CN217881476U

CN217881476U - Semiconductor packaging structure

Info

Publication number: CN217881476U
Application number: CN202221092037.8U
Authority: CN
Inventors: 周伟伟; 张志�; 唐怀军
Original assignee: Nanjing Weipan Microelectronics Co ltd
Current assignee: Nanjing Weipan Microelectronics Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-11-22
Anticipated expiration: 2032-05-09

Abstract

The utility model belongs to the technical field of the semiconductor package, especially, be a semiconductor package structure, including drain pan, ventilation piece, chip, top shell and radiating piece, fixedly connected with ventilation piece in the cavity of drain pan, the chip is installed to ventilation piece top, the setting is connected in drain pan and top shell cooperation. The utility model discloses a set up the drain pan, the ventilation piece, the chip, top shell and radiating piece, through the cooperation design, the device need not to carry out the processing of plastic envelope technology, the time that the plastic envelope needs the cooling design when saving the device encapsulation, improve production efficiency, through the mutual lock setting of drain pan and top shell, can be convenient carry out fast assembly with the chip, the device's radiating effect has the promotion that is showing than traditional semiconductor, the cooperation in heat-conducting plate and ventilation hole is passed through at the back of chip, can loose chip back temperature, the chip openly can be with temperature conduction diffusion through the radiating piece, improve whole radiating effect.

Description

Semiconductor packaging structure

Technical Field

The utility model relates to a semiconductor package technical field specifically is a semiconductor packaging structure.

Background

The semiconductor industry is moving towards an advanced copper hybrid bonding process, which is a process where chip passivation layer bonding occurs at room temperature and copper connections occur during high temperature annealing.

However, the existing semiconductor package has the following defects: when packaging is carried out, a plastic packaging process is needed to process, a certain period is needed for cooling and solidifying the plastic packaging material, the production process is delayed, and the packaging process can lead to poor heat dissipation of a chip in a semiconductor, is not beneficial to long-time operation and use and can lead to high-temperature damage.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a semiconductor packaging structure has solved semiconductor package production shaping cycle length and the relatively poor problem of semiconductor radiating effect.

(II) technical scheme

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

the utility model provides a semiconductor packaging structure, includes drain pan, ventilation piece, chip, top shell and radiating piece, fixedly connected with ventilation piece in the cavity of drain pan, the chip is installed to ventilation piece top, the drain pan is connected the setting with the cooperation of top shell, the cooperation is provided with the radiating piece on the top shell.

Furthermore, a sealing groove is formed in the bottom shell, an inserting hole is formed in the sealing groove, a connecting hole is formed in one side of the bottom shell, and the bottom shell is symmetrically provided with vent holes.

Further, the ventilation part comprises a heat conducting sheet, a limiting block and a heat conducting plate, the heat conducting sheet is fixedly connected to the bottom shell, the limiting block is fixedly connected to the bottom shell on one side of the heat conducting sheet, and the heat conducting plate is fixedly connected to the upper portion of the heat conducting sheet.

Furthermore, one end integrated into one piece of chip is provided with the connector, the connector is connected the setting with the pin cooperation, the pin cooperation is pegged graft in the connecting hole.

Furthermore, the top shell is provided with a mounting groove, the top shell is fixedly connected with bayonet locks at equal intervals, and the bayonet locks are matched with the insertion holes and are connected with each other.

Furthermore, the radiating piece comprises heating panel and heat dissipation fin, the heating panel cooperation sets up in the mounting groove, equidistant heat dissipation fin that is provided with on the heating panel.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor packaging structure possesses following beneficial effect:

the utility model discloses a set up the drain pan, the ventilation piece, the chip, top shell and radiating piece, through the cooperation design, the device need not to carry out the processing of plastic envelope technology, the time that the plastic envelope needs the cooling design when saving the device encapsulation, improve production efficiency, through the mutual lock setting of drain pan and top shell, can be convenient carry out fast assembly with the chip, the device's radiating effect has the promotion that is showing than traditional semiconductor, the cooperation in heat-conducting plate and ventilation hole is passed through at the back of chip, can loose chip back temperature, the chip openly can be with temperature conduction diffusion through the radiating piece, improve whole radiating effect.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall split structure of the present invention;

FIG. 3 is a schematic structural view of the bottom case and the ventilation member of the present invention;

fig. 4 is a schematic structural view of the top case and the heat sink of the present invention.

In the figure: 1. a bottom case; 101. a sealing groove; 102. inserting holes; 103. connecting holes; 104. a vent hole; 2. a ventilation member; 201. a heat conductive sheet; 202. a limiting block; 203. a heat conducting plate; 3. a chip; 301. a connector; 302. a pin; 4. a top shell; 401. mounting grooves; 402. a bayonet lock; 5. a heat sink; 501. a heat dissipation plate; 502. and a heat dissipation fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Examples

As shown in fig. 1-4, an embodiment of the present invention provides a semiconductor package structure, which includes a bottom case 1, a ventilation element 2, a chip 3, a top case 4 and a heat dissipation element 5, wherein the ventilation element 2 is fixedly connected in a cavity of the bottom case 1, the chip 3 is installed above the ventilation element 2, the bottom case 1 and the top case 4 are connected in a matching manner, the heat dissipation element 5 is arranged on the top case 4 in a matching manner, when the device is packaged, the bottom shell 1 and the top shell 4 are mutually buckled and connected, plastic package cooling and shaping are not needed, the subassembly is produced and finally assembled at the same time, the production efficiency can be improved, the production period can be reduced, in assembling, the chip 3 is placed over the heat conductive plate 203, the pins 302 are inserted into the connection holes 103, the pin 302 is soldered on the connector 301 by soldering, so that the pin 302 is connected with the chip 3 in a matching manner, then one side of the bayonet lock 402 on the top shell 4 is aligned with the sealing groove 101 for inserting, so that the bayonet lock 402 is matched, connected and clamped with the inserting hole 102, the whole device is assembled, the whole packaging step is simple, the feasibility is high, the production of the top shell 4 and the bottom shell 1 can be carried out while the chip 3 is produced, the whole production efficiency is improved, the heat conducting plates 201 are arranged below the heat conducting plates 203 below the chip 3, the bottom shell 1 on two adjacent heat conducting plates 201 is symmetrically provided with the vent holes 104, can make the device intracavity form through ventilation hole 104 and ventilate, through the circulation of air, can cool down the temperature on conducting strip 201 and the heat-conducting plate 203, can play the effect of cooling for the device, the heat dissipation piece 5 at top utilizes heating panel 501 and heat dissipation fin 502 and air contact equally, carries out the heat dissipation to chip 3 top, the reasonable encapsulation of overall design structure is simple, improves the feasibility, accelerate production efficiency.

As shown in fig. 3, in some embodiments, a sealing groove 101 is formed in the bottom case 1, an insertion hole 102 is formed in the sealing groove 101, a connection hole 103 is formed in one side of the bottom case 1, ventilation holes 104 are symmetrically formed in the bottom case 1, the sealing groove 101 can enable the device to achieve a good sealing effect when the top case 4 is clamped on the bottom case 1, the insertion hole 102 is used for being connected with a clamping pin 402 in a clamping manner, the connection hole 103 is used for the insertion of a pin 302, the ventilation holes 104 can enable the internal air of the device to circulate, the overall heat dissipation efficiency is improved, and it is ensured that the device cannot be damaged due to high temperature.

As shown in fig. 3, in some embodiments, ventilation member 2 is by conducting strip 201, stopper 202 and heat-conducting plate 203 constitute, conducting strip 201 fixed connection is on drain pan 1, fixedly connected with stopper 202 on the drain pan 1 of conducting strip 201 one side, conducting strip 201 top fixedly connected with heat-conducting plate 203, conducting strip 201 and heat-conducting plate 203 can absorb the temperature that chip 3 produced and diffuse, through the air of circulation, will go the temperature, play the purpose of high-efficient cooling, stopper 202 is used for restricting chip 3 mounted position on drain pan 1 the space can not appear, lead to encapsulating back chip 3 to rock and damage.

As shown in fig. 2, in some embodiments, a connector 301 is integrally formed at one end of the chip 3, the connector 301 is connected to the pin 302 in a matching manner, and the pin 302 is inserted into the connection hole 103 in a matching manner, so that the overall design of the chip 3 meets the design requirement and ensures normal use of the function.

As shown in fig. 4, in some embodiments, a mounting groove 401 is formed in the top shell 4, the bayonet pins 402 are fixedly connected to the top shell 4 at equal intervals, the bayonet pins 402 are connected with the insertion holes 102 in a matching manner, and the top shell 4 can be sealed on the bottom shell 1 by the design of the bayonet pins 402, so that a packaging effect is ensured, a conventional plastic packaging process is not required, and the overall production efficiency is improved.

As shown in fig. 4, in some embodiments, the heat dissipation member 5 is composed of a heat dissipation plate 501 and heat dissipation fins 502, the heat dissipation plate 501 is disposed in the mounting groove 401 in a matching manner, the heat dissipation fins 502 are disposed on the heat dissipation plate 501 at equal intervals, and by the design of the heat dissipation member 5, the temperature at the top of the chip 3 can be rapidly cooled, so that the use effect of the whole device is improved, and the heat dissipation member is not damaged due to high temperature generated during use.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor package structure, includes drain pan (1), ventilation piece (2), chip (3), top shell (4) and heat-radiating piece (5), its characterized in that: fixedly connected with ventilates piece (2) in the cavity of drain pan (1), chip (3) are installed to ventilation piece (2) top, the setting is connected in drain pan (1) and top shell (4) cooperation, the cooperation is provided with radiating piece (5) on top shell (4).

2. The semiconductor package structure of claim 1, wherein: the improved structure is characterized in that a sealing groove (101) is formed in the bottom shell (1), a splicing hole (102) is formed in the sealing groove (101), a connecting hole (103) is formed in one side of the bottom shell (1), and ventilation holes (104) are symmetrically formed in the bottom shell (1).

3. The semiconductor package structure of claim 1, wherein: the ventilation part (2) comprises a heat conducting sheet (201), a limiting block (202) and a heat conducting plate (203), the heat conducting sheet (201) is fixedly connected to the bottom shell (1), the limiting block (202) is fixedly connected to the bottom shell (1) on one side of the heat conducting sheet (201), and the heat conducting plate (203) is fixedly connected to the upper portion of the heat conducting sheet (201).

4. The semiconductor package structure of claim 1, wherein: one end integrated into one piece of chip (3) is provided with connector (301), connector (301) and pin (302) cooperation are connected the setting, pin (302) cooperation is pegged graft in connecting hole (103).

5. The semiconductor package structure of claim 1, wherein: the top shell (4) is provided with a mounting groove (401), the top shell (4) is fixedly connected with bayonet pins (402) at equal intervals, and the bayonet pins (402) are matched with the plug holes (102) to be connected.

6. The semiconductor package structure of claim 1, wherein: the heat dissipation piece (5) comprises heating panel (501) and heat dissipation fin (502), the cooperation of heating panel (501) sets up in mounting groove (401), equidistant heat dissipation fin (502) that are provided with on heating panel (501).