CN220106576U - High-performance ceramic-based LED device - Google Patents
High-performance ceramic-based LED device Download PDFInfo
- Publication number
- CN220106576U CN220106576U CN202321073421.8U CN202321073421U CN220106576U CN 220106576 U CN220106576 U CN 220106576U CN 202321073421 U CN202321073421 U CN 202321073421U CN 220106576 U CN220106576 U CN 220106576U
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- China
- Prior art keywords
- led device
- ceramic substrate
- radiator
- light
- chip
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- 239000000919 ceramic Substances 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 4
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- -1 luminescent chip Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides a high-performance ceramic-based LED device, which comprises an LED device body and a radiator, wherein the LED device body comprises a ceramic substrate and a light-emitting chip, the ceramic substrate is fixed on the front surface of the radiator, a plurality of radiating fins are arranged on the back surface of the radiator, a plurality of light-emitting chips which are sequentially connected in series are arranged on the ceramic substrate, output ends connected under the ceramic substrate pass through corresponding through holes on the radiator, the bottom end of the light-emitting chip is arranged on the ceramic substrate through a fixed wafer, and the top end of the light-emitting chip is fixed on the ceramic substrate through a connecting wire and a welding piece. The beneficial effects of the utility model are as follows: the LED device body and the radiator are directly connected, so that the heat radiation performance of the LED device is improved; and the ceramic substrate, the solid chip and the bonding wire chip are all provided with grooves at the joints, so that the heat generated by the LED device can be quickly released, and the service performance of the LED device is improved.
Description
Technical Field
The utility model belongs to the technical field of LED devices, and particularly relates to a high-performance ceramic-based LED device.
Background
The existing LED device mainly comprises an LED support, an LED chip and a packaging layer, wherein the LED chip is fixed on the LED support, and after bonding wires are completed, the packaging layer for coating the LED chip is formed through injection molding packaging glue. In the current use process of the LED device, the heat dissipation effect is not ideal, the heat dissipation is not timely, the normal use of the device is affected, and the use performance is reduced.
Disclosure of Invention
The utility model aims to provide a high-performance ceramic-based LED device which can quickly release heat generated by the device, prolong the entry of water vapor into an internal path and improve the performance of the device, and is particularly suitable for being used in an outdoor environment.
The technical scheme of the utility model is as follows: the utility model provides a high performance ceramic base LED device, includes LED device body, radiator, LED device body include ceramic substrate, luminescent chip, ceramic substrate fix the front at the radiator, the back of radiator be equipped with a plurality of fin, ceramic substrate on be equipped with a plurality of luminescent chips that establish ties in proper order, ceramic substrate under connect the output pass the perforation that corresponds on the radiator, the luminescent chip bottom establish on ceramic substrate through fixing the wafer, the luminescent chip top fix on ceramic substrate through connecting wire and welding piece, welding piece and ceramic substrate junction both sides, all be equipped with the recess with ceramic substrate junction both sides, ceramic substrate on cover and have the encapsulation colloid.
Preferably, the light emitting chip is a gallium nitride-based white light emitting chip.
Preferably, the through holes on the radiator are filled with insulating layers.
Preferably, the level of the die bond and the bond wire is higher than the level of the ceramic substrate.
Preferably, the radiator is buckled with a protective cover on the front surface, and an LED device body is arranged in the protective cover.
Preferably, the protective cover is a transparent protective cover.
The utility model has the advantages and positive effects that: by adopting the technical scheme, the LED device body and the radiator are directly connected, so that the heat radiation performance of the LED device is improved; and the ceramic substrate, the solid chip and the bonding wire chip are all provided with grooves at the joints, so that the heat generated by the LED device can be quickly released, and the service performance of the LED device is improved.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic diagram of a junction between a light emitting chip and a ceramic substrate.
In the figure:
1. radiator 2, ceramic substrate 3, and light emitting chip
4. Radiating fin 5, solid chip 6 and connecting wire
7. Bonding pad 8, groove 9 and packaging colloid
10. And a protective cover.
Detailed Description
As shown in fig. 1 and 2, the technical scheme of the utility model is a high-performance ceramic-based LED device, which comprises an LED device body and a radiator 1, wherein the LED device body comprises a ceramic substrate 2 and a light-emitting chip 3, the ceramic substrate 2 is fixed on the front surface of the radiator 1, a plurality of radiating fins 4 are arranged on the back surface of the radiator 1, a plurality of light-emitting chips 3 which are sequentially connected in series are arranged on the ceramic substrate 2, the output ends connected under the ceramic substrate 2 pass through corresponding perforations on the radiator 1, the bottom ends of the light-emitting chips 3 are arranged on the ceramic substrate 2 through solid wafers 5, the top ends of the light-emitting chips 3 are fixed on the ceramic substrate 2 through connecting wires 6 and welding pieces 7, grooves 8 are arranged on two sides of the joint of the welding pieces 7 and the ceramic substrate 2 and two sides of the joint of the solid wafers 5 and the ceramic substrate 2, and the heat generated by the LED device can be quickly released; the path of vapor entering the solid chip and the bonding wire chip can be prolonged, the vapor entering the electric connection part inside the LED device can be greatly delayed, and the ceramic substrate 2 is covered with the packaging colloid 9.
In this embodiment, the light emitting chip 3 is a gallium nitride-based white light emitting chip.
In this embodiment, the through holes on the heat sink 1 are filled with an insulating layer.
In this embodiment, the level of the die attach plate 5 and the bonding wire plate 7 is higher than the level of the ceramic substrate 2.
In this embodiment, a protective cover 10 is fastened on the front surface of the radiator 1, and an LED device body is disposed in the protective cover 10.
In this embodiment, the protective cover is a transparent protective cover.
The working process and principle of this example: the LED lamp is connected with the wiring terminal through the output end, the connection is completed by covering the protective cover, grooves are formed in two sides of the connection part of the welding piece and the ceramic substrate, and the connection part of the fixing piece and the ceramic substrate, and heat generated by the LED device can be rapidly released.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (6)
1. A high performance ceramic-based LED device, characterized by: the LED device comprises an LED device body and a radiator, wherein the LED device body comprises a ceramic substrate and a light-emitting chip, the ceramic substrate is fixed on the front surface of the radiator, a plurality of radiating fins are arranged on the back surface of the radiator, a plurality of light-emitting chips which are sequentially connected in series are arranged on the ceramic substrate, an output end connected under the ceramic substrate passes through corresponding through holes on the radiator, the bottom end of the light-emitting chip is arranged on the ceramic substrate through a fixing chip, the top end of the light-emitting chip is fixed on the ceramic substrate through connecting wires and welding chips, grooves are formed in two sides of a joint of the welding chips and the ceramic substrate, and packaging colloid is covered on the ceramic substrate.
2. A high performance ceramic-based LED device as recited in claim 1, wherein: the light-emitting chip is a gallium nitride-based white light-emitting chip.
3. A high performance ceramic-based LED device as recited in claim 1, wherein: the through holes on the radiator are filled with insulating layers.
4. A high performance ceramic-based LED device as recited in claim 1, wherein: the level of the solid chip and the bonding wire chip is higher than that of the ceramic substrate.
5. A high performance ceramic-based LED device as recited in claim 1, wherein: the radiator is buckled with a protective cover on the front face, and an LED device body is arranged in the protective cover.
6. A high performance ceramic-based LED device as recited in claim 5, wherein: the protective cover is a transparent protective cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321073421.8U CN220106576U (en) | 2023-05-08 | 2023-05-08 | High-performance ceramic-based LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321073421.8U CN220106576U (en) | 2023-05-08 | 2023-05-08 | High-performance ceramic-based LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106576U true CN220106576U (en) | 2023-11-28 |
Family
ID=88844063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321073421.8U Active CN220106576U (en) | 2023-05-08 | 2023-05-08 | High-performance ceramic-based LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106576U (en) |
-
2023
- 2023-05-08 CN CN202321073421.8U patent/CN220106576U/en active Active
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