CN217387141U

CN217387141U - Packaging shell structure for electronic chip

Info

Publication number: CN217387141U
Application number: CN202221848324.7U
Authority: CN
Inventors: 孙日东
Original assignee: Beijing Bangzhuoer Microelectronics Co ltd
Current assignee: Beijing Bangzhuoer Microelectronics Co ltd
Priority date: 2022-07-19
Filing date: 2022-07-19
Publication date: 2022-09-06
Anticipated expiration: 2032-07-19

Abstract

The utility model discloses an electronic chip is with encapsulation shell structure, comprising a main body, the up end center department of main part is provided with places the mouth, be provided with a plurality of connection ports on the wall of placing the front and back both sides respectively, it is provided with the heating panel on the lower inner wall of mouth to place, and is a plurality of be provided with the terminal plate on the lower inner wall of connection port respectively, the lower extreme of terminal plate is connected with the connecting wire respectively, and is a plurality of the lower inner wall that a plurality of connection ports were run through respectively to the lower extreme of connecting wire, the lower terminal surface center of main part leans on a plurality of wiring pins of front and back both sides edge difference fixedly connected with. The utility model discloses an inside of placing the mouth in the main part upper end is provided with the heating panel, is provided with the cavity in the inside of installation lid, is provided with a plurality of radiating fin on the lower inner wall of cavity, and the up end of installation lid adopts graphite alkene to make simultaneously, makes it have good radiating effect, improves the security when using.

Description

Packaging shell structure for electronic chip

Technical Field

The utility model relates to a chip package field especially relates to an electronic chip is with encapsulation shell structure.

Background

The shell for installing semiconductor integrated circuit chip has the functions of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also the bridge for communicating the internal world of chip with external circuit, and the contacts on the chip are connected to the pins of the package shell by wires, and these pins are connected with other devices by wires on the printed board. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.

The prior patent (publication number: CN 213242528U) discloses an electronic chip package casing, which comprises a casing, a casing cover and a plurality of solder legs, wherein the solder legs are uniformly distributed on two opposite side walls of the casing, the upper ends of the solder legs are solder terminals, the lower ends of the solder legs are solder ends, the solder ends penetrate out from the lower side of the side walls of the casing, the solder surfaces of the solder terminals are higher than the upper edge of the casing, the lower parts of the solder terminals sink into the casing, the two opposite side walls of the casing are respectively provided with a plurality of lead grooves which are uniformly distributed, and the lead grooves are respectively communicated with one solder wire end; four angles of cap all are equipped with first connecting piece, all are equipped with the second connecting piece on four angles of casing bottom, first connecting piece respectively with one the second connecting piece joint. The utility model aims to provide a: the electronic chip packaging shell has the advantages that the position of the welding wire end is not easy to shift, the shell body is connected with the shell cover in a quick matching mode, time and cost are saved, and working efficiency is improved.

The prior patent (publication number: CN 208521768U) discloses an electronic chip package casing for placing and welding a coil, which comprises a casing main body and PIN legs, wherein the casing main body is made of a thermosetting flame-retardant material, the top of the casing main body is in an open box shape, the casing main body comprises a casing side wall, the PIN legs penetrate through the casing side wall, and the PIN legs at the opening are bonding wire terminals; the wire welding terminal extends towards the side face of the shell main body to form a PIN foot extending end, the PIN foot extending end is provided with a notch structure, and the width of the narrowest part of an opening of the notch structure is smaller than the diameter of a lead terminal of the coil. Because the narrowest width of the opening of the notch structure is smaller than the diameter of the lead terminal of the coil, the lead terminal is clamped in the notch structure of the PIN foot extension end and is very stable, the lead terminal cannot move, the efficiency is high, and the fixation efficiency of the lead terminal is improved by at least ten times compared with the process that the lead terminal is wound on the PIN foot extension end.

However, in the above-mentioned utility model, still have some shortcomings in the in-service use, the supplementary chip heat dissipation that can not be fine in the in-process of electronic chip actual work, two kinds of packaging structure can not carry out good protection to moulding the base plate moreover, lead to electronic chip to damage very easily at the in-process of transportation, provide a packaging shell structure for electronic chip for this.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a packaging shell structure for an electronic chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a packaging shell structure for an electronic chip comprises a main body, wherein a placing opening is formed in the center of the upper end face of the main body, a plurality of connecting ports are formed in the front side wall and the rear side wall of the placing opening respectively, a heat dissipation plate is arranged on the lower inner wall of the placing opening, a plurality of connecting terminal plates are arranged on the lower inner walls of the connecting ports respectively, the lower ends of the connecting terminal plates are connected with connecting wires respectively, the lower ends of the connecting wires penetrate through the lower inner walls of the connecting ports respectively and are communicated with the lower ends, a plurality of connecting pins are fixedly connected to the center of the lower end face of the main body close to the front side edge and the rear side edge respectively, the lower ends of the connecting wires are connected to the upper ends of the connecting pins respectively, movable grooves are formed in the centers of the two inner side walls of the placing opening respectively, clamping holes are formed in one side wall of each of the two movable grooves respectively, and an installation cover is arranged at the upper end of the main body, the lower terminal surface center of installation lid leans on both sides edge to be provided with a plurality of briquetting down respectively, the inside of installation lid is provided with the cavity, the inside of cavity is provided with a plurality of radiating fin, and is a plurality of radiating fin's lower extreme difference fixed connection is on the lower inner wall of cavity, be provided with heat conduction silica gel on the lower terminal surface of installation lid, the lower terminal surface center of installation lid leans on both sides edge fixedly connected with buckle respectively.

As a further description of the above technical solution:

the center of the upper end face of the mounting cover is provided with notches respectively close to the edges of two sides, and the two notches are semicircular.

As a further description of the above technical solution:

the two buckles are mutually matched with the two buckle holes.

As a further description of the above technical solution:

the length of the lower pressing block is slightly shorter than the depth of the connecting port.

As a further description of the above technical solution:

the radiating fins are made of copper-aluminum alloy.

As a further description of the above technical solution:

the shape of wiring pin is the L type.

As a further description of the above technical solution:

the positions of the plurality of lower pressing blocks correspond to the positions of the plurality of connecting ports one to one.

As a further description of the above technical solution:

the upper end face of the mounting cover is made of graphene.

The utility model discloses following beneficial effect has:

the utility model discloses with the current contrast that sets up, the inside through placing the mouth in the main part upper end is provided with the heating panel, is provided with the cavity in the inside of installation lid, is provided with a plurality of radiating fin on the lower inner wall of cavity, and the up end of installation lid adopts graphite alkene to make simultaneously, makes it have good radiating effect, improves the security when using.

The utility model discloses with the current contrast that sets up, through be provided with a plurality of connection ports on placing the two inside walls of mouth around respectively, the terminal surface center has set up a plurality of briquetting down respectively by front and back both sides edge under the installation lid simultaneously, places the pin of chip in the connection port during installation, then cooperates the joint respectively in placing the card hole on the wall of a mouthful both sides through two buckles of installation lid lower extreme, the equipment of being convenient for can play good guard action simultaneously, causes the damage to inside chip when avoiding transporting.

Drawings

Fig. 1 is an isometric view of a package housing structure for an electronic chip according to the present invention;

fig. 2 is a side view of a mounting cover of a package housing structure for an electronic chip according to the present invention;

fig. 3 is a front cross-sectional view of a mounting cover of a package housing structure for an electronic chip according to the present invention;

fig. 4 is a front cross-sectional view of a package housing structure body for an electronic chip according to the present invention;

fig. 5 is an enlarged schematic view of a portion a of fig. 1.

Illustration of the drawings:

1. a notch; 2. installing a cover; 3. pressing the block; 4. a connection port; 5. a wiring pin; 6. a heat dissipation plate; 7. a placement port; 8. buckling; 9. heat conducting silica gel; 10. a cavity; 11. a heat dissipating fin; 12. a terminal lug; 13. a connecting wire; 14. a main body; 15. clamping holes; 16. a movable groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, the present invention provides an embodiment: the utility model provides an electronic chip is with encapsulation shell structure, including main part 14, the up end center department of main part 14 is provided with places mouth 7, be provided with a plurality of connection ports 4 on the wall of placing the front and back both sides respectively of mouth 7, be provided with heating panel 6 on the lower inner wall of placing mouth 7, be provided with terminal plate 12 on the lower inner wall of a plurality of connection ports 4 respectively, the lower extreme of terminal plate 12 is connected with connecting wire 13 respectively, the lower extreme of a plurality of connecting wire 13 runs through the lower inner wall of a plurality of connection ports 4 respectively and leads to the lower extreme, the lower terminal center of main part 14 leans on front and back both sides edge respectively fixedly connected with a plurality of wiring pins 5, the lower extreme of a plurality of connecting wire 13 is connected respectively in the upper end of a plurality of wiring pins 5, wiring pin 5's shape is the L type, two inside wall center departments of placing mouth 7 are provided with movable groove 16 respectively, be provided with card hole 15 on two movable groove 16's the lateral wall respectively.

The upper end of the main body 14 is provided with an installation cover 2, the center of the upper end surface of the installation cover 2 is respectively provided with notches 1 by two side edges, the two notches 1 are both semicircular, the upper end surface of the installation cover 2 is made of graphene, the graphene has good heat dissipation performance, the center of the lower end surface of the installation cover 2 is respectively provided with a plurality of lower pressing blocks 3 by the front and back side edges, the interior of the installation cover 2 is provided with a cavity 10, the interior of the cavity 10 is provided with a plurality of heat dissipation fins 11, the lower ends of the plurality of heat dissipation fins 11 are respectively fixedly connected on the lower inner wall of the cavity 10, the heat dissipation fins 11 are made of copper-aluminum alloy, the lower end surface of the installation cover 2 is provided with heat conduction silica gel 9, so that the heat conduction silica gel has good heat dissipation effect and ensures the safety in use, the center of the lower end surface of the installation cover 2 is respectively and fixedly connected with buckles 8 by the two side edges, and the two buckles 8 are mutually matched with two clamping holes 15, the length of the hold-down block 3 is slightly shorter than the depth of the connection port 4, and the positions of the plurality of hold-down blocks 3 correspond to the positions of the plurality of connection ports 4 one by one.

The working principle is as follows: the utility model relates to a packaging shell structure for electronic chips, a heat dissipation plate 6 is arranged in a placing port 7 at the upper end of a main body 14, a cavity 10 is arranged in a mounting cover 2, a plurality of heat dissipation fins 11 are arranged on the lower inner wall of the cavity 10, the upper end surface of the mounting cover 2 is made of graphene, so that the packaging shell structure has good heat dissipation effect and improves the safety in use, a plurality of connecting ports 4 are respectively arranged on the front inner wall and the rear inner wall of the placing port 7, a plurality of lower pressing blocks 3 are respectively arranged at the lower end surface center of the mounting cover 2 near the front and rear edges, pins of the chip are placed in the connecting ports 4 during mounting, the positions of the plurality of lower pressing blocks 3 and the plurality of connecting ports 4 are in one-to-one correspondence, so that the lower pressing blocks play a pressing role on one corner of the chip, then two buckles 8 at the lower end of the mounting cover 2 are respectively matched and clamped in clamping holes 15 on the two side walls of the placing port 7, the equipment of being convenient for can play good guard action simultaneously, causes the damage to inside chip when avoiding transporting.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims

1. A kind of electronic chip uses the encapsulated shell structure, including the body (14), characterized by: the upper end face center of the main body (14) is provided with a placing port (7), a plurality of connecting ports (4) are respectively arranged on the front side wall and the rear side wall of the placing port (7), a heating panel (6) is arranged on the lower inner wall of the placing port (7), a plurality of connecting terminal plates (12) are respectively arranged on the lower inner walls of the connecting ports (4), the lower ends of the connecting terminal plates (12) are respectively connected with connecting wires (13), the lower ends of the connecting wires (13) respectively penetrate through the lower inner walls of the connecting ports (4) and are communicated to the lower ends, the lower end face center of the main body (14) is fixedly connected with a plurality of wiring pins (5) respectively by the front side edge and the rear side edge, the lower ends of the connecting wires (13) are respectively connected to the upper ends of the wiring pins (5), and the centers of the two inner side walls of the placing port (7) are respectively provided with a movable groove (16), two be provided with card hole (15) on the lateral wall of movable groove (16) respectively, the upper end of main part (14) is provided with installation lid (2), the lower terminal surface center of installation lid (2) is provided with a plurality of briquetting (3) down respectively by front and back both sides edge, the inside of installation lid (2) is provided with cavity (10), the inside of cavity (10) is provided with a plurality of radiating fin (11), and is a plurality of the lower extreme fixed connection respectively of radiating fin (11) is on the lower inner wall of cavity (10), be provided with heat conduction silica gel (9) on the lower terminal surface of installation lid (2), the lower terminal surface center of installation lid (2) is by both sides edge fixedly connected with buckle (8) respectively.

2. The package housing structure for an electronic chip according to claim 1, wherein: the center of the upper end face of the mounting cover (2) is provided with notches (1) by the edges of two sides respectively, and the two notches (1) are semicircular.

3. The package housing structure for an electronic chip according to claim 1, wherein: the two buckles (8) are matched with the two clamping holes (15) mutually.

4. The package housing structure for an electronic chip according to claim 1, wherein: the length of the lower pressing block (3) is slightly shorter than the depth of the connecting port (4).

5. The package housing structure for an electronic chip according to claim 1, wherein: the radiating fins (11) are made of copper-aluminum alloy.

6. The package housing structure for an electronic chip according to claim 1, wherein: the wiring pin (5) is L-shaped.

7. The package housing structure for an electronic chip according to claim 1, wherein: the positions of the plurality of lower pressing blocks (3) correspond to the positions of the plurality of connecting ports (4) one by one.

8. The package housing structure for an electronic chip according to claim 1, wherein: the upper end face of the mounting cover (2) is made of graphene.