CN213304111U

CN213304111U - Heat dissipation type semiconductor packaging structure

Info

Publication number: CN213304111U
Application number: CN202022362577.0U
Authority: CN
Inventors: 林辉达
Original assignee: Ruisheng Electronic Technology Shenzhen Ltd
Current assignee: Ruisheng Electronic Technology Shenzhen Ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-05-28
Anticipated expiration: 2030-10-22

Abstract

The utility model discloses a heat dissipation type semiconductor package structure, including the packaging part, the bottom fixedly connected with bottom plate of packaging part, the top fixedly connected with chip of bottom plate holds carrier, the top fixedly connected with semiconductor chip that the carrier was held to the chip, semiconductor chip's top is provided with the radiating piece, the radiating piece includes supporting part and leveling portion, the top of leveling portion is provided with the fin, the outside of fin is provided with the guard ring, the inner chamber of radiating piece is provided with first colloid, the outside of radiating piece is provided with the second colloid, the equal fixedly connected with connecting rod in both sides of bottom plate. The utility model discloses a set up the protection circle, can protect the pars plana, the colloid covers when effectively having avoided the encapsulation and leads to being difficult to radiating phenomenon, through setting up the fin, can increase the area of contact of pars plana and air, has effectively promoted the radiating effect of device.

Description

Heat dissipation type semiconductor packaging structure

Technical Field

The utility model relates to the field of semiconductor technology, specifically a heat dissipation type semiconductor package structure.

Background

Ball Grid Array (BGA) is an advanced semiconductor chip packaging technology, which is characterized in that a substrate is used to mount a semiconductor chip, and a plurality of solder balls are implanted on the back surface of the substrate in a grid array, so that more I/O connection terminals can be accommodated on a semiconductor chip carrier of the same unit area as required by a highly integrated semiconductor chip to solder and electrically connect the entire package unit to an external printed circuit board through the solder balls, but the highly integrated semiconductor chip is accompanied by a large amount of heat generation during operation, and a package colloid covering the semiconductor chip is formed of a poor heat transfer resin material having a thermal conductivity of only 0.8w/m-k, so that the heat dissipation efficiency is very poor and the performance and the service life of the semiconductor chip are compromised, and during the production, the encapsulant often covers the surface of the heat sink, which seriously affects the heat dissipation effect of the semiconductor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation type semiconductor package structure, it is good to possess the radiating effect, and long service life's advantage has solved semiconductor chip when production, and the encapsulation colloid often can cover to the surface of radiating piece, has seriously influenced the radiating effect's of semiconductor problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation type semiconductor package structure, includes the packaging part, the bottom fixedly connected with bottom plate of packaging part, the top fixedly connected with chip of bottom plate holds carrier, the top fixedly connected with semiconductor chip that the chip held carrier, semiconductor chip's top is provided with the radiating piece, the radiating piece includes supporting part and leveling portion, the top of leveling portion is provided with the fin, the outside of fin is provided with the guard ring, the inner chamber of radiating piece is provided with first colloid, the outside of radiating piece is provided with the second colloid.

Preferably, both sides of the bottom plate are fixedly connected with connecting rods, and mounting holes are formed in the surfaces of the connecting rods.

Preferably, the top of the leveling part is fixedly connected with a soft material buffer layer, and the thickness of the soft material buffer layer is 0.32 mm.

Preferably, the first colloid and the second colloid are made of the same material, and the second colloid is located on the outer side of the first colloid.

Preferably, the radiating fins are uniformly distributed on the surface of the flat part at equal intervals, and radiating protrusions are arranged on the surface of the radiating fins.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the protection circle, can protect the pars plana, the colloid covers when effectively having avoided the encapsulation and leads to being difficult to radiating phenomenon, through setting up the fin, can increase the area of contact of pars plana and air, has effectively promoted the radiating effect of device.

2. The utility model discloses a set up connecting rod and mounting hole, can make the device reach the fixed effect of installation of being convenient for, effectively promoted the convenience of device installation, through setting up soft material buffer layer, can play certain cushioning effect, effectively alleviateed because of the pressure that the thermal energy produced the fin, through the affirmation to using the material, optimized production technology, effectively reduced the required cost of device production, protruding through setting up the heat dissipation, can increase heat radiating area, further promoted the radiating effect of device.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the protective ring of the present invention;

fig. 3 is a top view of the protection ring of the present invention.

In the figure: 1. a package; 2. a guard ring; 3. a base plate; 4. a connecting rod; 5. a heat sink; 6. a chip carrier; 7. a semiconductor chip; 8. a support portion; 9. a leveling section; 10. a heat sink; 11. a soft material buffer layer; 12. a first colloid; 13. a second colloid; 14. and (7) installing holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a package part 1, guard ring 2, bottom plate 3, connecting rod 4, radiating piece 5, chip hold carrier 6, semiconductor chip 7, supporting part 8, pars planata 9, fin 10, soft material buffer layer 11, first colloid 12, second colloid 13 and mounting hole 14 part are the parts that general standard spare or technical staff in the field know, and its structure and principle all are this technical staff all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a heat dissipation type semiconductor package structure includes a package 1, a bottom plate 3 is fixedly connected to the bottom of the package 1, connecting rods 4 are fixedly connected to both sides of the bottom plate 3, mounting holes 14 are formed on the surfaces of the connecting rods 4, the device can be conveniently mounted and fixed by arranging the connecting rods 4 and the mounting holes 14, convenience of mounting the device is effectively improved, a chip carrier 6 is fixedly connected to the top of the bottom plate 3, a semiconductor chip 7 is fixedly connected to the top of the chip carrier 6, a heat sink 5 is arranged above the semiconductor chip 7, the heat sink 5 includes a supporting portion 8 and a leveling portion 9, a heat sink 10 is arranged on the top of the leveling portion 9, a soft material buffer layer 11 is fixedly connected to the top of the leveling portion 9, the soft material buffer layer 11 has a thickness of 0.32mm, and by arranging the soft material, the buffer structure has the advantages that a certain buffer effect can be achieved, the pressure generated by thermal expansion on the radiating fins 10 is effectively reduced, the protective rings 2 are arranged on the outer sides of the radiating fins 10, the radiating fins 10 are evenly distributed on the surface of the leveling part 9 at equal intervals, the radiating protrusions are arranged on the surface of the radiating fins 10, the radiating area can be increased by arranging the radiating protrusions, the radiating effect of the device is further improved, the first colloid 12 is arranged in the inner cavity of the radiating element 5, the second colloid 13 is arranged on the outer side of the radiating element 5, the first colloid 12 and the second colloid 13 are made of the same material, the second colloid 13 is arranged on the outer side of the first colloid 12, the production process is optimized by determining the material used, the cost required by the production of the device is effectively reduced, the protective rings 2 are arranged, the leveling part 9 can be protected, and the phenomenon that the colloid covers, by arranging the radiating fins 10, the contact area between the flat part 9 and air can be increased, and the radiating effect of the device is effectively improved.

During the use, use through guard ring 2, can protect pars planata 9, colloid covers when effectively having avoided the encapsulation and leads to being difficult to radiating phenomenon, through setting up fin 10, can increase the area of contact of pars planata 9 and air, the radiating effect of device has effectively been promoted, through setting up soft material buffer layer 11, can play certain cushioning effect, effectively alleviate the pressure that produces fin 10 because of the thermal energy, cooperation through the structure, it is good to make the device reach the radiating effect, long service life's advantage, and is suitable for being generalized to use.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation type semiconductor package structure comprises a package (1), and is characterized in that: the bottom fixedly connected with bottom plate (3) of packaging part (1), the top fixedly connected with chip of bottom plate (3) holds carrier (6), the top fixedly connected with semiconductor chip (7) that chip held carrier (6), the top of semiconductor chip (7) is provided with radiating piece (5), radiating piece (5) include supporting part (8) and leveling portion (9), the top of leveling portion (9) is provided with fin (10), the outside of fin (10) is provided with guard ring (2), the inner chamber of radiating piece (5) is provided with first colloid (12), the outside of radiating piece (5) is provided with second colloid (13).

2. The heat dissipation type semiconductor package structure according to claim 1, wherein: the connecting rod (4) is fixedly connected to the two sides of the bottom plate (3), and mounting holes (14) are formed in the surface of the connecting rod (4).

3. The heat dissipation type semiconductor package structure according to claim 1, wherein: the top of the flattening part (9) is fixedly connected with a soft material buffer layer (11), and the thickness of the soft material buffer layer (11) is 0.32 mm.

4. The heat dissipation type semiconductor package structure according to claim 3, wherein: the first colloid (12) and the second colloid (13) are made of the same material, and the second colloid (13) is located on the outer side of the first colloid (12).

5. The heat dissipation type semiconductor package structure according to claim 1, wherein: the radiating fins (10) are evenly distributed on the surface of the flat part (9) at equal intervals, and radiating protrusions are arranged on the surface of the radiating fins (10).