，M277239 八、新型說明： 【新型所屬之技徇^領域】, M277239 8. Explanation of the new model: [Technology 所属 field of the new model]
本創作係有關一 指一種可以適於各式 體模組。 種晶片屬持導接式記憶體模組，特別 晶片更換應用之晶片壓持導接式記憶 【先前技術】 現今的晶片封裴製程，均於完成產品封裝後，對每一 顆封裝晶片進行檢測，篩選出運作功能穩定或達成效率之 晶片’俾確保品質，降低應用於電子產品的瑕疲率，俾節 錢_固成本。習見晶片測試裝置，參考第十一圖所示 ’具有-電路板1G於板面設有數個晶片承座3Q，於電路板 10-選定邊設有數個訊號接點2Q(金手指），該晶片承座3〇 係可供晶片簡易插拔之座體，於其内部並設有訊號接點40 f扣持裝置與其他構件；藉此將該電路板10以其訊號接點 2〇插接於-主機板或其他檢測設備，即可於所述之數個晶 片承座30中分別置入晶片5〇,俾進行該晶片5〇之品質測試 作業。惟現今半導體封裝技術曰新月異，且具有多種封襄 型式提供電子產品選用，無法使用同一型晶片測試裝置進 仃多種晶片測試作業，不营要求業者隨時改變晶片承座 内。卩之Λ唬接點40、扣持裝置及其他構件設計，若此，不 僅曰加„午夕曰曰片承座設計上的技術瓶頸，且設計多種不 同形態的訊號接點40、扣持裳置及其他構件，將增加制造 、管理上的成本。 另者，習知的記憶體模組，通常為數個記憶晶片直接 焊接於一電路板上組成，因此在其中一記憶晶片損壞或發 生瑕疵時，即難以進行維修更換，誠非良善的設計。 【新型内容】This creation refers to a type of module that can be adapted to various types of body. This type of chip is a lead-on memory module, a special chip-holding lead-on memory for chip replacement applications. [Previous Technology] Today's wafer sealing processes are performed after each product package is tested. , Screen out the stable operation function or achieve the efficiency of the chip 'to ensure quality, reduce the defect rate of electronic products, saving money_solid cost. See the wafer test device, refer to the figure 11 for reference. 'With-circuit board 1G, there are several wafer sockets 3Q on the board surface, and there are several signal contacts 2Q (gold fingers) on the selected side of the circuit board. The socket 30 is a seat body for simple insertion and removal of the chip, and a signal contact 40 f holding device and other components are provided in the socket; thereby, the circuit board 10 is inserted into the circuit board 10 with its signal contact 20. -Main board or other testing equipment, can put wafer 50 in each of the several wafer holders 30, and perform the quality test operation of the wafer 50. However, today's semiconductor packaging technology is changing with each passing day, and there are multiple types of electronic packaging options available for electronic products. It is not possible to use the same type of wafer testing device to perform multiple wafer testing operations, and the industry is not required to change the wafer holder at any time. The design of the contact point 40, the holding device and other components is not only a technical bottleneck in the design of the socket, but also a variety of signal contact 40 and holding devices Placement and other components will increase manufacturing and management costs. In addition, the conventional memory module is usually composed of several memory chips directly soldered to a circuit board, so when one of the memory chips is damaged or a defect occurs, , That is difficult to repair and replace, is not a good design. [New content]
(S 5 ，M277239 本創作主要目的，係在提供一種晶片壓持導接式記憶 體模組，特別藉以電路基板上的插座結構及壓制件之組裝 結構改良，組成一種可插接於主機板應用，或與其他檢測 設備配合成檢測治具之晶片壓持導接式記憶體模組，並達 成晶片組裝結構精簡、方便，且可廣泛適用於各種晶片組 裝應用之效果。 ' 依上述目的，本創作之實施内容係包括 ，一 一 ^ %塔暴板、 數插座及壓制件所組成，其中：該電路基板，係於板面設 有電路、電子τΜ牛等，以及可與插座電性連接之複數電路 接點；該插座’係結合於電路基板供晶片容設之絕緣座體 ，於插座上凹設有-容室，於容室底部設有數導接端子盘 電路基板之數電路接點電性連接，且選定二相對稱外側壁 !有：！部：該壓制件’係一個二端具有被卡擎部及抵制 知之日日固疋疋件，且為可分別對應插座組裝或同時 數插座組裝之形態，藉該被卡擎部與插座之卡擎部相= =即組卿件可抵制一個或數個晶片 令 與導接端子電性連接之晶片壓持導接式記憶體模组。 【實施方式】 兹依附圖實施例將本創作之結構特 目的詳細說明如下： ，、κ作用 參閱附圖所示’本創作所為『晶片壓持導 杈組』，係-種可插接於主機 ^ 合成檢測治具之晶片a持導 曼備配 _ ^ ^ , 伐八口己^體核組，乃知括_雷 路基板1、數插座2及壓制件3所組成，並中電 電路基板1，如第—圖所示，可^卩 板面設有必要的電路、雷早 、 板於其 之複數電路接點，並於選定;^ 插座電性連接 部11 (例如金手指）； 緣3又有可快速插接之電連接(S5, M277239 The main purpose of this creation is to provide a chip-clamping conductive memory module. In particular, the socket structure on the circuit substrate and the assembly structure of the pressed parts are improved to form a pluggable application on the motherboard. Or, it can be combined with other detection equipment to form a wafer holding and guiding memory module of a detection jig, and achieve the effect that the wafer assembly structure is simple, convenient, and can be widely applied to various wafer assembly applications. 'According to the above purpose, this The implementation content of the creation is composed of a ^% tower storm board, several sockets and pressed parts, of which: the circuit board, which is provided with a circuit on the surface of the board, electronic τM cattle, etc., and can be electrically connected to the socket. The plurality of circuit contacts; the socket is an insulating base which is combined with a circuit substrate for accommodating a chip, and a -reservoir is recessed on the socket, and a plurality of circuit contacts on the bottom of the chamber are provided with a plurality of lead terminals. The connection is selected, and the two symmetrical outer walls are selected! There are: Department: The pressing piece 'is a two-end piece with a stuck portion and a resisting knowing day-to-day fixing piece, and can be corresponding to the socket. In the form of assembling or counting sockets at the same time, by the phase of the card engine and the card engine of the socket = = that the assembly can resist one or more chips to make the chip electrically connected to the lead terminal. [Module] [Embodiment] The specific purpose of the structure of this creation will be described in detail in the embodiment of the accompanying drawings as follows: For the role of κ, please refer to the attached drawing. It can be plugged into the host ^ synthetic detection jigs, a guide, and a _ ^ ^, cutting eight mouths ^ body core group, it is known to include _ Lei Lu substrate 1, digital socket 2 and pressed parts 3, The CLP circuit board 1 can be provided with necessary circuits, thunder early, and multiple circuit contacts on the board, as shown in the first figure, and can be selected; ^ The electrical connection portion of the socket 11 (for example (Gold finger); edge 3 has an electrical connection that can be quickly plugged in
M277239 插座2 ’如第二圖至第四圖所示，係結合於電路基板 1板面提供晶片容設之絕緣座體，於插座2上設有一容室 21，於容室21底部設有數導接端子22可與電路基板丄之數 電路接點構成電性連接，且選定插座2二相對稱外側壁處 刀另又有卡掣部23;其中，所述該容室21可為下凹狀或貫 牙至底端狀；該導接端子22可為二排設於容室21底部二側 (如第三圖所示）或四排矩陣或其他排列形態，其内端延 伸於谷至21底部形成為一弧形導接部221，外端延伸於插座 2外形成為一焊接部222;而該卡掣部23可為一體成型於插 座2二相對稱外側壁之倒鉤凸塊231所構成； ”壓制件3，如第二圖至第四圖所示，可為以金屬片沖 壓形成之片體，可為门形片體或其他形狀片體，於壓制件 3相對稱的二端側壁分別設有被卡掣部31，另外二側分別 向下凸設有一抵制塊32，於該抵制塊32底面設有晶片50之 抵制端33 ;其中，所述該被卡掣部31可為匹配所述倒鉤凸 塊231之通孔311 ; 藉上述電路基板i、插座2及壓制件3，即組成該壓 制件3被卡掣部31可與插座2之卡掣部23相匹配組合，可 用壓制件3抵制一晶片5〇於插座2容室21中與導接端子電 性連接之晶片壓持導接式記憶體模組。 參閱第四圖所示，本創作應用實施時，可將晶片5〇一 :置入插座2之容室21中，使其對外導電部與插座2導接 端子22之導接部221接觸形成電性連接，再將壓制件3設於 插座2上，使插座2二外側壁之卡掣部23 (倒鉤凸塊^; )嵌合於壓制件3之被卡掣部31 (通孔311)，即能利用壓 制件3另外二側之抵制端33下壓該晶片5〇，俾達成晶片5〇 固疋及更臻緊密電性連接功能。由於本創作該插座2及壓 制件3組裝結構改良，係使其操作組裝手續及組成結構更 (S： M277239 為精簡，且採以該抵制端33從晶片50頂端下壓形態，不必 因晶片50尺寸稍有改變即變更結構設計，故能廣泛因應各 種晶片50測試時使用，俾進一步降低檢測治具製造及管理 成本。 參閱第五圖所示，本創作該壓制件3亦可實施為同時 能覆蓋多數插座2 —片體結構形態，於選定處設有對應插 座2卡掣部23之被卡掣部31，藉此達成一次組裝該壓件 3，而能同步下壓複數晶片5〇與插座2電性連接功能。又 如第六圖所示，本創作亦可於插座2之導接端子22下方設 有一彈性墊4，藉此保護導接端子22之導接部221，預防= 導接部221被壓縮疲乏，確保其彈性接觸效果。 另參閱第七圖及第八圖所示，本創作該插座2上端係 可黏設有一片或一片以上膠帶6，該壓制件3係可於底面 凸設一抵制塊32，以該抵制塊32底面作為一抵制端33，-藉 此’令該壓制件3結合於插座2上，透過所述膠帶6心 固疋，使抵制塊32可壓持一晶片5〇與插座2電性連接亦 能組成晶片壓持導接式記憶體模組。或參閱第九圖及第十 圖所示，言亥電路基板工選定處係設有複數個定位孔12，而 該壓制件3係構成能覆蓋多數插座2之—片體結構形能， 2制件3底面設有複數個抵制塊32，以各抵制塊咖面 作為-抵制端33，並於壓制件3設有對應電路基板丄其定 位，12之通孔34，藉此應用―鉚釘7穿設於定位孔似通 =二Ϊ壓制件3結合於複數插座2上，並令各抵制塊 = '日日片5G與插座2電性連接，亦能組成晶片麼持導 接式記憶體模組。 確且：本創作『晶片壓持導接式記憶體模組』，已 功;性’其手段之運用亦出於新賴無疑，且 ’一汁目的誠然符合’已稱合理進步至明，為此，依 M277239 法提出新型專利申請，惟懇請鈞局惠予詳審，並賜准專 利為禱，至感德便。M277239 Socket 2 'As shown in the second to fourth figures, it is an insulating base that is integrated with the circuit board 1 to provide chip accommodation. A receptacle 21 is provided on the receptacle 2 and a numerical guide is provided at the bottom of the receptacle 21 The connection terminal 22 can be electrically connected to a number of circuit contacts on the circuit board, and the selected socket 2 has a clamping portion 23 at the outer side wall, and the receiving chamber 21 can be concave. Or the teeth are connected to the bottom end; the connecting terminals 22 may be arranged in two rows on the bottom two sides of the chamber 21 (as shown in the third figure) or in a four-row matrix or other arrangement, and the inner ends thereof extend from the valley to 21 The bottom is formed as an arc-shaped guide portion 221, the outer end of which extends from the socket 2 into a welding portion 222; and the latching portion 23 may be formed by barb protrusions 231 integrally formed on the two opposite outer walls of the socket 2 ; "Pressed part 3, as shown in the second to fourth figures, may be a sheet body formed by stamping a metal sheet, may be a door-shaped sheet body or other shaped sheet body, and is opposite to the two side walls of the pressed part 3 The latched portions 31 are respectively provided, and a resisting block 32 is protruded downwards on the other two sides, and is provided on the bottom surface of the resisting block 32. The resisting end 33 of the sheet 50; wherein, the latched portion 31 may be a through hole 311 matching the barb projection 231; the circuit board i, the socket 2 and the pressing part 3 are used to form the pressing part 3 The latched portion 31 can be matched and combined with the latched portion 23 of the socket 2, and a pressed piece 3 can be used to resist a wafer 50. The wafer held in the socket 2 chamber 21 and electrically connected to the lead terminal holds the conductive memory. Refer to the fourth figure, when this creative application is implemented, the chip 501: can be placed in the receptacle 21 of the socket 2 so that the external conductive part and the conducting part of the conducting terminal 22 of the socket 2 221 contacts to form an electrical connection, and then the pressed part 3 is set on the socket 2 so that the latching part 23 (barb projection ^;) of the two outer side walls of the socket 2 is fitted into the latched part 31 of the pressing part 3 ( The through hole 311), that is, the resisting end 33 on the other two sides of the pressed part 3 can be used to press down the chip 50, thereby achieving the solidification of the chip 50 and a more compact electrical connection function. Due to the creation of the socket 2 and the pressed part 3 The assembly structure is improved to make its operation and assembly procedures and composition structure more simple (S: M277239 is simplified, and the resisting end 33 is taken from the top of the wafer 50 The pressing form does not need to change the structural design due to a slight change in the size of the wafer 50, so it can be widely used in the test of various wafers 50, which further reduces the manufacturing and management costs of the testing fixture. See the fifth figure, the pressed part of this creation 3 can also be implemented to cover most of the sockets 2 at the same time-the structure of the sheet body, at the selected place is provided with the latched portion 31 corresponding to the latching portion 23 of the socket 2 so as to achieve the assembly of the pressing piece 3 at one time, which can be synchronized The multiple chip 50 is electrically connected to the socket 2. As shown in the sixth figure, an elastic pad 4 can be provided under the lead terminal 22 of the socket 2 to protect the lead of the lead terminal 22. Part 221, prevention = The compression part 221 is fatigued, ensuring its elastic contact effect. Referring also to the seventh and eighth figures, the upper end of the socket 2 can be provided with one or more pieces of adhesive tape 6, and the pressing part 3 can be provided with a resisting block 32 on the bottom surface. The bottom surface is used as a resisting end 33, by which the pressing part 3 is bonded to the socket 2 and fixed through the adhesive tape 6 so that the resisting block 32 can hold a chip 50 and be electrically connected to the socket 2 Forms a wafer-clamping conductive memory module. Or referring to the ninth and tenth figures, a plurality of positioning holes 12 are provided at selected locations of the circuit board worker of Yanhai, and the pressed part 3 is configured to cover most of the sockets 2—the structure of the sheet body. The bottom surface of piece 3 is provided with a plurality of resisting blocks 32, each resisting block is used as a resisting end 33, and the pressing part 3 is provided with a corresponding circuit board, its positioning, and 12 through holes 34, thereby applying ―rivets 7 through It is located in the positioning hole like = two pressed parts 3 are combined with a plurality of sockets 2 and each resisting block = 'Japanese-Japanese film 5G is electrically connected to the socket 2 and can also form a chip. A conductive memory module can be formed. . Indeed: In the creation of "Chip-holding lead-in-memory module," the work has been successful; the use of its means is also based on the new era, and the "one juice purpose is indeed in line with it" has been said to be reasonable progress to the clear, Therefore, a new patent application was filed in accordance with the M277239 law, but the Bureau is kindly requested to review it carefully and grant the patent as a prayer.
(S 9 M277239 【圖式簡單說明】 第一圖為本創作晶片檢測治具之立體示意圖。 第二圖為本創作插座及壓制件之組合示意圖。 第三圖為本創作插座及壓制件之分解示意圖。 第四圖為本創作應用實施狀態之示意圖。 之一 〇 之二。 之二。 第五圖為本創作壓制件另一實施例之示意圖。 第六圖為本創作設有彈性墊實施例之示意圖。 第七圖為本創作膠帶黏固壓制件實施例示意圖 第八圖為本創作膠帶黏固壓制件實施例示意圖 第九圖為本創作鉚釘結合壓制件實施例示意圖 第十圖為本創作鉚釘結合壓制件實施例示意圖 第十一圖為習見晶片測試裝置之立體示意圖。 【主要元件符號說明】 電路基板1; 電連接部11 定位孔12 ; 插座2 ; 容室21 ; 導接端子22 ; 導接部221 ; 焊接部222 ; 卡掣部23 ; 倒鉤凸塊231 壓制件3 ; 被卡掣部31 ; 通孔311 ; 抵制塊32 ; 抵制端33 ; 通孔34 ; 彈性墊4 ; 晶片50， 膠帶6 ; 鉚釘7 ;(S 9 M277239 [Schematic explanation] The first picture is a three-dimensional schematic diagram of the creative wafer detection jig. The second picture is a combined schematic diagram of the creative socket and the pressed part. The third picture is the decomposition of the creative socket and the pressed part. Schematic diagram. The fourth diagram is a diagram of the implementation status of the creative application. One of the two. The second diagram. The fifth diagram is a schematic diagram of another embodiment of the pressed part of the creation. The sixth diagram is an embodiment with an elastic pad for the creation. The seventh diagram is the embodiment of the adhesive tape and the pressed part. The eighth diagram is the embodiment of the adhesive tape and the pressed part. The ninth diagram is the embodiment of the rivet and the pressed part. The tenth diagram is the creation. Schematic diagram of the embodiment of the rivet bonded pressed part. The eleventh figure is a three-dimensional schematic diagram of a conventional wafer testing device. [Description of the main component symbols] Circuit board 1; Electrical connection portion 11; Positioning hole 12; Socket 2; Receptacle 21; Leading terminal 22; Leading part 221; welding part 222; latching part 23; barb projection 231 pressing part 3; latched part 31; through hole 311; resisting block 32; resisting end 33; through hole 34; spring Pad 4; wafer 50, the tape 6; 7 rivet;