CN211226328U

CN211226328U - Stacking packaging structure for MEMS chip

Info

Publication number: CN211226328U
Application number: CN201922271267.5U
Authority: CN
Inventors: 苏岩; 夏续金; 王标
Original assignee: Jiangsu Sensiton Electronic Technology Co ltd
Current assignee: Jiangsu Sensiton Electronic Technology Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-08-11
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses a stacking and packaging structure for MEMS chips, which comprises a packaging structure body, wherein the bottom end of a sealing plate is fixedly connected with an opening at the top end of a plastic packaging shell through a sealing glue, first steps are fixedly arranged at two sides of the top end of a substrate, a first chip is fixedly arranged between the two first steps, second steps are fixedly arranged at the top ends of the two first steps, a second chip is fixedly arranged between the two second steps, a third step is fixedly arranged at the top ends of the two second steps, a third chip is fixedly arranged between the two third steps, and the top ends of the two third steps are fixedly connected with a heat dissipation plate, the volume ratio is reduced, the packaging density can be improved, and the use is convenient.

Description

Stacking packaging structure for MEMS chip

Technical Field

The utility model relates to a packaging structure, in particular to pile up packaging structure for MEMS chip.

Background

MEMS is a Micro Electro Mechanical System (MEMS), which refers to a high-tech device with a size of several millimeters or less, and the internal structure of the MEMS is generally in the micrometer or even nanometer level, and the MEMS is an independent intelligent System. The device mainly comprises a sensor, an actuator and a micro-energy source. The micro electro mechanical system relates to various subjects and engineering technologies such as physics, semiconductor, optics, electronic engineering, chemistry, material engineering, mechanical engineering, medicine, information engineering, biological engineering and the like, and develops wide application in the fields of synthetic biology, microfluidic technology and the like of intelligent systems, consumer electronics, wearable equipment, smart homes, system biotechnology and the like. Common products include MEMS accelerometers, MEMS microphones, micro-motors, micro-pumps, micro-vibrators, MEMS pressure sensors, MEMS gyroscopes, MEMS humidity sensors, and the like, as well as integrated products thereof.

The MEMS chip needs to go through the packaging structure for use, but the existing packaging structure has some disadvantages, such as poor heat dissipation, short service life, and the existing packaging structure can not effectively stack chips with different areas, which occupies a large space and is inconvenient to use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pile up packaging structure for MEMS chip to solve the current packaging structure thermal diffusivity of proposing among the above-mentioned background art relatively poor, life is low and current packaging structure can not effectually pile up the chip of different area sizes, and occupation space is big, awkward problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a pile up packaging structure for MEMS chip, includes the packaging structure body, the packaging structure body comprises plastic envelope shell and shrouding, the bottom of shrouding and the opening part on plastic envelope shell top are through gluing a rubber fixed connection, the fixed base plate that is equipped with in bottom of plastic envelope shell inner chamber, the both sides on base plate top are all fixed and are equipped with first step, two fixed being equipped with first chip, two between the first step the top of first step is all fixed and is equipped with the second step, two fixed being equipped with the second chip, two between the second step top is all fixed and is equipped with the third step, two fixed being equipped with the third chip, two between the third step the top of third step all with the heating panel fixed connection that is equipped with.

As an optimal technical scheme of the utility model, the fixed heat dissipation rib that is equipped with a plurality of being parallel to each other in top of heating panel is a plurality of the top surface that the top of heat dissipation rib extended to the shrouding.

As a preferred technical scheme of the utility model, first chip, second chip and third chip all correspond fixedly through the bonding wire and the bonding point on substrate surface and link to each other.

As an optimal technical scheme of the utility model, two avris departments of base plate are all fixed and are equipped with a plurality of pins, and are a plurality of the one end of pin all extends to the outside of plastic envelope shell.

As a preferred technical scheme of the utility model, the bottom mounting of plastic envelope shell is equipped with the pin protection pad, the pin protection pad alternates with a plurality of pins and is connected.

As an optimal technical scheme of the utility model, plastic envelope shell and shrouding are made by ceramic material.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a pile up packaging structure for MEMS chip through the heating panel and the heat dissipation rib that are equipped with, is convenient for accelerate the heat dissipation, improves the life of inside a plurality of chips, through first step, second step and the third step that is equipped with, is convenient for pile up the chip of different area sizes, reduces the volume and accounts for the ratio, also can improve packing density, convenient to use simultaneously.

Drawings

FIG. 1 is a schematic front view of the present invention;

fig. 2 is the schematic diagram of the internal structure of the package structure body of the present invention.

In the figure: 1. a package structure body; 2. plastic packaging the shell; 3. closing the plate; 4. a pin protection pad; 5. a pin; 6. a substrate; 7. a first step; 8. a second step; 9. a third step; 10. a first chip; 11. a second chip; 12. a third chip; 13. a heat dissipation plate; 14. heat dissipation ribs; 15. and bonding wires.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-2, the utility model provides a pile up packaging structure for MEMS chip, including packaging structure body 1, packaging structure body 1 comprises plastic envelope shell 2 and shrouding 3, the bottom of shrouding 3 and the opening part on 2 tops of plastic envelope shell are through gluing a fixed connection, the fixed base plate 6 that is equipped with in bottom of 2 inner chambers of plastic envelope shell, the both sides on 6 tops of base plate are all fixed and are equipped with first stage 7, fixed first chip 10 that is equipped with between two first stage 7, the top of two first stage 7 is all fixed and is equipped with second stage 8, it is fixed and is equipped with second chip 11 between two second stages 8, two 8 tops of second stage are all fixed and are equipped with third stage 9, fixed and be equipped with third chip 12 between two third stage 9, the top of two third stages 9 all with the heating panel 13 fixed connection that is equipped with.

Preferably, a plurality of heat dissipation ribs 14 parallel to each other are fixedly arranged at the top end of the heat dissipation plate 13, the top ends of the plurality of heat dissipation ribs 14 extend to the top end surface of the sealing plate 3, so as to further improve the heat dissipation effect, meanwhile, the heat dissipation ribs 14 also increase the structural strength of the packaging structure body 1, so as to ensure long use time, the first chip 10, the second chip 11 and the third chip 12 are correspondingly and fixedly connected with bonding points on the surface of the substrate 6 through bonding wires 15, so as to facilitate connection and simultaneously realize electric signal transmission, a plurality of pins 5 are fixedly arranged at two lateral sides of the substrate 6, one ends of the plurality of pins 5 extend to the outer side of the plastic package housing 2, so as to facilitate connection with an external circuit mainboard and realize signal transmission, a protection pin pad 4 is fixedly arranged at the bottom end of the plastic package housing 2, the pin protection pad 4 is in penetrating connection with the plurality of pins 5, so as to play a role of, the plastic package shell 2 and the seal plate 3 are made of ceramic materials, and the plastic package shell 2 and the seal plate 3 made of the ceramic materials have good hardness and wear resistance, so that the package structure body 1 is prevented from being damaged.

When in specific use, the utility model relates to a stacking and packaging structure for MEMS chip, firstly, a first chip 10 is laminated between two first stages 7 through an adhesive layer, a second chip 11 is laminated between two second stages 8 through an adhesive layer and a third chip 12 is laminated between two third stages 9 through an adhesive layer by a chip mounting process, then a plurality of mutually parallel radiating ribs 14 are embedded and connected with a sealing plate 3, and finally, a plastic package shell 2 and the sealing plate 3 are fixedly connected together to form a packaging structure body 1 through a sealing and welding process, the utility model is convenient for quickening the heat dissipation through the arranged radiating plate 13 and the radiating ribs 14, improving the service life of the inner first chip 10, the second chip 11 and the third chip 12, and is convenient for stacking chips with different areas and sizes through the arranged first stage 7, the second stage 8 and the third stage 9, the volume ratio is reduced, the packaging density can be improved, and the use is convenient.

In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A stacking and packaging structure for MEMS chips comprises a packaging structure body (1) and is characterized in that the packaging structure body (1) is composed of a plastic package shell (2) and sealing plates (3), the bottom end of each sealing plate (3) is fixedly connected with an opening at the top end of the plastic package shell (2) through sealing glue, a substrate (6) is fixedly arranged at the bottom of an inner cavity of the plastic package shell (2), first steps (7) are fixedly arranged on two sides of the top end of the substrate (6), a first chip (10) is fixedly arranged between the two first steps (7), second steps (8) are fixedly arranged at the top ends of the two first steps (7), a second chip (11) is fixedly arranged between the two second steps (8), third steps (9) are fixedly arranged at the top ends of the two second steps (8), and a third chip (12) is fixedly arranged between the two third steps (9), the top ends of the two third steps (9) are fixedly connected with a heat dissipation plate (13).

2. The stacked package structure for MEMS chips of claim 1, wherein: the top of heating panel (13) is fixed and is equipped with a plurality of heat dissipation ribs (14) that are parallel to each other, and is a plurality of the top of heat dissipation rib (14) extends to the top surface of shrouding (3).

3. The stacked package structure for MEMS chips of claim 1, wherein: the first chip (10), the second chip (11) and the third chip (12) are correspondingly and fixedly connected with the bonding points on the surface of the substrate (6) through bonding wires (15).

4. The stacked package structure for MEMS chips of claim 1, wherein: two avris departments of base plate (6) all are fixed and are equipped with a plurality of pins (5), and are a plurality of the one end of pin (5) all extends to the outside of plastic envelope shell (2).

5. The stacked package structure for the MEMS chip as claimed in claim 4, wherein: the bottom end of the plastic package shell (2) is fixedly provided with a pin protection pad (4), and the pin protection pad (4) is connected with the pins (5) in an inserting mode.

6. The stacked package structure for MEMS chips of claim 1, wherein: the plastic package shell (2) and the sealing plate (3) are both made of ceramic materials.