CN219321347U

CN219321347U - Heat dissipation type lead frame

Info

Publication number: CN219321347U
Application number: CN202223164817.1U
Authority: CN
Inventors: 冯军民; 何应华; 刘国滔
Original assignee: Ningbo Dezhou Precision Electronic Co ltd
Current assignee: Ningbo Dezhou Precision Electronic Co ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-07-07
Anticipated expiration: 2032-11-28

Abstract

The utility model provides a heat dissipation type lead frame which comprises a frame body, wherein a plastic package area for injection molding packaging is arranged in the middle of the frame body, a base island for supporting a chip is arranged in the middle of the plastic package area, pins for connecting the chip are arranged on the periphery of the base island, one end of each pin, which is far away from the base island, is positioned outside the plastic package area and is provided with pins, a heat dissipation copper sheet is fixedly connected with the side edge of the base island, and the heat dissipation copper sheet extends to the outer side of the plastic package area. Stitch and heat dissipation copper sheet just can all be located outside the plastic envelope district and show, and the stitch cooperates with pegging graft with other interfaces, and the heat dissipation copper sheet need not to peg graft just exposes in the air completely, because copper is good heat conductor so the heat that the chip produced just can transmit outside the plastic envelope district through heat dissipation copper sheet transfer to the people on the base island after to the chip dispels the heat, promote chip performance. Meanwhile, a radiating unit such as air cooling or liquid cooling and the like can be arranged on the radiating copper sheet.

Description

Heat dissipation type lead frame

Technical Field

The present utility model relates to a lead frame for a semiconductor chip.

Background

The lead frame is a key structural member for realizing the electric connection between the lead-out end of the internal circuit of the chip and the outer lead by means of bonding materials to form an electric loop, and plays a role of a bridge connected with an external wire, thereby being an important basic material in the electronic information industry.

In the prior art, the heat dissipation type lead frame is generally formed by stamping a copper sheet, a rectangular base island for placing a chip is arranged on the heat dissipation type lead frame, pins electrically connected with the chip are arranged around the rectangular base island, pins which are in plug-in fit with other components are connected to the tail ends of the pins, and the pins are generally arranged on two sides or around the heat dissipation type lead frame in parallel. The heat dissipation type lead frame and the chip in the heat dissipation type lead frame need to be subjected to injection molding packaging treatment, pins of the heat dissipation type lead frame can be left outside an injection molding square block and then bent, and the rectangular base island and the pins can be packaged in a plastic block. Therefore, the heat dissipation of the chip is difficult, and the phenomenon of overhigh temperature of the chip is easy to cause.

Disclosure of Invention

The utility model aims to provide a heat dissipation type lead frame for enhancing heat dissipation of chips on the lead frame.

The application adopts the following technical scheme for realizing the technical purposes:

the utility model provides a heat dissipation formula lead frame, includes the frame body, the frame body middle part is for the plastic envelope district that is used for moulding plastics encapsulation, the middle part in plastic envelope district is provided with the base island that is used for holding in the palm the propping chip, the periphery of base island is provided with the pin that is used for connecting the chip, the one end that the base island was kept away from to the pin is located outside the plastic envelope district and is provided with the stitch, the side edge fixedly connected with heat dissipation copper sheet of base island, heat dissipation copper sheet extends to the plastic envelope district outside.

In the scheme, when the chip is used, the chip is firstly placed on the base island and then connected with the chip and the pins through the wiring, so that the chip can be electrically connected with the pins, then the lead frame is subjected to plastic package, the pins and the radiating copper sheets are exposed out of the plastic package area, the pins are in plug-in fit with other interfaces, the radiating copper sheets are not required to be plugged in and are completely exposed in the air, and heat generated by the chip can be transferred to the base island after being carried by people through the radiating copper sheets, so that the chip is conveniently radiated, and the chip performance is improved. Meanwhile, a radiating unit such as air cooling or liquid cooling and the like can be arranged on the radiating copper sheet.

Preferably, the plastic package area is rectangular, the pins and the pins are arranged in a plurality, the pins are positioned on two long sides of the rectangle, and the length directions of the pins and the pins are perpendicular to the long sides of the rectangle.

Preferably, the heat dissipation copper sheet is provided with one and is positioned on one long side of the rectangle, and the heat dissipation copper sheet is positioned between two pins.

Preferably, the width of the pin is larger than the width of the pin, and the pin extends to the outer side of the plastic package area.

Preferably, the width of the heat dissipation copper sheet is larger than the width of the pin, and one end of the heat dissipation copper sheet, which is far away from the base island, is flush with one end of the pin, which is far away from the base island.

Preferably, the heat dissipation copper sheet and the pins are provided with glue clamping holes, and the glue clamping holes are positioned in the plastic package area.

Preferably, the base island, the pins and the radiating copper sheet are integrally punched and cut on the copper strip.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic drawing of a press cut on a copper strip in accordance with the present utility model;

reference numerals illustrate: 10. a frame body; 11. a plastic package area; 12. a base island; 13. pins; 14. a stitch; 15. a heat dissipation copper sheet; 16. and (5) a glue clamping hole.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

In the description of the present utility model, it should be noted that the terms "bottom," "outside," "front-to-back," and the like indicate an orientation or a positional relationship based on the orientation or the positional relationship shown in the state of use of the present application, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The utility model provides a heat dissipation formula lead frame, includes frame body 10, frame body 10 middle part is for the plastic envelope district 11 that is used for the encapsulation of moulding plastics, the middle part of plastic envelope district 11 is provided with the base island 12 that is used for propping the chip, the periphery of base island 12 is provided with the pin 13 that is used for connecting the chip, the one end that base island 12 was kept away from to pin 13 is located outside the plastic envelope district 11 and is provided with stitch 14, the side edge fixedly connected with heat dissipation copper sheet 15 of base island 12, heat dissipation copper sheet 15 extends to the plastic envelope district 11 outside.

In the above scheme, when in use, the chip is firstly placed on the base island 12 and then connected with the chip and the pins 13 through the wiring, so that the chip can be electrically connected with the pins 14, then the lead frame is subjected to plastic package, then the pins 14 and the radiating copper sheets 15 are exposed out of the plastic package area 11, the pins 14 are in plug-in fit with other interfaces, the radiating copper sheets 15 are completely exposed in the air without plug-in connection, and because copper is a good heat conductor, heat generated by the chip can be transferred to the base island 12 and then transferred out of the plastic package area 11 through the radiating copper sheets 15, so that the chip is conveniently radiated, and the chip performance is improved. Meanwhile, a heat radiating unit such as air cooling or liquid cooling can be arranged on the heat radiating copper sheet 15.

Further, the plastic package area 11 is rectangular, the pins 13 and the pins 14 are provided in plurality, the pins 13 are located on two long sides of the rectangle, and the length directions of the pins 13 and the pins 14 are perpendicular to the long sides of the rectangle. The two long sides of the rectangle have more space for arranging the pins 13 and the pins 14, and the pins 13 and the pins 14 which are vertically arranged are convenient for bending the pins 14 so as to be convenient for plugging and matching.

Further, the heat dissipation copper sheet 15 is disposed on one long side of the rectangle, and the heat dissipation copper sheet 15 is disposed between the two pins 13. Since the space on the lead frame is limited, only one heat dissipation copper sheet 15 is provided. The pins 13 at two sides of the heat dissipation copper sheet 15 are high-power pins 13, and because the pins 13 generally correspond to different functional areas, the power consumption of the different functional areas is different, so that the heat dissipation copper sheet 15 adjacent to the high-power pins 13 can dissipate heat better.

Further, the width of the pins 13 is larger than the width of the pins 14, and the pins 13 extend to the outside of the molding region 11. Therefore, the pins 13 positioned outside the plastic package area 11 can also play a role in heat dissipation at the same time, so that the heat dissipation performance is further improved.

Further, the width of the heat dissipation copper sheet 15 is larger than the width of the pins 13, and the end of the heat dissipation copper sheet 15 away from the base island 12 is flush with the end of the pins 14 away from the base island 12. Thus being convenient for stamping, cutting and forming.

Further, the heat dissipation copper sheet 15 and the pins 13 are provided with glue clamping holes 16, and the glue clamping holes 16 are located in the plastic package area 11. Thus, part of plastic parts can be filled into the glue clamping holes 16 during injection molding to form a cylindrical structure, and the cylindrical structure can be clamped with the glue clamping holes 16.

As shown in fig. 2, the base island 12, the pins 13, the pins 14 and the heat dissipation copper sheet 15 are integrally punched and cut on the copper strip. This facilitates mass production due to the smaller lead frame.

Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the utility model.

Claims

1. A heat dissipation type lead frame, characterized in that: the plastic packaging structure comprises a frame body (10), wherein a plastic packaging area (11) for injection packaging is arranged in the middle of the frame body (10), the plastic packaging area (11) is arranged in a rectangular shape, a base island (12) for supporting a chip is arranged in the middle of the plastic packaging area (11), a pin (13) for connecting the chip is arranged on the periphery of the base island (12), one end, far away from the base island (12), of the pin (13) is located outside the plastic packaging area (11) and is provided with a pin (14), the pin (13) and the pin (14) are provided with a plurality of pins, the pin (13) is located on two long sides of the rectangular shape, and the length directions of the pin (13) and the pin (14) are perpendicular to the long sides of the rectangular shape; the side edges of the base islands (12) are fixedly connected with radiating copper sheets (15), and the radiating copper sheets (15) extend to the outer side of the plastic package area (11); and the radiating copper sheets (15) and the pins (13) are provided with glue clamping holes (16), and the glue clamping holes (16) are positioned in the plastic package area (11).

2. The heat sink type lead frame according to claim 1, wherein: the radiating copper sheet (15) is provided with one long side of the rectangle, and the radiating copper sheet (15) is positioned between the two pins (13).

3. The heat sink type lead frame according to claim 2, wherein: the width of the pins (13) is larger than that of the pins (14), and the pins (13) extend to the outer side of the plastic package area (11).

4. A heat sink type lead frame according to claim 3, wherein: the width of the radiating copper sheet (15) is larger than that of the pins (13), and one end of the radiating copper sheet (15) far away from the base island (12) is flush with one end of the pins (14) far away from the base island (12).

5. The heat sink type lead frame according to claim 1 or 2 or 3 or 4, wherein: the base island (12), the pins (13), the pins (14) and the radiating copper sheet (15) are integrally punched, cut and formed on the copper strip.