CN1253933C

CN1253933C - Test equipment for packed semiconductor elements

Info

Publication number: CN1253933C
Application number: CN 02103593
Authority: CN
Inventors: 廖沐盛; 谢宜璋; 周秀竹
Original assignee: Silicon Integrated Systems Corp
Current assignee: Silicon Integrated Systems Corp
Priority date: 2002-02-07
Filing date: 2002-02-07
Publication date: 2006-04-26
Anticipated expiration: 2022-02-07
Also published as: CN1437239A

Abstract

The present invention discloses a semiconductor package element tester which is used for testing a semiconductor package element. The semiconductor package element tester comprises a conductive element, a first main body, a second main body and a pressing member, wherein the conductive element is provided with a plurality of conductive points which are electrically connected with pins of a semiconductor package element and are arranged on one side of the first main body; the second main body is arranged on the other side of the first main body, the first main body is provided with a first through port, a space which can contain the semiconductor package element is formed in the first main body, the semiconductor package element is positioned in the first through port by the pressing member, and the pressing member is connected with the second main body through the second through port of the second main body. In the present invention, the first main body and the second main body are used for fixing the semiconductor package element, an automatic test classifier is not used, and therefore, the manual test of the semiconductor package element can be carried out conveniently. Pins of the element are electrically connected with a test board through the conductive element, and therefore, bad contact during the test is avoided. Inner frames in different sizes can be used for testing semiconductor package elements in different sizes.

Description

Test equipment for packed semiconductor elements

Technical field

The present invention relates to a kind of test equipment for packed semiconductor elements, particularly about a kind of test equipment for packed semiconductor elements that is applied to manual test.

Background technology

Generally speaking, integrated circuit (IC) chip must be through test to guarantee the quality of semiconductor encapsulated element after through encapsulation.And be that the output that adapts to current semiconductor factory heightens, utilizing automatic test device to come the measuring semiconductor potted element is more efficient mode.

Yet at some special statuss, for example product development test, few products are verified, test products is electrical etc., if specially buy a cover automatic test device for these special statuss are provided with, cost is too high; Deal with these special statuss if divert the automatic test device that produces on the line, then can make the pause of production line and cause waste, and can cause tester's trouble, because the tester may must travel to and fro between different departments, also these testing apparatuss, for example automatic testing and sorting machine may must be moved.In addition, above-mentioned automatic testing and sorting machine is merely able to test at a kind of semiconductor encapsulated element of size usually, in other words, when the semiconductor encapsulated element of needs test has multiple size, just must have many automatic testing and sorting machines to test.

As mentioned above, concerning the tester, the manual type test equipment for packed semiconductor elements has its necessity.In the prior art, the tester utilizes spring probe (spring-loadprobe), for example is the POGO syringe needle, carries out the manual test of semiconductor encapsulated element.Yet after using a period of time, problem such as oxidation and residual scruff can take place and cause loose contact in this spring probe, so the error can cause test the time produces, and then has influenced the result of test.(BGA Package Device) is example with the ball grid array potted element, its pin is the tin ball, so when using above-mentioned spring probe to test, the scruff of meeting residual tin ball on the spring probe, thereby when carrying out testing next time, can can't test exactly because of loose contact.

In sum, how can provide a kind of tester of convenience to carry out the manual test of semiconductor encapsulated element, probe loose contact in the time of can avoiding testing again, but also can be used for testing the test equipment for packed semiconductor elements of different size semiconductor encapsulated element, one of current just important topic.

Summary of the invention

At the problems referred to above, the purpose of this invention is to provide a kind of test equipment for packed semiconductor elements that can conveniently carry out the semiconductor encapsulated element manual test.

Another object of the present invention provides a kind of test equipment for packed semiconductor elements of probe loose contact can avoid testing the time.

Another object of the present invention provides a kind of test equipment for packed semiconductor elements that can be used for testing the different size semiconductor encapsulated element.

For reaching above-mentioned purpose, test equipment for packed semiconductor elements of the present invention comprises a conducting element, one first body, one second body and a pressing member.In the present invention, conducting element has a plurality of conductiving points, first body has one first port, and the conducting element and second body are arranged at the both sides of first port of first body respectively, and therefore the formed space of first port can ccontaining semiconductor potted element.Second body has one second port, and the pressing member is connected with and semiconductor encapsulated element is positioned in first port via second port and second body.From the above, the conductiving point of conducting element is the pin that is used for electrically connecting first semiconductor encapsulated element.In addition, test equipment for packed semiconductor elements of the present invention can also comprise an inside casing, and it is arranged in first port, and inside casing can the different semiconductor encapsulated element of a ccontaining size.

Test equipment for packed semiconductor elements of the present invention also comprises a junction surface and a lower lock block, and the junction surface can engage second body and first body, and lower lock block is connected with in pressing member one end so that the pressing semiconductor encapsulated element.

Because test equipment for packed semiconductor elements of the present invention utilizes first body and second body to establish semiconductor encapsulated element surely, and need not use automatic testing and sorting machine, so can conveniently carry out the manual test of semiconductor encapsulated element.

Again, test equipment for packed semiconductor elements of the present invention utilizes conducting element to be electrically connected the pin and the test board of semiconductor encapsulated element, so the situation of loose contact can avoid the residual test that is caused with the probe oxidation of scruff the time.

In addition, test equipment for packed semiconductor elements of the present invention can utilize the inside casing of different size to locate the semiconductor encapsulated element of different size, so can test the semiconductor encapsulated element of different size.

Description of drawings

The present invention is described in detail below in conjunction with drawings and Examples:

Fig. 1 is a schematic diagram, shows the test equipment for packed semiconductor elements of preferred embodiment of the present invention and the schematic diagram of test board;

Fig. 2 is a schematic diagram, is presented in the test equipment for packed semiconductor elements of preferred embodiment of the present invention the schematic diagram of conducting element, first body and semiconductor encapsulated element;

Fig. 3 is a schematic diagram, is presented in the test equipment for packed semiconductor elements of another preferred embodiment of the present invention the schematic diagram of conducting element, first body, inside casing and semiconductor encapsulated element;

Fig. 4 is a schematic diagram, is presented in the test equipment for packed semiconductor elements of preferred embodiment of the present invention the schematic diagram of second body, pressing member and lower lock block.

Symbol description among the figure:

1 test equipment for packed semiconductor elements

11 conducting elements

111 frame portions

112 conducting films

113 through holes

12 first bodies

121 first ports

122 through holes

13 second bodies

131 second ports

14 pressing members

15 junction surfaces

151 buckling partss

152 fasteners

16 lower lock blocks

161 screws

162 nuts

17 inside casings

18 screws

2 test boards

21 touch the district

22 screws

61 semiconductor encapsulated elements

62 semiconductor encapsulated elements

Embodiment

Hereinafter with reference to relevant drawings, the test equipment for packed semiconductor elements of preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical reference marks.

Please refer to shown in Figure 1ly, the test equipment for packed semiconductor elements 1 of preferred embodiment of the present invention comprises a conducting element 11, one first body 12, one second body 13, a pressing member 14 and a junction surface 15.

Test equipment for packed semiconductor elements 1 is to cooperate the test of carrying out semiconductor encapsulated element with test board (load board) 2.

In the present embodiment, conducting element 11 has a frame portion 111 and a conducting film 112, conducting film 112 can be an elastic conducting film, and wherein be formed with a plurality of conductiving points (as shown in Figure 2), the material of these conductiving points is the good metal of conductivity, for example be gold, and this conductiving point penetrate conducting film 112 and ionization mutually respectively.

First body 12 has one first port 121 with ccontaining semiconductor potted element 61.As shown in Figure 2, the size of the big or small conjunction with semiconductors potted element 61 of first port 121 is so first port 121 can ccontaining just semiconductor encapsulated element 61 with conducting element 11 and second body, 13 formed spaces.And, when semiconductor encapsulated element 61 is placed in first port 121, the pin of semiconductor encapsulated element 61 can contact with conducting film 112, for example, semiconductor encapsulated element 61 is a ball grid array potted element, its pin (tin ball) can be towards conducting element 11, and is electrically connected with the district 21 that touches of test board 2 by the conductiving point of conducting film 112.In addition, test board 2 has a plurality of screws 22, and in the conducting element 11 and first body 12, with respect to being formed with a plurality of through holes 113 and 122 on the position of this screw 22 respectively, therefore screw 18 (as shown in Figure 2) can pass this through hole 113 and 122, and cooperate with screw 22, so that conducting element 11 and first body, 12 spiral shells are located on the test board 2.

In addition, the test equipment for packed semiconductor elements 1 of preferred embodiment of the present invention can also comprise an inside casing 17 (as shown in Figure 3), the peripheral shape of inside casing 17 is to cooperate first port 121, so inside casing 17 can be placed in first port 121 just, and, the size of inside casing 17 central conjunction with semiconductors potted elements 62 is so semiconductor encapsulated element 62 can be placed in the inside casing 17 just.As previously mentioned, when semiconductor encapsulated element 62 was placed in inside casing 17, the pin of semiconductor encapsulated element 62 can contact with the conducting film 112 of conducting element 11.

Comparison diagram 2 can be known understanding with Fig. 3, the size of semiconductor encapsulated element 62 is less than the size of semiconductor encapsulated element 61, for example, the size of semiconductor encapsulated element 61 can be 37.5mm * 37.5mm, the size of semiconductor encapsulated element 62 can be 35mm * 35mm, and with respect to the size of semiconductor encapsulated element, first port 121 is 37.5mm * 37.5mm, inside casing 17 central authorities are 35mm * 35mm, more detailed description, first port 121 can ccontaining semiconductor encapsulated element 61 to test, and when measuring semiconductor potted element 62, must semiconductor encapsulated element 62 can be placed in the inside casing 17 to test prior in first port 121 inside casing 17 being set.All those skilled in the art should understand, the design of above-mentioned inside casing 17 can be decided according to the size of semiconductor encapsulated element 62, for example, the size of semiconductor encapsulated element 62 can be 27mm * 27mm, and corresponding inside casing 17 central authorities are that 27mm * 27mm is so that ccontaining semiconductor encapsulated element 62.As mentioned above, utilize the design of inside casing 17 can test the semiconductor encapsulated element of different size.

Referring again to shown in Figure 1, second body 13 is arranged at first body, 12 tops and has one second port 131, and pressing member 14 is connected with in the central authorities of second body 13 via second port 121.As shown in Figure 4, second port 131 is a screw, be located on second body 13 so pressing member 14 can cooperate with spiral shell with second port 131, and locate aforesaid semiconductor encapsulated element 61 or semiconductor encapsulated element 62 according to the rotation pressing downwards of pressing member 14.

In addition, the test equipment for packed semiconductor elements 1 of preferred embodiment of the present invention also comprises a lower lock block 16, and it utilizes a retaining element to be connected with a end in pressing member 14.In the present embodiment, retaining element is one group of screw 161 and nut 162 (as shown in Figure 4).Therefore, when 14 rotations of pressing member press down, lower lock block 16 is pressing semiconductor encapsulated element 61 (or semiconductor encapsulated element 62) closely, electrically connects so the pin of semiconductor encapsulated element 61 (or semiconductor encapsulated element 62) can be distinguished 21 (contact area) with touching of test board 2 by the conducting film 112 of conducting element 11.

Referring again to shown in Figure 1, the test equipment for packed semiconductor elements 1 of preferred embodiment of the present invention also comprises a junction surface 15, and it engages first body 12 and second body 13, and the mode of its joint can comprise modes such as fastening, spiral shell are established, engaging.Present embodiment is that example is illustrated with the manner.

As Fig. 2 (or Fig. 3) and shown in Figure 4, junction surface 15 comprises buckling parts 151 and fastener 152, wherein, buckling parts 151 is formed at first body, 12 both sides, fastener 152 is formed at second body, 13 both sides, therefore, when placing second body 13 on first body 12, fastener 152 can fasten mutually with buckling parts 151, at this moment, above-mentioned semiconductor encapsulated element 61 or semiconductor encapsulated element 62 can be set in the space (i.e. second port 121) that conducting element 11, first body 12 and second body 13 constituted.

Be noted that, present embodiment is to be that example illustrates the present invention with the manner, in fact, engage the mode of first body 12 and second body 13 and the structure of pressing member 14 and be not limited in this, those skilled in the art should be according to making otherwise to reach identical purpose.

As previously mentioned, because semiconductor encapsulated element can be set in the space that conducting element 11, first body 12 and second body 13 constituted, and the pin of semiconductor encapsulated element is towards conducting element 11, adding first body, 12 spiral shells is located on the test board 2, so, when pressing member 14 downwards fixedly during semiconductor encapsulated element, the pin of semiconductor encapsulated element can electrically connect by the touch district 21 of conducting film 112 with test board 2, therefore, the tester just can carry out the test of semiconductor encapsulated element on test board 2.

In sum, test equipment for packed semiconductor elements of the present invention is to utilize conducting element, first body, second body and pressing member are located semiconductor encapsulated element, and utilize conducting element to be electrically connected the pin and the test board of semiconductor encapsulated element, and the inside casing that utilizes different size is located the semiconductor encapsulated element of different size, therefore, can conveniently carry out the manual test of semiconductor encapsulated element, the situation of loose contact in the time of can avoiding the residual test that is caused with the probe oxidation of scruff again, and can test the semiconductor encapsulated element of different size.

The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the protection range of this patent its equivalent modifications of carrying out or change.

Claims

1, a kind of test equipment for packed semiconductor elements in order to test semiconductor potted element, is characterized in that, comprises:

One conducting element, it has a plurality of conductiving points, so that electrically connect with the pin of this semiconductor encapsulated element;

One first body, it has one first port, and this conducting element is arranged at a side of first port of this first body, and makes the space of ccontaining this semiconductor encapsulated element of first port formation, one energy of this first body;

One inside casing, it is arranged in this first port, so that the semiconductor encapsulated element of ccontaining different size;

One second body, it has one second port, and this second body is arranged at the opposite side of first port of this first body; And

One pressing member is connected with this second body via second port of this second body, in order to this semiconductor encapsulated element is positioned in this first port or this inside casing.

2, test equipment for packed semiconductor elements according to claim 1, it is characterized in that: also comprise: a junction surface, it engages this first body and this second body.

3, as test equipment for packed semiconductor elements as described in the claim 2, it is characterized in that: this junction surface is to engage this first body and this second body with manner.

4, as test equipment for packed semiconductor elements as described in the claim 2, it is characterized in that: this junction surface is to engage this first body and this second body in the mode of being spirally connected.

5, as test equipment for packed semiconductor elements as described in the claim 2, it is characterized in that: this junction surface is to engage this first body and this second body in the engaging mode.

6, test equipment for packed semiconductor elements according to claim 1, it is characterized in that: this conducting element comprises:

One frame portion; And

One conducting film, it is equipped in this frame portion, and this conductiving point is distributed in this conducting film.

7, as test equipment for packed semiconductor elements as described in the claim 6, it is characterized in that: this conducting film is an elastic conducting film.

8, test equipment for packed semiconductor elements according to claim 1 is characterized in that: this pressing member is to move in a spiral manner to press down to locate this semiconductor encapsulated element in this port.

9, test equipment for packed semiconductor elements according to claim 1, it is characterized in that: also comprise: a lower lock block, it is connected with in this pressing member one end with this semiconductor encapsulated element of pressing.

10, as test equipment for packed semiconductor elements as described in the claim 9, it is characterized in that: this lower lock block also comprises a fixed cell, in order to this lower lock block is connected with in this pressing member.

11, test equipment for packed semiconductor elements according to claim 1, it is characterized in that: this test equipment for packed semiconductor elements is arranged on the test board in the spiral shell mode of establishing, and this conductiving point is in order to the district that touches of the pin that electrically connects this semiconductor encapsulated element and this test board.