CN219267648U - Semiconductor chip packaging structure - Google Patents

Abstract

The utility model provides a semiconductor chip packaging structure, and belongs to the technical field of chips. It has solved the radiating problem of chip among the prior art. The semiconductor chip packaging structure comprises a chip, pins and a plastic package body, wherein a base island for placing the chip is arranged in the plastic package body, an opening is formed in the bottom surface of the plastic package body corresponding to the base island, and the opening enables part of the base island to leak out of the plastic package body. The utility model has an opening on the bottom surface of the plastic package body corresponding to the base island, and the opening enables part of the base island to leak outside the plastic package body, so that the base island is utilized to dissipate heat through the opening, and meanwhile, the plastic package body can be saved for materials, and the packaging cost is reduced.

Description

Semiconductor chip packaging structure

Technical Field

The utility model belongs to the technical field of chips, in particular to a semiconductor chip packaging structure.

Background

It is well known that chips can be used after being packaged, and the packaging plays roles of placing, fixing, sealing, protecting the chips and enhancing the electrothermal performance, and is also a bridge for communicating the world inside the chips with external circuits, namely, the joints on the chips are connected to pins of a packaging shell by wires, and the pins are connected with other devices by wires on a printed board. Thus, packaging plays an important role for the chip.

For example, patent application number CN202022479678.6 discloses a semiconductor chip package structure, which comprises a base island where a chip unit is placed and a plurality of pins connected with the chip unit; the base island is provided with a supporting surface which is used for placing the chip unit and the pins at a set angle and is matched with the chip unit in size. According to the semiconductor chip packaging structure, the base island is arranged to be polygonal, the supporting surface which can be used for placing the chip unit at a set angle with the pins and is matched with the chip unit in size is arranged on the base island, and then the chip unit can be obliquely placed, so that the whole structure after plastic injection packaging is smaller in size, however, the base island is provided with a larger supporting surface, and the base island is completely packaged in the plastic packaging body, so that the heat dissipation effect is still poor.

Therefore, how to realize better heat dissipation of the chip by using the larger area of the base island becomes a technical problem to be solved in the industry.

Disclosure of Invention

The utility model mainly aims to provide a semiconductor chip packaging structure which can utilize a larger-area base island with the bottom surface of the base island exposed so as to realize better heat dissipation of a chip and enable the chip with the same size to have higher heat dissipation effect.

The aim of the utility model can be achieved by the following technical scheme: the semiconductor chip packaging structure comprises a chip, pins and a plastic package body, wherein a base island for placing the chip is arranged in the plastic package body, an opening is formed in the bottom surface of the plastic package body corresponding to the base island, and the opening enables part of the base island to leak out of the plastic package body.

In some embodiments, the opening is disposed along a contour edge of the base island, the opening is wrapped around the contour edge of the base island, and the bottom surface of the plastic package is higher than the surface of the base island.

In some embodiments, the back side of the chip is in thermally conductive contact with the island, and the chip is electrically connected to the leads.

In some embodiments, the base island has heat dissipating pins extending out of the plastic package.

In some embodiments, the pin includes a connection portion located inside the plastic package body and an external connection portion leaking out of the plastic package body, where the connection portion is used for connecting the chip inside the plastic package body, the external connection portion is used for connecting an external circuit, a bending portion is located between the connection portion and the external connection portion, the bending portion is located inside the plastic package body, the external connection portion extends out from the bottom surface of the plastic package body, and the bottom surface of the external connection portion is flush with the bottom surface of the plastic package body.

In some embodiments, the width of the connection portion at which the connection portion is connected to the bending portion is greater than the width of the bending portion.

In some embodiments, the connection is above the upper surface of the island.

Compared with the prior art, the semiconductor chip packaging structure has the following advantages:

the utility model has the opening on the bottom surface of the plastic package body corresponding to the base island, and the opening enables part of the base island to leak outside the plastic package body, so that the base island is utilized to radiate heat through the opening, chips with the same size have higher radiating effect, meanwhile, the material consumption of the plastic package body can be saved, and the packaging cost is reduced.

The pin is arranged in the plastic package body, later cutting and bending are not needed, damage possibly caused by an internal chip is avoided, and the pin is favorably and firmly fixed in the plastic package body.

Drawings

In the drawings, like reference numerals may describe similar components in different views in order to facilitate an understanding of the principles thereof and which are not necessarily drawn to scale. The drawings illustrate generally, by way of example and not limitation, embodiments discussed herein.

Fig. 1 is a schematic front view of an embodiment.

Fig. 2 is a left-hand schematic view of fig. 1.

Fig. 3 is a schematic top view of fig. 1.

Fig. 4 is a schematic rear view of fig. 1.

In the figure, 1, a chip; 2. pins; 3. a plastic package body; 4. a base island; 5. a wire; 101. an opening; 201. a connection part; 202. an external connection part; 203. and a bending part.

Detailed Description

The following are specific examples of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these examples, and the following embodiments do not limit the utility models according to the claims. Furthermore, all combinations of features described in the embodiments are not necessarily essential to the inventive solution.

It will be appreciated by those of ordinary skill in the art that all directional references (e.g., above, below, upward, downward, top, bottom, left, right, vertical, horizontal, etc.) are descriptive of the drawings to aid the reader in understanding, and do not represent (e.g., positional, azimuthal, use, etc.) limitations on the scope of the utility model defined by the appended claims. Additionally, some ambiguous terms (e.g., substantially, certain, generally, etc.) may refer to slight imprecision or slight deviation of conditions, amounts, values, or dimensions, etc., some of which are within manufacturing tolerances or tolerances. Unless explicitly stated otherwise, the terms of "a," "an," or "the" are intended to include the plural forms thereof.

Examples

The development direction of the integrated circuit is miniaturization and microminiaturization, so that the heat productivity of the chip is large, particularly, some power chips are more obvious, meanwhile, the heat productivity is concentrated due to the small area of the chip, so that the chip is seriously heated and damaged, the chip is usually arranged on a base island in a plastic package, and the heat is mainly transferred to the base island, so that the effective heat dissipation of the base island can be realized.

For this purpose, a semiconductor chip package structure is proposed, as shown in fig. 1, 2, 3 and 4, comprising a chip 1, a lead 2 and a plastic package body 3, wherein a base island 4 for placing the chip 1 is arranged in the plastic package body 3, the back surface of the chip 1 is in heat conduction contact with the base island 4, for example, the chip 1 and the lead 2 are fixedly connected through a heat conduction silica gel, and the lead 2 is connected through a lead 5. The base islands 4 are carriers of the chips 1 in the plastic package body 3 and are used for supporting the chips 1, one base island 4 is attached with one chip 1, a wafer is cut into small wafers after being subjected to a cutting process, then the cut wafers are attached to the corresponding base islands 4 of the corresponding substrate, and bonding pads of the wafers are connected to the corresponding pins 2 of the substrate by using superfine metal (gold, silver and copper) wires 5 to form a required circuit; the individual wafers are then encapsulated and protected by injection molding or epoxy. The chip 1 base island 4 can also realize the integrated package of a multifunctional module, the chip 1 base island 4 plays roles in high-voltage isolation and thermal isolation, and the chip 1 base island 4 also has the function of rapid heat dissipation, so that the chips with the same size have higher heat dissipation effect.

The conventional chips are completely encapsulated in the plastic package body, which is not beneficial to heat dissipation, and therefore, in this embodiment, the base island 4 is provided with an opening 101 on the bottom surface of the plastic package body 3, and the opening 101 allows part of the base island 4 to leak out of the plastic package body 3, so that the base island 4 is utilized to dissipate heat through the opening 101, and meanwhile, the plastic package body 3 can be saved for material, and the encapsulation cost is reduced.

In order to enable as many islands 4 as possible to leak and dissipate heat while ensuring that the chip 1 is in a sealed environment, in this embodiment, the opening edge at the opening 101 is disposed along the contour edge of the islands 4, and the opening edge of the opening 101 wraps the contour edge of the islands 4, which is equivalent to wrapping the islands 4, so that the edges of the islands 4 are in a sealed body, and the sealed body is pressed on the edges of the islands 4 by using a pressing adhesive, so that the bottom surface of the plastic package 3 is higher than the surface of the islands 4, and contact between the islands 4 and an external circuit board can be avoided.

The two ends of the base island 4 are outwards extended to form pins 2, the pins 2 at the two ends are symmetrically arranged with respect to the center of the base island 4, and the base island 4 and the pins 2 are integrally formed by the same material, so that the whole base island 4 has a symmetrical structure, and the production and the stress stability of the structure are facilitated.

The chip 1 is connected with the independent pins 2 through leads 5, and the two independent pins 2 are also symmetrically arranged about the center of the base island 4, and the structures of the independent pins 2 are the same.

As disclosed in the patent application No. CN., the leads 2 of the conventional chip 1 are in-line leads 2 extending out from the plastic package body 3, and further need to be cut and bent in the later stage, which not only has a complicated process, but also is easy to damage the chip 1 during cutting and bending, and the chip 1 is submitted to be increased due to such a structure.

For this reason, the pin 2 in this embodiment adopts a pre-bent structure, that is, the pin 2 includes a connection portion 201 located inside the plastic package body 3 and an external connection portion 202 leaking out of the plastic package body 3, the connection portion 201 is used for connecting the chip 1 inside the plastic package body 3, the external connection portion 202 is used for connecting an external circuit, a bending portion 203 is provided between the connection portion 201 and the external connection portion 202, the bending portion 203 is located inside the plastic package body 3, the external connection portion 202 extends out from the bottom surface of the plastic package body 3, and the bending portion 203 makes the bottom surface of the external connection portion 202 flush with the bottom surface of the plastic package body 3, so that the pin 2 can be fully combined with an external circuit board, welding and heat dissipation are facilitated, the packaged chip 1 is small, damage to the chip 1 caused by a later cutting and bending step is not necessary, and damage to the chip 1 due to external stress is avoided; the bending parts of the bent pins are all encapsulated in the plastic package body 3, so that the external stress is more difficult to transfer to the chip 1; the whole plastic package body 3 is more attractive and has smaller volume. Meanwhile, the bending part 203 is located in the plastic package body 3, which is favorable for firmly fixing the pins 2 in the plastic package body 3, while the conventional in-line pins 2 are easy to separate from the plastic package body 3.

The width of the connection part 201 and the connection part 203 is greater than the width of the connection part 203, so that the connection part 201 is clamped in the plastic package body 3 corresponding to a larger clamping head, the pins 2 are firmly fixed relative to the plastic package body 3, and the base islands 4 are provided with unfilled corner parts corresponding to the pins 2, so that a placement position is provided for the pins 2, and the packaged structure is compact. The connection portion 201 of the independent pin 2 is higher than the upper surface of the base island 4, that is, the upper surface of the base island 4 is lower than the connection portion 201 of the pin 2, which is favorable for the height of the chip 1 to be equivalent to that of the connection portion 201 of the pin 2 after the chip 1 is placed on the base island 4, thereby being favorable for the stress stability of the whole packaging structure and the compactness of the whole structure.

Although some terms are used more herein, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the utility model; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present utility model. The order of execution of the operations, steps, and the like in the apparatuses and methods shown in the specification and the drawings may be any order as long as the order is not particularly limited, and the output of the preceding process is not used in the following process. The use of similar ordinal terms (e.g., "first," "then," "second," "again," "then," etc.) for convenience of description does not necessarily imply that they are necessarily performed in such order. The terms "comprises," "comprising," "including," and their derivatives do not exclude the presence of any other component, step or procedure, and are not related to whether or not such other component, step or procedure is disclosed in the present application. The term "or" refers to the listed individual members or any combination thereof unless explicitly stated otherwise.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.

Claims (6)

1. The semiconductor chip packaging structure comprises a chip, pins and a plastic package body, wherein a base island for placing the chip is arranged in the plastic package body, and the semiconductor chip packaging structure is characterized in that an opening is formed in the bottom surface of the plastic package body corresponding to the base island, and the opening enables part of the base island to leak outside the plastic package body; the opening edge of the opening is arranged along the outline edge of the base island, the outline edge of the base island is wrapped by the opening edge, and the bottom surface of the plastic package body is higher than the surface of the base island.

2. The semiconductor chip package according to claim 1, wherein the back surface of the chip is in thermally conductive contact with the island, and the chip is electrically connected to the leads.

3. The semiconductor chip package according to claim 1, wherein the base island has heat dissipation pins extending out of the plastic package.

4. The semiconductor chip package according to claim 1, wherein the leads include a connection portion located inside the molding body and an external portion leaking out of the molding body, the connection portion is used for connecting the chip inside the molding body, the external portion is used for connecting an external circuit, a bending portion is located between the connection portion and the external portion, the bending portion is located inside the molding body, the external portion extends out from a bottom surface of the molding body, and a bottom surface of the external portion is flush with a bottom surface of the molding body.

5. The semiconductor chip package according to claim 4, wherein a width of a junction of the connection portion and the bending portion is larger than a width of the bending portion.

6. The semiconductor chip package according to claim 4, wherein the connection portion is higher than the upper surface of the island.

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