CN112259512B

CN112259512B - Packaging structure for multiple chips

Info

Publication number: CN112259512B
Application number: CN202011137317.1A
Authority: CN
Inventors: 吴俊楠
Original assignee: Shenzhen Kingdau Electronic Co ltd
Current assignee: Shenzhen Kingdau Electronic Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2022-10-25
Anticipated expiration: 2040-10-22
Also published as: CN112259512A

Abstract

The invention discloses a multi-chip packaging structure which comprises a base, an upper cover, ventilating devices, supporting devices, a chip main body, a wiring, pins, a cavity and a pressing plate, wherein the top end of the base is fixedly connected with the upper cover; and both ends set up breather respectively about the upper cover, carry out the moisture absorption through the drier layer that opening inner wall department is fixed, and ventilative cloth layer carries out the dirt and separates, has reached to add and has established the beneficial effect of separation part in order to improve chip protection.

Description

Packaging structure for multiple chips

Technical Field

The invention belongs to the technical field of chip packaging, and particularly relates to a packaging structure for multiple chips.

Background

The chip package, install the outer casing that the semiconductor integrated circuit chip uses, play and place, fix, seal, protect the chip and strengthen the electric heating performance, and also link the bridge of the internal world of the chip and external circuit-the contact on the chip is connected to the pin of the outer casing of the package with the wire, these pins establish connection with other devices through the wire on the printed board again;

with the rapid development of the semiconductor industry, in order to meet the requirements of users and improve the performance of electronic products, the electronic products are thinner and develop towards miniaturization, at present, a plurality of chip stacking technologies are mostly adopted for packaging semiconductor chip stacked products, and two or more chips are sequentially stacked in a single packaging structure, so that the packaging volume of the products is reduced and the performance of the products is improved;

but the chip among the novel this packaging structure of prior art piles up the difficult discharge of heat that leads to producing to the not enough problem of protectiveness of heat extraction department to the chip.

Disclosure of Invention

Technical problem to be solved

In order to overcome the prior art not enough, the packaging structure for the multi-chip is provided at present to solve the problem that the heat generated by the accumulation of the chip in the middle of the packaging structure is not easy to be discharged, and the heat discharging part has insufficient protection to the chip, and the beneficial effects of arranging the separated heat absorption part so as to facilitate the heat discharge are realized by adding the separation part and improving the beneficial effects of protecting the chip.

(II) technical scheme

The invention is realized by the following technical scheme: the invention provides a packaging structure for multiple chips, which comprises a base, an upper cover, ventilating devices, a supporting device, a chip main body, wiring, pins, a cavity and a pressing plate, wherein the top end of the base is fixedly connected with the upper cover, the ventilating devices are symmetrically arranged at the left end and the right end of the upper cover, the top end of the base is fixedly connected with the supporting device, the inner side of the supporting device is fixedly connected with the chip main body, the wiring is respectively arranged at the front end and the rear end of the chip main body, the outer side end of the wiring is soldered with the pins, the pins are respectively fixedly embedded into the front end and the rear end of the base, the cavity is formed between the top end of the base and the bottom end of the upper cover, the pressing plate is arranged at the top end of the inner wall of the upper cover, the pressing plate and the upper cover are integrally formed, and the bottom end of the pressing plate is tightly attached to the top end of the supporting device.

Furthermore, the ventilation device comprises an opening, a drying agent layer and a breathable cloth layer, the inner wall of the opening is fixedly connected with the drying agent layer, the breathable cloth layer is arranged on the outer side of the opening, the opening and the breathable cloth layer are symmetrically arranged at the left end and the right end of the upper cover, and the periphery of the inner side of the breathable cloth layer is fixedly connected with the upper cover.

Further, strutting arrangement includes riser, diaphragm, L template, lug and silica gel heat-sink piece layer, the riser left end is provided with the diaphragm to riser and diaphragm integrated into one piece, lug and L template swing joint are passed through on the riser top, L template left end upper portion is provided with the lug, L template bottom right part is provided with the lug to lug and L template integrated into one piece, lug and base top right part swing joint, the diaphragm top bonds with the chip main part through the heat-conducting glue, riser left end face bonds with the silica gel heat-sink piece layer respectively with L template lateral surface, riser bottom and base fixed connection.

Furthermore, a first groove is formed in the top end of the vertical plate, and the inner wall of the first groove is embedded with the outer surface of the convex block.

Furthermore, a second groove is formed in the top end of the base, and the inner wall of the second groove is embedded with the outer surface of the projection.

Furthermore, the diaphragm is provided with three groups and distributes in the riser right-hand member from bottom to top.

Furthermore, the transverse plate, the L-shaped plate and the convex block are all made of heat-conducting insulating plastics.

(III) advantageous effects

Compared with the prior art, the invention has the following beneficial effects:

1) The problem of piling up the heat that leads to producing for the chip in the middle of solving this packaging structure is difficult for discharging, through setting up strutting arrangement on the base top, fixes chip subject in diaphragm top department through heat conduction glue to carry out heat conduction to silica gel radiator fin layer department by riser, diaphragm and L template and dispel the heat, reached through adding the beneficial effect who establishes cellular-type heat-absorbing component so that heat discharge.

2) For solving the not enough problem of protectiveness of heat extraction department to the chip, set up breather respectively through both ends about the upper cover, carry out the moisture absorption through the fixed drier layer of opening inner wall department, and ventilative cloth layer carries out the dirt and separates, has reached to add and has established the beneficial effect of separation part in order to improve the protection of chip.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic front sectional view of the present invention;

FIG. 3 is a schematic left-side sectional view of the present invention;

in the figure: the chip comprises a base-1, an upper cover-2, a ventilating device-3, a supporting device-4, a chip main body-5, a wiring-6, pins-7, a cavity-8, a pressing plate-9, a through opening-31, a drying agent layer-32, a ventilating cloth layer-33, a vertical plate-41, a horizontal plate-42, an L-shaped plate-43, a bump-44 and a silica gel heat dissipation sheet layer-45.

Detailed Description

Referring to fig. 1, 2 and 3, the present invention provides a multi-chip package structure: including base 1, upper cover 2, breather 3, strutting arrangement 4, chip main part 5, wiring 6, pin 7, cavity 8 and

clamp plate

9, 1 top and 2 fixed connection on the base, 2 left and right ends symmetries on upper cover are provided with

breather

3, 1 top and strutting arrangement 4 fixed connection on the base, 4 inboard and 5 fixed connection on the chip main part of strutting arrangement, both ends are provided with wiring 6 respectively around the chip

main part

5, 6 outside ends of wiring and the soldering of pin 7, and pin 7 is fixed embedding 1 front and back both ends respectively, cavity 8 is formed between 1 top of base and 2 bottoms of upper cover, 2 inner wall tops of upper cover are provided with clamp plate 9, and

clamp plate

9 and 2 integrated into one piece on the upper cover, clamp plate 9 bottom is hugged closely with 4 tops of strutting arrangement.

Wherein, ventilation unit 3 includes opening 31, drier layer 32 and ventilative cloth layer 33, opening 31 inner wall and drier layer 32 fixed connection, the opening 31 outside is provided with ventilative cloth layer 33, opening 31 and the equal symmetry of ventilative cloth layer 33 set up both ends about upper cover 2 to ventilative cloth layer 33 inboard periphery and upper cover 2 fixed connection establish the beneficial effect of separation part in order to improve the chip protection according to the aforesaid with.

The supporting device 4 comprises a vertical plate 41, a horizontal plate 42, an L-shaped plate 43, a convex block 44 and a silica gel heat sink layer 45, wherein the horizontal plate 42 is arranged at the left end of the vertical plate 41, the vertical plate 41 and the horizontal plate 42 are integrally formed, the top end of the vertical plate 41 is movably connected with the L-shaped plate 43 through the convex block 44, the convex block 44 is arranged at the upper part of the left end of the L-shaped plate 43, the convex block 44 is arranged at the right part of the bottom end of the L-shaped plate 43 and integrally formed with the L-shaped plate 43, the convex block 44 is movably connected with the right part of the top end of the base 1, the top end of the horizontal plate 42 is bonded with the chip main body 5 through heat conducting glue, the left end surface of the vertical plate 41 and the outer side surface of the L-shaped plate 43 are respectively bonded with the silica gel heat sink layer 45, the bottom end of the vertical plate 41 is fixedly connected with the base 1, and a separated heat absorbing component is additionally arranged to facilitate the beneficial effect of heat discharge.

The top end of the vertical plate 41 is provided with a first groove, and the inner wall of the first groove is embedded with the outer surface of the projection 44, so as to improve the fitting degree between the inner wall of the first groove and the outer surface of the projection 44, and improve the stability.

The top end of the base 1 is provided with a second groove, the inner wall of the second groove is embedded with the outer surface of the lug 44, and the fitting degree between the inner wall of the second groove and the outer surface of the lug 44 is improved according to the above, so that the stability is improved.

The transverse plate 42 is provided with three groups and distributed at the right end of the vertical plate 41 from bottom to top, and the arrangement is convenient according to the reasonable arrangement position.

The transverse plate 42, the L-shaped plate 43 and the bump 44 are all made of heat-conducting insulating plastics, and are good in heat conductivity and high in hardness.

The working principle is as follows: firstly, taking out the components for manufacturing the packaging structure for the multiple chips and placing the components at proper positions;

then, the chip main body 5 is placed on the top end of the transverse plate 42 in the supporting device 4, the position is adjusted and is stabilized through heat conducting glue, the L-shaped plate 43 is embedded and stabilized at the first groove and the second groove through the convex block 44 respectively, the chip main body 5 and the pins 7 are connected through the wiring 6 respectively, the periphery of the top end of the base 1 is fixed through the upper cover 2, and the position of the L-shaped plate 43 is supported and stabilized through the pressing plate 9, so that the manufacturing is completed;

then, by arranging the supporting device 4 at the top end of the base 1, providing a fixed heat conduction effect by the heat conduction glue between the chip main body 5 and the transverse plate 42, and conducting heat to the silica gel heat sink layer 45 by the vertical plate 41, the transverse plate 42 and the L-shaped plate 43 for heat dissipation, the beneficial effect of facilitating heat discharge by additionally arranging a separated heat absorbing part is achieved;

finally, through setting up ventilation unit 3 respectively at both ends about upper cover 2, carry out moisture absorption through the fixed drier layer 32 of opening 31 inner wall department, and ventilative cloth layer 33 carries out the dirt and separates, has reached and has add and establish the separation part in order to improve the beneficial effect to chip protection, and cavity 8 that forms between base 1 and upper cover 2 provides the isolated electricity breakdown protection of space.

While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A packaging structure for multiple chips is characterized in that: the LED lamp is characterized by comprising a base (1), an upper cover (2), an air breather (3), a supporting device (4), a chip main body (5), a wiring (6), pins (7), a cavity (8) and a pressing plate (9), wherein the top end of the base (1) is fixedly connected with the upper cover (2), the air breather (3) is symmetrically arranged at the left end and the right end of the upper cover (2), the top end of the base (1) is fixedly connected with the supporting device (4), the inner side of the supporting device (4) is fixedly connected with the chip main body (5), the front end and the rear end of the chip main body (5) are respectively provided with the wiring (6), the outer side end of the wiring (6) is soldered with the pins (7), the pins (7) are respectively and fixedly embedded into the front end and the rear end of the base (1), the cavity (8) is formed between the top end of the base (1) and the bottom end of the upper cover (2), the pressing plate (9) is arranged at the top end of the inner wall of the upper cover (2), the pressing plate (9) and the upper cover (2) are integrally formed, and the bottom end of the pressing plate (9) is tightly attached to the top end of the supporting device (4);

the ventilating device (3) comprises a through opening (31), a drying agent layer (32) and a ventilating cloth layer (33), the inner wall of the through opening (31) is fixedly connected with the drying agent layer (32), the ventilating cloth layer (33) is arranged on the outer side of the through opening (31), the through opening (31) and the ventilating cloth layer (33) are symmetrically arranged at the left end and the right end of the upper cover (2), and the periphery of the inner side of the ventilating cloth layer (33) is fixedly connected with the upper cover (2);

the supporting device (4) comprises a vertical plate (41), a horizontal plate (42), an L-shaped plate (43), a convex block (44) and a silica gel heat dissipation sheet layer (45), the horizontal plate (42) is arranged at the left end of the vertical plate (41), the vertical plate (41) and the horizontal plate (42) are integrally formed, the top end of the vertical plate (41) is movably connected with the L-shaped plate (43) through the convex block (44), the convex block (44) is arranged at the upper part of the left end of the L-shaped plate (43), the convex block (44) is arranged at the right part of the bottom end of the L-shaped plate (43), the convex block (44) and the L-shaped plate (43) are integrally formed, the convex block (44) is movably connected with the right part of the top end of the base (1), the top end of the horizontal plate (42) is bonded with the chip main body (5) through heat conduction glue, the left end surface of the vertical plate (41) and the outer side surface of the L-shaped plate (43) are respectively bonded with the silica gel heat dissipation sheet layer (45), and the bottom end of the vertical plate (41) is fixedly connected with the base (1);

a first groove is formed in the top end of the vertical plate (41), and the inner wall of the first groove is embedded with the outer surface of the bump (44);

a second groove is formed in the top end of the base (1), and the inner wall of the second groove is embedded with the outer surface of the bump (44);

the transverse plate (42) is provided with three groups which are distributed at the right end of the vertical plate (41) from bottom to top.