CN218769495U - Packaging structure for improving reliability of SiC chip - Google Patents

Abstract

The utility model discloses a packaging structure for improving the reliability of SiC chips, which comprises a base plate, a casing is fixedly installed on the top surface of the bottom plate, a cover plate is fixedly installed on the top of the casing, a DBC substrate is arranged on the top surface of the bottom plate, and the A plurality of SiC chips are arranged on the surface of the DBC substrate, a heat conduction member is arranged inside the casing, a plurality of cooling grooves are opened on the outside of the casing, a through hole is opened on one side of the cooling groove, and a heat dissipation device is fixedly installed inside the cooling groove. pieces. The utility model can improve the heat dissipation performance of the packaged SiC chip, prevent the SiC chip from being damaged due to high temperature, and improve the reliability of the chip.

Description

A packaging structure to improve the reliability of SiC chips

technical field

The utility model relates to the technical field of packaging structures, in particular to a packaging structure for improving the reliability of SiC chips.

Background technique

Silicon carbide (SiC) is a third-generation compound semiconductor material that can be used to make high-power electronic devices. The main form of silicon carbide in semiconductors is as a substrate material.

The traditional SiC power device packaging technology is to solder the lower surface of the SiC chip on the DBC substrate, and conduct heat dissipation through the solder layer between the DBC substrate and the package shell, but only through the solder layer between the SiC and the DBC substrate. The heat transfer efficiency is low, which can easily lead to high temperature failure of the SiC chip, which reduces the reliability of the SiC chip.

Utility model content

The purpose of this utility model is to provide a packaging structure for improving the reliability of SiC chips, so as to solve the problems raised by the above-mentioned background technology.

In order to achieve the above purpose, the utility model provides the following technical solutions: a packaging structure for improving the reliability of SiC chips, including a bottom plate, a casing is fixedly installed on the top surface of the bottom plate, a cover plate is fixedly installed on the top of the casing, and the bottom plate The top surface is provided with a DBC substrate, the surface of the DBC substrate is provided with a plurality of SiC chips, the inner side of the housing is provided with a heat conducting member, the outer side of the housing is provided with a plurality of cooling grooves, and a through hole is provided on one side of the cooling groove. A heat sink is fixedly installed inside the heat sink.

Preferably, the DBC substrate is fixed on the top surface of the bottom plate by solder, and the SiC chip is fixed on the top surface of the DBC substrate by solder.

Preferably, the heat conduction element includes a heat conduction pad, one side of the heat conduction pad is provided with a connection part, and one side of the connection part is fixed to the inner wall of the housing.

Preferably, a plurality of pads are fixedly installed on the top surface of the bottom plate, and the pads are fixed with the heat conduction pad.

Preferably, the heat dissipation element is specifically a heat dissipation fin, and there are a plurality of heat dissipation fins, and the heat dissipation fins are fixedly installed inside the heat dissipation groove.

Compared with the prior art, the beneficial effects of the utility model are:

1. The packaging structure that improves the reliability of the SiC chip, the high temperature generated during the operation of the SiC chip is conducted from the DBC substrate to the bottom plate for heat dissipation, and part of the heat energy is conducted to the shell through the thermal pad and the connection part for heat dissipation, through various heat dissipation methods, It can effectively prevent the failure of SiC chips caused by high temperature and improve the reliability of SiC chips.

2. The packaging structure that improves the reliability of the SiC chip, the heat energy of the shell is quickly dissipated through multiple heat sinks, and the heat sink and through holes can be more conducive to the contact between the heat sink and the air, thereby improving the heat dissipation efficiency of the shell and improving the entire package The cooling efficiency of the structure.

Description of drawings

Fig. 1 is a schematic diagram of the overall structure of the utility model;

Fig. 2 is a schematic diagram of the internal structure of the utility model housing;

Fig. 3 is the schematic diagram of enlarged structure of the utility model A;

Fig. 4 is a schematic diagram of the enlarged structure of the utility model B.

In the figure: 1. Bottom plate; 2. Shell; 3. Cover plate; 4. DBC substrate; 5. SiC chip; 6. Thermal pad; 7. Heat sink; 8. Pad; ; 11, through hole.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Embodiment one

Please refer to Figures 1-4, the utility model provides a packaging structure to improve the reliability of SiC chips, including a base plate 1, a housing 2 is fixedly installed on the top surface of the base plate 1, a cover plate 3 is fixedly installed on the top of the housing 2, and the base plate 1 The top surface is provided with a DBC substrate 4, and the surface of the DBC substrate 4 is provided with a plurality of SiC chips 5, and the inside of the casing 2 is provided with a heat conducting member, and the outside of the casing 2 is provided with a plurality of cooling grooves 10, and one side of the cooling groove 10 is provided with through holes 11. A heat sink is fixedly installed inside the heat sink 10 .

Specifically, the heat generated when the SiC chip 5 is working is conducted from the DBC substrate 4 to the bottom plate 1 for heat dissipation, and a part of the heat energy is conducted to the casing 2 through the heat conduction element for heat dissipation. The heat energy of the casing 2 is quickly exported through the heat dissipation element, and the heat dissipation groove 10 And the through hole 11 can be more conducive to the contact between the heat sink and the air, thereby improving the heat dissipation efficiency of the casing 2 and the SiC chip 5 .

Among them: the DBC substrate 4 is fixed on the top surface of the bottom plate 1 by solder, the SiC chip 5 is fixed on the top surface of the DBC substrate 4 by solder, the heat conduction between the SiC chip 5 and the DBC substrate 4 is conducted through solder, and the connection between the DBC substrate 4 and the bottom plate 1 is The space also conducts heat through the solder, which can play a role in heat dissipation.

Among them: the heat conduction part includes a heat conduction pad 6, a connection part 9 is provided on one side of the heat conduction pad 6, and one side of the connection part 9 is fixed to the inner wall of the casing 2, and a plurality of pads 8 are fixedly installed on the top surface of the bottom plate 1, and the pads 8 and the heat conduction pad 6, when packaging, place the thermal pad 6 on the surface of multiple SiC chips 5, and fix the thermal pad 6 on the top surface of the pad 8, the pad 8 supports the thermal pad 6, and the connecting part 9 is fixed to the inner wall of the housing 2, which is beneficial to the heat conduction effect between the SiC chip 5 and the housing 2.

Among them: the heat sink is specifically the heat sink 7, and there are multiple heat sinks 7. The heat sink 7 is fixedly installed inside the heat sink 10, and the heat sink 7 quickly dissipates heat by contacting with the outside air. Compared with the traditional heat dissipation method, the heat dissipation efficiency is improved. more.

Working principle: the utility model is a packaging structure that improves the reliability of SiC chips. When packaging, the thermal pad 6 is placed on the surface of a plurality of SiC chips 5, and the thermal pad 6 is fixed on the top surface of the pad 8, and the pad 8 play a supporting effect on the heat conduction pad 6, and fix the connecting part 9 and the inner wall of the shell 2;

The heat generated during the operation of the SiC chip 5 is conducted from the DBC substrate 4 to the bottom plate 1 for heat dissipation, and part of the heat energy is conducted to the casing 2 through the thermal pad 6 and the connection part 9 for heat dissipation, and the heat energy of the casing 2 is quickly exported through a plurality of heat sinks 7 , and the heat dissipation groove 10 and the through hole 11 can be more conducive to the contact between the heat dissipation sheet 7 and the air, thereby improving the heat dissipation efficiency of the shell 2, thereby accelerating the heat dissipation efficiency of the SiC chip 5, preventing the SiC chip 5 from malfunctioning or even being damaged due to high temperature, and improving the performance of the SiC chip 5. Reliability of SiC chips.

The content not described in detail in this description belongs to the prior art known to those skilled in the art.

Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art can modify the technical solutions described in the aforementioned embodiments, or perform equivalent replacements for some of the technical features. Within the spirit and principles of the utility model, any modification, equivalent replacement, improvement, etc., should be included in the protection scope of the utility model.

Claims (5)

1. The utility model provides an improve packaging structure of SiC chip reliability, includes bottom plate (1), its characterized in that: bottom plate (1) top surface fixed mounting has shell (2), shell (2) top fixed mounting has apron (3), bottom plate (1) top surface is provided with DBC base plate (4), DBC base plate (4) surface is provided with a plurality of SiC chips (5), shell (2) inboard is provided with heat-conducting piece, a plurality of radiating grooves (10) have been seted up in the shell (2) outside, through-hole (11) have been seted up to radiating groove (10) one side, radiating groove (10) inside fixed mounting has the radiating piece.

2. The packaging structure for improving the reliability of the SiC chip according to claim 1, wherein: the DBC substrate (4) is fixed on the top surface of the bottom plate (1) through welding materials, and the SiC chip (5) is fixed on the top surface of the DBC substrate (4) through welding materials.

3. The packaging structure for improving the reliability of the SiC chip according to claim 1, wherein: the heat conducting piece comprises a heat conducting pad (6), one side of the heat conducting pad (6) is provided with a connecting part (9), and one side of the connecting part (9) is fixed with the inner wall of the shell (2).

4. The packaging structure for improving reliability of the SiC chip according to claim 3, wherein: the top surface of the bottom plate (1) is fixedly provided with a plurality of cushion blocks (8), and the cushion blocks (8) and the heat conducting pad (6) are fixed.

5. The packaging structure for improving the reliability of the SiC chip according to claim 1, wherein: the radiating piece is specifically fin (7), fin (7) are a plurality of in total, fin (7) fixed mounting is in heat dissipation groove (10).

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