CN210958713U - Waterproof and moistureproof structure of Bluetooth headset chip - Google Patents
Waterproof and moistureproof structure of Bluetooth headset chip Download PDFInfo
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- CN210958713U CN210958713U CN201921608874.XU CN201921608874U CN210958713U CN 210958713 U CN210958713 U CN 210958713U CN 201921608874 U CN201921608874 U CN 201921608874U CN 210958713 U CN210958713 U CN 210958713U
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- inner shell
- chip
- wall
- bluetooth headset
- fixture block
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Abstract
The utility model discloses a dampproofing and waterproofing structure of bluetooth headset chip, including protective housing, protective housing's inside excavation is equipped with the dark check, is equipped with the inner shell in the dark check, and protective housing's inner wall top excavation is equipped with a plurality of draw-in grooves, and a relative draw-in groove of top outer wall of inner shell is equipped with the fixture block, fixture block and inner shell fixed connection, is equipped with the drier package in the dark check between inner shell and the protective housing, drier package and protective housing fixed connection, the inner wall fixedly connected with sponge that absorbs water of inner shell, compare with prior art, the beneficial effects of the utility model are that: this dampproofing and waterproofing structure avoids the chip to contact steam through installing the chip inside the protecting crust, sets up the sponge that absorbs water through the inside of interior protecting crust, can be with the abundant absorption of steam, and the drier that sets up in the hole groove that sets up between inner shell and shell can play further dry effect with the inside drying of protecting crust, increases bluetooth headset's life.
Description
Technical Field
The utility model relates to a dampproofing and waterproofing structure, in particular to dampproofing and waterproofing structure of bluetooth headset chip belongs to protective structure technical field.
Background
With the development of technology and living demands, the earphone gradually develops from a wired earphone to a wireless Bluetooth earphone, the existing wired earphone often has the phenomena of knotting of a wire end and the like due to the longer transmission line, and the use of wired earphones is greatly limited, the audio conveying device needs to be used within the range of the earphone transmission line, therefore, the bluetooth headset, which is operated by transmitting and receiving signals using an integrated circuit, the electronic chip is arranged in the earphone, because the practicability of the Bluetooth earphone is wider, the time for people to wear the earphone is longer, therefore, the protection of the earphone is further improved, and many people who love sports like listening to music during sports, when the sports, people can spill over a large amount of sweat, if inside these sweat got into the earphone through the gap of earphone, cause the harm to the chip easily, consequently need design the dampproofing and waterproofing structure of a chip.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a dampproofing and waterproofing structure of bluetooth headset chip, through installing the chip inside the protecting crust, avoid the chip to contact steam, the inside through interior protecting crust sets up the sponge that absorbs water, can be with the abundant absorption of steam, and the drier that sets up in the hole groove that sets up between inner crust and shell can be with the inside drying of protecting crust, plays further dry effect, increases bluetooth headset's life.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model relates to a dampproofing and waterproofing structure of bluetooth headset chip, including protective housing, protective housing's inside excavation is equipped with dark check, be equipped with the inner shell in the dark check, protective housing's inner wall top excavation is equipped with a plurality of draw-in grooves, a relative draw-in groove of top outer wall of inner shell is equipped with the fixture block, fixture block and inner shell fixed connection, be equipped with the drier package in the dark check between inner shell and the protective housing, drier package and protective housing fixed connection, the inner wall fixedly connected with sponge that absorbs water of inner shell.
As a preferred technical scheme of the utility model, fixture block and inner shell fixed connection, fixture block threaded connection has a bolt, the inner shell can be dismantled with protective housing through a bolt and be connected.
As an optimized technical scheme of the utility model, the inner wall equidistance of inner shell is excavated and is equipped with a plurality of bleeder vents.
As an optimal technical scheme of the utility model, the relative excavation in top of inner shell inner wall is equipped with No. two draw-in grooves, be equipped with electronic chip in No. two draw-in grooves.
As an optimal technical scheme of the utility model, the both ends threaded connection of electron chip has No. two bolts, the electron chip can be dismantled with the inner shell through No. two bolts and be connected.
Compared with the prior art, the beneficial effects of the utility model are that: this dampproofing and waterproofing structure avoids the chip to contact steam through installing the chip inside the protecting crust, sets up the sponge that absorbs water through the inside of interior protecting crust, can be with the abundant absorption of steam, and the drier that sets up in the hole groove that sets up between inner shell and shell can play further dry effect with the inside drying of protecting crust, increases bluetooth headset's life.
Drawings
FIG. 1 is a schematic sectional view of the present invention;
fig. 2 is a schematic top view of the present invention.
In the figure: 1. a protective housing; 11. a first card slot; 2. an inner shell; 21. air holes are formed; 22. a clamping block; 221. a first bolt; 23. a second card slot; 3. dark lattices; 31. a desiccant bag; 4. an electronic chip; 41. a second bolt; 5. a water-absorbing sponge.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, the utility model relates to a waterproof and moistureproof structure of bluetooth headset chip, including protecting sheathing 1, protecting sheathing 1's inside is excavated and is equipped with dark check 3, is equipped with inner shell 2 in the dark check 3, protecting sheathing 1's inner wall top is excavated and is equipped with a plurality of draw-in grooves 11, the relative draw-in groove 11 of top outer wall of inner shell 2 is equipped with fixture block 22, fixture block 22 and inner shell 2 fixed connection, be equipped with drier package 31 in the dark check 3 between inner shell 2 and the protecting sheathing 1, drier package 31 and protecting sheathing 1 fixed connection, the inner wall fixedly connected with of inner shell 2 sponge 5 that absorbs water.
Specifically, the utility model discloses during the use, install electronic chip 4's both ends on inner shell 2 through No. two bolts 41, fix drier package 31 in dark check 3, fix inner shell 2's both ends on protecting sheathing 1 through a bolt 221 again, fix protecting sheathing 1 in the bluetooth headset, when water, inside water gets into the earphone through the gap of earphone, protecting sheathing 1 blocks most water, a small amount of inside steam that gets into protecting sheathing 1 is through the absorption of sponge 5 and drier package 31 of absorbing water, can not cause the damage to electronic chip 4, increase bluetooth headset's life.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a dampproofing and waterproofing structure of bluetooth headset chip, a serial communication port, including protecting sheathing (1), the inside excavation of protecting sheathing (1) is equipped with hidden check (3), be equipped with inner shell (2) in hidden check (3), the inner wall top excavation of protecting sheathing (1) is equipped with a plurality of draw-in grooves (11), draw-in groove (11) relatively of top outer wall of inner shell (2) are equipped with fixture block (22), fixture block (22) and inner shell (2) fixed connection, be equipped with drier package (31) in hidden check (3) between inner shell (2) and protecting sheathing (1), drier package (31) and protecting sheathing (1) fixed connection, the inner wall fixedly connected with sponge (5) that absorb water of inner shell (2).
2. The waterproof and moistureproof structure of the bluetooth earphone chip according to claim 1, wherein the fixture block (22) is fixedly connected with the inner shell (2), the fixture block (22) is in threaded connection with a first bolt (221), and the inner shell (2) is detachably connected with the protective outer shell (1) through the first bolt (221).
3. The waterproof and moisture-proof structure of the Bluetooth headset chip as claimed in claim 1, wherein the inner wall of the inner case (2) is cut with a plurality of air holes (21) at equal intervals.
4. The waterproof and moistureproof structure of the bluetooth headset chip as claimed in claim 1, wherein a second card slot (23) is cut at the top end of the inner wall of the inner housing (2) relatively, and an electronic chip (4) is arranged in the second card slot (23).
5. The waterproof and moistureproof structure of the bluetooth earphone chip according to claim 4, wherein two ends of the electronic chip (4) are connected with a second bolt (41) in a threaded manner, and the electronic chip (4) is detachably connected with the inner shell (2) through the second bolt (41).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921608874.XU CN210958713U (en) | 2019-09-26 | 2019-09-26 | Waterproof and moistureproof structure of Bluetooth headset chip |
Applications Claiming Priority (1)
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CN201921608874.XU CN210958713U (en) | 2019-09-26 | 2019-09-26 | Waterproof and moistureproof structure of Bluetooth headset chip |
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CN210958713U true CN210958713U (en) | 2020-07-07 |
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CN201921608874.XU Active CN210958713U (en) | 2019-09-26 | 2019-09-26 | Waterproof and moistureproof structure of Bluetooth headset chip |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112259512A (en) * | 2020-10-22 | 2021-01-22 | 吴俊楠 | Packaging structure for multiple chips |
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2019
- 2019-09-26 CN CN201921608874.XU patent/CN210958713U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112259512A (en) * | 2020-10-22 | 2021-01-22 | 吴俊楠 | Packaging structure for multiple chips |
CN112259512B (en) * | 2020-10-22 | 2022-10-25 | 深圳市金道微电子有限公司 | Packaging structure for multiple chips |
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Effective date of registration: 20220823 Address after: 5th Floor, No. 01 Factory Building, Xintianxia Industrial City, Vanke City Community, Bantian Street, Longgang District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Huawei Jijiang Technology Co.,Ltd. Address before: 518000 Room 501 (5004), No.01, xintianxia industrial city, wankecheng community, Bantian street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen wanweike Technology Co.,Ltd. |