CN207555524U - A kind of aluminium base encapsulating copper-clad plate and LED lamp - Google Patents
A kind of aluminium base encapsulating copper-clad plate and LED lamp Download PDFInfo
- Publication number
- CN207555524U CN207555524U CN201721720384.XU CN201721720384U CN207555524U CN 207555524 U CN207555524 U CN 207555524U CN 201721720384 U CN201721720384 U CN 201721720384U CN 207555524 U CN207555524 U CN 207555524U
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- China
- Prior art keywords
- layer
- copper
- aluminum substrate
- copper foil
- foil circuit
- Prior art date
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 64
- 239000004411 aluminium Substances 0.000 title claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 32
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- -1 Polypropylene Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a kind of aluminium base encapsulating copper-clad plate and the LED lamp with the aluminium base encapsulating copper-clad plate, the copper-clad plate of aluminium base encapsulating includes the aluminum substrate layer being cascading, thermal insulation layer and copper foil circuit layer, the aluminum substrate layer, thermal insulation layer and copper foil circuit layer, which run through, is equipped with jack, the inner wall that the aluminum substrate layer forms the jack is coated with insulating layer, when being packaged, the light source component package is electrically connected to copper foil circuit layer surface and with the copper foil circuit layer, the power supply component package is to aluminum substrate layer bottom surface, its pin is inserted into jack and extends to copper foil circuit layer surface, and it is electrically connected with copper foil circuit layer.Ensure the heat-conducting area of aluminum substrate layer and the circuit connection safety of power supply member device so that structure is more compact, stablizes, and heat conduction, thermal diffusivity are good；And the glass harden structure of packaging power component is eliminated, cost is lower.
Description
Technical field
The utility model is related to board structure of circuit, and in particular to the aluminium base encapsulating of a kind of integrated power supply and light-source structure covers copper
Plate and the LED lamp with the aluminium base encapsulating copper-clad plate.
Background technology
In LED illumination lamp field, power panel and light source board are assembled apart, i.e., current whole lamp production technology is to use
One power panel and light source board are assembled by connector (such as power cord).Production needs to purchase two kinds of materials simultaneously, makes
Must owe a kind of material cannot all produce, and leverage production efficiency.Meanwhile this kind of structure the space occupied is larger, is unfavorable for
Integration of compact.With the improvement of structure, present LED illumination drive scheme is increasingly simpler and replaces complicated circuit knot year by year
Structure.The current existing light source board by with light source and the power panel with power supply (common glass-fiber-plate) directly ectonexine are embedded pressing
It forms and common glass-fiber-plate is embedded in cricoid light source board, this technique is because the aluminium base plate suqare of light source board is small, heat conduction effect
Fruit is poor, and loss is high, and there is no play heat-conducting effect of the aluminum substrate to LED well for this mode；This kind of structure is easily divided simultaneously
Layer, structural instability.
Utility model content
For this purpose, the utility model provides a kind of stable structure, good heat dissipation effect, integrated power supply and light-source structure at low cost
The copper-clad plate of aluminium base encapsulating and with the aluminium base encapsulating copper-clad plate LED lamp.
For this purpose, a kind of aluminium base encapsulating copper-clad plate provided by the utility model, including the aluminum substrate layer, absolutely being cascading
Edge heat-conducting layer and copper foil circuit layer, the aluminum substrate layer, thermal insulation layer and copper foil circuit layer, which run through, is equipped with jack, the aluminium base
The inner wall that plate layer forms the jack is coated with insulating layer.
Further, the thickness of the insulating layer is at least 3mm.
Further, the thickness of the thermal insulation layer is 25 μm, 35 μm or 70 μm.
Further, the material of the thermal insulation layer is PP (Polypropylene) materials or resin and Heat Conduction Material
The peaceful material of glue being combined.
Further, the aluminum substrate layer is the aluminium sheet of a system, three systems or five systems.
The utility model also provides a kind of LED lamp, including at least power supply component, light source component and described above
Aluminium base encapsulating copper-clad plate, the light source component package is electrically connected to copper foil circuit layer surface and with the copper foil circuit layer, described
To aluminum substrate layer bottom surface, pin is inserted into jack and extends to copper foil circuit layer surface power supply component package, and electric with copper foil
Road floor electrical connection.
By technical solution provided by the utility model, have the advantages that：
The aluminum substrate layer, thermal insulation layer and copper foil circuit layer, which run through, is equipped with jack, and the aluminum substrate layer forms this and inserts
The inner wall in hole is coated with insulating layer, and when being packaged, by power supply component package to aluminum substrate layer bottom surface, pin is inserted into jack
And copper foil circuit layer surface is extended to, and be electrically connected with copper foil circuit layer.By power supply component package to aluminum substrate layer bottom surface, and
It is insulated between the pin of power supply member device and aluminum substrate layer by insulating layer, ensures the heat-conducting area of aluminum substrate layer and power supply member device
Circuit connection safety so that structure is more compact, stablizes, and heat conduction, thermal diffusivity are good；And eliminate the glass of packaging power component
Fine harden structure, cost are lower.
Power supply component package does not interfere with the light path of light source to aluminum substrate layer bottom surface.
Description of the drawings
Fig. 1 show the schematic cross-section of aluminium base encapsulating copper-clad plate in embodiment；
Fig. 2 show the schematic cross-section after aluminium base encapsulating copper-clad plate encapsulation in embodiment.
Specific embodiment
To further illustrate each embodiment, the utility model is provided with attached drawing.These attached drawings is in the utility model exposure
A part for appearance mainly to illustrate embodiment, and can coordinate the associated description of specification to explain the running of embodiment original
Reason.With reference to these contents, those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new for cooperation
The advantages of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
It is shown in reference picture 1, Fig. 2, a kind of aluminium base encapsulating copper-clad plate provided by the utility model, including what is be cascading
Aluminum substrate layer 11, thermal insulation layer 12 and copper foil circuit layer 13, the aluminum substrate layer 11, thermal insulation layer 12 and copper foil circuit layer
13 run through equipped with jack 15, and the inner wall that the aluminum substrate layer 11 forms the jack 15 is coated with insulating layer 14.During follow-up encapsulation, light
Source component 30 is encapsulated to 13 surface of copper foil circuit layer and is electrically connected with the copper foil circuit layer 13, and power supply component 20 is encapsulated to aluminium
11 bottom surface of substrate layer, pin 21 are inserted into jack 15 and extend to 13 surface of copper foil circuit layer, and be electrically connected with copper foil circuit layer 13
It connects.
Further, in the present embodiment, the thickness H of the insulating layer 14 is at least 3mm, to ensure power supply component 20
Do not allow to be also easy to produce electric leakage between pin 21 and aluminum substrate layer 11, ensure service life.The material of the insulating layer 14 is existing skill
Isolation material in art, such as rubber.
Further, in the present embodiment, the material of the thermal insulation layer 12 is answered for PP materials or resin with Heat Conduction Material
The peaceful material of glue formed is closed, is respectively provided with preferable insulating heat-conductive effect, in other embodiments, heat conductive silica gel etc. can also be used
Other insulating heat-conduction materials.The thickness of the thermal insulation layer is 25 μm, 35 μm or 70 μm, this is relatively conventional thickness,
Different thickness can be selected according to actual conditions, is no longer described in detail.
Further, in the present embodiment, the aluminum substrate layer 11 is the aluminium sheet of a system, in other embodiments, can also
Select the aluminium sheet of three systems or five systems.Aluminium sheet model can be selected according to need, be also no longer described in detail herein.
The utility model also provides a kind of LED lamp, including at least power supply component, light source component and described above
Aluminium base encapsulating copper-clad plate, with reference to shown in Fig. 2, the light source component 30 encapsulate to 13 surface of copper foil circuit layer and with copper foil electricity
Road floor 13 is electrically connected, and the power supply component 20 is encapsulated to 11 bottom surface of aluminum substrate layer, and pin 21 is inserted into jack and extends to copper
13 surface of foil circuit layer, and be electrically connected with copper foil circuit layer 13.
By technical solution provided by the utility model, the aluminum substrate layer, thermal insulation layer and copper foil circuit layer run through
Equipped with jack, the inner wall that the aluminum substrate layer forms the jack is coated with insulating layer, during encapsulation, by power supply component package to aluminium
Substrate layer bottom surface, pin are inserted into jack and extend to copper foil circuit layer surface, and be electrically connected with copper foil circuit layer.By power supply member
Device is encapsulated to aluminum substrate layer bottom surface, and is insulated between the pin of power supply member device and aluminum substrate layer by insulating layer, ensures aluminium base
The heat-conducting area of plate layer and the circuit connection safety of power supply member device so that structure is more compact, stablizes, and heat conduction, thermal diffusivity are good；
And the glass harden structure of packaging power component is eliminated, cost is lower.Power supply component package, will not to aluminum substrate layer bottom surface
Influence the light path of light source.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, in the spirit and scope for not departing from the utility model that the appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (6)
1. a kind of aluminium base encapsulating copper-clad plate, it is characterised in that：Including aluminum substrate layer, thermal insulation layer and the copper being cascading
Foil circuit layer, the aluminum substrate layer, thermal insulation layer and copper foil circuit layer, which run through, is equipped with jack, and the aluminum substrate layer forms this and inserts
The inner wall in hole is coated with insulating layer.
2. aluminium base encapsulating copper-clad plate according to claim 1, it is characterised in that：The thickness of the insulating layer is at least 3mm.
3. aluminium base encapsulating copper-clad plate according to claim 1, it is characterised in that：The thickness of the thermal insulation layer is 25 μ
M, 35 μm or 70 μm.
4. aluminium base encapsulating copper-clad plate according to claim 1, it is characterised in that：The material of the thermal insulation layer is PP materials
The peaceful material of glue that matter or resin are combined with Heat Conduction Material.
5. aluminium base encapsulating copper-clad plate according to claim 1, it is characterised in that：The aluminum substrate layer for a system, three systems or
The aluminium sheet of five systems.
6. a kind of LED lamp, it is characterised in that：Including at least power supply component, light source component and the claims 1 to 5
Any aluminium base encapsulating copper-clad plate, the light source component package are to copper foil circuit layer surface and electric with the copper foil circuit layer
Connection, the power supply component package to aluminum substrate layer bottom surface, pin are inserted into jack and extend to copper foil circuit layer surface, and
It is electrically connected with copper foil circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721720384.XU CN207555524U (en) | 2017-12-12 | 2017-12-12 | A kind of aluminium base encapsulating copper-clad plate and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721720384.XU CN207555524U (en) | 2017-12-12 | 2017-12-12 | A kind of aluminium base encapsulating copper-clad plate and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207555524U true CN207555524U (en) | 2018-06-29 |
Family
ID=62662849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721720384.XU Active CN207555524U (en) | 2017-12-12 | 2017-12-12 | A kind of aluminium base encapsulating copper-clad plate and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207555524U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110410757A (en) * | 2019-07-22 | 2019-11-05 | 厦门阳光恩耐照明有限公司 | A kind of structure of the aluminium sheet access driving circuit of aluminum substrate |
-
2017
- 2017-12-12 CN CN201721720384.XU patent/CN207555524U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110410757A (en) * | 2019-07-22 | 2019-11-05 | 厦门阳光恩耐照明有限公司 | A kind of structure of the aluminium sheet access driving circuit of aluminum substrate |
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