks the air between described socket pin and the encapsulation;
Pipeline is inserted in the described air assembly, and is applied as the path that inner air is flowed out to the outside;
Power set provide relevant power, make inner air pass through described pipeline and flow out to the outside.
3, decompression type packaging and testing socket as claimed in claim 2 is characterized in that:
Described power set adopt any one in motor or the pump machine.
4, decompression type packaging and testing socket as claimed in claim 2 is characterized in that:
Described air assembly forms the idle space of socket between described socket pin, and an end of the idle space of described socket top is provided with pore.
5, decompression type packaging and testing socket as claimed in claim 4 is characterized in that:
Described pore is formed at the idle space top center position of described socket, perhaps adopts around described socket pin structure on every side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410053915 CN1741261A (en) | 2004-08-23 | 2004-08-23 | Voltage reducing packaged test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410053915 CN1741261A (en) | 2004-08-23 | 2004-08-23 | Voltage reducing packaged test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1741261A true CN1741261A (en) | 2006-03-01 |
Family
ID=36093558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410053915 Pending CN1741261A (en) | 2004-08-23 | 2004-08-23 | Voltage reducing packaged test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1741261A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105353175A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA packaging test socket |
| CN105589025A (en) * | 2016-03-08 | 2016-05-18 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA package testing socket |
| CN107024605A (en) * | 2016-01-29 | 2017-08-08 | 泰克元有限公司 | Testing, sorting machine plug connector |
-
2004
- 2004-08-23 CN CN 200410053915 patent/CN1741261A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105353175A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA packaging test socket |
| CN105353175B (en) * | 2015-11-22 | 2018-01-05 | 苏州光韵达光电科技有限公司 | A kind of BGA package test jack |
| CN107024605A (en) * | 2016-01-29 | 2017-08-08 | 泰克元有限公司 | Testing, sorting machine plug connector |
| CN107024605B (en) * | 2016-01-29 | 2019-10-22 | 泰克元有限公司 | Testing, sorting machine plug connector |
| CN105589025A (en) * | 2016-03-08 | 2016-05-18 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA package testing socket |
| CN105589025B (en) * | 2016-03-08 | 2018-06-12 | 江苏福田电气有限公司 | A kind of BGA package test jack |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |