CN216793667U - Novel air-cooling and heat-dissipating integrated module - Google Patents
Novel air-cooling and heat-dissipating integrated module Download PDFInfo
- Publication number
- CN216793667U CN216793667U CN202220304102.2U CN202220304102U CN216793667U CN 216793667 U CN216793667 U CN 216793667U CN 202220304102 U CN202220304102 U CN 202220304102U CN 216793667 U CN216793667 U CN 216793667U
- Authority
- CN
- China
- Prior art keywords
- air
- copper
- double
- layer
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A novel air-cooling heat dissipation integrated module comprises an air-cooling heat dissipation substrate, an injection molding shell and a power module main body arranged in the injection molding shell, wherein the air-cooling heat dissipation substrate adopts fin type air-cooling radiating fins, the power module main body comprises a circuit module and a heat dissipation substrate, and the circuit module comprises a double-sided copper-clad ceramic plate, an IGBT chip, a diode chip and an NTC resistor; the IGBT chip, the diode chip and the NTC resistor are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip, the NTC resistor and the NTC resistor are connected with one another through aluminum wires. The air-cooled radiating substrate used by the utility model is provided with huge fin-type radiating fins, the air-cooled radiating fins on the lower part of the air-cooled radiating substrate are a whole aluminum plate, and the fin-type radiating fins are formed by cutting, so that the radiating capacity of the module can be effectively improved, meanwhile, the silicon gel is filled in the relative space between the power module main body and the injection molding shell, the thermal resistance of the module is reduced, and the radiating efficiency and the power density of the module are integrally improved.
Description
Technical Field
The utility model relates to the field of power modules, in particular to a novel air-cooled heat dissipation power module.
Background
In conventional power semiconductor module packages, the DBC needs to be soldered to a substrate, which is mounted to a heat sink coated with a thermally conductive silicone grease. Due to the relatively high thermal resistance of thermally conductive silicone grease, the modules are continually becoming bulky for higher power densities, which is contrary to the trend toward lighter modules. What is needed is a way to reduce the thermal resistance of the module and to increase the heat dissipation efficiency and power density of the module.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a novel air-cooling and heat-dissipating integrated module.
The purpose of the utility model is achieved by the following technical scheme: a novel air-cooling heat dissipation integrated module comprises an air-cooling heat dissipation substrate, an injection molding shell and a power module main body arranged in the injection molding shell, wherein the air-cooling heat dissipation substrate adopts fin type air-cooling radiating fins, the power module main body comprises a circuit module and a heat dissipation substrate, and the circuit module comprises a double-sided copper-clad ceramic plate, an IGBT chip, a diode chip and an NTC resistor; the IGBT chip, the diode chip and the NTC resistor are fixed on the double-sided copper-clad ceramic plate, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip, the NTC resistor and the NTC resistor are mutually connected through an aluminum wire; the double-sided copper-clad ceramic plate is fixed on the air-cooled radiating substrate, and the injection molding shell is fixed on the air-cooled radiating substrate through epoxy sealant and screws.
Further, the double-sided copper-clad ceramic plate comprises a connecting copper layer, a ceramic layer and a copper-clad layer, the connecting copper layer is arranged on the upper portion of the ceramic layer, a printed circuit is arranged in the connecting copper layer, the ceramic layer is arranged in the middle of the connecting copper layer, and the ceramic layer comprises Al2O3Ceramic layer, Al2O3The doped zirconia ceramic layer and AlN ceramic layer, the copper-clad layer sets up in the lower part of ceramic layer.
Furthermore, the air-cooled radiating fins on the lower portion of the air-cooled radiating substrate are whole aluminum plates, fin-type radiating fins are formed by cutting, the upper portion and the double-sided copper-clad ceramic plate welded substrate are nickel-plated aluminum plates or nickel-plated copper plates, and the copper-clad layers of the double-sided copper-clad ceramic plates are welded on the air-cooled radiating substrate through tin sheets or tin paste.
Furthermore, the IGBT chip, the diode chip and the NTC resistor are welded on a connecting copper layer of the double-sided copper-clad ceramic plate through tin sheets or tin pastes, and the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the NTC resistor are mutually connected through aluminum wires.
Furthermore, the injection molding shell is fixed on the air-cooled heat dissipation substrate through epoxy sealant and screws, and silica gel is filled in a space opposite to the power module main body and the injection molding shell.
Compared with the prior art, the utility model has the advantages and positive effects that,
according to the utility model, the used air-cooled radiating substrate is provided with huge fin-type radiating fins, the air-cooled radiating fins at the lower part of the air-cooled radiating substrate are a whole aluminum plate, and the fin-type radiating fins are formed by cutting, so that the radiating capacity of the module can be effectively improved; meanwhile, the IGBT chip and the diode chip form a parallel circuit in a parallel mode, the IGBT chip, the diode chip and the NTC resistor are all welded on a connecting copper layer of a double-sided copper-clad ceramic plate through tin sheets or tin pastes, the double-sided copper-clad ceramic plate, the IGBT chip, the diode chip and the NTC resistor are mutually connected through aluminum wires, silica gel is filled in a relative space between a power module main body and an injection molding shell, the thermal resistance of the module is reduced, and the heat dissipation efficiency and the power density of the module are integrally improved.
Drawings
Fig. 1 is a schematic view of the overall structure of a novel air-cooling and heat-dissipating integrated module according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a novel air-cooling and heat-dissipating integrated module according to the present invention;
FIG. 3 is a connection diagram of an aluminum wire of the novel integrated air-cooling and heat-dissipating module according to the present invention;
fig. 4 is a diagram of an air-cooling and heat-dissipating substrate of the novel air-cooling and heat-dissipating integrated module according to the utility model.
Illustration of the drawings: 1. an air-cooled heat dissipation substrate; 2. injection molding the housing; 3. an upper cover; 4. a double-sided copper-clad ceramic plate; 5. an IGBT chip; 6. a diode chip; 7. an NTC resistance.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further explained below with reference to the accompanying drawings and examples.
As shown in fig. 1-2, the novel air-cooling and heat-dissipating integrated module according to the present invention includes an air-cooling heat-dissipating substrate 1, an injection molding housing 2, and a power module main body disposed in the injection molding housing, wherein the air-cooling heat-dissipating substrate 1 adopts a fin-type air-cooling heat sink, the power module main body includes a circuit module and a heat-dissipating substrate, and the circuit module includes a double-sided copper-clad ceramic plate 4, an IGBT chip 5, a diode chip 6, and an NTC resistor 7; the IGBT chip 5, the diode chip 6 and the NTC resistor 7 are fixed on the double-sided copper-clad ceramic plate 4, and the double-sided copper-clad ceramic plate 4, the IGBT chip 5, the diode chip 6, the NTC resistor 7 and the NTC resistor 7 are connected with each other through an aluminum wire; the double-sided copper-clad ceramic plate 4 is fixed on the air-cooled heat dissipation substrate 1, and the injection molding shell 2 is fixed on the air-cooled heat dissipation substrate 1 through epoxy sealant and screws.
As shown in FIGS. 1 to 2, the double-sided copper-clad ceramic sheet 4 includes a connection copper layer disposed on the upper portion of the ceramic layer and provided with a printed circuit therein, a ceramic layer disposed in the middle portion, and a copper-clad layer including Al2O3Ceramic layer, Al2O3The doped zirconia ceramic layer and the AlN ceramic layer, the copper-clad layer is arranged on the lower part of the ceramic layer.
As shown in fig. 3, the air-cooled heat sink at the lower part of the air-cooled heat sink substrate 1 is a one-piece aluminum plate, and is cut to form a fin-type heat sink, the substrate welded to the double-sided copper-clad ceramic plate 4 at the upper part is a nickel-plated aluminum plate or a nickel-plated copper plate, and the copper-clad layer of the double-sided copper-clad ceramic plate 4 is welded to the air-cooled heat sink substrate 1 by a tin foil or a tin paste.
As shown in fig. 4, the IGBT chip 5 and the diode chip 6 form a parallel circuit in a parallel manner, the IGBT chip 5, the diode chip 6, and the NTC resistor 7 are all soldered to a connection copper layer of the double-sided copper-clad ceramic plate 4 by a solder sheet or solder paste, and the double-sided copper-clad ceramic plate 4, the IGBT chip 5, the diode chip 6, and the NTC resistor 7 are connected to each other by an aluminum wire.
As shown in fig. 2, the injection molding casing 2 is fixed on the air-cooled heat dissipation substrate 1 through epoxy sealant and screws, and silicone gel is filled in a space between the power module body and the injection molding casing 2.
The working principle of the utility model is as follows: twelve IGBT chips 5, twelve diode chips 6 and an NTC resistor 7 in the module are welded and fixed on the upper parts of three double-sided copper-clad ceramic plates (DBC)4 by tin sheets to be connected with copper layers, the double-sided copper-clad ceramic plates (DBC)4 are welded on an air-cooled radiating substrate 1 by tin sheets, an injection molding shell 2 is fixed on the air-cooled radiating substrate 1 by epoxy sealant and screws, silica gel is filled in the relative space between a power module main body and the injection molding shell 2, and an upper cover 3 of the module is covered after the silica gel is filled, the utility model uses two different aluminum wires for connection, 20mil aluminum wires are used from the injection molding shell 2 to the double-sided copper-clad ceramic plates (DBC)4, the rest are 15mil aluminum wires, the double-sided copper-clad ceramic plates (DBC)4, the IGBT chips 5 and the diode chips 6 are connected by 15mil aluminum wires, a signal terminal on the IGBT chip 5 is connected to the double-sided copper-clad ceramic plates (DBC)4 by a 15mil wire, the terminals from the double-sided copper-clad ceramic plate (DBC)4 to the NTC resistor 7 are connected by two 20mil aluminum wires, and the air-cooled heat dissipation substrate 1 used in the utility model has huge fin-type heat dissipation fins, so that the heat dissipation capacity of the module can be effectively improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the equivalent replacement or change according to the technical solution and the modified concept of the present invention should be covered by the scope of the present invention.
Claims (5)
1. The utility model provides a novel forced air cooling heat dissipation integration module, includes forced air cooling heat dissipation base plate (1), the shell (2) of moulding plastics and sets up the power module main part in the shell of moulding plastics, its characterized in that: the air-cooled radiating substrate (1) adopts fin-type air-cooled radiating fins, the power module main body comprises a circuit module and a radiating substrate, and the circuit module comprises a double-sided copper-clad ceramic plate (4), an IGBT chip (5), a diode chip (6) and an NTC resistor (7); the IGBT chip (5), the diode chip (6) and the NTC resistor (7) are fixed on the double-sided copper-clad ceramic plate (4), and the double-sided copper-clad ceramic plate (4), the IGBT chip (5), the diode chip (6), the NTC resistor (7) and the NTC resistor (7) are connected with each other through aluminum wires; the double-sided copper-clad ceramic plate (4) is fixed on the air-cooled heat dissipation substrate (1), and the injection molding shell (2) is fixed on the air-cooled heat dissipation substrate (1) through epoxy sealant and screws.
2. The novel air-cooling and heat-dissipating integrated module as claimed in claim 1, wherein: the double-sided copper-clad ceramic plate (4) comprises a connecting copper layer, a ceramic layer and a copper-clad layer, the connecting copper layer is arranged on the upper portion of the ceramic layer, a printed circuit is arranged in the connecting copper layer, the ceramic layer is arranged in the middle of the connecting copper layer, and the ceramic layer comprises Al2O3Ceramic layer, Al2O3The doped zirconia ceramic layer and the AlN ceramic layer, the copper-clad layer is arranged on the lower part of the ceramic layer.
3. The novel air-cooling and heat-dissipating integrated module as claimed in claim 1, wherein: the air-cooled radiating fin at the lower part of the air-cooled radiating substrate (1) is a whole aluminum plate, a fin radiating fin is formed by cutting, the upper part of the air-cooled radiating substrate and the double-sided copper-clad ceramic plate (4) are welded to form a substrate which is a nickel-plated aluminum plate or a nickel-plated copper plate, and the copper-clad layer of the double-sided copper-clad ceramic plate (4) is welded to the air-cooled radiating substrate (1) through a tin sheet or tin paste.
4. The novel air-cooling and heat-dissipating integrated module as claimed in claim 1, wherein: IGBT chip (5), diode chip (6) constitute parallel circuit with parallelly connected form, IGBT chip (5), diode chip (6), NTC resistance (7) all weld on the connection copper layer of two-sided copper-clad ceramic plate (4) with tin sheet or tin cream, through aluminium wire interconnect between two-sided copper-clad ceramic plate (4), IGBT chip (5), diode chip (6), NTC resistance (7).
5. The novel air-cooling and heat-dissipating integrated module as claimed in claim 1, wherein: the injection molding shell (2) is fixed on the air-cooled heat dissipation substrate (1) through epoxy sealant and screws, and silica gel is filled in a relative space between the power module main body and the injection molding shell (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220304102.2U CN216793667U (en) | 2022-02-17 | 2022-02-17 | Novel air-cooling and heat-dissipating integrated module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220304102.2U CN216793667U (en) | 2022-02-17 | 2022-02-17 | Novel air-cooling and heat-dissipating integrated module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216793667U true CN216793667U (en) | 2022-06-21 |
Family
ID=82017953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220304102.2U Active CN216793667U (en) | 2022-02-17 | 2022-02-17 | Novel air-cooling and heat-dissipating integrated module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216793667U (en) |
-
2022
- 2022-02-17 CN CN202220304102.2U patent/CN216793667U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11139278B2 (en) | Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module | |
| JP2008259267A5 (en) | ||
| CN219738956U (en) | Reverse-conduction IGBT module for vehicle | |
| CN111696936A (en) | Power module of integrated radiator and manufacturing method thereof | |
| CN113782504B (en) | Simplified packaging structure of power module of integrated radiator and manufacturing method | |
| CN110707057B (en) | Packaging structure of SiC power device | |
| CN110707054A (en) | Direct cooling heat dissipation substrate and power module thereof | |
| CN220822876U (en) | Novel low stray inductance power module for vehicle | |
| JP2000156439A (en) | Power semiconductor module | |
| CN216793667U (en) | Novel air-cooling and heat-dissipating integrated module | |
| CN210866172U (en) | High-power thermoelectric separation type LED device and LED light source module | |
| CN112038245B (en) | Connection process of internal binding line of power module | |
| CN213212151U (en) | Semiconductor packaging structure | |
| CN111354692A (en) | Power heat dissipation device | |
| CN217544598U (en) | Packaging structure for semiconductor chip | |
| CN214672591U (en) | Power device packaging structure | |
| CN217280846U (en) | Multi-chip module packaging structure | |
| CN211980603U (en) | Semiconductor product and electronic product with bottom surface heat dissipation plate | |
| CN213583770U (en) | Semiconductor discrete device packaging structure | |
| CN218788368U (en) | Packaging substrate with split type heat radiation structure and chip packaging module | |
| CN215183904U (en) | Power module unit and power module combination unit | |
| CN215644461U (en) | Power module and electronic equipment | |
| CN217588898U (en) | Packaging structure of semiconductor device and electronic equipment | |
| CN212587484U (en) | Dual-heat-dissipation semiconductor product and electronic product | |
| CN219959039U (en) | Device for improving heat dissipation of high-power LED chip based on COB packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |