CN219553625U

CN219553625U - CPC encapsulation lead frame

Info

Publication number: CN219553625U
Application number: CN202320522427.2U
Authority: CN
Inventors: 高伋
Original assignee: Wuhan Shirui Control System Co ltd
Current assignee: Wuhan Shirui Control System Co ltd
Priority date: 2023-03-14
Filing date: 2023-03-14
Publication date: 2023-08-18
Anticipated expiration: 2033-03-14

Abstract

The utility model relates to the technical field of CPC packaging, and discloses a CPC packaging lead frame which comprises a frame, wherein one side of the inside of the frame is provided with a plurality of high-power pins which are connected at equal intervals, the other side of the inside of the frame is provided with a plurality of low-power pins, one ends of the high-power pins and the low-power pins, which are far away from the frame, are connected with pins, the other two sides of the inside of the frame are fixedly connected with connecting pieces, two adjacent sides of the two connecting pieces are connected with connecting strips, a base island is commonly connected between the connecting strips, so that the space of the mounting positions among the pins is larger when the frame is mounted, the connection between the base island and the frame is more stable through the arrangement of the connecting strips and the connecting pieces, and the service life of the frame is prolonged when the frame is mounted.

Description

CPC encapsulation lead frame

Technical Field

The utility model relates to the technical field of CPC packaging, in particular to a CPC packaging lead frame.

Background

The chip package is a technology for packaging an integrated circuit by using insulating plastic or ceramic materials, plays roles of placing, fixing, sealing, protecting a chip and enhancing heat conduction performance, and is a bridge for communicating the world inside the chip with an external circuit.

The prior lead frame with the publication number of CN217158179U comprises a frame body, wherein a base island for supporting a chip is arranged in the middle of the frame body, pins for connecting the chip are arranged on the periphery of the base island, so that high-power pins on one side of the lead frame are sparse, low-power pins are arranged more tightly, wider pins can be arranged for connection with the lead frame while heat dissipation is facilitated, the resistance of the pins is reduced, and the heat generation of the high-power pins is reduced.

However, although the high-power pins and the low-power pins in the device are distributed according to different arrangements, when the lead frame is connected with the chip, the mutual distances among the pins connected with the pins are similar, the heat dissipation performance is improved but is not obvious, and the connection part between the base island and the lead frame is weak, so that the possibility of breakage of the base island is easily caused after the chip is pressed and connected.

Accordingly, based on the above technical problems, it is necessary for those skilled in the art to develop a CPC package lead frame.

Disclosure of Invention

The present utility model is directed to a CPC package leadframe, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: including the frame, inside one side of frame is provided with equidistant a plurality of high-power stitch of connection, the inside opposite side of frame is provided with a plurality of low-power stitch, and is a plurality of high-power stitch and low-power stitch keep away from the one end of frame all are connected with the pin, the inside other both sides of frame all fixedly connected with connection piece, and two the adjacent one side of connection piece is connected with the connecting band, and is a plurality of be connected with a base island jointly between the connecting band, the frame is connected through the frame junction in low-power stitch one side, outside one side rigid coupling of frame has the outer pin.

Preferably, in order to facilitate the installation of the frame, a plurality of connecting holes are formed on the outer surface of the frame.

Preferably, for heat dissipation of the frame after installation, the pins on the high power pin side and the pins on the low power pin side are distributed in parallel.

Preferably, in order to improve heat dissipation of the frame, heat dissipation fins are embedded in the two connecting pieces, and the heat dissipation fins are located between the base island and the frame.

Preferably, for better pin arrangement, the high power pins and the low power pins are respectively located at two sides of the base island.

Preferably, in order to improve the connection stability between the base island and the frame, the shape of the connecting sheet and the shape of the connecting belt are both rectangular.

Compared with the prior art, the utility model has the beneficial effects that:

(1) Through the high-power stitch and low-power stitch structure design, the space of the installation positions among the pins is larger when the frame is installed, and the connection between the base island and the frame is more stable through the arrangement of the connecting belt and the connecting sheet, so that the service life of the frame is prolonged when the frame is installed.

(2) Through the structural design of the radiating fin, the overall heat radiation performance of the frame is improved after the frame is installed.

(3) Through the structural design of the connecting belt, the connection stability between the base island and the frame is improved conveniently.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

In the reference numerals: 1. a frame; 2. high power pins; 3. a connecting sheet; 4. a heat sink; 5. a connecting belt; 6. a low power pin; 7. a frame joint; 8. an outer pin; 9. a base island; 10. a connection hole; 11. pins.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.

Referring to fig. 1, the present utility model provides a CPC package lead frame technical solution: including frame 1, the inside one side of frame 1 is provided with equidistant a plurality of high-power stitch 2 of connection, the inside opposite side of frame 1 is provided with a plurality of low-power stitch 6, and is a plurality of high-power stitch 2 and low-power stitch 6 keep away from the one end of frame 1 and all are connected with pin 11, the inside other both sides of frame 1 all fixedly connected with connection piece 3, and two the adjacent one side of connection piece 3 is connected with connecting band 5, and is a plurality of be connected with a base island 9 jointly between the connecting band 5, frame 1 passes through frame junction 7 in low-power stitch 6 one side and is connected, outside one side rigid coupling of frame 1 has outer pin 8, through a plurality of high-power stitch 2 and pin 11 on low-power stitch 6 range for when being connected with the chip, and through the connection of connection piece 3 and connecting band 5, make the connection of base island 9 and frame 1 more stable, when base island 9 and chip are connected, be difficult for with frame 1 and connect the cracked problem.

In order to facilitate the installation of the frame 1, a plurality of connection holes 10 are formed on the outer surface of the frame 1.

In order to improve the better heat dissipation of the pins 11 after the frame 1 is mounted, the pins 11 on the high power pin 2 side and the pins 11 on the low power pin 6 side are distributed in parallel.

In order to further dissipate heat from the whole frame 1 after the frame 1 is mounted, the heat dissipation fins 4 are embedded in the two connecting pieces 3, and the heat dissipation fins 4 are located between the base island 9 and the frame 1.

In order to facilitate the arrangement of the positions of the plurality of pins 11, the high power pins 2 and the low power pins 6 are respectively located at two sides of the base island 9.

In order to better increase the stability of the connection between the base island 9 and the frame 1, the shape of the connecting sheet 3 and the connecting belt 5 are both rectangular, so that the connection between the base island 9 and the frame 1 is not easy to break when the base island is installed.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a CPC encapsulation lead frame, includes frame (1), its characterized in that, inside one side of frame (1) is provided with equidistant a plurality of high-power stitch (2) of connection, the inside opposite side of frame (1) is provided with a plurality of low-power stitch (6), and is a plurality of the one end that frame (1) was kept away from to high-power stitch (2) and low-power stitch (6) all is connected with pin (11), the inside other both sides of frame (1) all fixedly connected with connection piece (3), and two adjacent one side of connection piece (3) is connected with connecting band (5), and is a plurality of be connected with a base island (9) jointly between connecting band (5), frame (1) is connected through frame junction (7) in low-power stitch (6) one side, outside one side rigid coupling of frame (1) has outer pin (8).

2. The CPC package leadframe of claim 1, wherein: a plurality of connecting holes (10) are formed in the outer surface of the frame (1).

3. The CPC package leadframe of claim 1, wherein: the pins (11) on one side of the high-power pin (2) and the pins (11) on one side of the low-power pin (6) are distributed in parallel.

4. The CPC package leadframe of claim 1, wherein: the inside of two connection piece (3) all inlays and is equipped with fin (4), just fin (4) are located between base island (9) and frame (1).

5. The CPC package leadframe of claim 1, wherein: the high-power pins (2) and the connecting sheet (3) are respectively positioned at two sides of the base island (9).

6. The CPC package leadframe of claim 1, wherein: the connecting sheet (3) and the connecting belt (5) are both rectangular.