CN218101250U - Chip structure easy to package and position - Google Patents
Chip structure easy to package and position Download PDFInfo
- Publication number
- CN218101250U CN218101250U CN202221673697.5U CN202221673697U CN218101250U CN 218101250 U CN218101250 U CN 218101250U CN 202221673697 U CN202221673697 U CN 202221673697U CN 218101250 U CN218101250 U CN 218101250U
- Authority
- CN
- China
- Prior art keywords
- groove
- pad
- inserted block
- chip
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model relates to a chip package technical field just discloses an easily encapsulate chip architecture of location, which comprises a housin, the inside of casing is provided with the chip component, there is the pad in the left side of chip component bottom through wire fixed mounting, the left side fixedly connected with fixed block of pad, the holding tank has been seted up at the left top of fixed block, the inner wall fixedly connected with reset spring on holding tank right side, reset spring's left end fixedly connected with inserted block. This chip structure of easy encapsulation location, through setting up reset spring, inserted block and spacing perpendicular groove, press the inserted block of casing one side, make the inserted block move into spacing perpendicular groove from the jack in, make the pad of casing bottom move down, make the inserted block at spacing perpendicular inslot lapse, through reset spring's restoring force effect, make the inserted block play to the jack of below in, make the pad move down the height increase back rigidity, thereby highly adjusting the pad, and then be convenient for the welding operation on pad and circuit board surface.
Description
Technical Field
The utility model relates to a chip package technical field specifically is an easily encapsulate chip architecture of location.
Background
The chip package is a housing for mounting a semiconductor integrated circuit chip, and has functions of mounting, fixing, sealing, protecting the chip, and enhancing the electrothermal performance. The chip package is a bridge for communicating the internal world of the chip with an external circuit, the connection point of the chip is connected to the pin of the package shell by a lead, the pin is connected with other devices by the lead on the printed board, the package plays an important role in CPU and other LSI integrated circuits, the number of the pins is increased, the pin interval is reduced, the weight is reduced, the reliability is improved, and the use is more convenient.
The through groove of chip contact wire one end pad forms with the bottom bonding of chip shell at present, and the installation and the dismantlement operation of pad are convenient inadequately, and the high unable regulation of pad, probably influence the welding operation on pad and circuit board surface. Therefore, it is highly desirable to design a chip structure that is easy to package and position.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides an easy encapsulation location's chip architecture possesses advantages such as location effect is good, easy dismounting and adjustable mounting height, has solved pad and shell bonding mode and has convenient inadequately when installation and dismantlement, and the highly unable regulation of pad, probably influences the problem of pad and circuit board surface welding operation.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip structure of easy encapsulation location, includes the casing, the inside of casing is provided with the chip component, there is the pad in the left side of chip component bottom through wire fixed mounting, the left side fixedly connected with fixed block of pad, the holding tank has been seted up at the left top of fixed block, the inner wall fixedly connected with reset spring on holding tank right side, reset spring's left end fixedly connected with inserted block, the left side at inserted block top sets up to the inclined plane, the jack has been seted up to the left bottom of casing, the left end of inserted block is pegged graft with the inside activity of jack.
Preferably, the mounting groove has been seted up to the left side of casing bottom, the inside looks adaptation of pad and mounting groove, pad and mounting groove internal phase adaptation make the encapsulation positioning effect between casing and the pad reinforcing.
Preferably, the placing groove is formed in the left side of the inner bottom wall of the shell, the lead is movably connected with the inside of the placing groove, the through hole is formed in the right side of the inner bottom wall of the placing groove, the through hole is communicated with the inner top wall of the mounting groove, one end, far away from the chip element, of the lead is movably connected with the inside of the through hole, the lead with the redundant length is placed in the placing groove, and therefore the height of a bonding pad at the bottom of the shell can be conveniently adjusted.
Preferably, the inner wall on the right side of the mounting groove is fixedly connected with a connecting block, the right side of the top of the bonding pad is provided with a groove, the connecting block is movably connected with the inside of the groove, and the bonding pad vertically moves all the time when the height of the bonding pad is adjusted through the inner fit of the connecting block and the groove on the right side of the top of the bonding pad.
Preferably, square groove has been seted up to the left inner wall of mounting groove, the inside looks adaptation in fixed block and square groove through fixed block and the square inslot looks adaptation, makes the encapsulation effect between casing and the pad better.
Preferably, the left inner wall in square groove has been seted up spacing perpendicular groove, the jack communicates with the left inner wall in spacing perpendicular groove, the inside sliding connection in inserted block and spacing perpendicular groove presses the inserted block of casing one side, makes the inserted block move into spacing perpendicular groove from the jack in, makes the pad of casing bottom move down, makes the inserted block slide downwards in spacing perpendicular inslot, the altitude mixture control of the pad of being convenient for.
Compared with the prior art, the utility model provides an easily encapsulate chip structure of location possesses following beneficial effect:
1. this chip structure of easy encapsulation location, through setting up the fixed block, reset spring, inserted block and spacing perpendicular groove, press the inserted block of casing one side, make the inserted block move into in the spacing perpendicular groove from the jack, make the pad of casing bottom move down, make the inserted block at spacing perpendicular inslot lapse, through reset spring's restoring force effect, make the inserted block play to the jack of below in, make the pad move down highly increased back rigidity, thereby highly adjust the pad, and then be convenient for the welding operation on pad and circuit board surface.
2. This chip architecture of easy encapsulation location, through setting up the mounting groove, connecting block and square groove, pad and the interior adaptation of mounting groove, fixed block and square inslot adaptation, the encapsulation effect of casing bottom pad is better, make it move into spacing perpendicular groove from the jack through pressing the inserted block to finally move into completely in the holding tank of fixed block, can take out the pad of casing bottom downwards, replaced the fixed mode that bonds, thereby the installation and the dismantlement of the pad of being convenient for.
Drawings
FIG. 1 is a sectional view of the present invention;
FIG. 2 is an enlarged view of the structure A of FIG. 1 according to the present invention;
fig. 3 is a side view of the structure of the housing part of the present invention.
Wherein: 1. a housing; 2. a chip element; 3. a wire; 4. a pad; 5. a fixed block; 6. accommodating grooves; 7. a return spring; 8. inserting a block; 9. a jack; 10. mounting grooves; 11. a placement groove; 12. a through hole; 13. connecting blocks; 14. a square groove; 15. and limiting vertical grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a chip structure easy to package and position includes a housing 1, a chip component 2 is disposed inside the housing 1, a pad 4 is fixedly mounted on the left side of the bottom of the chip component 2 through a wire 3, a mounting groove 10 is disposed on the left side of the bottom of the housing 1, the pad 4 is adapted to the inside of the mounting groove 10, a placing groove 11 is disposed on the left side of the inner bottom wall of the housing 1, the wire 3 is movably connected to the inside of the placing groove 11, a through hole 12 is disposed on the right side of the inner bottom wall of the placing groove 11, the through hole 12 is communicated with the inner top wall of the mounting groove 10, one end of the wire 3 away from the chip component 2 is movably connected to the inside of the through hole 12, a connecting block 13 is fixedly connected to the inner wall of the right side of the mounting groove 10, a groove is disposed on the right side of the top of the pad 4, the connecting block 13 is movably connected to the inside of the groove, a fixing block 5 is fixedly connected to the left side of the pad 4, a square groove 14 is disposed on the inner wall of the left side of the mounting groove 10, the fixing block 5 is matched with the inside of the square groove 14, the mounting groove 10, the connecting block 13 and the square groove 14 are arranged, the bonding pad 4 is matched with the inside of the mounting groove 10, the fixing block 5 is matched with the inside of the square groove 14, the packaging effect of the bonding pad 4 at the bottom of the shell 1 is better, the bonding pad 4 is moved into the limiting vertical groove 15 from the jack 9 by pressing the inserting block 8 and finally completely moved into the accommodating groove 6 of the fixing block 5, the bonding pad 4 at the bottom of the shell 1 can be downwards taken out, the bonding and fixing mode is replaced, so that the mounting and the dismounting of the bonding pad 4 are convenient, the accommodating groove 6 is arranged at the top at the left side of the fixing block 5, the reset spring 7 is fixedly connected to the inner wall at the right side of the accommodating groove 6, the inserting block 8 is fixedly connected to the left end of the reset spring 7, the left side of the top of the inserting block 8 is arranged as an inclined plane, the jack 9 is arranged at the bottom at the left side of the shell 1, and the left end of the inserting block 8 is movably inserted in the jack 9, spacing perpendicular groove 15 has been seted up to the left inner wall in square groove 14, jack 9 and the left inner wall intercommunication in spacing perpendicular groove 15, the inside sliding connection in inserted block 8 and spacing perpendicular groove 15, set up fixed block 5, reset spring 7, inserted block 8 and spacing perpendicular groove 15, press the inserted block 8 of casing 1 one side, make inserted block 8 move in spacing perpendicular groove 15 from jack 9, make the pad 4 of casing 1 bottom move down, make inserted block 8 slide down in spacing perpendicular groove 15, through reset spring 7's restoring force effect, make inserted block 8 play in the jack 9 of below, make pad 4 move down the height increase after the rigidity, thereby highly adjust pad 4, and then be convenient for the welding operation on pad 4 and circuit board surface.
When the chip structure is used, the insertion block 8 on one side of the shell 1 is pressed, the insertion block 8 moves into the limiting vertical groove 15 from the insertion hole 9, the bonding pad 4 at the bottom of the shell 1 moves downwards, the insertion block 8 slides downwards in the limiting vertical groove 15, the insertion block 8 is bounced to the insertion hole 9 below through the restoring force action of the reset spring 7, the bonding pad 4 moves downwards to be fixed in position after the height is increased, the height of the bonding pad 4 is adjusted, the bonding pad 4 at the bottom of the shell 1 can be taken out downwards due to the fact that the bonding pad 4 is matched with the mounting groove 10 and the fixed block 5 is matched with the square groove 14, the packaging effect of the bonding pad 4 at the bottom of the shell 1 is good, the mounting and dismounting of the bonding pad 4 are facilitated by pressing the insertion block 8, the mounting and dismounting operation of the bonding pad 4 is convenient, the mounting height of the bonding pad 4 can be adjusted, and the welding operation between the bonding pad 4 and a circuit board is facilitated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a chip architecture of easy encapsulation location, includes casing (1), its characterized in that: the inside of casing (1) is provided with chip component (2), wire (3) fixed mounting is passed through in the left side of chip component (2) bottom has pad (4), left side fixedly connected with fixed block (5) of pad (4), holding tank (6) have been seted up at the left top of fixed block (5), inner wall fixedly connected with reset spring (7) on holding tank (6) right side, the left end fixedly connected with inserted block (8) of reset spring (7), the left side at inserted block (8) top sets up to the inclined plane, jack (9) have been seted up to the left bottom of casing (1), the left end of inserted block (8) is pegged graft with the inside activity of jack (9).
2. The chip structure easy to package and position as claimed in claim 1, wherein: mounting groove (10) have been seted up to the left side of casing (1) bottom, pad (4) and the inside looks adaptation of mounting groove (10).
3. The chip structure easy to package and position as claimed in claim 2, wherein: the novel chip component mounting structure is characterized in that a placing groove (11) is formed in the left side of the inner bottom wall of the shell (1), the conducting wire (3) is movably connected with the inside of the placing groove (11), a through hole (12) is formed in the right side of the inner bottom wall of the placing groove (11), the through hole (12) is communicated with the inner top wall of the mounting groove (10), and one end, far away from the chip component (2), of the conducting wire (3) is movably connected with the inside of the through hole (12).
4. The chip structure easy to package and position as claimed in claim 2, wherein: the inner wall on the right side of the mounting groove (10) is fixedly connected with a connecting block (13), the right side of the top of the bonding pad (4) is provided with a groove, and the connecting block (13) is movably connected with the inside of the groove.
5. The chip structure easy to package and position as claimed in claim 2, wherein: square groove (14) have been seted up to the inner wall on mounting groove (10) left, fixed block (5) and the inside looks adaptation in square groove (14).
6. The chip structure easy to package and position as claimed in claim 5, wherein: spacing perpendicular groove (15) have been seted up to the left inner wall in square groove (14), jack (9) and the left inner wall intercommunication in spacing perpendicular groove (15), inserted block (8) and the inside sliding connection in spacing perpendicular groove (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221673697.5U CN218101250U (en) | 2022-07-01 | 2022-07-01 | Chip structure easy to package and position |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221673697.5U CN218101250U (en) | 2022-07-01 | 2022-07-01 | Chip structure easy to package and position |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218101250U true CN218101250U (en) | 2022-12-20 |
Family
ID=84478650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221673697.5U Active CN218101250U (en) | 2022-07-01 | 2022-07-01 | Chip structure easy to package and position |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218101250U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116631951A (en) * | 2023-05-27 | 2023-08-22 | 江苏晟驰微电子有限公司 | Same-side electrode Tvs chip applicable to flip-chip packaging |
-
2022
- 2022-07-01 CN CN202221673697.5U patent/CN218101250U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116631951A (en) * | 2023-05-27 | 2023-08-22 | 江苏晟驰微电子有限公司 | Same-side electrode Tvs chip applicable to flip-chip packaging |
| CN116631951B (en) * | 2023-05-27 | 2023-11-21 | 江苏晟驰微电子有限公司 | Same-side electrode Tvs chip applicable to flip-chip packaging |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1401251B1 (en) | LGA socket contact | |
| US7440286B2 (en) | Extended USB dual-personality card reader | |
| CN100461541C (en) | Structure of a camera module with auto-focus feature and a module connector therefore | |
| TW200731140A (en) | A semiconductor device and a method for manufacturing the same | |
| US6998702B1 (en) | Front edge chamfer feature for fully-molded memory cards | |
| CN218101250U (en) | Chip structure easy to package and position | |
| CN107422804B (en) | Main board assembly | |
| CN218957736U (en) | Patch diode capable of hiding pins | |
| CN217740534U (en) | Intelligent power module | |
| CN110676238B (en) | Integrated circuit packaging shell | |
| JPH0226785B2 (en) | ||
| US7126219B2 (en) | Small memory card | |
| CN215575520U (en) | Testing device for flat pin chip | |
| US20080009153A1 (en) | Semiconductor package and method of making the same | |
| KR100819192B1 (en) | Semiconductor device having signal contacts and high current power contacts | |
| CN210722994U (en) | Packaging structure of electronic element | |
| CN114038804A (en) | Chip packaging structure | |
| CN208539890U (en) | A kind of mobile terminal and its mainboard assembly | |
| KR100338225B1 (en) | Semiconductor device | |
| KR101228628B1 (en) | 5-pin connector which supports the universal serial bus 3.0 and usb memory package comprising such a 5-pin connector | |
| WO2005109498A3 (en) | Cut-out heat slug for integrated circuit device packaging | |
| KR100792146B1 (en) | Semicouductor package | |
| TWM277239U (en) | Chip-pressing and conducting memory module | |
| CN215578509U (en) | Chip packaging device | |
| CN217387141U (en) | Packaging shell structure for electronic chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |