CN211858621U - Integrated circuit SIP packaging structure - Google Patents
Integrated circuit SIP packaging structure Download PDFInfo
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- CN211858621U CN211858621U CN202020945652.3U CN202020945652U CN211858621U CN 211858621 U CN211858621 U CN 211858621U CN 202020945652 U CN202020945652 U CN 202020945652U CN 211858621 U CN211858621 U CN 211858621U
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Abstract
The utility model provides an integrated circuit SIP packaging structure, which comprises an outer shell, the aluminum sheet, a chip, the pin, resin gum cover, graphite alkene board, the base plate, the asbestos board, green glued membrane and silicon wafer, the shell is fixed at the base plate up end, the aluminum sheet is pasted at the shell up end, the chip sets up inside the shell, the silicon wafer pastes terminal surface under the chip, graphite alkene board is pasted at the chip up end, pin electric connection is in the chip left and right sides, resin gum cover is established in the pin outside, the asbestos board is pasted at the base plate up end, green glued membrane is pasted at the asbestos board up end, original integrated circuit chip packaging structure has been solved in this design not good, the not strong problem of heat dissipation and leakproofness, the utility model discloses rational in infrastructure, the leakproofness is strong, compromise good heat dissipation function.
Description
Technical Field
The utility model discloses an integrated circuit SIP packaging structure belongs to SIP encapsulation technical field.
Background
The SIP package is a package that integrates multiple functional chips, including processor, memory, etc., into one package, thereby implementing a substantially complete function. Corresponds to SOC (System On a Chip System On Chip). The difference is that system-in-package is a side-by-side or stacked package of different chips, and SOC is a highly integrated chip product. SIP is defined by some as: a plurality of active electronic components having different functions are preferably assembled with optional passive devices, and other devices such as MEMS or optical devices, to form a single standard package for performing a function, thereby forming a system or subsystem. From the perspective of package development, SIP is the basis for SOC package implementation.
SIP packaging technology is used for the encapsulation of a plurality of chips of printed circuit board more, can practice thrift the space of circuit board, improves functional items, but packaging structure is ageing easily among the SIP packaging structure in the past, and the heat resistance is not good, and the not easy encapsulation that leads to of radiating effect is overheated phenomenon well in addition, and current integrated circuit chip packaging structure is not good, and heat dissipation and leakproofness are not strong problem, need the problem that integrated circuit SIP packaging structure solved the aforesaid and appear now urgently.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims at providing an integrated circuit SIP packaging structure to solve the problem that proposes in the above-mentioned background art, the utility model discloses rational in infrastructure, the leakproofness is strong, compromises good heat dissipation function.
In order to achieve the above purpose, the present invention is realized by the following technical solution: integrated circuit SIP packaging structure, including shell, aluminum sheet, chip, pin, resin gum cover, graphite alkene board, base plate, asbestos board, green glued membrane and silicon wafer, the shell is fixed at the base plate up end, the aluminum sheet is pasted at the shell up end, the chip sets up inside the shell, the terminal surface is pasted under the chip to the silicon wafer, graphite alkene board is pasted at the chip up end, pin electric connection is in the chip left and right sides, the resin gum cover is established in the pin outside, the asbestos board is pasted at the base plate up end, green glued membrane is pasted at the asbestos board up end.
Further, the shell is made of polyvinyl chloride, a sealing cavity is formed in the shell, and the specification of the sealing cavity is slightly larger than that of the chip.
Furthermore, the upper end face of the aluminum sheet is provided with folds, and the lower end face of the aluminum sheet is in contact with the graphene plate.
Furthermore, the pins penetrate through the green adhesive film, the asbestos board and the substrate, and the length of the pins is larger than the sum of the thicknesses of the green adhesive film, the asbestos board and the substrate.
Furthermore, the substrate is made of high-purity alumina, and the length and width specifications of the substrate are the same as those of the shell.
The utility model has the advantages that: the utility model discloses an integrated circuit SIP packaging structure, because of the utility model discloses added shell, aluminum sheet, chip, pin, resin gum cover, graphite alkene board, base plate, asbestos board, green glue film and silicon wafer, this design makes things convenient for integrated circuit chip's sealed encapsulation effect, has solved original integrated circuit chip packaging structure not good, and the not strong problem of heat dissipation and leakproofness has improved the utility model discloses a practicality.
Because of the shell material is polyvinyl chloride, the inside sealed chamber that is equipped with of shell, and sealed chamber specification slightly is greater than the chip specification, this design makes the chip have sufficient installation space, be equipped with the fold because of the aluminum sheet up end, terminal surface and graphite alkene looks contact under the aluminum sheet, this design improves the radiating effect of chip, run through green glued membrane because of the pin, asbestos board, the base plate, pin length is greater than green glued membrane, asbestos board, base plate thickness sum, this design makes things convenient for the use of pin, because of the base plate material is high-purity alumina, the long wide specification of base plate is the same with the long wide specification of shell, this design improves heat-resisting and anti-oxidant effect, the utility model discloses rational in infrastructure, the leakproofness is strong, compromise good heat dissipation function.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a top view of an integrated circuit SIP package structure of the present invention;
FIG. 2 is a top sectional view of the integrated circuit SIP package structure of the present invention;
FIG. 3 is a front sectional view of an integrated circuit SIP package structure according to the present invention;
in the figure: 1-shell, 2-aluminum sheet, 3-chip, 4-pin, 5-resin gum cover, 6-graphene plate, 7-substrate, 8-asbestos plate, 9-green glue film, and 10-silicon wafer.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: integrated circuit SIP packaging structure, which comprises a housing 1, aluminum sheet 2, chip 3, pin 4, resin gum cover 5, graphite alkene board 6, base plate 7, asbestos board 8, green glued membrane 9 and silicon wafer 10, shell 1 is fixed at base plate 7 up end, aluminum sheet 2 pastes at 1 up end of shell, chip 3 sets up inside shell 1, silicon wafer 10 pastes terminal surface under chip 3, graphite alkene board 6 pastes at 3 up end of chip, 4 electric connection of pin is in 3 left and right sides of chip, 5 covers of resin gum cover are established in the pin 4 outside, asbestos board 8 pastes at base plate 7 up end, green glued membrane 9 pastes at asbestos board 8 up end, this design has solved original integrated circuit chip 3 packaging structure not good, the not strong problem of heat dissipation and leakproofness.
The material of shell 1 is polyvinyl chloride, the inside sealed chamber that is equipped with of shell 1, and sealed chamber specification slightly is greater than 3 specifications of chip, this design makes chip 3 have sufficient installation space, 2 up end of aluminum sheet are equipped with the fold, the terminal surface contacts with graphite alkene board 6 under the aluminum sheet 2, this design improves chip 3's radiating effect, pin 4 runs through green glued membrane 9, asbestos board 8, base plate 7, 4 length of pin are greater than green glued membrane 9, asbestos board 8, 7 thickness sums of base plate, this design makes things convenient for pin 4's use, the base plate 7 material is high-purity alumina, the long wide specification of base plate 7 is the same with the long wide specification of shell 1, this design improves heat-resisting and anti-oxidant effect.
As an embodiment of the present invention: can find out through carrying out the analysis to packaging structure, 1 material of shell is polyvinyl chloride, shell 1 closely laminates with base plate 7, chip 3 is fixed in shell 1, make chip 3 have sufficient installation space, 2 up end of aluminum sheet are equipped with the fold, the terminal surface contacts with graphite alkene board 6 under the aluminum sheet 2, the heat that chip 3 produced shifts to aluminum sheet 2 through graphite alkene board 6 and gives off the transfer, pin 4 length is greater than green glued membrane 9, asbestos board 8, 7 thickness sums of base plate, make things convenient for pin 4's use, green glued membrane 9 plays heat-resisting effect of preventing softening, silicon wafer 10 effectively isolates external electromagnetic influence, base plate 7 adopts to be high-purity alumina plate, improve packaging structure's heat-resisting and anti-oxidant effect.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. Integrated circuit SIP packaging structure, its characterized in that: including shell, aluminum sheet, chip, pin, resin gum cover, graphite alkene board, base plate, asbestos board, green glued membrane and silicon wafer, the shell is fixed at the base plate up end, the aluminum sheet is pasted at the shell up end, the chip sets up inside the shell, the terminal surface is pasted under the chip to the silicon wafer, graphite alkene board is pasted at the chip up end, pin electric connection is in the chip left and right sides, the resin gum cover is established in the pin outside, asbestos board is pasted at the base plate up end, green glued membrane is pasted at asbestos board up end.
2. The integrated circuit SIP package structure of claim 1, wherein: the shell material is polyvinyl chloride, the inside sealed chamber that is equipped with of shell, and sealed chamber specification slightly is greater than the chip specification.
3. The integrated circuit SIP package structure of claim 1, wherein: the aluminum sheet up end is equipped with the fold, aluminum sheet down end and graphite alkene board looks contact.
4. The integrated circuit SIP package structure of claim 1, wherein: the pins penetrate through the green adhesive film, the asbestos board and the substrate, and the length of each pin is larger than the sum of the thicknesses of the green adhesive film, the asbestos board and the substrate.
5. The integrated circuit SIP package structure of claim 1, wherein: the substrate is made of high-purity alumina, and the length and width specifications of the substrate are the same as those of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020945652.3U CN211858621U (en) | 2020-05-29 | 2020-05-29 | Integrated circuit SIP packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020945652.3U CN211858621U (en) | 2020-05-29 | 2020-05-29 | Integrated circuit SIP packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211858621U true CN211858621U (en) | 2020-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020945652.3U Active CN211858621U (en) | 2020-05-29 | 2020-05-29 | Integrated circuit SIP packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211858621U (en) |
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2020
- 2020-05-29 CN CN202020945652.3U patent/CN211858621U/en active Active
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