CN218513445U

CN218513445U - Low-cost power chip packaging structure

Info

Publication number: CN218513445U
Application number: CN202222905923.4U
Authority: CN
Inventors: 刘佳琳
Original assignee: Shenzhen Mushixin Electronic Technology Co ltd
Current assignee: Shenzhen Mushixin Electronic Technology Co ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-02-21
Anticipated expiration: 2032-10-31

Abstract

The utility model discloses a low-cost power chip packaging structure, including encapsulation seat and encapsulation lid, the both sides integrated into one piece of encapsulation seat has the stabilizer blade that is equidistance structural distribution, and the inside of encapsulation seat agree with and be electric connection's power chip body through the leg between the stabilizer blade, the top integrated into one piece of encapsulation seat inside wall has along the groove, the bottom integrated into one piece of encapsulation lid has the boss of agreeing with along the inslot portion. The utility model discloses encapsulation lid connects at the top of encapsulation seat, and at this moment, the lead screw runs through the through-hole, and the boss agrees with and laminates mutually with the power chip body along the inside in groove, fine promotion the power chip body at the inside stability of encapsulation seat, last lock nut threaded connection presses the encapsulation lid at the top of lead screw for can be convenient for more after the power chip body encapsulation dismantle and encapsulate, processing simple manufacture has reduced the encapsulation cost of power chip body.

Description

Low-cost power chip packaging structure

Technical Field

The utility model relates to a power chip packaging technology field, concretely relates to low-cost power chip packaging structure.

Background

The power chip package is a technique of sealing a power chip in an insulator after the power chip is assembled, the power chip is a chip mounted on a circuit board in an electronic device system and plays roles of conversion, distribution, detection and other power management of electric energy, and is an important element in the electronic device, and the power chip is required to be packaged as a housing for mounting a semiconductor integrated circuit chip during processing, and plays roles of placing, fixing, sealing, protecting the chip and enhancing heat dissipation performance.

If the authorization notice number is CN 216563245U, the authorization notice date is 2022-05-17, the power chip packaging structure comprises a plastic package shell, a chip main body, a bonding wire pin and a power pin, wherein the bonding wire pin and the power pin are arranged oppositely, the power pin comprises a first extension part and a base island, the first extension part is positioned at one side of the base island, the number of the first extension parts is a plurality, one ends of the chip main body, the base island and the bonding wire pin are all embedded in the plastic package shell, the chip main body is attached to the surface of the base island, and the chip main body is electrically connected with the bonding wire pin and the power pin through the bonding wire pin.

At present, the in-process that power chip encapsulated, it was fixed to need adopt the glue encapsulation when fixed chip, was not convenient for pinpoint power chip, has increased the manufacturing cost of packaging body, and the fixed power chip of glue encapsulation dismantles to overhaul very difficultly, has also increased the cost of overhaul simultaneously.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a low-cost power chip packaging structure to solve the above-mentioned weak point among the prior art.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a low-cost power chip packaging structure, includes encapsulation seat and encapsulation lid, the both sides integrated into one piece of encapsulation seat has the stabilizer blade that is equidistant structural distribution, and the inside of encapsulation seat agree with and be electric connection's power chip body through the leg between the stabilizer blade, the top integrated into one piece of encapsulation seat inside wall has along the groove, the bottom integrated into one piece of encapsulation lid has the boss of agreeing with along the inslot portion, and the equal integrated into one piece all around of encapsulation seat top outer wall has the lead screw, the through-hole has all been seted up all around of encapsulation caping portion outer wall, and the top threaded connection that the lead screw runs through the through-hole lateral wall has lock nut.

Furthermore, the center of the outer wall of the bottom of the packaging seat is provided with a slot, a lower radiating fin plate is inserted into the slot, a lower heat conducting plate is integrally formed on the inner wall of the bottom of the packaging seat, and the lower heat conducting plate is attached to the lower radiating fin plate.

Furthermore, the center of the outer walls of the two sides of the lower radiating fin plate is provided with a positioning groove, and the center of the inner walls of the two sides of the slot is integrally formed with a positioning block inserted in the positioning groove.

Furthermore, a communicating groove is formed in the bottom of the boss, a rectangular groove is formed in the communicating groove, a push block extending into the communicating groove is inserted into the communicating groove, and a pressing plate attached to the power chip body is welded to the bottom of the push block.

Furthermore, a limiting plate is welded on the outer wall of the pushing block in the rectangular groove, and a plurality of springs are welded on the outer wall of the top of the limiting plate.

Furthermore, an upper heat conducting plate is welded on the inner wall of the top of the rectangular groove, and an upper radiating fin plate which is attached to the upper heat conducting plate is integrally formed at the center of the top of the packaging cover.

In the technical scheme, the utility model provides a pair of low-cost power chip packaging structure, (1) encapsulation seat and encapsulation lid through setting up, encapsulation lid connects at the top of encapsulation seat, this moment, the lead screw runs through the through-hole, and the boss agrees with and laminates mutually with the power chip body along the inside in groove, fine promotion the power chip body at the inside stability of encapsulation seat, lock nut threaded connection presses the encapsulation lid at the top of lead screw at last, make power chip body can be convenient for more after the encapsulation dismantle and encapsulate, the processing simple manufacture, the encapsulation cost of power chip body has been reduced. (2) Through the boss that sets up, the ejector pad is laminated between ejector pad and the power chip body under the effect of limiting plate and spring, has further promoted stability and the firm nature of power chip body when encapsulation seat is inside. (3) Through last radiating fin board and lower radiating fin board that sets up, lower radiating fin board pegs graft in the inside of slot, at this moment, the locating piece is pegged graft in the inside of constant head tank, the laminating can be evacuated the heat that the power chip body produced for lower radiating fin board through heat-conducting plate transmission down between lower heat-conducting plate and the lower radiating fin board, and the clamp plate, ejector pad limiting plate and spring adopt heat conduction material can evacuate the heat that the power chip body produced for last radiating fin board through last heat-conducting plate transmission, the collocation of going up radiating fin board and lower radiating fin board uses fine radiating effect and the radiating efficiency who has promoted the power chip body.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.

Fig. 1 is a schematic view of a three-dimensional structure provided in an embodiment of the present invention.

Fig. 2 is a schematic diagram of an explosion structure provided in an embodiment of the low-cost power chip package structure of the present invention.

Fig. 3 is a schematic view of a socket structure provided in an embodiment of the low-cost power chip package structure of the present invention.

Fig. 4 is a schematic diagram of a cross-sectional structure of a boss provided in an embodiment of a low-cost power chip package structure of the present invention.

Description of the reference numerals:

1. a package base; 2. a package cover; 3. a leg; 4. a power chip body; 5. along the groove; 6. a lead screw; 7. a boss; 8. an upper heat dissipation fin plate; 9. a through hole; 10. locking the nut; 11. inserting slots; 12. a lower heat dissipating fin plate; 13. positioning blocks; 14. positioning a groove; 15. an upper heat conducting plate; 16. a rectangular groove; 17. a limiting plate; 18. pushing a block; 19. a spring; 20. pressing a plate; 21. a communicating groove; 22. a lower heat conducting plate.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the attached drawings.

As shown in fig. 1-4, the utility model provides a pair of low-cost power chip packaging structure, including encapsulation seat 1 and encapsulation lid 2, the both sides integrated into one piece of encapsulation seat 1 has the stabilizer blade 3 that is equidistance structure distribution, and encapsulation seat 1's inside agree with and be electric connection's power chip body 4 through the leg between 3, the top integrated into one piece of encapsulation seat 1 inside wall has along groove 5, the bottom integrated into one piece of encapsulation lid 2 has agree with at the boss 7 along groove 5 inside, and encapsulation seat 1 top outer wall all around equal integrated into one piece have lead screw 6, through-hole 9 has all been seted up all around of encapsulation lid 2 top outer wall, and lead screw 6 runs through the top threaded connection of through-hole 9 lateral wall has lock nut 10, encapsulation lid 2 cup joints at the top of encapsulation seat 1, lead screw 6 runs through-hole 9, and boss 7 closes and laminates with power chip body 4 in the inside along groove 5, fine promotion power chip body 4 is at the inside stability of encapsulation seat 1, last lock nut 10 threaded connection presses to hold encapsulation lid 2, make power chip 4 agree with encapsulation body can carry out encapsulation chip and the encapsulation body dismantlement simple preparation cost reduction.

The utility model provides a further embodiment, as shown in fig. 2 and 3, slot 11 has been seted up to the center department of package seat 1 bottom outer wall, and peg graft in the inside of slot 11 and have lower radiating fin board 12, integrated into one piece has lower heat-conducting plate 22 on the bottom inner wall of package seat 1, and laminate mutually between lower heat-conducting plate 22 and the lower radiating fin board 12, constant head tank 14 has been seted up to the center department of lower radiating fin board 12 both sides outer wall, and the equal integrated into one piece shaping of center department of slot 11 both sides inner wall has the locating piece 13 of pegging graft in constant head tank 14 inside, lower radiating fin board 12 pegs graft in the inside of slot 11, at this moment, locating piece 13 pegs graft in the inside of constant head tank 14, it can be sparse for lower radiating fin board 12 through heat-conducting plate 22 transmission down to laminate between lower heat-conducting plate 22 and the lower radiating fin board 12 the heat that power chip body 4 produced.

The utility model provides a still another embodiment, as shown in fig. 2 and 4, intercommunication groove 21 has been seted up to the bottom of boss 7, and the inside of intercommunication groove 21 has seted up rectangular channel 16, the inside grafting of intercommunication groove 21 has the ejector pad 18 that extends to the inside of intercommunication groove 21, and the bottom welding of ejector pad 18 has the clamp plate 20 of laminating mutually with power chip body 4, the welding has limiting plate 17 on the outer wall that ejector pad 18 is in the inside of rectangular channel 16, and the welding has a plurality of springs 19 on limiting plate 17's the top outer wall, the welding has last heat-conducting plate 15 on the top inner wall of rectangular channel 16, and the center department integrated into one piece at encapsulation lid 2 top have with last heat dissipation fin board 8 of laminating mutually between last heat-conducting plate 15, ejector pad 18 laminates between ejector pad 20 and power chip body 4 under the effect of limiting plate 17 and springs 19, stability and the fastness when power chip body 4 is inside encapsulation seat 1 have further been promoted, and clamp plate 20, ejector pad 18 limiting plate 17 and springs 19 adopt the heat conduction plate can be scattered the heat that power chip body 4 produced for last heat dissipation fin board 8 transmission for last heat dissipation through last heat dissipation.

The working principle is as follows: the packaging cover 2 is covered on the top of the packaging seat 1, the lead screw 6 penetrates through the through hole 9, the boss 7 fits inside the edge groove 5 and is attached to the power chip body 4, at the moment, the push block 18 pushes the press plate 20 to be attached to the power chip body 4 under the action of the limiting plate 17 and the spring 19, the stability and firmness of the power chip body 4 inside the packaging seat 1 are further improved, the stability of the power chip body 4 inside the packaging seat 1 is improved well, finally, the lock nut 10 is in threaded connection with the top of the lead screw 6 to press the packaging cover 2, the power chip body 4 can be detached and packaged conveniently after being packaged, the processing and manufacturing are simple, the packaging cost of the power chip body 4 is reduced, the lower radiating fin plate 12 is inserted into the inserting groove 11, at the moment, the positioning block 13 is inserted into the positioning groove 14, the lower heat conducting plate 22 is attached to the lower radiating fin plate 12, heat conducting plate 4 can be transferred to the lower radiating fin plate 12 through the lower radiating fin plate 22 to be evacuated, the press plate 20, the push block 18 and the spring 19 can transfer heat generated by the upper radiating fin plate 4 to the lower radiating plate 8 of the power chip body, and the radiating plate 4, and the radiating plate can be used for increasing the radiating efficiency of the radiating chip.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

Claims

1. The utility model provides a low-cost power chip packaging structure, is including encapsulation seat (1) and encapsulation lid (2), its characterized in that, the both sides integrated into one piece of encapsulation seat (1) have stabilizer blade (3) that are equidistant structure and distribute, and the inside of encapsulation seat (1) agree with and be electric connection's power chip body (4) through the leg between stabilizer blade (3), the top integrated into one piece of encapsulation seat (1) inside wall has along groove (5), the bottom integrated into one piece of encapsulation lid (2) has and agrees with boss (7) inside along groove (5), and the equal integrated into one piece all around of encapsulation seat (1) top outer wall has lead screw (6), all around of encapsulation lid (2) top outer wall through-hole (9) have all to seted up, and lead screw (6) run through the top threaded connection of through-hole (9) lateral wall has lock nut (10).

2. The package structure of a low-cost power chip as claimed in claim 1, wherein a slot (11) is formed in a center of an outer wall of a bottom of the package base (1), a lower heat dissipation fin plate (12) is inserted into the slot (11), a lower heat conduction plate (22) is integrally formed on an inner wall of the bottom of the package base (1), and the lower heat conduction plate (22) is attached to the lower heat dissipation fin plate (12).

3. The package structure of claim 2, wherein the lower heat sink fin plate (12) has a positioning groove (14) formed at the center of the outer walls at both sides thereof, and the slot (11) has a positioning block (13) integrally formed at the center of the inner walls at both sides thereof and inserted into the positioning groove (14).

4. The low-cost power chip packaging structure according to claim 1, wherein a communication groove (21) is formed in the bottom of the boss (7), a rectangular groove (16) is formed in the communication groove (21), a push block (18) extending into the communication groove (21) is inserted into the communication groove (21), and a pressing plate (20) attached to the power chip body (4) is welded to the bottom of the push block (18).

5. The low-cost power chip packaging structure according to claim 4, wherein a limiting plate (17) is welded on the outer wall of the pushing block (18) inside the rectangular groove (16), and a plurality of springs (19) are welded on the outer wall of the top of the limiting plate (17).

6. A low cost power chip package structure as claimed in claim 4, wherein the inner wall of the top of said rectangular groove (16) is welded with an upper heat conducting plate (15), and the center of the top of the package cover (2) is integrally formed with an upper heat dissipating fin plate (8) attached to the upper heat conducting plate (15).