CN218783017U - Packaging structure of ceramic tube shell - Google Patents
Packaging structure of ceramic tube shell Download PDFInfo
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- CN218783017U CN218783017U CN202223156587.4U CN202223156587U CN218783017U CN 218783017 U CN218783017 U CN 218783017U CN 202223156587 U CN202223156587 U CN 202223156587U CN 218783017 U CN218783017 U CN 218783017U
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- mounting groove
- drain pan
- pottery
- ceramic
- packaging structure
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Abstract
The utility model relates to the field of packaging technology, a packaging structure of ceramic tube is disclosed, including the pottery drain pan, pottery drain pan upper surface is equipped with first mounting groove, the lower surface of pottery drain pan is equipped with the second mounting groove, the inside opposite side of second mounting groove is linked together through the inside opposite side of bonding passageway with first mounting groove, the inside upside conducting metal layer of pottery drain pan, the interior middle part of pottery drain pan is equipped with the metal heat dissipation layer, the inside downside of pottery drain pan is equipped with insulating ceramic substrate. The utility model discloses in, adopt the structure of two-sided encapsulation, can encapsulate a plurality of chips in a tube simultaneously, realize the integrated encapsulation of modularization of detector, make the contractile force of high temperature welding back pottery drain pan frame only act on in the insulating ceramic base plate through increasing the insulating ceramic base plate inside the pottery drain pan, change the stress distribution that coefficient of thermal expansion mismatch brought.
Description
Technical Field
The utility model relates to an encapsulation technology field especially relates to a packaging structure of ceramic tube shell.
Background
The power electronic technology occupies a very important position in the current rapidly-developed industrial field, and the power electronic power module is taken as a representative of the power electronic technology and is widely applied to industries such as electric automobiles, photovoltaic power generation, wind power generation, industrial frequency conversion and the like.
The encapsulation of detector chip needs the tube shell as the carrier, plays the effect of supporting or protecting to the chip that is capsulated, and the tube shell encapsulation of chip is indispensable important link.
However, most of the semiconductor power modules are mainly packaged by plastic packaging, the working temperature range is small, the overall quality and reliability are poor, and the medium-low power modules are used for reducing the weight, generally adopt an air cooling mode to dissipate heat, the heat dissipation efficiency is not high, and the service life is influenced.
Disclosure of Invention
The utility model aims at solving the defects existing in the prior art and providing a packaging structure of a ceramic tube shell.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a packaging structure of ceramic tube shell, includes the pottery drain pan, the pottery drain pan upper surface is equipped with first mounting groove, the lower surface of pottery drain pan is equipped with the second mounting groove, the inside opposite side of second mounting groove is linked together through the inside opposite side of bonding passageway with first mounting groove, the inside upside conducting metal layer of pottery drain pan, the interior middle part of pottery drain pan is equipped with the metal heat dissipation layer, the inside downside of pottery drain pan is equipped with insulating ceramic substrate.
As a further description of the above technical solution:
the edge of the first mounting groove is provided with a plurality of adjusting holes.
As a further description of the above technical solution:
and heat-conducting silicone grease is arranged on one side of the interior of the first mounting groove.
As a further description of the above technical solution:
one side of the second mounting groove is provided with a notch, and the tail end of the notch extends to the edge of the ceramic bottom shell.
As a further description of the above technical solution:
a plurality of welding discs are welded on one side of the inner portion of the second mounting groove.
The utility model discloses following beneficial effect has:
the utility model discloses in, through the structure that adopts two-sided encapsulation, can encapsulate a plurality of chips simultaneously in a tube, realize the integrated encapsulation of modularization of detector, utilize bonding channel to carry out the bonding connection to the chip of top and bottom simultaneously, shorten the electricity and connect the distance, improve stability.
The utility model discloses in, through at inside increase conductive metal layer and the metal heat dissipation layer of ceramic drain pan, can effectually dissipate the heat that the during operation produced, increase the contractile force that insulating ceramic base plate made high temperature welding back ceramic drain pan frame simultaneously and only be used in insulating ceramic base plate, change the stress distribution that coefficient of thermal expansion mismatch brought.
Drawings
Fig. 1 is a schematic front structural view of a packaging structure of a ceramic tube shell according to the present invention;
fig. 2 is a schematic back structural view of a package structure of a ceramic package according to the present invention;
fig. 3 is an internal structural schematic diagram of the packaging structure of the ceramic tube shell according to the present invention.
Illustration of the drawings:
1. a ceramic bottom shell; 2. a first mounting groove; 3. an adjustment hole; 4. heat-conducting silicone grease; 5. a second mounting groove; 6. welding a disc; 7. opening the gap; 8. a bonding channel; 9. a conductive metal layer; 10. a metal heat dissipation layer; 11. an insulating ceramic substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a packaging structure of ceramic tube shell, including ceramic drain pan 1, ceramic drain pan 1 upper surface is equipped with first mounting groove 2, be used for installing the microchip, the lower surface of ceramic drain pan 1 is equipped with second mounting groove 5, be used for installing chiplet or sensor module, the inside opposite side of second mounting groove 5 is linked together through bonding channel 8 and the inside opposite side of first mounting groove 2, utilize bonding channel 8 to carry out the bonding connection to the chip of top and bottom, shorten electric connection distance, and the stability is improved, the inside upside conducting metal layer 9 of ceramic drain pan 1, the interior middle part of ceramic drain pan 1 is equipped with metal heat dissipation layer 10, be used for improving heat dispersion, the inside downside of ceramic drain pan 1 is equipped with insulating ceramic substrate 11, insulating ceramic substrate 11 makes the contractile force of high temperature welding back ceramic drain pan 1 frame only act on in insulating ceramic substrate 11, change the stress distribution that coefficient of thermal expansion mismatching brought.
In this embodiment, the edge of first mounting groove 2 is equipped with a plurality of regulation hole 3, makes things convenient for the installation of big chip to adjust, and inside one side of first mounting groove 2 is equipped with heat conduction silicone grease 4, the radiating effect, and one side of second mounting groove 5 is equipped with opening 7 and opening 7's end and extends to the edge of ceramic drain pan 1, makes things convenient for external electronic component, and the inside one side welding of second mounting groove 5 has a plurality of welding dish 6, welding chiplet or sensor etc. easy to assemble.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (5)
1. The utility model provides a packaging structure of ceramic tube shell, includes ceramic drain pan (1), its characterized in that: the ceramic bottom case is characterized in that a first mounting groove (2) is formed in the upper surface of the ceramic bottom case (1), a second mounting groove (5) is formed in the lower surface of the ceramic bottom case (1), the other side of the second mounting groove (5) is communicated with the other side of the first mounting groove (2) through a bonding channel (8), a conductive metal layer (9) is arranged on the upper side of the ceramic bottom case (1), a metal heat dissipation layer (10) is arranged in the middle of the ceramic bottom case (1), and an insulating ceramic substrate (11) is arranged on the lower side of the ceramic bottom case (1).
2. The packaging structure of a ceramic package according to claim 1, wherein: the edge of the first mounting groove (2) is provided with a plurality of adjusting holes (3).
3. The ceramic package of claim 1, wherein: and heat-conducting silicone grease (4) is arranged on one side of the inside of the first mounting groove (2).
4. The packaging structure of a ceramic package according to claim 1, wherein: one side of the second mounting groove (5) is provided with a notch (7), and the tail end of the notch (7) extends to the edge of the ceramic bottom shell (1).
5. The ceramic package of claim 4, wherein: a plurality of welding discs (6) are welded on one side of the interior of the second mounting groove (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223156587.4U CN218783017U (en) | 2022-11-28 | 2022-11-28 | Packaging structure of ceramic tube shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223156587.4U CN218783017U (en) | 2022-11-28 | 2022-11-28 | Packaging structure of ceramic tube shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218783017U true CN218783017U (en) | 2023-03-31 |
Family
ID=85711771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223156587.4U Active CN218783017U (en) | 2022-11-28 | 2022-11-28 | Packaging structure of ceramic tube shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218783017U (en) |
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2022
- 2022-11-28 CN CN202223156587.4U patent/CN218783017U/en active Active
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